Equipment for nickel plating of target material back plate

Abstract

The utility model discloses equipment for nickel plating of a target material back plate, which comprises an electroplating box with an uncovered box body structure, a control panel is fixedly mounted on the outer surface of the front side of the electroplating box, a suspension bracket is mounted in the middle of the inner side of the electroplating box, and an electrode bar is fixedly mounted on the inner wall of the rear side of the electroplating box. And an electric heater is fixedly installed on the lower surface in the electroplating box, a filtering box used for filtering impurities in electroplating liquid is fixedly installed on the right side in the electroplating box, a water inlet pipe is fixedly installed on the side face of the filtering box in a penetrating mode, and a water outlet pipe is fixedly installed on the upper surface of the filtering box in a penetrating mode. According to the equipment for nickel plating of the target material back plate, a novel structural design is adopted, in the electroplating process, a small water pump and a water inlet pipe are used for sucking electroplating liquid into the filtering box, and a filtering net and filtering filler in the filtering box are used for filtering the electroplating liquid, so that impurities in the electroplating liquid are removed, and the situation that the follow-up electroplating quality is affected by the impurities is avoided; and the filtered electroplating liquid is discharged from the water outlet pipe.

Description

Technical Field

[0001] The utility model relates to the technical field of nickel plating on a target back plate, in particular to a device for nickel plating on a target back plate. Background Art

[0002] The target back plate usually refers to the back plate or base used to support the target material, making the target material more stable. During the production process of the target back plate, it is often necessary to perform nickel plating on it so that a layer of nickel metal is attached to the surface of the target back plate, thereby improving its corrosion resistance.

[0003] In the prior art, a Chinese patent with announcement number CN108103561A discloses an electroplating box, including a main tank body, an overflow tank, a variable temperature tank and a variable temperature pump. An overflow port is provided on the outer wall of the main tank body, and the overflow port is connected to the overflow tank. The variable temperature tank includes an inlet, an outlet and a variable temperature pipe. The overflow tank and the main tank body are both connected to the liquid inlet of the variable temperature pump, and the liquid outlet of the variable temperature pump is connected to the inlet. The variable temperature pipe is located inside the variable temperature tank, and the outlet is connected to the main tank body. The inlet and outlet of the variable temperature pipe are respectively connected to the variable temperature fluid pipe. The arrangement of the overflow port and the overflow tank can prevent liquid splashing. In order to avoid the temperature difference of the electroplating solution due to the tank depth, a variable temperature tank is arranged, and the electroplating solution in the overflow tank and the main tank body is sent to the variable temperature tank through the variable temperature pump for heat exchange. On the one hand, the temperature of the electroplating solution can be adjusted, and on the other hand, through continuous circulation, the temperature of the electroplating solution in the main tank body can be ensured to be equal everywhere to avoid temperature difference.

[0004] The above-mentioned device performs electroplating operation by placing the workpiece (ie, the target backing plate) into the main tank body. However, in actual use, some impurities will be generated in the electroplating solution after electroplating. If these impurities are not processed, they will affect the quality of subsequent electroplating. Utility Model Content

[0005] The utility model aims to provide a device for nickel plating a target back plate, so as to solve the problem that electroplating impurities cannot be cleaned in the above-mentioned background technology.

[0006] To achieve the above object, the utility model provides the following technical solution: an apparatus for nickel plating a target back plate, comprising an electroplating box with an uncovered box structure, a control panel fixedly mounted on the front outer surface of the electroplating box, and further comprising:

[0007] A suspension rack is installed in the middle of the inner side of the electroplating box, an electrode rod is fixedly installed on the inner wall of the rear side of the electroplating box, and an electric heater is fixedly installed on the lower surface of the inner side of the electroplating box;

[0008] A filter box for filtering impurities in the electroplating solution is fixedly installed on the right side of the electroplating box, and a water inlet pipe is fixedly installed through the side of the filter box, and a water outlet pipe is fixedly installed through the upper surface of the filter box;

[0009] A stirring plate for stirring the electroplating liquid to make it evenly distributed is installed on the lower surface of the electroplating box.

[0010] Preferably, a small water pump is fixedly installed at the rear end of the water inlet pipe, and a filter screen and filter filler are fixedly installed inside the filter box.

[0011] Preferably, the upper end of the water outlet pipe corresponds to the position of the rotating impeller, and the rotating impeller is rotatably connected to the electroplating box, and the rotating impeller is higher than the water level of the electroplating solution.

[0012] Preferably, a driving bevel gear is coaxially fixedly mounted on the side surface of the rotating impeller, and a driven bevel gear is meshingly connected to the side surface of the driving bevel gear.

[0013] Preferably, the driven bevel gear and the reciprocating screw are coaxially fixedly installed, and a movable slider is threadedly installed on the outside of the reciprocating screw.

[0014] Preferably, a connecting rod is fixedly installed on the lower surface of the movable slider, and the bottom end of the connecting rod is fixedly connected to the stirring plate, and the stirring plate slides relative to a limiting slide groove provided on the lower surface of the inside of the electroplating box.

[0015] Preferably, both ends of the suspension bracket are snap-connected to the mounting block, and the mounting block is slidably connected to a lifting slide fixedly installed inside the electroplating box.

[0016] Compared with the prior art, the beneficial effects of the utility model are: the equipment for nickel plating the target back plate adopts a new structural design, and its specific contents are as follows:

[0017] 1. Hang the target back plate to be nickel plated on the suspension rack, and then move the suspension rack downward by sliding the mounting block inside the lifting slide, so as to move the target back plate to be electroplated into the electroplating solution for electroplating operation;

[0018] Furthermore, during the electroplating process, a small water pump and a water inlet pipe are used to suck the plating liquid into a filter box, and the filter screen and filter filler in the filter box are used to filter the plating liquid to remove impurities and prevent the impurities from affecting the subsequent electroplating quality. The filtered plating liquid is discharged from the outlet pipe.

[0019] 2. The water flow sprayed from the outlet pipe hits the rotating impeller, and the water flow drives the rotating impeller to rotate. During the rotation of the rotating impeller, the driving bevel gear is driven to rotate, so that the driven bevel gear meshing with the driving bevel gear drives the reciprocating screw to rotate, so that the moving slider installed with threads passing through the outside of the reciprocating screw reciprocates;

[0020] Furthermore, the movement of the movable slider drives the stirring plate to move back and forth through the connecting rod, thereby stirring the electroplating solution, making the temperature of the electroplating solution more uniform, and also making the effective molecules in the electroplating solution more evenly distributed. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the internal structure of the electroplating box of the utility model;

[0023] Figure 3 This is a schematic diagram of the structure of the suspension frame of the utility model;

[0024] Figure 4 This is a schematic diagram of the internal structure of the filter box of the utility model;

[0025] Figure 5 This is a schematic diagram of the structure of the position relationship between the rotating impeller and the water outlet pipe of the utility model;

[0026] Figure 6 This is a schematic diagram of the structure of the stirring plate of the utility model.

[0027] In the figure: 1. electroplating box; 2. control panel; 3. hanging bracket; 4. electrode rod; 5. electric heater; 6. mounting block; 7. lifting slide; 8. filter box; 9. water inlet pipe; 10. water outlet pipe; 11. small water pump; 12. filter screen; 13. filter filler; 14. rotating impeller; 15. driving bevel gear; 16. driven bevel gear; 17. reciprocating screw; 18. moving slider; 19. connecting rod; 20. stirring plate; 21. limiting slide. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] Example 1: Please refer to Figure 1-Figure 3In order to achieve the purpose of nickel plating the target back plate, the present embodiment provides the following technical solutions, which specifically disclose: an electroplating box 1 with an uncovered box structure, a control panel 2 is fixedly installed on the front outer surface of the electroplating box 1, a suspension bracket 3 is installed at the middle position of the inner side of the electroplating box 1, and an electrode rod 4 is fixedly installed on the inner wall of the rear side of the electroplating box 1, and an electric heater 5 is fixedly installed on the lower surface of the inner part of the electroplating box 1, both ends of the suspension bracket 3 are snap-connected with the mounting block 6, and the mounting block 6 is slidably connected with a lifting slide 7 fixedly installed inside the electroplating box 1.

[0030] When using the device, first hang the target back plate that needs nickel plating on the hook below the suspension frame 3, then open the lifting slide 7, and use the lifting slide 7 to drive the mounting block 6 to move downward, so that the mounting block 6 moves the suspension frame 3 downward, and finally the target back plate is immersed in the plating solution. Then, start the device through the control panel 2, and perform electroplating on the target back plate, so that a layer of nickel metal is attached to the surface of the target back plate.

[0031] Example 2: Please refer to Figure 4 In order to solve the problem that the traditional device cannot clean the impurities in the electroplating liquid during use, this embodiment provides the following technical solutions. The electroplating liquid circulates into the filter box 8 for filtration, so as to remove the impurities therein. Specifically disclosed is: a filter box 8 for filtering impurities in the electroplating liquid is fixedly installed on the right side of the electroplating box 1, and a water inlet pipe 9 is fixedly installed through the side of the filter box 8, and a water outlet pipe 10 is fixedly installed through the upper surface of the filter box 8, a small water pump 11 is fixedly installed at the rear end of the water inlet pipe 9, and a filter screen 12 and a filter filler 13 are fixedly installed inside the filter box 8.

[0032] During the electroplating process, a small water pump 11 is turned on to suck the plating liquid into the filter box 8 through the water inlet pipe 9. At this time, the filter mesh 12 and filter filler 13 inside the filter box 8 are used to filter the plating liquid to remove impurities in the plating liquid. The filtered plating liquid is discharged from the outlet pipe 10.

[0033] Example 3: Please refer to Figure 5 and Figure 6In order to solve the problem of uneven heating of the plating liquid in the traditional device, this embodiment provides the following technical solutions. The flow of the plating liquid is accelerated by stirring the stirring plate 20, so that the heating can be uniform and the coating can be uniformly attached. Specifically disclosed is: a stirring plate 20 for stirring the plating liquid to make it uniformly distributed is installed on the lower surface of the inner part of the plating box 1, the upper end of the water outlet pipe 10 corresponds to the position of the rotating impeller 14, and the rotating impeller 14 is rotatably connected to the plating box 1, and the rotating impeller 14 is higher than the water level of the plating liquid. A driving bevel gear 15 is coaxially fixedly installed on the side of the rotating impeller 14, and a driven bevel gear 16 is meshedly connected to the side of the driving bevel gear 15, the driven bevel gear 16 and the reciprocating screw 17 are coaxially fixedly installed, and a movable slider 18 is threadedly installed on the outside of the reciprocating screw 17, a connecting rod 19 is fixedly installed on the lower surface of the movable slider 18, and the bottom end of the connecting rod 19 is fixedly connected to a stirring plate 20, and the stirring plate 20 slides with a limiting slide groove 21 opened on the lower surface of the electroplating box 1.

[0034] The electroplating liquid discharged from the water outlet pipe 10 impacts the rotating impeller 14, causing the rotating impeller 14 to rotate. During the rotation process, the rotating impeller 14 drives the active bevel gear 15 fixedly mounted coaxially therewith to rotate. At this time, the driven bevel gear 16 meshing with the active bevel gear 15 drives the reciprocating screw 17 to rotate. During the rotation of the reciprocating screw 17, it drives the moving slider 18 installed with a thread passing through the outside thereof to reciprocate. The moving slider 18 is used to drive the stirring plate 20 to move through the connecting rod 19 (the stirring plate 20 and the limiting slide groove 21 slide against each other, thereby achieving the purpose of limiting the stirring plate 20). The movement of the stirring plate 20 is used to stir the electroplating liquid, so that the electroplating liquid heated by the electric heater 5 is distributed more evenly, reducing the problem of uneven heating. At the same time, the stirring of the stirring plate 20 can make the nickel element in the electroplating liquid more evenly distributed, so that the thickness of the coating is more uniform.

[0035] In the description of the present invention, unless otherwise specified, "multiple" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A device for nickel plating a target back plate, comprising an electroplating box (1) in a coverless box structure, wherein a control panel (2) is fixedly mounted on the front outer surface of the electroplating box (1), characterized in that: Also includes: A suspension bracket (3) is installed at the middle position of the inner side of the electroplating box (1), an electrode rod (4) is fixedly installed on the inner wall of the rear side of the electroplating box (1), and an electric heater (5) is fixedly installed on the lower surface of the inner side of the electroplating box (1); A filter box (8) for filtering impurities in the electroplating solution is fixedly installed on the right side of the electroplating box (1), and a water inlet pipe (9) is fixedly installed through the side of the filter box (8), and a water outlet pipe (10) is fixedly installed through the upper surface of the filter box (8); The lower surface of the interior of the electroplating box (1) is provided with a stirring plate (20) for stirring the electroplating liquid to make it evenly distributed.

2. The device for nickel plating a target back plate according to claim 1, characterized in that: A small water pump (11) is fixedly installed at the rear end of the water inlet pipe (9), and a filter screen (12) and a filter filler (13) are fixedly installed inside the filter box (8).

3. The device for nickel plating a target back plate according to claim 2, characterized in that: The upper end of the water outlet pipe (10) corresponds to the position of the rotating impeller (14), and the rotating impeller (14) is rotatably connected to the electroplating box (1), and the rotating impeller (14) is higher than the water level of the electroplating liquid.

4. The device for nickel plating a target back plate according to claim 3, characterized in that: A driving bevel gear (15) is coaxially fixedly mounted on the side of the rotating impeller (14), and a driven bevel gear (16) is meshingly connected on the side of the driving bevel gear (15).

5. The device for nickel plating a target back plate according to claim 4, characterized in that: The driven bevel gear (16) and the reciprocating screw rod (17) are coaxially fixedly installed, and a movable slider (18) is threadedly installed on the outside of the reciprocating screw rod (17).

6. The device for nickel plating a target back plate according to claim 5, characterized in that: A connecting rod (19) is fixedly installed on the lower surface of the movable slider (18), and the bottom end of the connecting rod (19) is fixedly connected to the stirring plate (20), and the stirring plate (20) slides with a limiting slide groove (21) provided on the lower surface of the inside of the electroplating box (1).

7. The device for nickel plating a target back plate according to claim 1, characterized in that: The two ends of the suspension frame (3) are snap-connected to the mounting block (6), and the mounting block (6) is slidably connected to a lifting slideway (7) fixedly installed inside the electroplating box (1).

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