Copper removal device and electroplating production line

Abstract

The utility model discloses a copper removal device and an electroplating production line. The copper removal device comprises a liquid inlet cavity, a piston assembly, a communicating cavity and a filtering assembly. The piston assembly comprises a piston cavity, a piston and a push rod, the piston is slidably and hermetically arranged in the piston cavity, the push rod is connected with the piston and partially extends out of the piston cavity, the filter assembly comprises a filter cavity and copper removal resin arranged in the filter cavity, and the liquid inlet cavity, the piston cavity, the communicating cavity and the filter cavity are sequentially communicated. The liquid inlet cavity is provided with a first liquid inlet and a first valve, the communicating cavity is provided with a second inlet and a second valve, the first valve is used for controlling opening and closing of the first liquid inlet, the second valve is used for controlling opening and closing of the second inlet, and the push rod is configured to push the piston to move towards or away from the bottom of the piston cavity.

Description

Technical Field

[0001] The present application relates to the field of electroplating technology, and in particular to a copper removal device and an electroplating production line. Background Art

[0002] In nickel sulfate electroplating solution, due to the slight dissolution of the copper foil surface coating, the copper ion content in the solution will gradually increase. When it exceeds a certain concentration, it will greatly affect the efficiency and effect of nickel plating and deteriorate the coating performance. At present, resin towers are usually used for copper removal. However, the resin tower itself is large in size and occupies a large space. Utility Model Content

[0003] In view of this, the present application provides a copper removal device and an electroplating production line with a smaller volume.

[0004] The first aspect of the present application provides a copper removal device, including a liquid inlet cavity, a piston assembly, a connecting cavity and a filter assembly. The piston assembly includes a piston cavity, a piston and a push rod, the piston is slidably and sealingly disposed in the piston cavity, the push rod is connected to the piston and partially extends out of the piston cavity, the filter assembly includes a filter cavity and a copper removal resin disposed in the filter cavity, the liquid inlet cavity, the piston cavity, the connecting cavity and the filter cavity are connected in sequence, the liquid inlet cavity is provided with a first liquid inlet, the piston cavity is provided with a first inlet and a first outlet, the first inlet is connected to the liquid inlet cavity, the connecting cavity is provided with a second inlet and a second outlet, the second inlet is connected to the first outlet, the filter cavity is provided with a first liquid outlet, and the The liquid inlet cavity is provided with a first valve, and the first valve is used to control the opening and closing of the first liquid inlet. The connecting cavity is provided with a second valve, and the second valve is used to control the opening and closing of the second inlet. The push rod is configured to push the piston to move toward or away from the bottom of the piston cavity; when the push rod pushes the piston to move away from the bottom of the piston cavity, the first valve is configured to open the first liquid inlet, and the second valve is configured to close the second inlet; when the push rod pushes the piston to move toward the bottom of the piston cavity, the first valve is configured to close the first liquid inlet, and the second valve is configured to open the second inlet.

[0005] In some embodiments, the copper removal device further includes a fixed frame, and the liquid inlet cavity, the piston cavity, the connecting cavity and the filter cavity are arranged in the fixed frame.

[0006] In some embodiments, the copper removal device further includes a hook, and the hook is connected to the fixing frame.

[0007] In some embodiments, the copper removal device further includes a fixing rod, and the fixing rod connects two adjacent hooks.

[0008] In some embodiments, the copper removal device further includes a driving member, which is connected to the push rod and is used to drive the push rod to push the piston to move relative to the piston cavity, and the driving member is installed on the fixed rod.

[0009] In some embodiments, the first valve includes a first filter element and a first blocking element, the first filter element is disposed in the liquid inlet cavity and divides the liquid inlet cavity into two parts, and the first blocking element is placed on the first filter element and is located between the first filter element and the first liquid inlet.

[0010] In some embodiments, the second valve includes a second filter and a second blocking member, the second filter is disposed in the connecting cavity and divides the connecting cavity into two parts, the second filter has a recessed portion sunken toward the bottom of the connecting cavity, and the second blocking member is disposed in the recessed portion.

[0011] In some embodiments, the filter assembly further includes a filter bag, which is disposed in the filter cavity and covers the copper removal resin.

[0012] In some embodiments, the first liquid outlet is located at the top of the filter cavity.

[0013] A second aspect of the present application provides an electroplating production line, which includes any one of the above-mentioned copper removal devices.

[0014] The copper removal device provided in the embodiment of the present application includes a liquid inlet cavity, a piston assembly, a connecting cavity and a filter assembly. It has a simple structure and a smaller overall volume than the existing resin tower. It can be directly placed in the electroplating production line for use without complicated assembly. It can be applied to old electroplating equipment that is not suitable for assembling resin towers, and has a wider range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of a copper removal device provided in one embodiment of the present application.

[0016] Figure 2 A partial schematic diagram of an electroplating production line provided in one embodiment of the present application.

[0017] Main component symbols

[0018] Copper removal device 100

[0019] Liquid inlet cavity 10

[0020] Piston assembly 20

[0021] Connecting cavity 30

[0022] Filter assembly 40

[0023] First valve 50

[0024] Second valve 60

[0025] First liquid inlet 10a

[0026] Second liquid outlet 10b

[0027] Piston cavity 21

[0028] Piston 22

[0029] Putter 23

[0030] First entrance 21a

[0031] First exit 21b

[0032] Second entrance 30a

[0033] Second exit 30b

[0034] Second liquid inlet 41a

[0035] First liquid outlet 41b

[0036] Driving member 70

[0037] Fixed frame 80

[0038] Hook 90

[0039] Fixed rod 91

[0040] Transmission wheel 92

[0041] Connecting rod 93

[0042] First filter element 51

[0043] The first stopper 52

[0044] Second filter element 61

[0045] The second blocking member 62

[0046] Recess 611

[0047] Filter Bag 43

[0048] Electroplating production line 200

[0049] Plating tank 210

[0050] Skeet 220

[0051] Through hole 61a

[0052] Box 411

[0053] Cover 412

[0054] Cavity 411a

[0055] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0056] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0057] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0058] The technical scheme in the embodiment of the present application is described clearly and in detail below. Obviously, the described embodiment is a part of the embodiment of the present application, rather than all the embodiments. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the present application. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0059] In addition, for simplicity and clarity, in the accompanying drawings, the size or thickness of various components, layers may be amplified. Throughout the entire text, the same numerical value refers to the same element. As used herein, the term "and / or", "and / or" includes any and all combinations of one or more related enumerated items. In addition, it should be understood that when element A is referred to as "connecting" element B, element A may be directly connected to element B, or there may be an intermediate element C and element A and element B may be indirectly connected to each other.

[0060] Further, the use of “may” when describing embodiments of the present application means “one or more embodiments of the present application”.

[0061] The technical terms used herein are for the purpose of describing specific embodiments and are not intended to limit the present application. As used herein, the singular form is intended to also include the plural form, unless the context clearly indicates otherwise. It should be further understood that the term "comprising", when used in this specification, refers to the presence of narrated features, values, steps, operations, elements and / or components, but does not exclude the presence or increase of one or more other features, values, steps, operations, elements, components and / or combinations thereof.

[0062] It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts herein, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, the first element, component, region, layer or part discussed below can be referred to as the second element, component, region, layer or part without departing from the teaching of the exemplary embodiment.

[0063] See also Figure 1 In one embodiment of the present application, a copper removal device 100 is provided, comprising a liquid inlet cavity 10, a piston assembly 20, a connecting cavity 30 and a filter assembly 40. The liquid inlet cavity 10 is provided with a first liquid inlet 10a and a second liquid outlet 10b. The electroplating liquid enters the liquid inlet cavity 10 through the first liquid inlet 10a and is discharged from the liquid inlet cavity 10 through the second liquid outlet 10b. The liquid inlet cavity 10 is provided with a first valve 50, and the first valve 50 is used to control the opening and closing of the first liquid inlet 10a. The piston assembly 20 comprises a piston cavity 21, a piston 22 and a push rod 23. The piston 22 is slidably and sealingly arranged in the piston cavity 21. The push rod 23 is connected to the piston 22 and partially extends out of the piston cavity 21. The piston cavity 21 is provided with a first inlet 21a and a first outlet 21b. The first inlet 21a is connected to the second liquid outlet 10b. The communicating cavity 30 is provided with a second inlet 30a and a second outlet 30b, and the second inlet 30a is communicated with the first outlet 21b. The communicating cavity 30 is provided with a second valve 60, and the second valve 60 is used to control the opening and closing of the second inlet 30a. The filter assembly 40 includes a filter cavity 41 and a copper removal resin 42 arranged in the filter cavity 41. The filter cavity 41 is provided with a second liquid inlet 41a and a first liquid outlet 41b, and the second liquid inlet 41a is communicated with the second outlet 30b. The piston 22 can move away from or toward the bottom of the piston cavity 21 driven by the push rod 23. The first valve 50 is configured so that when the piston 22 moves away from the bottom of the piston cavity 21, the first valve 50 opens the first liquid inlet 10a to connect the piston cavity 21 with the external environment, and when the piston 22 moves toward the bottom of the piston cavity 21, the first valve 50 closes the first liquid inlet 102. The second valve 60 is configured to close the second inlet 30 a when the piston 22 moves away from the bottom of the piston cavity 21 , and to open the second inlet 30 a to connect the piston cavity 21 and the filter cavity 41 when the piston 22 moves toward the bottom of the piston cavity 21 .

[0064] When in use, the push rod 23 pushes the piston 22 to move away from the bottom of the piston cavity 21, the first valve 50 controls the first liquid inlet 10a to open, and the second valve 60 controls the second inlet 30a to close, and the external electroplating liquid enters the piston cavity 21 through the first liquid inlet 10a and the liquid inlet cavity 10; then, the push rod 23 pushes the piston 22 to move toward the bottom of the piston cavity 21, the first valve 50 controls the first liquid inlet 10a to close, and the second valve 60 controls the second inlet 30a to open, and the electroplating liquid in the piston cavity 21 enters the filter cavity 41 through the first outlet 21b and the connecting cavity 30, and is discharged to the external environment through the copper removal resin 42 and the first liquid outlet 41b. When the electroplating liquid passes through the copper removal resin 42, the copper ions in the electroplating liquid form a complex with the functional groups of the copper removal resin 42 and are removed.

[0065] In this embodiment, the second liquid outlet 10b overlaps with the first inlet 21a, the first outlet 21b overlaps with the second inlet 30a, and the second outlet 30b overlaps with the second liquid inlet 41a. In other embodiments, the second liquid outlet 10b is connected to the first inlet 21a through a pipe, the first outlet 21b is connected to the second inlet 30a through a pipe, and the second outlet 30b is connected to the second liquid inlet 41a through a pipe.

[0066] In some embodiments, the copper removal device 100 further includes a driving member 70, which is connected to the push rod 23 and is used to drive the push rod 23 to push the piston 22 to move relative to the piston cavity 21. In some embodiments, the driving member 70 is a motor.

[0067] In some embodiments, the copper removal device 100 further includes a fixed frame 80. The fixed frame 80 is used to position and support the liquid inlet cavity 10, the piston assembly 20, the connecting cavity 30 and the filter assembly 40. In some embodiments, the liquid inlet cavity 10, the piston cavity 21, the connecting cavity 30 and the filter cavity 41 are arranged in the fixed frame 80. The fixed frame 80 is formed by overlapping a plurality of rods, and the fixed frame 80 has a plurality of openings formed between the rods. When the fixed frame 80 is placed in the plating solution, the plating solution can enter the fixed frame 80 through the opening, and then enter the piston cavity 21 through the first liquid inlet 10a.

[0068] In some embodiments, the copper removal device 100 further includes a hook 90. ​​The hook 90 is connected to the fixing frame 80. The hook 90 can be hung on the target of the electroplating production line for easy installation. The number of the hooks 90 can be set according to actual needs. In this embodiment, the number of the hooks 90 is two.

[0069] In some embodiments, the copper removal device 100 further includes a fixed rod 91, and the fixed rod 91 connects two adjacent hooks 90 to fix the hooks 90. The driving member 70 is mounted on the fixed rod 91. The copper removal device 100 further includes a transmission wheel 92 and a connecting rod 93, the transmission wheel 92 is connected to the driving member 70 and fixed on the fixed rod 91, and the connecting rod 93 is connected to the transmission wheel 92 and the push rod 23. The transmission wheel 92 can be a gear structure. When the driving member 70 drives the transmission wheel 92 to rotate, the transmission wheel 92 drives the connecting rod 93 to rotate, and the piston 22 moves up and down along the inner wall of the piston cavity 21.

[0070] In some embodiments, the first valve 50 includes a first filter 51 and a first blocking member 52. The first filter 51 is disposed in the liquid inlet cavity 10 and divides the liquid inlet cavity 10 into two parts, and the first filter 51 is provided with a plurality of through holes to connect the two parts. The first liquid inlet 10a is directly connected to one of the parts, and the first inlet 21a is directly connected to the other part. The first blocking member 52 is placed on the first filter 51 and located between the first filter 51 and the first liquid inlet 10a. The first blocking member 52 is configured to block the first liquid inlet 10a. The cross-sectional area of ​​the first blocking member 52 is greater than or equal to the cross-sectional area of ​​the first liquid inlet 10a, so that the first blocking member 52 can block the first liquid inlet 10a. The cross-sectional area of ​​the first blocking member 52 is smaller than the area of ​​the first filter 51, so that the first filter 51 will not be completely blocked by the first blocking member 52, and the electroplating solution can flow into the piston cavity 21 after passing through the first filter 51. The first blocking member 52 may be, but is not limited to, spherical. The first filter element 51 may be, but is not limited to, a filter screen.

[0071] When the push rod 23 pushes the piston 22 to move away from the bottom of the piston cavity 21, the first blocking member 52 falls on the first filter element 51 under the action of its own gravity and the hydraulic pressure generated by the electroplating liquid being sucked into the piston cavity 21, and does not block the first liquid inlet 10a; when the push rod 23 pushes the piston 22 to move toward the bottom of the piston cavity 21, the first blocking member 52 flows to the first liquid inlet 10a under the action of the hydraulic pressure generated by the electroplating liquid being discharged from the piston cavity 21 and blocks the first liquid inlet 10a.

[0072] In some embodiments, the second valve 60 includes a second filter 61 and a second blocking member 62. The second filter 61 is disposed in the communicating cavity 30 and divides the communicating cavity 30 into two parts, and the second filter 61 is provided with a through hole 61a, and the two parts are connected through the through hole 61a. The second inlet 30a is directly connected to one of the parts, and the second outlet 30b is directly connected to the other part. The second filter 61 has a recess 611 that is recessed toward the bottom of the communicating cavity 30, and the through hole 61a is located at the bottom of the recess 611. The second blocking member 62 is disposed in the recess 611. The second blocking member 62 is configured to block the through hole 61a to close the second inlet 30a.

[0073] When the push rod 23 pushes the piston 22 to move away from the bottom of the piston cavity 21, the second blocking member 62 flows to the recess 611 and blocks the through hole 61a under the action of the hydraulic pressure generated by the electroplating liquid being sucked into the piston cavity 21. When the push rod 23 pushes the piston 22 to move toward the bottom of the piston cavity 21, the second blocking member 62 opens the through hole 61a to connect the second inlet 30a and the second outlet 30b under the action of the hydraulic pressure generated by the electroplating liquid being discharged from the piston cavity 21.

[0074] In some embodiments, the filter chamber 41 includes a box body 411 and a cover body 412. The box body 411 has a cavity 411a, and the copper removal resin 42 is contained in the cavity 411a. The cover body 412 is connected to the box body 411 and is suitable for covering the box body 411 to seal the cavity 411a. The second liquid inlet 41a is provided in the box body 411, and the first liquid outlet 41b is provided in the cover body 412.

[0075] In some embodiments, the filter assembly 40 further includes a filter bag 43, which is disposed in the filter cavity 41 and coated with the copper removal resin 42. The filter bag 43 has a plurality of filter holes, and the electroplating solution entering the filter cavity 41 enters the filter bag 43 through the filter holes to contact the copper removal resin 42 coated in the filter bag 43. The filter bag 43 may be made of, but not limited to, polypropylene. The filter bag 43 may be fixed to the box 411, but not limited to.

[0076] In some embodiments, the first liquid outlet 41 b is located at the top of the filter cavity 41 , so that the electroplating liquid can fully contact with the copper removal resin 42 before flowing out of the filter cavity 41 through the first liquid outlet 41 b , thereby giving full play to the adsorption effect of the copper removal resin 42 .

[0077] In some embodiments, the second liquid inlet 41 a is located below the filter bag 43 , which helps to improve the adsorption efficiency of the copper removal resin 42 coated in the filter bag 43 .

[0078] In some embodiments, the first liquid inlet 10 a is located at the top of the liquid inlet cavity 10 , the second liquid outlet 10 b is located at the bottom of the liquid inlet cavity 10 , and the first inlet 21 a is located at the bottom of the piston cavity 21 .

[0079] See also Figure 2 Another embodiment of the present application provides an electroplating production line 200, including the above-mentioned copper removal device 100, an electroplating tank 210 and a target 220. The hook 90 is hung on the target 220. The target 220 serves as an anode. The driving member 70 can be connected to the cathode and anode of the electroplating production line 200 without the need for an additional power supply. It is understood that the electroplating production line 200 also includes other common components of the electroplating equipment, such as a conveying device, a rectifier, etc., which will not be described in detail in this application.

[0080] The copper removal device 100 of the present application includes a liquid inlet chamber 10, a piston assembly 20, a connecting chamber 30 and a filter assembly 40. It has a simple structure and a smaller overall volume than the existing resin tower. It can be directly placed in the electroplating production line 200 for use without complicated assembly. It can be applied to old electroplating equipment that is not suitable for assembling resin towers, and has a wider range of applications.

[0081] The above is only the preferred implementation mode of the present application, and is not any form of limitation on the present application. Although the present application has been disclosed as the preferred implementation mode as above, it is not used to limit the present application. Any technician familiar with this profession can make some changes or modify the technical contents disclosed above into equivalent implementation modes without departing from the scope of the technical solution of the present application. However, any simple modification, equivalent change and modification made to the above implementation modes based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A copper removal device, comprising a liquid inlet cavity, a piston assembly, a connecting cavity and a filter assembly, characterized in that: The piston assembly includes a piston cavity, a piston and a push rod, the piston is slidably and sealingly arranged in the piston cavity, the push rod is connected to the piston and partially extends out of the piston cavity, the filter assembly includes a filter cavity and a copper removal resin arranged in the filter cavity, the liquid inlet cavity, the piston cavity, the connecting cavity and the filter cavity are connected in sequence, the liquid inlet cavity is provided with a first liquid inlet, the piston cavity is provided with a first inlet and a first outlet, the first inlet is connected to the liquid inlet cavity, the connecting cavity is provided with a second inlet and a second outlet, the second inlet is connected to the first outlet, the filter cavity is provided with a first liquid outlet, the liquid inlet cavity is provided with a first valve, the first valve is used to control the opening and closing of the first liquid inlet, the connecting cavity is provided with a second valve, the second valve is used to control the opening and closing of the second inlet, and the push rod is configured to push the piston to move toward or away from the bottom of the piston cavity; When the push rod pushes the piston to move away from the bottom of the piston cavity, the first valve is configured to open the first liquid inlet, and the second valve is configured to close the second inlet; as well as When the push rod pushes the piston to move toward the bottom of the piston cavity, the first valve is configured to close the first liquid inlet, and the second valve is configured to open the second inlet.

2. The copper removal device according to claim 1, characterized in that: The copper removal device further comprises a fixed frame, and the liquid inlet cavity, the piston cavity, the connecting cavity and the filter cavity are arranged in the fixed frame.

3. The copper removal device according to claim 2, characterized in that: The copper removal device also includes a hook, and the hook is connected to the fixing frame.

4. The copper removal device according to claim 3, characterized in that: The copper removal device also includes a fixing rod, which connects two adjacent hooks.

5. The copper removal device according to claim 4, characterized in that: The copper removal device also includes a driving member, which is connected to the push rod and is used to drive the push rod to push the piston to move relative to the piston cavity, and the driving member is installed on the fixing rod.

6. The copper removal device according to claim 1, characterized in that: The first valve includes a first filter element and a first blocking element. The first filter element is disposed in the liquid inlet cavity and divides the liquid inlet cavity into two parts. The first blocking element is placed on the first filter element and is located between the first filter element and the first liquid inlet.

7. The copper removal device according to claim 1, characterized in that: The second valve includes a second filter and a second blocking member, wherein the second filter is disposed in the connecting cavity and divides the connecting cavity into two parts, the second filter has a recessed portion sunken toward the bottom of the connecting cavity, and the second blocking member is disposed in the recessed portion.

8. The copper removal device according to claim 1, characterized in that: The filter assembly further comprises a filter bag, which is arranged in the filter cavity and covers the copper removal resin.

9. The copper removal device according to claim 1, characterized in that: The first liquid outlet is located at the top of the filter cavity.

10. An electroplating production line, characterized in that: The invention comprises a copper removal device as claimed in any one of claims 1 to 9.

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