Semiconductor precision component connecting support

Abstract

The utility model relates to the technical field of semiconductors, and discloses a semiconductor precision part connecting support which comprises a main body mechanism and a connecting mechanism, the connecting mechanism is located at the upper end of the main body mechanism, the main body mechanism comprises a supporting plate, a sliding groove and a reinforcing groove, the sliding groove is fixedly arranged at the upper end of the supporting plate, and the reinforcing groove is fixedly arranged at the lower end of the supporting plate. The reinforcing grooves are fixedly formed in the left end and the right end of the sliding groove. The main body mechanism further comprises a mounting plate, sliding blocks, a through groove and a placing plate, the mounting plate is movably mounted at the front end and the rear end of the upper end of the supporting plate, the sliding blocks are fixedly mounted at the left end and the right end of the lower end of the mounting plate, the sliding blocks are located at the inner ends of the sliding groove and the reinforcing groove, and the sliding blocks are movably connected with the sliding groove and the reinforcing groove; and the through groove is fixedly formed in the inner end of the mounting plate. According to the semiconductor precision component connecting bracket, the mounting main body mechanism and the connecting bracket are convenient to adjust according to the size of a semiconductor component, so that the adaptability is improved, the practicability is improved, and the use requirements are met.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a semiconductor precision component connection bracket. Background Art

[0002] Semiconductor refers to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields, and their importance is enormous.

[0003] The prior art patent document CN217482385U discloses a semiconductor precision component connecting bracket, including a base plate, a through hole is provided in the middle of the base plate, and supporting feet are connected to the bottom of the base plate near the four corners, the top of the supporting foot is provided with a T-shaped block, the bottom of the base plate is provided with a T-shaped slide groove in the horizontal direction corresponding to the outside of the T-shaped block, and the top of the supporting foot is provided with a first fixing hole connected to the bottom of the base plate, the bottom of the supporting foot is provided with a second fixing hole connected to the top of the mounting surface, the top of the base plate is connected to a fixing seat near the four corners, and the top of the fixing seat is provided with a clamping mechanism. The supporting feet arranged in the utility model are convenient to adjust according to the actual installation position, avoiding the problem that other objects at the mounting surface position affect the fixing position, and are convenient to adjust the fixing position according to actual needs, and can clamp and fix the installed semiconductor precision components.

[0004] However, the size of the semiconductor connection bracket in the prior art CN217482385U patent is fixed. The connection bracket in the prior art is not easy to adjust according to the size of the semiconductor component, has low adaptability, and reduces practicality. Utility Model Content

[0005] 1. Technical issues to be solved

[0006] The utility model aims to provide a semiconductor precision component connection bracket to solve the problem in the above background technology that the connection bracket is not convenient to be adjusted according to the size of the semiconductor component.

[0007] (II) Technical solution

[0008] To achieve the above object, the utility model provides the following technical solutions: a semiconductor precision component connection bracket, comprising a main body mechanism and a connection mechanism, wherein the connection mechanism is located at the upper end of the main body mechanism, the main body mechanism comprises a support plate, a slide groove and a reinforcement groove, the slide groove is fixedly arranged at the upper end of the support plate, and the reinforcement groove is fixedly arranged at the left and right ends of the slide groove;

[0009] The main body mechanism also includes a mounting plate, a slider, a through slot and a placement plate. The mounting plate is movably mounted on the front and rear ends of the upper end of the support plate, the slider is fixedly mounted on the left and right ends of the lower end of the mounting plate, the slider is located at the inner end of the slide slot and the reinforcement slot, the slider movably connects the slide slot and the reinforcement slot, the through slot is fixedly arranged at the inner end of the mounting plate, and the placement plate is movably mounted on the left and right ends of the inner end of the through slot.

[0010] Preferably, the connecting mechanism includes a groove, a movable block, a fixed plate, a threaded hole, a screw, a connecting block, a clamping block, a connecting groove, a rubber pad, a twisting block and a mounting block. The groove is fixedly arranged at the upper end of the mounting plate. The groove is located at the upper end of the through groove to facilitate the movement of the movable block and limit the movable block at the same time.

[0011] Preferably, the movable block is fixedly mounted on the front and rear ends of the upper end of the placement plate, the movable block is located at the inner end of the groove, the movable block is movably connected to the groove, and the movable block extends to the top of the groove, so as to follow the movement of the placement plate and improve practicality.

[0012] Preferably, the fixed plate is fixedly installed in the middle of the movable block, the threaded hole is fixedly arranged at the upper end of the fixed plate, the screw is threadedly installed at the upper end of the threaded hole, and the screw extends to the bottom of the threaded hole to facilitate driving the clamping block and the rubber pad to move downward.

[0013] Preferably, the connecting block is fixedly mounted on the lower end of the screw, the clamping block is movably mounted on the lower end of the screw, the connecting groove is fixedly arranged on the upper end of the clamping block, and the connecting groove is movably connected to the connecting block, so as to cooperate with the placement plate to fix the semiconductor precision components.

[0014] Preferably, the rubber pad is fixedly mounted on the lower end of the pressing block, the screw block is fixedly mounted on the upper end of the screw, and the mounting block is fixedly mounted on the lower end of the support plate, so as to prevent the pressing block from wearing the surface of the semiconductor component.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. The semiconductor precision component connection bracket can be easily adjusted according to the size of the semiconductor component by installing the main body mechanism, thereby improving adaptability, improving practicality, and meeting the use requirements;

[0017] 2. The semiconductor precision component connection bracket is installed with a connection mechanism, and the clamping block is convenient for cooperating with the placement plate to fix the semiconductor precision component, and the rubber pad is convenient for preventing the clamping block from wearing the surface of the semiconductor component, thereby improving practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0019] Figure 2 It is a partial structural diagram of the main mechanism of the utility model;

[0020] Figure 3 The local structure diagram of the connection mechanism of the utility model is shown in FIG. Figure 1 ;

[0021] Figure 4 The local structure diagram of the connection mechanism of the utility model is shown in FIG. Figure 2 .

[0022] In the figure: 1. main body; 101. support plate; 102. slide groove; 103. reinforcement groove; 104. mounting plate; 105. slider; 106. through groove; 107. placement plate; 2. connecting mechanism; 201. groove; 202. movable block; 203. fixed plate; 204. threaded hole; 205. screw; 206. connecting block; 207. clamping block; 208. connecting groove; 209. rubber pad; 210. screw block; 211. mounting block. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-Figure 4 The utility model provides a technical solution: a semiconductor precision component connection bracket, including a main body mechanism 1 and a connection mechanism 2, the connection mechanism 2 is located at the upper end of the main body mechanism 1, the main body mechanism 1 includes a support plate 101, a slide groove 102 and a reinforcement groove 103, the slide groove 102 is fixedly arranged at the upper end of the support plate 101, and the reinforcement groove 103 is fixedly arranged at the left and right ends of the slide groove 102;

[0025] The main body mechanism 1 also includes a mounting plate 104, a slider 105, a through slot 106 and a placement plate 107. The mounting plate 104 is movably mounted at the front and rear ends of the upper end of the support plate 101. The slider 105 is fixedly mounted at the left and right ends of the lower end of the mounting plate 104. The slider 105 is located at the inner end of the slide slot 102 and the reinforcement slot 103. The slider 105 movably connects the slide slot 102 and the reinforcement slot 103. The through slot 106 is fixedly arranged at the inner end of the mounting plate 104. The placement plate 107 is movably mounted at the left and right ends of the inner end of the through slot 106.

[0026] The connecting mechanism 2 includes a groove 201, a movable block 202, a fixed plate 203, a threaded hole 204, a screw 205, a connecting block 206, a pressing block 207, a connecting groove 208, a rubber pad 209, a screw block 210 and a mounting block 211. The groove 201 is fixedly arranged at the upper end of the mounting plate 104, the groove 201 is located at the upper end of the through groove 106, the movable block 202 is fixedly installed at the front and rear ends of the upper end of the placement plate 107, the movable block 202 is located at the inner end of the groove 201, the movable block 202 is movably connected to the groove 201, and the movable block 202 extends to Above the groove 201, the fixed plate 203 is fixedly installed in the middle of the movable block 202, the threaded hole 204 is fixedly set at the upper end of the fixed plate 203, the screw 205 is threadedly installed at the upper end of the threaded hole 204, the screw 205 extends to the bottom of the threaded hole 204, the connecting block 206 is fixedly installed at the lower end of the screw 205, the pressing block 207 is movably installed at the lower end of the screw 205, the connecting groove 208 is fixedly set at the upper end of the pressing block 207, the connecting groove 208 is movably connected to the connecting block 206, and the rubber pad 209 is fixedly installed at the pressing block 207. At the lower end, the screw block 210 is fixedly installed on the upper end of the screw rod 205, and the mounting block 211 is fixedly installed on the lower end of the support plate 101. First, when using the semiconductor component precision component connection bracket, the staff first installs the support plate 101 in a suitable position through the mounting block 211. The staff can adjust the connection bracket according to the size of the semiconductor component. The mounting plate 104 moves back and forth in the slide groove 102 and the reinforcement groove 103 through the slider 105. The mounting plate 104 can be adjusted to a suitable position according to the width of the semiconductor component. The placement plate 107 can be The placement plate 107 moves left and right in the through slot 106, and the movable block 202 moves synchronously when it moves. The placement plate 107 can be adjusted to a suitable position according to the length of the semiconductor component, and then the semiconductor component is placed on the placement plate 107. The placement plate 107 supports the semiconductor component, and then the screw block 210 is turned to rotate the screw 205. The screw 205 drives the clamping block 207 and the rubber pad 209 to move downward, and cooperates with the placement plate 107 to fix the semiconductor component. The rubber pad 209 can prevent the clamping block 207 from wearing the surface of the semiconductor component.

[0027] Working principle: First, when using the semiconductor component precision component connecting bracket, the staff first installs the support plate 101 in the appropriate position through the mounting block 211. The staff can adjust the connecting bracket according to the size of the semiconductor component. The mounting plate 104 moves forward and backward in the slide groove 102 and the reinforcement groove 103 through the slider 105. The mounting plate 104 can be adjusted to a suitable position according to the width of the semiconductor component. The placement plate 107 can move left and right in the through groove 106. When moving, the placement plate 107 will drive the movable block 202 to move synchronously. The placement plate 107 can be adjusted to a suitable position according to the length of the semiconductor component, and then the semiconductor component is placed on the placement plate 107. The placement plate 107 supports the semiconductor component, and then the screw block 210 is turned to rotate the screw 205. The screw 205 drives the clamping block 207 and the rubber pad 209 to move downward, and cooperates with the placement plate 107 to fix the semiconductor component. The rubber pad 209 can prevent the clamping block 207 from wearing the surface of the semiconductor component.

[0028] Finally, it should be noted that the above content is only used to illustrate the technical solution of the utility model, rather than to limit the protection scope of the utility model. Simple modifications or equivalent substitutions of the technical solution of the utility model by ordinary technicians in this field do not deviate from the essence and scope of the technical solution of the utility model.

Claims

1. A semiconductor precision component connection bracket, comprising a main body mechanism (1) and a connection mechanism (2), characterized in that: The connecting mechanism (2) is located at the upper end of the main mechanism (1); the main mechanism (1) comprises a support plate (101), a slide groove (102) and a reinforcement groove (103); the slide groove (102) is fixedly arranged at the upper end of the support plate (101); and the reinforcement groove (103) is fixedly arranged at the left and right ends of the slide groove (102); The main body mechanism (1) further comprises a mounting plate (104), a slider (105), a through slot (106) and a placement plate (107); the mounting plate (104) is movably mounted at the front and rear ends of the upper end of the support plate (101); the slider (105) is fixedly mounted at the left and right ends of the lower end of the mounting plate (104); the slider (105) is located at the inner ends of the slide slot (102) and the reinforcement slot (103); the slider (105) movably connects the slide slot (102) and the reinforcement slot (103); the through slot (106) is fixedly arranged at the inner end of the mounting plate (104); and the placement plate (107) is movably mounted at the left and right ends of the inner end of the through slot (106).

2. A semiconductor precision component connection bracket according to claim 1, characterized in that: The connecting mechanism (2) comprises a groove (201), a movable block (202), a fixed plate (203), a threaded hole (204), a screw rod (205), a connecting block (206), a pressing block (207), a connecting groove (208), a rubber pad (209), a screw block (210) and a mounting block (211); the groove (201) is fixedly arranged at the upper end of the mounting plate (104); and the groove (201) is located at the upper end of the through groove (106).

3. A semiconductor precision component connection bracket according to claim 2, characterized in that: The movable block (202) is fixedly mounted at the front and rear ends of the upper end of the placement plate (107), the movable block (202) is located at the inner end of the groove (201), the movable block (202) is movably connected to the groove (201), and the movable block (202) extends to the top of the groove (201).

4. A semiconductor precision component connection bracket according to claim 3, characterized in that: The fixed plate (203) is fixedly mounted in the middle of the movable block (202), the threaded hole (204) is fixedly arranged at the upper end of the fixed plate (203), the screw rod (205) is threadedly mounted at the upper end of the threaded hole (204), and the screw rod (205) extends to the bottom of the threaded hole (204).

5. The semiconductor precision component connection bracket according to claim 4, characterized in that: The connecting block (206) is fixedly mounted on the lower end of the screw rod (205), the pressing block (207) is movably mounted on the lower end of the screw rod (205), the connecting groove (208) is fixedly arranged on the upper end of the pressing block (207), and the connecting groove (208) is movably connected to the connecting block (206).

6. A semiconductor precision component connection bracket according to claim 5, characterized in that: The rubber pad (209) is fixedly mounted on the lower end of the pressing block (207), the screw block (210) is fixedly mounted on the upper end of the screw rod (205), and the mounting block (211) is fixedly mounted on the lower end of the support plate (101).

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