Water cooling unit and thermal cycler

Abstract

The utility model relates to a water cooling device, and discloses a water cooling unit and a thermal cycler, which comprise a fan (4), a water cooling plate assembly (1), a water pump (2) and an air-liquid heat exchanger (3), the water cooling plate assembly (1) is provided with a first water inlet (11) and a first water outlet (12); the air-liquid heat exchanger (3) comprises a second water outlet (31) and a second water inlet (32); the first water inlet (11) is connected with the second water outlet (31) through a pipeline, the first water inlet (11) is connected with one end of the water pump (2), and the other end of the water pump (2) is connected with the second water outlet (31); the first water outlet (12) is connected with the second water inlet (32) through a pipeline; and the fan (4) is used for performing air circulation on the air-liquid heat exchanger (3). The water cooling unit is good in water cooling temperature uniformity and high in heat exchange efficiency.

Description

Technical Field

[0001] The utility model relates to a water cooling device, in particular to a water cooling unit and a thermal cycler. Background Art

[0002] When liquid cooling system is used for heat dissipation of thermal cycler, water cooling plate is one of the most important components.

[0003] The sample holder carries the sample tube and exchanges heat with the liquid reaction liquid in the tube to complete the PCR reaction. The liquid cooling and heat dissipation system is applied to the heat dissipation of the thermal cycler. The semiconductor refrigerator transfers heat to the coolant flowing in the water-cooled plate. After the coolant flows out of the water-cooled plate, it enters the air-liquid heat exchanger to exchange heat with the air, and finally the heat is discharged to the ambient air. The cooled coolant flows out of the air-liquid heat exchanger and circulates again to the water-cooled plate to exchange heat with the sample holder.

[0004] The power for the cooling liquid to flow is provided by a water pump. After heat exchange, there is a difference in liquid temperature between the coolant entering the water inlet of the water cooling plate and leaving the water outlet of the water cooling plate, resulting in uneven temperature distribution on the contact surface between the water cooling plate and the semiconductor refrigerator, which affects the temperature uniformity of the sample tubes distributed at different positions on the sample holder. The temperature uniformity in each sample tube is an important performance indicator of the thermal cycler, which will affect the efficiency of the PCR reaction. Therefore, when the liquid cooling heat dissipation system is applied to the thermal cycler, the structure of the water cooling plate needs to be carefully optimized.

[0005] For example, the prior art CN208577718U discloses a structural solution for a water cooling plate of a liquid cooling system for a PCR instrument. The main feature of this technical solution is the use of a U-shaped flow channel, with the two ends of the U-shaped flow channel being the water inlet and the water outlet respectively. Since the medium water in the U-shaped flow channel is constantly flowing, after heat exchange, the water temperature at the water outlet is the highest and the water temperature at the water inlet is the lowest. The two parallel flow channels on the U-shaped flow channel have a low temperature on one side and a high temperature on the other side, and the interval area in the middle of the U-shaped flow channel is a good conductor of heat, which quickly exchanges heat on both sides, so that the temperature of the entire U-shaped flow channel area remains uniform, resulting in the temperature rise of the coolant not being fully used for heat exchange with the sample holder. Utility Model Content

[0006] The utility model provides a water cooling unit and a thermal cycler to solve the problem that the temperature rise of the cooling liquid in the water cooling unit in the prior art cannot be fully used for heat exchange of the sample holder and the heat exchange efficiency is low.

[0007] In order to solve the above technical problems, the utility model is solved by the following technical solutions:

[0008] A water cooling unit comprises a fan, a water cooling plate assembly, a water pump and an air-liquid heat exchanger; the water cooling plate assembly is provided with a first water inlet and a first water outlet; the air-liquid heat exchanger comprises a second water outlet and a second water inlet; the first water inlet is connected to the second water outlet through a pipeline, and the first water inlet is connected to one end of the water pump, and the other end of the water pump is connected to the second water outlet; the first water outlet is connected to the second water inlet through a pipeline; the fan is used for circulating air in the air-liquid heat exchanger.

[0009] Preferably, the water-cooling plate assembly comprises a water-cooling plate box body, on which a semiconductor refrigeration sheet is placed.

[0010] Preferably, the semiconductor refrigeration sheets are evenly placed on the water-cooled plate box.

[0011] Preferably, the water-cooled plate box includes a refrigeration base frame, a refrigeration top plate and a sealing ring. The refrigeration top plate is located above the refrigeration base frame and is sealed by the sealing ring.

[0012] Preferably, a flow channel partition is provided in the water cooling plate box, and the flow channel partition is evenly placed in the water cooling plate box.

[0013] Preferably, the flow channel partition is made of heat insulating material.

[0014] In order to solve the above technical problems, the utility model also provides a thermal cycler, including a thermal cycler box, in which a thermal cycler sample holder assembly is arranged; the sample holder assembly includes a sample holder; the sample holder assembly also includes the water cooling unit, the thermal cycler sample holder is located on the water cooling plate assembly of the water cooling unit, and the semiconductor cooling plate is located between the thermal cycler sample holder and the water cooling plate assembly.

[0015] Preferably, the thermal cycler housing is pluggably connected to the thermal cycler sample holder assembly and provides current to the thermal cycler sample holder assembly.

[0016] The design of the utility model achieves the following technical effects:

[0017] The utility model has good water cooling temperature uniformity and high heat exchange efficiency.

[0018] The water cooling unit designed by the utility model can evenly distribute the temperature on the heat exchange surface of the water cooling plate.

[0019] The utility model adopts low thermal conductivity heat insulation material such as plastic to prevent or reduce heat exchange between channels. Plastic is light in weight, low in cost, easy to form various complex channel structures, can resist corrosion from various chemical substances, and will not deform after long-term immersion in liquid.

[0020] The utility model adopts a plug-in connection mode between the thermal cycler box body and the thermal cycler sample holder assembly, which makes it convenient to replace the sample holder assembly and reduces maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural diagram of a water cooling unit of the utility model;

[0022] Figure 2 This is a structural diagram of a water-cooling plate box of the utility model;

[0023] Figure 3 This is a schematic diagram of water flow in the water cooling plate box of the utility model;

[0024] Figure 4 This is a structural diagram of the refrigeration base of the utility model;

[0025] Figure 5 It is a structural diagram of the thermal cycler of the utility model.

[0026] in,

[0027] 1—Water cooling plate assembly,

[0028] 11—First water inlet,

[0029] 12—First water outlet,

[0030] 2—Water pump,

[0031] 3—Air-to-liquid heat exchanger,

[0032] 31—Second water outlet,

[0033] 32—Second water inlet,

[0034] 4—Fan,

[0035] 13—Water cooling plate box,

[0036] 14—Semiconductor refrigeration chip,

[0037] 15—Refrigeration base frame,

[0038] 16—Refrigeration top plate,

[0039] 17—Sealing ring,

[0040] 18—Flow channel baffle,

[0041] 5—Thermal cycler box,

[0042] 6—Electrical sockets,

[0043] 7—Sample holder. DETAILED DESCRIPTION

[0044] The utility model is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0045] Example 1

[0046] A water cooling unit includes a fan 4, a water cooling plate assembly 1, a water pump 2 and an air-liquid heat exchanger 3; the water cooling plate assembly 1 is provided with a first water inlet 11 and a first water outlet 12; the air-liquid heat exchanger 3 includes a second water outlet 31 and a second water inlet 32; the first water inlet 11 is connected to the second water outlet 31 through a pipeline, and the first water inlet 11 is connected to one end of the water pump 2, and the other end of the water pump 2 is connected to the second water outlet 31; the first water outlet 12 is connected to the second water inlet 32 ​​through a pipeline; the fan 4 is used to circulate air to the air-liquid heat exchanger 3. The temperature distribution on the heat exchange surface of the water cooling plate can be uniform. In this embodiment, the fan 4 is a fan, which is used to accelerate the circulation of air in the air-liquid heat exchanger 3 to achieve the effect of cooling the air-liquid heat exchanger.

[0047] The water-cooling plate assembly 1 comprises a water-cooling plate box 13 , on which a semiconductor cooling sheet 14 is placed.

[0048] The semiconductor cooling sheets 14 are evenly placed on the water cooling plate box 13. The water cooling plate box 13 includes a cooling base frame 15, a cooling top plate 16 and a sealing ring 17. The cooling top plate 16 is located above the cooling base frame 15 and is sealed by the sealing ring 17.

[0049] A flow channel baffle 18 is provided in the water cooling plate box 13 , and the flow channel baffle 18 is evenly placed in the water cooling plate box 13 .

[0050] The material of the flow channel partition 18 is a heat insulating material.

[0051] Example 2

[0052] Different from the first embodiment, the present embodiment adopts a water pump 2 with controllable forward and reverse water discharge to improve the temperature uniformity of the heat exchange surface of the water-cooled plate.

[0053] By using a water pump 2 with controllable forward and reverse water discharge and switching the direction of water flow at the water inlet and the water outlet at intervals, the temperature distribution on the heat exchange surface of the water cooling plate can be uniform. One of the water pumps 2 with controllable forward and reverse water discharge specifically used includes a water pump 2 with a double gear meshing reverse rotation drainage principle, such as the commercially available Japanese NIDEC high-pressure gear pump, model NTGM.

[0054] Example 3

[0055] Based on Example 1, the heat insulation material of this example is plastic material. Plastic is light in weight, low in cost, easy to form various complex flow channel structures, can resist corrosion from various chemical substances, and will not deform after long-term immersion in liquid. Therefore, plastic is the preferred material for low thermal conductivity.

[0056] Example 4

[0057] Based on Example 1, different from the above examples, in this example, not only the flow channel partition 18 is made of thermal insulation material, but also all other components of the water cooling unit are made of thermal insulation material with low thermal conductivity except for the cooling top plate 16 which is not made of thermal insulation material with low thermal conductivity.

[0058] Example 5

[0059] Based on the first embodiment, the present embodiment is a thermal cycler, comprising a thermal cycler housing 5, in which a thermal cycler sample holder assembly is arranged; the sample holder assembly comprises a sample holder 7 and the water cooling unit, the thermal cycler sample holder 7 is located on the water cooling plate assembly 1 of the water cooling unit, and the semiconductor cooling sheet 14 is located between the thermal cycler sample holder 7 and the water cooling plate assembly 1. The thermal cycler sample holder 7 and the water cooling plate assembly 1 are fixed by screws or fixing glue, so that the semiconductor cooling sheet 14 is in close contact with the thermal cycler sample holder 7 and the water cooling plate assembly 1.

[0060] Electrical sockets 6 are provided on both sides of the thermal cycler housing 5. The electrical sockets 6 can be male or female, corresponding to the electrical sockets 6 in the thermal cycler sample holder assembly, realizing plug-in connection and providing current to the thermal cycler sample holder assembly.

[0061] The method for replacing the liquid-cooled sample holder assembly includes: opening the upper cover of the thermal cycler, or pulling out the liquid-cooled sample holder assembly to expose the liquid-cooled sample holder assembly. Unlock the assembly locking mechanism, which is not necessary. Hold the assembly with both hands and lift it in the separation direction to separate the male or female hole of the electrical socket 6 on the assembly from the female hole or male head of the electrical socket 6 corresponding to the chassis. The liquid-cooled sample holder assembly can be taken out of the thermal cycler case 5. The method for installing a liquid-cooled sample holder assembly into the chassis is the same, except that the assembly is held with both hands to align the male or female hole of the electrical socket 6 on the assembly with the female hole or male head of the electrical socket 6 corresponding to the chassis and insert it into the electrical sockets 6 provided on both sides of the thermal cycler case 5. With the thermal cycler of this design, the process of replacing the sample holder assembly is very convenient.

[0062] The sample holder 7 carries the sample tube and exchanges heat with the liquid reaction liquid in the sample tube to complete the PCR reaction. The water cooling unit is used for heat dissipation of the thermal cycler. The semiconductor refrigeration plate transfers heat to the coolant flowing in the water cooling plate box. After the coolant flows out of the water cooling plate box, it enters the air-liquid heat exchanger to exchange heat with the air, and finally the heat is discharged to the ambient air. The cooled coolant flows out of the air-liquid heat exchanger and circulates again into the water cooling plate box to exchange heat with the sample holder 7.

[0063] The power for the cooling liquid to flow is provided by a water pump. After heat exchange, there is a difference in liquid temperature between the coolant entering the water inlet of the water-cooled plate box and leaving the water outlet of the water-cooled plate, resulting in uneven temperature distribution on the contact surface between the water-cooled plate and the semiconductor refrigerator, affecting the temperature uniformity in the sample tubes distributed at different positions on the sample holder. The temperature uniformity in each sample tube is an important performance indicator of the thermal cycler and will affect the efficiency of the PCR reaction. The implementation of this technical solution improves the heat exchange efficiency between the water-cooled plate assembly and the semiconductor refrigeration sheet, improves the heating and cooling performance of the thermal cycler, and reduces maintenance costs while ensuring the uniformity of temperature distribution on the surface of the water-cooled plate.

[0064] Although this embodiment is designed for a thermal cycler, it can also provide a reference for product design using liquid cooling and heat dissipation systems in other industries, such as temperature cooling of battery packs for new energy vehicles.

Claims

1. A water cooling unit, comprising a fan (4), a water cooling plate assembly (1), a water pump (2) and an air-liquid heat exchanger (3); characterized in that: The water-cooling plate assembly (1) is provided with a first water inlet (11) and a first water outlet (12); the air-liquid heat exchanger (3) comprises a second water outlet (31) and a second water inlet (32); the first water inlet (11) and the second water outlet (31) are connected via a pipeline, and the first water inlet (11) is connected to one end of a water pump (2), and the other end of the water pump (2) is connected to the second water outlet (31); the first water outlet (12) is connected to the second water inlet (32) via a pipeline; and the fan (4) is used to circulate air in the air-liquid heat exchanger (3).

2. A water cooling unit according to claim 1, characterized in that: The water-cooling plate assembly (1) comprises a water-cooling plate box (13), on which a semiconductor refrigeration sheet (14) is placed.

3. A water cooling unit according to claim 2, characterized in that: The semiconductor refrigeration sheets (14) are evenly placed on the water-cooling plate box (13).

4. A water cooling unit according to claim 3, characterized in that: The water-cooled plate box (13) comprises a refrigeration base frame (15), a refrigeration top plate (16) and a sealing ring (17); the refrigeration top plate (16) is located above the refrigeration base frame (15) and is sealed by the sealing ring (17).

5. A water cooling unit according to claim 4, characterized in that: A flow channel partition (18) is provided in the water cooling plate box (13), and the flow channel partition (18) is evenly placed in the water cooling plate box (13).

6. A water cooling unit according to claim 5, characterized in that: The material of the flow channel partition (18) is a heat insulating material.

7. A thermal cycler, comprising a thermal cycler housing (5), wherein a thermal cycler sample holder assembly is arranged in the thermal cycler housing (5); the sample holder assembly comprises a sample holder (7); characterized in that: The sample holder assembly also includes a water cooling unit as described in any one of claims 1 to 6, the thermal cycler sample holder (7) is located on a water cooling plate assembly (1) of the water cooling unit, and the semiconductor refrigeration sheet (14) is located between the thermal cycler sample holder (7) and the water cooling plate assembly (1).

8. A thermal cycler according to claim 7, characterized in that: The thermal cycler box (5) is plug-in connected to the thermal cycler sample seat assembly and provides electric current to the thermal cycler sample seat assembly.

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