Sensor and electronic device

Abstract

The utility model discloses a sensor and an electronic device, the sensor comprises a housing and a sensing assembly, the housing comprises a substrate and a housing, one side of the housing is provided with an opening, the substrate covers the opening and forms a cavity with the housing, the opening of the housing is covered with a reflection lens, and the reflection lens is provided with an air hole communicated with the cavity; the sensing assembly comprises an integrated circuit chip, an MEMS chip and an optical detection chip, the integrated circuit chip is installed on the substrate, the MEMS chip and the optical detection chip are installed on the integrated circuit chip, the optical detection chip is arranged corresponding to the reflection lens, and a heating module is integrated on the integrated circuit chip. According to the utility model, through cooperation of the reflection lens, the optical detection chip and the heating module, the heating module is started to evaporate the liquid when the air hole is shielded by the liquid, so that the liquid on the surface is prevented from influencing the detection precision of the sensor or damaging the sensor, and the reliability and the detection precision of the sensor are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of micro-electromechanical systems, in particular to a sensor and an electronic device. Background Art

[0002] At present, the application of sensors is becoming more and more extensive, and there are more and more application scenarios. This requires that sensors can be used in various harsh environments. When the sensor is splashed with water or other liquids, the sensor is required to be able to accurately identify and then heat and evaporate to avoid sensor failure or large deviation in detection accuracy due to the presence of water or other liquids on the sensor surface.

[0003] For example, when water falls on a humidity sensor, it cannot evaporate in time, causing the humidity detection value of the sensor to always be 100% RH, and when water falls on a pressure sensor, the pressure detection deviation of the sensor is large, and the actual pressure value cannot be truly detected. Therefore, the current sensors have the defects of poor reliability and low detection accuracy. Utility Model Content

[0004] The main purpose of the utility model is to provide a sensor and an electronic device, aiming to solve the problems of poor reliability and low detection accuracy of existing sensors.

[0005] To achieve the above object, the utility model provides a sensor, comprising:

[0006] A housing, the housing comprising a substrate and an outer shell, one side of the outer shell being open, the substrate covering the open portion and forming a cavity with the outer shell, an opening being formed on a side of the outer shell away from the substrate, the opening being covered with a reflective lens, and the reflective lens being provided with an air vent connected to the cavity;

[0007] A sensor component, the sensor component includes an integrated circuit chip, a MEMS chip and an optical detection chip, the integrated circuit chip is mounted on the substrate, the MEMS chip and the optical detection chip are mounted on the integrated circuit chip, the optical detection chip is arranged corresponding to the reflective lens, and a heating module is integrated on the integrated circuit chip.

[0008] Preferably, the optical detection chip is arranged directly below the air hole.

[0009] Preferably, the top of the housing is recessed downward to form a mounting portion, the mounting portion surrounds the opening, and the reflective lens is mounted on the mounting portion.

[0010] Preferably, the mounting portion comprises a connecting section and a bearing section, the connecting section is bent toward the substrate, the bearing section is connected to the connecting section and is arranged parallel to the substrate, and the bottom of the reflective lens abuts against the top of the bearing section.

[0011] Preferably, the reflective lens and the bearing section are bonded together by a sealing adhesive.

[0012] Preferably, a gap is formed between the optical detection chip and the integrated circuit chip, and the gap is filled with a sealing adhesive.

[0013] Preferably, the housing and the substrate are sealed and connected to each other through a conductive adhesive.

[0014] Preferably, the shell includes a top plate and side plates, the top of the side plate is connected to the outer periphery of the top plate, the bottom of the side plate surrounds the opening, and the connection between the top plate and the side plate is rounded.

[0015] Preferably, the MEMS chip is one of a pressure sensor chip, a temperature and humidity sensor chip, a gas sensor chip and an acoustic sensor chip.

[0016] The utility model also provides an electronic device, wherein the electronic device is applied with the above-mentioned sensor.

[0017] In the technical solution of the utility model, a reflective lens is arranged on the top of the shell, and a vent hole is opened on the reflective lens. Under normal use, there is no liquid on the top of the shell, and the light emitted by the optical detection chip is just reflected back by the reflective lens on the top. The optical chip will determine that there is no liquid on the sensor surface, and will not send a signal to the integrated circuit chip. The heating module is in a stopped state. When there is liquid on the shell surface that blocks the reflective lens, the light emitted by the optical detection chip is scattered and refracted by the droplets, and cannot be reflected back to the optical detection chip through the rod reflective lens. At this time, the optical detection chip determines that there is liquid on the sensor surface, sends a signal to the integrated circuit chip to start the heating module, and heats to evaporate the liquid on the shell until the optical detection chip can receive the reflected light again, and stops heating. At this time, the liquid on the shell surface is completely evaporated, avoiding the liquid on the surface from affecting the detection accuracy of the sensor or damaging the sensor, thereby improving the reliability and detection accuracy of the sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0019] Figure 1 This is a cross-sectional schematic diagram of a sensor according to an embodiment of the present utility model;

[0020] Figure 2 It is a top view schematic diagram of a sensor according to an embodiment of the utility model.

[0021] Description of Figure Numbers:

[0022] Label name Label name 1 sensor 14 roof 10 case 15 Side panels 11 substrate 16 Reflective lens 12 shell 161 Ventilation holes 121 Cavity 20 Sensing components 122 Opening 21 Integrated Circuit Chip 13 Installation Department 22 MEMS Chips 131 Connection segment 23 Optical detection chip 132 Load-bearing section

[0023] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0026] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0027] The utility model provides a sensor 1.

[0028] Please combine Figure 1 and Figure 2The sensor 1 of this embodiment includes a shell 10 and a sensor component 20. The shell 10 includes a substrate 11 and a shell 12. One side of the shell 12 is open. The substrate 11 covers the open position and forms a cavity 121 with the shell 12. An opening 122 is formed on the side of the shell 12 away from the substrate. A reflective lens 16 is covered at the opening 122. The reflective lens 16 is provided with an air vent 161 connected to the cavity. The sensor component 20 includes an integrated circuit chip 21, a MEMS chip and an optical detection chip 23. The integrated circuit chip 21 is mounted on the substrate 11. The MEMS chip and the optical detection chip 23 are mounted on the integrated circuit chip 21. The optical detection chip 23 is arranged corresponding to the reflective lens 16. A heating module is integrated on the integrated circuit chip 21.

[0029] It can be understood that the MEMS chip can be a pressure sensor chip, a temperature sensor chip, etc. Since most of the sensors 1 of this type have a housing 10 that is provided with an air vent 161 connected to the outside for detection, the present application retains the air vent 161 while reconfiguring a portion of the housing 12 to be a reflective lens 16, and adding a heating module and an optical detection chip 23 to the integrated circuit chip 21 (ASIC chip).

[0030] In the technical solution of the utility model, a reflective lens 16 is arranged on the top of the housing 12, and a vent hole 161 is provided on the reflective lens 16. In normal use, there is no liquid on the top of the housing 12, and the light emitted by the optical detection chip 23 is just reflected back by the reflective lens 16 on the top. The optical chip will determine that there is no liquid on the surface of the sensor 1, and will not send a signal to the integrated circuit chip 21. The heating module is in a stopped state. When there is liquid on the surface of the housing 12 to block the reflective lens 16, the light emitted by the optical detection chip 23 is scattered and refracted by the droplets, and cannot be reflected back to the optical detection chip 23 through the rod reflective lens 16. At this time, the optical detection chip 23 determines that there is liquid on the surface of the sensor 1, sends a signal to the integrated circuit chip 21 to start the heating module, and heats to evaporate the liquid on the housing 12 until the optical detection chip 23 can receive the reflected light again, and stops heating. At this time, the liquid on the surface of the housing 12 is completely evaporated, which prevents the surface liquid from affecting the detection accuracy of the sensor 1 or damaging the sensor 1, thereby improving the reliability and detection accuracy of the sensor 1.

[0031] Furthermore, the optical detection chip 23 is arranged directly below the air hole 161. The optical detection chip 23 is arranged directly below the air hole 161. When the volume of the droplet on the top of the reflective lens 16 is small, as long as it blocks the air hole 161, it can be detected by the optical detection chip 23, thereby improving the detection sensitivity of the liquid.

[0032] In one embodiment, the top of the housing 12 is recessed downward to form a mounting portion 13, the mounting portion 13 surrounds an opening 122, and the reflective lens 16 is mounted on the mounting portion 13. The top of the housing 12 is recessed downward to form a mounting portion 13 for limiting the reflective lens 16, and the reflective lens 16 is limited by the side wall of the mounting portion 13 to prevent the reflective lens 16 from being offset, resulting in failure to accurately detect the liquid at the vent hole 161.

[0033] Furthermore, the mounting portion 13 includes a connecting section 131 and a bearing section 132. The connecting section 131 is bent toward the substrate 11. The bearing section 132 is connected to the connecting section 131 and is arranged parallel to the substrate 11. The bottom of the reflective lens 16 abuts against the top of the bearing section 132. The reflective lens 16 is supported by the bearing section 132 and limited by the connecting section 131. The bearing section 132 is arranged parallel to the substrate 11, so that the reflective lens 16 can be parallel to the optical detection chip 23, so that the reflective lens 16 can reflect the light emitted by the optical detection chip 23 back along the original path, thereby improving the reliability of the optical detection chip 23.

[0034] Specifically, the reflective lens 16 is bonded to the bearing section 132 by a sealing adhesive. The reflective lens 16 is sealed to the bearing section 132 to prevent liquid from penetrating into the cavity 121 from the gap to cause a short circuit, thereby improving the safety of the sensor 1 and extending the life of the sensor 1. At the same time, the adhesive bonding prevents the reflective lens 16 from being damaged during use, thereby improving the stability of the sensor 1.

[0035] In one embodiment, a gap is formed between the optical detection chip 23 and the integrated circuit chip 21, and the gap is filled with a sealing adhesive. Since the integrated circuit chip 21 generates heat itself and has an internally integrated heating module, the optical detection chip 23 and the integrated circuit chip 21 are spaced apart, and the sealing adhesive is used as a heat insulation layer to prevent the heat on the integrated circuit chip 21 from being directly transferred to the optical detection chip 23 and causing damage, thereby improving the stability and performance of the sensor 1.

[0036] In one embodiment, the housing 12 and the substrate 11 are sealed and connected by a conductive adhesive. By connecting the housing 12 and the substrate 11 together using a conductive adhesive, a continuous conductive shielding layer can be formed, effectively reducing or preventing the impact of external interference on the performance of the sensor 1.

[0037] Specifically, the housing 12 includes a top plate 14 and a side plate 15, the top of the side plate 15 is connected to the outer periphery of the top plate 14, the bottom of the side plate 15 is open, and the connection between the top plate 14 and the side plate 15 is rounded. The connection between the top plate 14 and the side plate 15 is rounded, so that part of the liquid at the top edge of the housing 12 can flow away with the rounded edge, thereby avoiding liquid accumulation on the top of the housing 12 and improving the stability of the sensor 1.

[0038] In one embodiment, the MEMS chip is one of a pressure sensor chip, a temperature and humidity sensor chip, a gas sensor chip, and an acoustic sensor chip. It can be understood that the combined structure of the optical detection chip 23 and the reflective lens 16 of the present application can be applied to any housing 12 itself, that is, a sensor 1 structure with a vent hole 161, such as the vent hole 161 on the pressure sensor 1 for detecting the pressure difference, the vent hole 161 on the temperature and humidity sensor 1 and the gas sensor 1 for allowing ambient air to enter the cavity, and the vent hole 161 on the acoustic sensor 1 for receiving vibrations, so the MEMS chip can be selected from one of the above-mentioned multiple chips.

[0039] The utility model also provides an electronic device, which is applied with the above-mentioned sensor 1. The specific structure of the sensor 1 refers to the above-mentioned embodiment. Since the electronic device adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

[0040] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the concept of the utility model, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.

Claims

1. A sensor, characterized in that: include: A housing, the housing comprising a substrate and an outer shell, one side of the outer shell being open, the substrate covering the open portion and forming a cavity with the outer shell, an opening being formed on a side of the outer shell away from the substrate, the opening being covered with a reflective lens, and the reflective lens being provided with an air vent connected to the cavity; A sensor component, the sensor component includes an integrated circuit chip, a MEMS chip and an optical detection chip, the integrated circuit chip is mounted on the substrate, the MEMS chip and the optical detection chip are mounted on the integrated circuit chip, the optical detection chip is arranged corresponding to the reflective lens, and a heating module is integrated on the integrated circuit chip.

2. The sensor according to claim 1, characterized in that The optical detection chip is arranged directly below the air hole.

3. The sensor according to claim 1, characterized in that The top of the housing is recessed downward to form a mounting portion, the mounting portion surrounds the opening, and the reflective lens is mounted on the mounting portion.

4. The sensor according to claim 3, characterized in that The mounting portion includes a connecting section and a bearing section, the connecting section is bent toward the substrate, the bearing section is connected to the connecting section and is arranged parallel to the substrate, and the bottom of the reflective lens abuts against the top of the bearing section.

5. The sensor according to claim 4, characterized in that The reflective lens is bonded to the bearing section by a sealing adhesive.

6. The sensor according to any one of claims 1 to 5, characterized in that A gap is formed between the optical detection chip and the integrated circuit chip, and the gap is filled with a sealing adhesive.

7. The sensor according to any one of claims 1 to 5, characterized in that The housing and the substrate are sealed and connected to each other through a conductive adhesive.

8. The sensor according to any one of claims 1 to 5, characterized in that The shell comprises a top plate and side plates, the top of the side plate is connected to the outer periphery of the top plate, the bottom of the side plate surrounds the opening, and the connection between the top plate and the side plate is rounded.

9. The sensor according to any one of claims 1 to 5, characterized in that The MEMS chip is one of a pressure sensor chip, a temperature and humidity sensor chip, a gas sensor chip and an acoustic sensor chip.

10. An electronic device, characterized in that: The electronic device is applied with the sensor according to any one of claims 1 to 9.

Images