Pressure and temperature sensor

By designing a pressure temperature sensor including a housing, a second base, a circuit board, a temperature-sensitive element, a connector and a pressure-sensitive element, the existing temperature-pressure integrated sensor structure is solved and the simultaneous sensing and stable signal transmission of fluid pressure and temperature is achieved.

CN222774041UActive Publication Date: 2025-04-18QINTAI AUTOMOBILE SEAT XIAN
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Patent Information

Application Number
CN202422259632.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-14
Publication Date
2025-04-18
Estimated Expiration
2034-09-14

AI Technical Summary

Technical Problem

The existing temperature pressure integrated sensors are prone to problems such as structural instability, poor sealing and unstable signal instability when the structure is complex and the packaging space is small.

Method used

A pressure temperature sensor is designed, adopting a combined structure of a housing, a second base, a circuit board, a temperature-sensitive element, a connector and a pressure-sensitive element. The sealing effect is achieved through the recess and sealing ring of the second base, and the stability of temperature signal transmission is improved through the design of the connector.

Benefits of technology

The pressure and temperature of the fluid to be tested are realized simultaneously, which improves the sealing effect and the stability of temperature signal transmission, reduces the risk of circuit failure and extends the service life.

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Abstract

The present disclosure relates to a pressure and temperature sensor, comprising: a housing, the bottom of which is provided with an opening to communicate with an external environment; the second base is arranged in the shell, and the second base is provided with a concave part which is concave from the upper surface; the circuit board is arranged in the shell and is positioned above the second base; the temperature sensitive element is positioned below the second base so as to generate heat conduction between the temperature sensitive element and the external environment; the connecting piece is used for electrically connecting the temperature sensitive element to the circuit board, and the connecting piece penetrates through the second base; the pressure sensitive element is arranged in the concave part so as to enclose a sealed space together with the inner wall of the concave part, and the pressure sensitive element is electrically connected to the circuit board; the second base is provided with a second through hole communicated with the opening and the sealed space.
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Description

Technical Field

[0001] The present disclosure relates to the field of sensor technology, and in particular, to a pressure and temperature sensor. Background Art

[0002] Sensors are an important component in industrial control systems. Traditional sensors can usually only be used to measure one type of information. For example, traditional pressure sensors can only be used to measure pressure. However, in actual use scenarios, it is usually necessary to obtain temperature and pressure information of the same fluid at the same time. If independent temperature sensors and pressure sensors are used, it is difficult to ensure the identity of the measured point position, and two sets of electrical wiring harnesses and media channels are required during installation, which takes up a lot of space and is not convenient to install.

[0003] At present, a temperature and pressure integrated sensor capable of simultaneously sensing temperature and pressure is used to solve the above problems. However, since the temperature and pressure integrated sensor needs to integrate two sensing systems, namely, the temperature sensing system and the pressure sensing system, the sensor itself has a small packaging space and a complex structure, which may easily lead to structural instability, resulting in problems such as poor sealing and unstable signals. Utility Model Content

[0004] In order to solve the above technical problems, the embodiments of the present disclosure are intended to provide a pressure and temperature sensor, which has good sealing effect and low risk of circuit failure.

[0005] The technical solution of the present disclosure is achieved as follows:

[0006] The present disclosure provides a pressure and temperature sensor, comprising:

[0007] A housing, wherein the bottom of the housing is provided with an opening for communicating with the external environment;

[0008] a second base, the second base being disposed in the housing, the second base being provided with a recessed portion recessed from an upper surface;

[0009] A circuit board, the circuit board is arranged in the housing and located above the second base;

[0010] a temperature sensitive element, the temperature sensitive element being located below the second base to generate heat conduction between the temperature sensitive element and the external environment;

[0011] a connector, the connector being used to electrically connect the temperature sensitive element to the circuit board, wherein the connector passes through the second base;

[0012] a pressure sensitive element, the pressure sensitive element being arranged in the recessed portion to enclose a sealed space together with an inner wall of the recessed portion, and the pressure sensitive element being electrically connected to the circuit board;

[0013] Wherein, the second base is provided with a second through hole communicating with the opening and the sealed space.

[0014] The embodiments of the present disclosure provide a pressure and temperature sensor, which can not only sense the pressure and temperature of a fluid to be measured simultaneously through a single sensor, but also improve the stability of temperature signal transmission to obtain a better temperature sensing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The features and advantages of the embodiments of the present disclosure will become more easily understood through the following description with reference to the accompanying drawings. The drawings are not drawn to scale and some features may be exaggerated or reduced to show details of particular components.

[0016] In the attached picture:

[0017] Figure 1 FIG. 1 is a first schematic cross-sectional view of a pressure and temperature sensor according to an embodiment of the present disclosure.

[0018] Figure 2 FIG. 4 is a second schematic cross-sectional view of a pressure and temperature sensor according to an embodiment of the present disclosure.

[0019] Figure 3 FIG. 4 is a schematic perspective view of a second base of a pressure and temperature sensor according to an embodiment of the present disclosure.

[0020] Figure 4 FIG. 4 is a schematic bottom view of a second base of a pressure and temperature sensor according to an embodiment of the present disclosure.

[0021] Figure 5 FIG. 4 is a schematic front view of a first base of a pressure and temperature sensor according to an embodiment of the present disclosure.

[0022] In the drawings, the same or corresponding technical features or components are represented by the same or corresponding reference numerals. DETAILED DESCRIPTION

[0023] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present disclosure.

[0024] Reference Figures 1 to 4 According to an embodiment of the present disclosure, a pressure and temperature sensor 1 is provided, which includes a housing 10 and a sensing component 20 disposed in the housing 10 .

[0025] As in Figure 1 and Figure 2 As shown in FIG. 1 , the bottom of the housing 10 is provided with an opening 10A to communicate with the external environment.

[0026] As in Figure 2 As shown in FIG. 1 , the housing 10 may include an upper housing 10a and a lower housing 10b. The upper housing 10a is provided with metal terminals therein, and the metal terminals are used to connect an external power source to the pressure and temperature sensor 1 and transmit the pressure signal and temperature signal sensed by the pressure and temperature sensor 1. The lower housing 10b is configured to be connected to the upper housing 10a to define an accommodation space inside the housing 10. It is conceivable that the housing 10 may also be in any other suitable form.

[0027] The sensing component 20 is disposed in the inner space defined by the upper housing 10a and the lower housing 10b and includes a second base 22 , a circuit board 202 , a pressure sensitive element 203 and a temperature sensitive element 204 .

[0028] The circuit board 202 is electrically connected to the above-mentioned metal terminals and is electrically connected to the pressure sensitive element 203 and the temperature sensitive element 204, thereby being able to receive pressure signals and temperature signals from the pressure sensitive element 203 and the temperature sensitive element 204, respectively, and output these signals through the metal terminals after processing. It is conceivable that the circuit board 202 can be a flexible circuit board (such as Figure 1 ), thereby providing flexibility in the structural design of the pressure and temperature sensor 1, and facilitating the integration of the temperature sensing system and the pressure sensing system in the pressure and temperature sensor 1. However, it is understandable that the circuit board 202 may also be other types of circuit boards, such as a rigid circuit board.

[0029] The pressure sensitive element 203 may be a capacitive pressure sensitive element, a resistive pressure sensitive element, or any other suitable type of pressure sensitive element. The pressure sensitive element 203 may be provided with a connection terminal for electrically connecting to the circuit board 202, for example, Figure 2 As shown in , the circuit board 202 can be arranged above the pressure sensitive element 203 and electrically connected to the pressure sensitive element 203 through the connecting terminal. Figure 2 As shown in FIG, the pressure sensitive element 203 may be rectangular or square. However, it is also conceivable that the pressure sensitive element 203 may be in other shapes, such as circular.

[0030] The temperature sensitive element 204 may be a thermistor, a platinum resistor, or any other suitable type of temperature sensitive element.

[0031] As in Figure 1 and Figure 2 As shown in FIG. 1 , the second base 22 is disposed in the housing 10, as shown in FIG. Figure 3 As shown in FIG. 2 , the second base 22 is provided with a recessed portion 22R recessed from the upper surface 22U.

[0032] The circuit board 202 mentioned above can be disposed in the housing 10 and located above the second base 22 .

[0033] The temperature sensitive element 204 may be located below the second base 22 to generate heat conduction between the temperature sensitive element 204 and the external environment.

[0034] As in Figure 1 and Figure 2 As shown in FIG. 2 , the pressure temperature sensor 1 may include a connector 40, which is used to electrically connect the temperature sensitive element 204 to the circuit board 202, wherein the connector 40 passes through the second base 22. It is also understood that the connector 40 may be a separate element, such as a metal wire, or may be a part that is integrated with the temperature sensitive element 204 and / or the circuit board 202.

[0035] As in Figure 1 and Figure 2 As shown in FIG. 2 , the pressure sensitive element 203 is disposed in the recessed portion 22R to enclose a sealed space SC together with the inner wall of the recessed portion 22R. The pressure sensitive element 203 is electrically connected to the circuit board 202 .

[0036] As in Figure 2 As shown in FIG. 1 , the second base 22 is provided with a second through hole 22H communicating with the opening 10A and the sealed space SC.

[0037] Thus, the pressure of the fluid to be sensed can be transmitted from the external environment to the sealed space SC via the opening 10A of the housing 10 and the second through hole 22H and thus to the pressure sensitive element 203, thereby enabling sensing of the pressure of the fluid to be measured. In addition, heat conduction is generated between the temperature sensitive element 204 and the external environment and is electrically connected to the circuit board 202 through the connector 40. Thus, the temperature sensitive element 204 can sense the temperature of the fluid circulating in the external environment, thereby enabling sensing of the temperature of the fluid to be measured. In this way, sensing of the pressure and temperature of the fluid to be measured can be achieved simultaneously. In addition, since the connector 40 passes through the second base 22, the temperature sensitive element 204 is firmly connected, and the structure of the second base 22 is also simple, so it is easy to manufacture and simple to assemble, and the welding production line of the second base 22 and the temperature sensitive element 204 is easy to operate.

[0038] In some embodiments, as in Figure 1 and Figure 2 As shown in FIG. 1 , the pressure and temperature sensor 1 may further include a first base 21, which is disposed in the housing 10 and is located between the second base 22 and the temperature sensitive element 204, as shown in FIG. Figure 2 As shown in FIG. 1 , the first base 21 is provided with a first through hole 21H, and the first through hole 21H is communicated with the opening 10A and the second through hole 22H.

[0039] In this way, the connecting member 40 of the temperature sensitive element 204 can be stably arranged in the first base 21 first, so that the installation of the temperature sensitive element 204 is easier.

[0040] In some embodiments, as in Figure 1 and Figure 2 As shown in FIG. 1 , the connector 40 passes through the opening 10A, so that the temperature sensitive element 204 is exposed to the external environment.

[0041] In this way, the temperature response time is accelerated, the transmission speed for fluid temperature testing is fast and more accurate, and a better temperature sensing effect is obtained.

[0042] In some embodiments, in combination Figure 1 and Figure 4 It is easy to understand that the second base 22 is also provided with a first through hole 221 ( Figure 4 ) and the second through hole 222 ( Figure 1 ), and the connecting member 40 passes through the first through hole 221 and the second through hole 222, such as the combination Figure 1 and Figure 4 Easy to understand, such as Figure 1 As shown in FIG. 1 , the pressure and temperature sensor 1 may include a sealing filler 50, which is used to fill the recessed portion 22R, so that the section between the first through hole 221 and the second through hole 222 in the connector 40 is covered by the sealing filler 50. Exemplarily, filling the sealing filler 50 into the recessed portion 22R may be achieved by glass sintering or brazing.

[0043] In the above case, see Figure 1It is easy to understand that, due to the presence of the sealing filler 50, the fluid flowing to the bottom of the second base 22 is prevented from flowing further upward along the connector 40, and the fluid entering the sealed space SC is prevented from flowing further upward along the connector 40, thereby preventing the fluid from contacting the circuit in the pressure and temperature sensor 1, such as the circuit or metal terminal on the circuit board 202, thereby causing a circuit failure. In addition, by inserting the connector 40 into the recessed portion 22R, it is not only convenient to seal the connector 40 with the sealing filler 50, because the sealing filler 50 can be filled in such a large space as the recessed portion 22R, thereby preventing the fluid to be measured from flowing along the connector 40, but also convenient to operate the connector 40, also because the space of the recessed portion 22R is large.

[0044] In some embodiments, as in Figure 1 and Figure 2 As shown in FIG. 1 , the pressure and temperature sensor 1 may include a first sealing ring 30, which is disposed between the outer peripheral surface of the second base 22 and the inner peripheral surface of the housing 10 to provide radial sealing. In this case, the first through hole 221 is below the first sealing ring 30, and the second through hole 222 is above the first sealing ring 30. In addition, the pressure and temperature sensor 1 may include a second sealing ring 60, which is disposed between the pressure sensitive element 203 and the inner wall of the recessed portion 22R.

[0045] In the above case, see Figure 1 and Figure 2 It is easy to understand that due to the presence of the first sealing ring 30, the fluid is prevented from continuing to flow upward through the opening 10A, the first through hole 21H, the gap between the first base 21 and the second base 22, the gap between the first base 21 and the inner wall of the shell 10, etc., over the first sealing ring 30, thereby preventing the fluid from contacting, for example, the circuit board 202 and causing circuit failure.

[0046] In addition, in the above case, see Figure 1 and Figure 2 It is easy to understand that due to the presence of the second sealing ring 60, the fluid entering the sealed space SC can be prevented from escaping from the gap between the pressure sensitive element 203 and the inner wall of the recessed portion 22R, thereby preventing the fluid from contacting the circuit in the pressure and temperature sensor 1, such as the circuit on the circuit board 202 or the metal terminal, thereby causing circuit failure.

[0047] Through the above structure, not only can the pressure and temperature of the fluid to be tested be sensed simultaneously through a single sensor, but also a better sealing effect can be obtained, the risk of sensor circuit failure due to fluid leakage can be reduced, the service life can be extended, and the stability of temperature signal transmission can be improved, the temperature response time can be accelerated, and the transmission speed of fluid temperature testing can be fast and more accurate, thereby obtaining a better temperature sensing effect.

[0048] In some embodiments, as described in Figure 3 Combined with Figure 4 It is easy to understand that the segment between the first through hole 221 and the second through hole 222 in the connecting member 40 and the second through hole 22H can be arranged symmetrically about the longitudinal center line X of the second base 22 .

[0049] In this way, the segment between the first perforation 221 and the second perforation 222 in the connector 40 can be spaced apart from the second through hole 22H by a larger distance, so that the fluid flowing through the second through hole 22H can be spaced apart from the above-mentioned segment of the connector 40 by a larger distance, thereby reducing the risk of circuit failure caused by fluid contact with the connector 40 due to possible fluid leakage.

[0050] In some embodiments, Figure 3 As shown, the recessed portion 22R may include a first recessed portion 221R recessed from the upper surface 22U of the second base 22 and a second recessed portion 222R recessed from the bottom surface of the first recessed portion 221R. Figure 1 The second sealing ring 60 may be disposed between the lower surface of the pressure sensitive element 203 and the bottom surface of the first recess 221R to form an axial seal.

[0051] It can be understood that the second sealing ring 60 provides sealing by being compressed in the axial direction, while the first sealing ring 30 provides sealing by being compressed in the radial direction. For example, the connection between the upper shell 10a and the lower shell 10b can be a compression connection in the axial direction, such as a crimp connection, so that the lower surface of the pressure sensitive element 203 located in the shell 10 is pressed against the bottom surface of the first recess 221R, thereby causing the second sealing ring 60 to be compressed in the axial direction to provide axial sealing. In addition, the outer diameter of the second base 22 and the inner diameter of the shell 10 can be configured so that when the second base 22 is arranged in the shell 10, the first sealing ring 30 located between the outer peripheral surface of the second base 22 and the inner peripheral surface of the shell 10 is compressed in the radial direction, thereby providing radial sealing.

[0052] By providing radial sealing between the second base 22 and the housing 10, there is only one sealing ring providing axial sealing, thereby avoiding the problem that the compression amount of the sealing ring in the axial direction cannot be accurately controlled due to the presence of multiple sealing rings providing axial sealing in the axial direction, resulting in poor sealing effect.

[0053] In some embodiments, Figure 1 As shown, the connecting member 40 may include a first connecting element 41 and a second connecting element 42. Figure 3 As shown, the second recessed portion 222R may include a recessed portion 2211R recessed from the bottom surface of the first recessed portion 221R and a first recessed hole 2212R and a second recessed hole 2213R recessed from the bottom surface of the recessed portion 2211R. Figure 1 , the first connecting element 41 can extend in the first concave hole 2212R, the second connecting element 42 can extend in the second concave hole 2213R, and the sealing filler 50 can be filled in the first concave hole 2212R and the second concave hole 2213R. In this way, the first connecting element 41 and the second connecting element 42 are prevented from contacting each other, thereby causing circuit failure.

[0054] In some embodiments, Figure 3 and Figure 4 As shown, the second base 22 may include a main body portion 22B having an upper surface 22U and an extension portion 22E extending downward from a lower surface 22L of the main body portion 22B, the lower surface 22L may be provided with a first groove 221G and a second groove 222G, the first connecting element 41 may be placed in the first groove 221G, and the second connecting element 42 may be placed in the second groove 222G.

[0055] In some embodiments, Figure 3 and Figure 4 As shown, the main body 22B may be provided with a first through hole 221P and a second through hole 222P extending between the upper surface 22U and the lower surface 22L of the main body 22B, the first through hole 221P intersecting with the first groove 221G, the second through hole 222P intersecting with the second groove 222G, the first connecting element 41 may pass through the first through hole 221P, and the second connecting element 42 may pass through the second through hole 222P.

[0056] In some embodiments, Figure 5 As shown, a third groove 211G and a fourth groove 212G may be provided on the outer surface of the first base 21 , the first connecting element 41 may be disposed in the third groove 211G, and the second connecting element 42 may be disposed in the fourth groove 212G.

[0057] In this way, the connector 40 of the temperature sensitive element 204 can be arranged in the first base 21 more stably, the first connecting element 41 and the second connecting element 42 are prevented from being conductive, and the welding points between the first connecting element 41 and the second connecting element 42 and the temperature sensitive element 204 can be checked in time.

[0058] In some embodiments, Figure 1 and Figure 2 As shown, the housing 10 may be provided at its lower end with a mounting portion 100 for mounting the pressure and temperature sensor 1 to an external pipeline.

[0059] The pressure and temperature sensor 1 can be threadedly connected to an external pipeline to sense the pressure and temperature of the fluid in the external pipeline through the mounting portion 100. It is conceivable that the mounting portion 100 can be a threaded mounting portion connected by threads, or can be other types of mounting portions connected by any other suitable means.

[0060] In some embodiments, Figure 1 and Figure 2 As shown, the pressure and temperature sensor 1 may further include a third sealing ring 70 , and the third sealing ring 70 is used to seal the connection between the mounting portion 100 and the external pipeline.

[0061] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A pressure and temperature sensor, characterized in that: include: A shell, wherein the bottom of the shell is provided with an opening for communicating with the external environment; a second base, the second base being disposed in the housing, the second base being provided with a recessed portion recessed from an upper surface; A circuit board, the circuit board is arranged in the housing and located above the second base; a temperature sensitive element, the temperature sensitive element being located below the second base to generate heat conduction between the temperature sensitive element and the external environment; a connector, the connector being used to electrically connect the temperature sensitive element to the circuit board, wherein the connector passes through the second base; a pressure sensitive element, the pressure sensitive element being arranged in the recessed portion to enclose a sealed space together with an inner wall of the recessed portion, and the pressure sensitive element being electrically connected to the circuit board; Wherein, the second base is provided with a second through hole communicating with the opening and the sealed space.

2. The pressure and temperature sensor according to claim 1, characterized in that: The pressure and temperature sensor further comprises a first base, which is arranged in the housing and between the second base and the temperature sensitive element. The first base is provided with a first through hole, which is connected with the opening and the second through hole.

3. The pressure and temperature sensor according to claim 2, characterized in that: The connecting member passes through the opening so that the temperature sensitive element is exposed to the external environment.

4. The pressure and temperature sensor according to claim 3, characterized in that: The second base is also provided with a first through-hole and a second through-hole leading to the recessed portion, and the connecting piece passes through the first through-hole and the second through-hole. The pressure and temperature sensor also includes a sealing filler, which is used to fill the recessed portion so that the section between the first through-hole and the second through-hole in the connecting piece is covered by the sealing filler.

5. The pressure and temperature sensor according to claim 4, characterized in that: The pressure and temperature sensor also includes: A first sealing ring, wherein the first sealing ring is disposed between an outer peripheral surface of the second base and an inner peripheral surface of the housing, wherein the first through hole is below the first sealing ring, and the second through hole is above the first sealing ring; A second sealing ring is arranged between the pressure sensitive element and the inner wall of the recessed portion.

6. The pressure and temperature sensor according to claim 5, characterized in that: The recessed portion includes a first recessed portion recessed from the upper surface of the second base and a second recessed portion recessed from the bottom surface of the first recessed portion, and the second sealing ring is arranged between the lower surface of the pressure sensitive element and the bottom surface of the first recessed portion.

7. The pressure and temperature sensor according to claim 6, characterized in that: The connecting member includes a first connecting element and a second connecting element, the second recess includes a recessed portion recessed from the bottom surface of the first recessed portion and a first cavity and a second cavity recessed from the bottom surface of the recessed portion, the first connecting element extends in the first cavity, the second connecting element extends in the second cavity, and the sealing filler is filled in the first cavity and the second cavity.

8. The pressure and temperature sensor according to claim 7, characterized in that: The second base includes a main body having the upper surface and an elongated portion extending downward from the lower surface of the main body, the lower surface is provided with a first groove and a second groove, the first connecting element is arranged in the first groove, and the second connecting element is arranged in the second groove.

9. The pressure and temperature sensor according to claim 8, characterized in that: The main body is provided with a first through hole and a second through hole extending between the upper surface and the lower surface of the main body, the first through hole intersects with the first groove, the second through hole intersects with the second groove, the first connecting element passes through the first through hole, and the second connecting element passes through the second through hole.

10. The pressure and temperature sensor according to claim 7, characterized in that: A third groove and a fourth groove are provided on the outer surface of the first base, the first connecting element is arranged in the third groove, and the second connecting element is arranged in the fourth groove.