Novel sample detector for nano low-temperature solder production

Abstract

The utility model discloses a novel sample detector for nano low-temperature solder production, which comprises a detection frame, a group of fixing plates are fixed at the top of the detection frame, a group of display panels are fixed at the right side of the detection frame, and a console capable of controlling operation is mounted below the display panels; the device is characterized in that a set of protection plates are fixedly installed at the top of the detection frame, the control end of the control assembly is connected with two sets of heating conveyors, the output ends of the heating conveyors are connected with a connecting line, and the other end of the connecting line is connected to one side of a heat conduction contact. According to the novel sample detection machine for nano low-temperature solder production, the heating conveyor is arranged, the heating conveyor is controlled to be started through the control assembly, the heating conveyor can be conveyed to the heat conduction contact through the connecting wire, the heat conduction contact is used for detecting solder, and the solder is displayed through the display panel.

Description

Technical Field

[0001] The utility model relates to the technical field related to the production of nano low-temperature solder, in particular to a novel sample detection machine for the production of nano low-temperature solder. Background Art

[0002] Nano low-temperature solder is a welding material with special properties. Its advantages include environmental protection, high melting point, low-temperature sintering, good electrical and thermal conductivity, and good mechanical properties. During the production of nano low-temperature solder, a sample testing machine is required to test the performance of the nano low-temperature solder, for example:

[0003] Announcement No. CN218099143U discloses a quality detection device for extruded tin solder. When the quality detection device is working, the clamping rod is pulled outward through the connecting plate to extend the spring, and the tin solder is placed between the two sets of clamping rods. The connecting plate is then released so that the clamping rod clamps the tin solder under the action of the spring. The servo electric cylinder is then started, and the servo electric cylinder pushes the lifting plate downward through the slider, so that the lifting plate pushes the pressure plate downward through the guide rod, and the pressure plate squeezes the tin solder. The above-mentioned device performs pressure detection on the quality of the low-temperature solder by setting up an extrusion mechanism. However, when the low-temperature solder is detected, it is also necessary to detect the temperature of the low-temperature solder and detect the melting point of the low-temperature solder, so that a suitable heating device can be used for working processing.

[0004] Therefore, we proposed a new type of sample testing machine for nano low-temperature solder production, which can solve the above problems well. Utility Model Content

[0005] The purpose of the utility model is to provide a novel sample testing machine for the production of nano low-temperature solder, so as to solve the problem proposed in the above background technology that the sample testing device currently on the market performs pressure testing on the quality of the low-temperature solder by setting an extrusion mechanism, but when the low-temperature solder is tested, it is also necessary to detect and process the temperature of the low-temperature solder and detect the melting point of the low-temperature solder, so as to use a suitable heating device for working processing.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a novel sample testing machine for nano-low temperature solder production, comprising a testing frame, a group of fixing plates are fixed at the top position of the testing frame, a group of display panels are fixed at the right position of the testing frame, and a control console capable of controlling operation is installed below the display panel;

[0007] Also includes:

[0008] A group of protective plates are fixedly installed on the top of the detection frame, a group of control components are fixed on the rear side of the protective plates, and the control end of the control component is connected to two groups of heating conveyors. The output end of the heating conveyor is connected to the connecting line, and the other end of the connecting line is connected to one side of the thermal contact.

[0009] As a preferred technical solution of the present application, the outer side of the thermal contact is slidably arranged on the inner side of the clamping plate, the temperature range of the thermal contact is 130° to 220°, and one side of the heating conveyor is fixed on the rear side of the protective plate, so that the temperature can be easily adjusted to perform temperature detection processing on the low-temperature solder.

[0010] As a preferred technical solution of the present application, a group of mounting strips are fixed at the top of the protective plate, and a group of rotating motors are fixed at the top of the mounting strips. The bottom output end of the rotating motor is fixed at the outer side of the fan blade, so that heat can be dissipated after heating is completed.

[0011] As a preferred technical solution of the present application, the top of the fan blade corresponds to the center position of the bottom end of the protective plate, and the outer side of the mounting strip is fixed to the top position of the front side of the protective plate by bolts, so that the fan blade can cool the solder.

[0012] As a preferred technical solution of the present application, a group of electric push rods are installed on one side of the fixed plate, and the output end of the electric push rods is fixed on the outside of a group of clamping plates. A group of connecting racks are fixed on the rear side of the clamping plates. The other end of the connecting racks slides out of the slide groove opened on the rear side of the protective plate. A group of mating gears are meshed and connected to the outer side of the connecting racks to limit the low-temperature solder.

[0013] As a preferred technical solution of the present application, the bottom position of the mating gear is meshed and connected with another set of connecting racks, the outer side of the other set of connecting racks is slidably arranged inside the slide groove and fixed to the rear side of another set of clamping plates, the rear side of the other set of clamping plates is fixed to one side of the guide telescopic rod, and the other end of the guide telescopic rod is fixed to the inner side of the fixed plate, so that the two sets of clamping plates can be limited.

[0014] As a preferred technical solution of the present application, the moving directions of the two groups of clamping plates are opposite, and a heat-resistant gasket is provided on the inner side of the clamping plate. The inner side of the clamping plate is attached to the outer side of the solder to prevent the clamping plate from being damaged by heat.

[0015] Compared with the prior art, the beneficial effects of the utility model are as follows: the novel sample detection machine for nano low-temperature solder production is provided with a heating conveyor, which is started by controlling the heating conveyor through the control component, so that the heating conveyor can be escorted to the thermal contact through the connecting line, so that the thermal contact detects and processes the solder, and displays the process through the display panel. The specific contents are as follows:

[0016] 1. A display panel is provided, through which the data after temperature detection can be monitored, and the outer side of the thermal contact is attached to the outer side of the solder, which can facilitate sufficient temperature detection processing of the solder;

[0017] Furthermore, a heat-conducting contact is provided, and the heat-conducting contact is slidably provided on one side of the control component, so that the control component can be inspected and processed inside the protective plate, and the outer side of the heat-conducting contact can be ensured to be attached to one side of the low-temperature solder;

[0018] 2. An electric push rod is provided, and the clamping plate is driven to move by the output end of the electric push rod, so that the clamping plate can slide inside the slide groove through the connecting rack, and the connecting rack drives another set of connecting racks to move through the matching gear, so that the two sets of clamping plates move relative to each other, and the low-temperature solder can be limited;

[0019] Furthermore, a clamping plate is provided, and a guide telescopic rod provided on the clamping plate of another group can make the two groups of clamping plates move stably, which is convenient for position limiting processing;

[0020] 3. A protective plate is provided, and a mounting strip is fixed to the top of the protective plate by bolts. The rotating motor fixed to the top of the mounting strip can drive the fan blades to rotate, and the heated solder can be cooled. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0022] Figure 2 This is a rear view structural diagram of the utility model;

[0023] Figure 3 This is a schematic diagram of the main structure of the protective plate of the utility model;

[0024] Figure 4 This is a schematic diagram of the structure of the connecting rack of the utility model;

[0025] Figure 5 For this utility model Figure 1 The enlarged structural diagram at A in the middle;

[0026] Figure 6 This is a schematic diagram of the main structure of the utility model connected to the power supply.

[0027] In the figure: 1. detection frame; 2. fixing plate; 3. display panel; 4. control console; 5. electric push rod; 6. protective plate; 601. mounting strip; 602. rotating motor; 603. fan blade; 7. clamping plate; 8. connecting rack; 9. slide groove; 10. matching gear; 11. guide telescopic rod; 12. thermal contact; 13. connecting line; 14. heating conveyor; 15. control component. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] See also Figure 1-Figure 6 , the utility model provides the following technical solutions:

[0030] Embodiment 1: In order to solve the problem that the sample detection device currently on the market uses an extrusion mechanism to perform pressure detection on the quality of the low-temperature solder, but when the low-temperature solder is detected, it is also necessary to detect the temperature of the low-temperature solder and the melting point of the low-temperature solder, so as to use a suitable heating device for working processing, please refer to the attached Figure 1 , Attachment Figure 2 and attached Figure 6, including a detection frame 1, a set of fixed plates 2 are fixed at the top position of the detection frame 1, a set of display panels 3 are fixed at the right position of the detection frame 1, and a control console 4 for controlling operation is installed below the display panel 3; it also includes: a set of protective plates 6 are fixed at the top position of the detection frame 1, a set of control components 15 are fixed at the rear position of the protective plates 6, and the control end of the control component 15 is connected to two sets of heating conveyors 14, the output end position of the heating conveyor 14 is connected to the connecting line 13, and the other end position of the connecting line 13 is connected to one side of the thermal contact 12. The outer side of the thermal contact 12 is slidably set at the inner side position of the clamping plate 7, the temperature range of the thermal contact 12 is 130° to 220°, and one side position of the heating conveyor 14 is fixed at the rear position of the protective plate 6. The heating conveyor 14 is started by controlling the control component 15, and the output temperature of the heating conveyor 14 can be adjusted, so that the heating conveyor 14 will convey the thermal contact 12 through the connecting line 13. At this time, the thermal contact 12 can slide inside the clamping plate 7, so that the outer side of the thermal contact 12 can be attached to the outer side of the solder, so that the solder can be heated, and the temperature can be displayed through the display panel 3, which is convenient for temperature detection.

[0031] Embodiment 2: In order to limit the solder, please refer to the attached Figure 1 -Attached Figure 4 A set of electric push rods 5 are installed on one side of the fixed plate 2. The output end of the electric push rods 5 is fixed on the outside of a set of clamping plates 7. A set of connecting racks 8 are fixed on the rear side of the clamping plates 7. The other end of the connecting racks 8 slides out of the slide groove 9 opened on the rear side of the protective plate 6. The outer side of the connecting racks 8 is meshed and connected with a set of matching gears 10. Another set of connecting racks 8 is meshed and connected at the bottom of the matching gear 10. The outer side of the other set of connecting racks 8 is slidably set inside the slide groove 9 and fixed to the rear side of another set of clamping plates 7. The rear side of the other set of clamping plates 7 is fixed on one side of the guide telescopic rod 11. The other end of the guide telescopic rod 11 is fixed to the inner side of the fixed plate 2. The moving directions of the two sets of clamping plates 7 are opposite, and a heat-resistant gasket is set on the inner side of the clamping plates 7. The inner side of the clamping plates 7 is attached to the outer side of the solder. In order to perform welding processing on the solder, by starting the electric push rod 5, the output end of the electric push rod 5 can drive the clamping plate 7 to move, so that the clamping plate 7 can drive the connecting rack 8 to move, and the connecting rack 8 slides inside the slide groove 9, so that the connecting rack 8 drives the matching gear 10 to rotate at the rear side of the protective plate 6, causing the connecting rack 8 to drive another group of clamping plates 7 to move. At this time, the two groups of clamping plates 7 will move relative to each other, so that the solder can be limited, and a heat-resistant gasket is set at the internal position of the clamping plate 7, so that the clamping plate 7 can clamp the solder.

[0032] Example 3: In order to cool the heated solder, please refer to the attached Figure 1 and attached Figure 5 A set of mounting bars 601 are fixed at the top of the protective plate 6, and a set of rotating motors 602 are fixed at the top of the mounting bars 601. The bottom output end of the rotating motor 602 is fixed at the outer side of the fan blade 603. The top of the fan blade 603 corresponds to the center of the bottom end of the protective plate 6, and the outer side of the mounting bar 601 is fixed to the top position of the front side of the protective plate 6 by bolts. After the processing is completed, the rotating motor 602 fixed at the top of the mounting bar 601 will rotate through the mounting bar 601 fixed at the top of the protective plate 6, so that the output end of the rotating motor 602 drives the fan blade 603 to rotate, and at this time, the fan blade 603 will cool the solder placed at the bottom of the protective plate 6.

[0033] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0034] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A novel sample testing machine for production of nano low-temperature solder, comprising a testing frame (1), a set of fixing plates (2) being fixed at the top of the testing frame (1), a set of display panels (3) being fixed at the right side of the testing frame (1), and a control console (4) for controlling operation being installed below the display panel (3); It is characterized in that Also includes: A group of protective plates (6) are fixedly installed at the top of the detection frame (1), a group of control components (15) are fixedly installed at the rear side of the protective plates (6), and the control end of the control component (15) is connected to two groups of heating conveyors (14), the output end of the heating conveyor (14) is connected to the connecting line (13), and the other end of the connecting line (13) is connected to one side of the heat-conducting contact (12).

2. According to claim 1, a new type of sample testing machine for nano low-temperature solder production is characterized by: The outer side of the heat-conducting contact (12) is slidably arranged at the inner side of the clamping plate (7), the temperature of the heat-conducting contact (12) ranges from 130° to 220°, and one side of the heating conveyor (14) is fixed at the rear side of the protective plate (6).

3. The novel sample testing machine for nano-low temperature solder production according to claim 1 is characterized by: A group of mounting bars (601) are fixed at the top of the protective plate (6), and a group of rotating motors (602) are fixed at the top of the mounting bars (601), and the bottom output end of the rotating motor (602) is fixed at the outer side of the fan blade (603).

4. The novel sample testing machine for nano-low temperature solder production according to claim 3 is characterized by: The top of the fan blade (603) corresponds to the center position of the bottom end of the protective plate (6), and the outer side of the mounting strip (601) is fixed to the top position of the front side of the protective plate (6) by bolts.

5. The novel sample testing machine for nano-low temperature solder production according to claim 1 is characterized by: A group of electric push rods (5) are installed at one side of the fixed plate (2), and the output end of the electric push rod (5) is fixed at the outer side of a group of clamping plates (7). A group of connecting racks (8) are fixed at the rear side of the clamping plate (7). The other end of the connecting rack (8) slides out of a slide groove (9) provided at the rear side of the protective plate (6). The outer side of the connecting rack (8) is meshed with a group of matching gears (10), and the matching gears (10) are rotatably arranged at the middle position of the rear side of the protective plate (6).

6. The novel sample testing machine for nano-low temperature solder production according to claim 5 is characterized by: The bottom position of the mating gear (10) is meshedly connected with another set of connecting racks (8), the outer side of the other set of connecting racks (8) is slidably arranged inside the slide groove (9) and fixed to the rear side position of another set of clamping plates (7), the rear side position of the other set of clamping plates (7) is fixed to one side of the guide telescopic rod (11), and the other end of the guide telescopic rod (11) is fixed to the inner side position of the fixed plate (2).

7. The novel sample testing machine for nano-low temperature solder production according to claim 5 is characterized by: The moving directions of the two groups of clamping plates (7) are opposite to each other, and a heat-resistant gasket is arranged on the inner side of the clamping plate (7), and the inner side of the clamping plate (7) is attached to the outer side of the solder.

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