High-precision circuit board welding spot defect detection mechanism
By designing a high-precision circuit board solder joint defect detection mechanism, using machine vision technology and automated marking system, the problem of inaccurate manual inspection and prone to misjudgment is solved, and high-precision, accuracy and reliability solder joint defect detection is achieved.
Patent Information
- Application Number
- CN202420850401.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-06
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2035-01-06
AI Technical Summary
In the prior art, manual detection of circuit board solder joint defects is not accurate enough, and misjudgment is prone to manual detection, and manual detection is prone to problems such as fatigue and forgetting, resulting in increased detection risk.
Design a high-precision circuit board solder joint defect detection mechanism, including detection cabinets, mobile sliders, airbrushes and detection cameras, and shoot and mark solder joints through machine vision technology to achieve automated inspection.
It improves the accuracy and accuracy of solder joint defect detection, reduces the risk of manual misjudgment, can work continuously for a long time, and is suitable for industrial site environments.
Smart Images
Figure CN222774511U_ABST
Abstract
Description
Technical field:
[0001] The present invention relates to the technical field of machine vision defect detection, and in particular to a high-precision circuit board solder joint defect detection mechanism. Background technology:
[0002] Circuit board solder joint defect detection is a very important part of the electronics manufacturing process. Solder joint defects may cause loose connections or disconnections between electronic components on the circuit board, thus affecting the normal operation of the circuit. Existing detection of solder joint defects is done manually, and defective solder joints that are not visible to the human eye may be difficult to identify, which can easily lead to misjudgment. In addition, manual labor is prone to problems such as fatigue and forgetfulness, which brings unnecessary risks to detection. Therefore, it is necessary to perform high-precision defect detection of solder joint defects to ensure the reliability of circuit connections and not affect the quality and performance of the product.
[0003] Therefore, there is an urgent need to provide a high-precision circuit board solder joint defect detection mechanism to solve the above problems. Summary of the invention:
[0004] The technical problem to be solved by the utility model is to manually perform visual inspection on the solder joints on the circuit board that are prone to problems and quickly visual inspection on the other appearances to achieve the inspection work, but this method is not accurate enough, and when errors that cannot be observed by the human eye occur, it is easy to cause product failure, and manual labor is prone to problems such as fatigue and forgetfulness, which brings unnecessary risks to the inspection.
[0005] In order to solve the above technical problems, a technical solution adopted by the utility model is: to provide a high-precision circuit board solder joint defect detection mechanism, including a detection cabinet, the upper part of which is fixedly connected with parallel and spaced X-axis fixed slide rails, the X-axis fixed slide rails are fixedly connected with a moving slider in the vertical direction, and the moving slider is fixedly connected with a Y-axis fixed slide rail. The Y-axis fixed slide rail is fixedly connected with a moving slider, and the moving slider is fixedly connected with a spray pen, and a camera bracket is connected to the right side of the outer wall of the detection cabinet, and the camera bracket is connected with a detection camera and a light source.
[0006] The utility model is further configured as follows: sliding grooves corresponding to the movable sliding blocks are provided on both sides of the fixed sliding rail.
[0007] Through the above technical solution, the movable slider slides on the fixed sliding groove, and the sliding groove can limit the sliding of the movable slider.
[0008] The utility model is further configured as follows: a light source is arranged below the detection camera.
[0009] The above technical solution ensures that the upper shooting mechanism can smoothly shoot the soldering points of the circuit board.
[0010] The above technical solution ensures that after the upper camera captures the solder joints of the circuit board, the airbrush can successfully mark the defective solder joints. After the circuit board is placed, the top camera starts to capture the solder joints of the circuit board to detect whether there are defects. If there are defects, the airbrush will move to the corresponding position of the defective solder joint to mark it.
[0011] The beneficial effects of the utility model are as follows:
[0012] The utility model marks the defects of the solder joints of the circuit board by designing an airbrush moving device, has a good effect of marking the defects after detection, can work for a long time, and has high accuracy. Compared with the manual detection system in the general sense, machine vision emphasizes accuracy and speed, as well as feasibility in industrial field environments. Description of the drawings:
[0013] Figure 1 and Figure 3 It is a three-dimensional diagram of the utility model;
[0014] Figure 2 It is a front view of the utility model; Specific implementation method:
[0015] The concept, specific structure and technical effects of the present invention will be further described below in conjunction with the accompanying drawings to fully understand the purpose, characteristics and effects of the present invention.
[0016] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", "X", "Y" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present invention.
[0017] Example:
[0018] See also Figure 1 and Figure 2 A high-precision circuit board solder joint defect detection mechanism includes a detection cabinet 1, a first X-axis fixed slide rail 2 and a second X-axis fixed slide rail 3 are fixedly connected to the top of the detection cabinet 1, a Y-axis fixed slide rail 4 is vertically connected above the first X-axis fixed slide rail 2 and the second X-axis fixed slide rail 3; a camera bracket 5 is fixedly connected to the upper left side of the detection cabinet 1.
[0019] like Figure 1-Figure 3As shown, the X-axis driving motor 404 at the rear end of the first X-axis fixed slide rail 2 controls the first X-axis moving slider 402 and the second X-axis moving slider 403 at the same time, and the Y-axis driving motor 405 at the rear end of the Y-axis fixed slide rail 4 controls the Y-axis moving slider 401. The circuit board to be inspected is placed on the inspection cabinet 1. After the inspection is completed, the X-axis driving motor 404 drives the first X-axis moving slider 402 and the second X-axis moving slider 403 to complete the movement of the airbrush 8 in the X-axis direction, and the Y-axis driving motor 405 drives the Y-axis moving slider 401 to complete the movement of the airbrush 8 in the Y-axis direction.
[0020] The first X-axis fixed slide rail 2 and the second X-axis fixed slide rail 3 are provided with slide grooves corresponding to the first X-axis moving slider 402 and the second X-axis moving slider 403 on both sides, and the Y-axis fixed slide rail 4 is provided with a slide groove corresponding to the Y-axis moving slider 401. The first X-axis moving slider 402 slides on the first X-axis fixed slide rail 2, and the Y-axis moving slider 401 slides on the Y-axis fixed slide rail 4. The slide groove can limit the sliding of the moving slider, ensuring that the upper airbrush can accurately move to the position of the defective solder joint for marking.
[0021] Although the preferred specific embodiments of the present invention are described above in conjunction with the accompanying drawings, the present invention should not be limited to the structures and operations that are exactly the same as the above descriptions and drawings. For those skilled in the art, many equivalent improvements and changes can be made to the above embodiments through logical analysis, reasoning or limited experiments without exceeding the concept and scope of the present invention, but these improvements and changes should all fall within the scope of protection required by the present invention.
Claims
1. A high-precision circuit board solder joint defect detection mechanism, characterized by: The invention comprises a detection cabinet (1), on which a first X-axis fixed slide rail (2) and a second X-axis fixed slide rail (3) are arranged in parallel and at intervals, and a Y-axis fixed slide rail (4) is arranged in a vertical direction between the first X-axis fixed slide rail (2) and the second X-axis fixed slide rail (3); a camera bracket (5) is connected to the right side of the outer wall of the detection cabinet (1); and a detection camera (6) and a light source (7) are connected to the camera bracket (5).
2. A high-precision circuit board solder joint defect detection mechanism according to claim 1, characterized in that: The Y-axis fixed slide rail (4) is fixedly connected to a Y-axis movable slider (401), and the Y-axis movable slider (401) is fixedly connected to a spray brush (8); the first X-axis fixed slide rail (2) and the second X-axis fixed slide rail (3) are respectively fixedly connected to a first X-axis movable slider (402) and a second X-axis movable slider (403).
3. A high-precision circuit board solder joint defect detection mechanism according to claim 2, characterized in that The Y-axis movable slider (401) is provided with a slide groove corresponding to the Y-axis fixed slide rail (4), and the first X-axis movable slider (402) and the second X-axis movable slider (403) are provided with slide grooves corresponding to the first X-axis fixed slide rail (2) and the second X-axis fixed slide rail (3), respectively.
4. A high-precision circuit board solder joint defect detection mechanism according to claim 2, characterized in that The rear end of the first X-axis fixed slide rail (2) is connected to an X-axis drive motor (404), and the rear end of the Y-axis fixed slide rail (4) is connected to a Y-axis drive motor (405).