Temperature relay performance test platform

Abstract

The utility model relates to a temperature relay performance test, in particular to a temperature relay performance test platform, and aims to solve the technical problem that the temperature control performance of a temperature relay needs to be tested in order to ensure the normal operation of the temperature relay in the prior art. The platform comprises an electric heater, a heat conduction isothermal test module and a water cooling block, after series connection, two ends of the electric heater are connected with an external power supply; or the two ends of the electric heater are connected with the external power supply, the heat conduction isothermal test module is connected with the temperature relay to be tested in series, and the two ends are connected with the external power supply after series connection; a test area is arranged on the upper surface of the heat-conducting isothermal test module close to the electric heater, and a temperature sensor is attached to the test area and used for detecting the temperature value of the heat-conducting isothermal test module; the test area is also used for arranging a to-be-tested temperature relay, and the temperature sensor is arranged at a position close to the to-be-tested temperature relay in the test area.

Description

Technical Field

[0001] The utility model relates to a temperature relay performance testing device, in particular to a temperature relay performance testing platform. Background Art

[0002] For temperature relays, after reaching the target operating temperature, the temperature relay will open or close to realize the disconnection or connection of the temperature control circuit. However, different temperature relays will have corresponding changes in operating temperature due to changes in material properties and processing factors during the processing process. There may even be a situation where the relay cannot be used normally after reaching the target temperature. In order to confirm whether the temperature relay can work normally, it is necessary to test the temperature control performance of the temperature relay.

[0003] For example, a Chinese patent document with the announcement number CN210572617U discloses a test device for a temperature relay, which is characterized in that it includes: an integrated circuit board, a main control chip, a button, at least two temperature test interfaces, a temperature sensor corresponding to each temperature test interface one by one, and a display component corresponding to each temperature test interface one by one; the button, each temperature sensor, each display component, and each temperature test interface are all connected to the main control chip; the main control chip, the button, each display component, and each temperature test interface are all fixedly arranged on the integrated circuit board, and multiple temperature test interfaces are all arranged on the same side of the integrated circuit board; the temperature sensor is detachably fixed on the temperature relay to be tested; if the button sets the test device to the temperature detection mode, the main control chip controls the power supply to supply power to the temperature relay to be tested, obtains the level value output by the temperature relay to be tested, and if the level value indicates a high level, obtains the current temperature value collected by the temperature sensor, and displays the temperature value through the display component.

[0004] The shortcomings of the prior art are: the test device of the existing temperature relay has a complex structure, which makes it difficult to perform subsequent maintenance and troubleshooting. Utility Model Content

[0005] The utility model aims to solve the technical problems that the test device of the existing temperature relay is complex in structure and difficult in later maintenance and troubleshooting, and to provide a temperature relay performance test platform.

[0006] In order to solve the above technical problems, the technical solutions provided by the utility model are as follows:

[0007] A temperature relay performance test platform is used for setting action temperature test of temperature relays. Its special features are:

[0008] It includes an electric heater, a thermal conductivity isothermal test module and a water cooling block which are sequentially arranged from top to bottom;

[0009] The water cooling block is provided with a water inlet and a water outlet, and the water inlet and the water outlet of the water cooling block are respectively connected to the water outlet pipe and the water inlet pipe of the low-temperature water cooling machine;

[0010] The electric heater is connected in series with the temperature relay to be tested, and both ends of the series connection are connected to an external power supply; or, both ends of the electric heater are connected to an external power supply, and the thermal conductivity isothermal test module is connected in series with the temperature relay to be tested, and both ends of the series connection are connected to an external power supply;

[0011] A test area is provided on the upper surface of the thermal conductivity isothermal test module near the electric heater, and a temperature sensor is mounted on the test area to detect the temperature value of the thermal conductivity isothermal test module; the test area is also used to set a temperature relay to be tested, and the temperature sensor is set in the test area near the temperature relay to be tested.

[0012] Further, both ends of the electric heater are connected to an external power source, and the thermal conductivity isothermal test module is connected in series with the temperature relay to be tested, and both ends of the series connection are connected to an external power source;

[0013] The thermal conductivity isothermal test module includes a thermal conductivity isothermal body and a semiconductor refrigeration sheet;

[0014] The semiconductor cooling sheet is connected in series with the temperature relay to be measured, and both ends of the series connection are connected to an external power supply;

[0015] The cold end of the semiconductor refrigeration sheet is bonded to the lower surface of the heat-conducting isothermal body, and the hot end of the semiconductor refrigeration sheet is bonded to the upper surface of the water-cooling block;

[0016] A hot end temperature sensor is provided on the hot end of the semiconductor refrigeration chip to detect the temperature of the hot end of the semiconductor refrigeration chip.

[0017] Furthermore, the electric heater is connected in series with the temperature relay to be measured, and both ends of the series connection are connected to an external power supply;

[0018] The thermal conductivity isothermal test module comprises a thermal conductivity isothermal body, and the lower surface of the thermal conductivity isothermal body is in contact with the upper surface of the water cooling block.

[0019] Furthermore, thermally conductive silicone grease is provided between the water-cooling block and the thermally conductive isothermal body, between the cold end of the semiconductor refrigeration sheet and the thermally conductive isothermal body, and between the hot end of the semiconductor refrigeration sheet and the water-cooling block.

[0020] Furthermore, thermally conductive silicone grease is provided between the water cooling block and the thermally conductive isothermal body.

[0021] Furthermore, the thermally conductive isothermal body is a thermally conductive copper plate or a thermally conductive aluminum plate.

[0022] Furthermore, the operating temperature of the semiconductor refrigeration plate is not higher than 60°C.

[0023] Compared with the prior art, the utility model has the following beneficial effects:

[0024] The temperature relay performance test platform provided by the utility model is provided with an electric heater, a thermal conductivity isothermal test module, a water cooling block and a temperature sensor. By comparing the temperature value of the thermal conductivity isothermal test module detected by the temperature sensor with the set action temperature of the temperature relay to be tested, it can be judged whether the temperature relay can work normally and whether the action temperature of the working temperature relay is within the allowable range; thereby providing a parameter basis for judging whether the temperature relay can be used normally for a production enterprise or a user unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is an exploded structural diagram of Example 1 of the utility model;

[0026] Figure 2 This is an exploded structural diagram of Example 2 of the utility model.

[0027] Explanation of the reference numerals: 1-electric heater, 2-thermal conductive isothermal test module, 21-thermal conductive isothermal body, 22-semiconductor refrigeration sheet, 23-hot end temperature sensor, 3-water cooling block, 31-water inlet, 32-water outlet, 4-temperature sensor, 5-temperature relay to be tested, 6-thermal conductive silicone grease. DETAILED DESCRIPTION

[0028] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] Example 1

[0030] like Figure 1 As shown, a temperature relay performance test platform is used for setting the action temperature test of a normally open temperature relay, comprising an electric heater 1, a thermal conductivity isothermal test module 2 and a water cooling block 3 which are sequentially arranged from top to bottom; a water inlet 31 and a water outlet 32 ​​are arranged on the water cooling block 3, and the water inlet 31 and the water outlet 32 ​​of the water cooling block 3 are respectively connected to the water outlet pipe and the water inlet pipe of the low-temperature water chiller;

[0031] Both ends of the electric heater 1 are connected to an external power source, and the thermal conductivity isothermal test module 2 includes a thermal conductivity isothermal body 21 and a semiconductor cooling sheet 22; the semiconductor cooling sheet 22 is connected in series with the temperature relay 5 to be tested, and both ends of the series connection are connected to an external power source;

[0032] A test area is provided on the upper surface of the thermal isotherm 21 near the electric heater 1, and a temperature sensor 4 is mounted on the test area for detecting the temperature value of the thermal isotherm 21; the test area is also used to set a temperature relay 5 to be tested, and the temperature sensor 4 is arranged in the test area near the temperature relay 5 to be tested.

[0033] The cold end of the semiconductor refrigeration sheet 22 is bonded to the lower surface of the thermally conductive isothermal body 21, and the hot end of the semiconductor refrigeration sheet 22 is bonded to the upper surface of the water cooling block 3; a hot end temperature sensor 23 is provided on the hot end of the semiconductor refrigeration sheet 22 for detecting the temperature of the hot end of the semiconductor refrigeration sheet 22.

[0034] When using the temperature relay performance test platform to test the normally open temperature relay 5 to be tested:

[0035] Connect the electric heater 1, the semiconductor cooling sheet 22, and the normally open temperature relay 5 to the external power supply respectively;

[0036] The heat conducting isothermal body 21 is heated by the electric heater 1, and the temperature value of the heat conducting isothermal body 21 is detected by the temperature sensor 4 and displayed;

[0037] When the normally open temperature relay 5 to be tested jumps and closes, the temperature value of the thermally conductive isothermal body 21 detected by the temperature sensor 4 when the normally open temperature relay 5 to be tested jumps is compared with the set operating temperature of the normally open temperature relay 5 to be tested, so as to determine whether the normally open temperature relay 5 to be tested can work normally and whether the actual operating temperature is within the allowable range.

[0038] After the normally open temperature relay 5 to be tested is closed, the semiconductor refrigeration sheet 22 starts to work to cool the heat-conducting copper plate. At the same time, the connection between the electric heater 1 and the external power supply is disconnected, and the low-temperature water cooler is turned on to provide cooling water to the water cooling block 3 to cool the heat-conducting isothermal body 21 until the normally open temperature relay 5 to be tested is disconnected.

[0039] To ensure that the temperature of the hot end of the semiconductor refrigeration chip 22 is not higher than 60°C, a hot end temperature sensor 23 is provided to detect the temperature of the hot end of the semiconductor refrigeration chip 22; when the temperature of the semiconductor refrigeration chip 22 is higher than 60°C, the test is stopped and the user is prompted to lower the cooling water temperature in the water cooling block 3 or increase the cold water flow of the water cooling block 3.

[0040] In order to increase the heat conduction efficiency, thermal grease 6 is provided between the cold end of the semiconductor refrigeration sheet 22 and the heat-conducting isothermal body 21 , and between the hot end of the semiconductor refrigeration sheet 22 and the water-cooling block 3 .

[0041] Example 2

[0042] The difference from Example 1 is that Example 2 is used for setting the action temperature test of the normally closed temperature relay, such as Figure 2 As shown, the electric heater 1 is connected in series with the temperature relay 5 to be tested, and both ends of the series connection are connected to an external power supply; the thermal conductivity isothermal test module 2 includes a thermal conductivity isothermal body 21, and the lower surface of the thermal conductivity isothermal body 21 is in contact with the upper surface of the water cooling block 3.

[0043] When using the temperature relay performance test platform to test the normally closed temperature relay 5 to be tested:

[0044] Connect the electric heater 1 to an external power source;

[0045] The heat conducting isothermal body 21 is heated by the electric heater 1, and the temperature of the heat conducting isothermal body 21 is detected by the temperature sensor 4 and displayed;

[0046] When the normally closed temperature relay 5 to be tested jumps and disconnects, the temperature value of the thermally conductive isothermal body 21 detected by the temperature sensor 4 when the normally closed temperature relay 5 to be tested jumps and disconnects is compared with the set operating temperature of the normally closed temperature relay 5 to be tested, so as to determine whether the normally closed temperature relay 5 to be tested can work normally and whether the actual operating temperature is within the allowable range.

[0047] After the normally closed temperature relay 5 to be tested is disconnected, the electric heater 1 stops heating the thermally conductive isothermal body 21, and the low-temperature water cooler continues to provide cooling water to the water cooling block 3 to cool the thermally conductive isothermal body 21 until the normally closed temperature relay 5 to be tested is closed.

[0048] In order to increase the heat conduction efficiency, a thermally conductive silicone grease 6 is provided between the water cooling block 3 and the thermally conductive isothermal body 21 .

[0049] In Embodiment 1 and Embodiment 2, the heat-conducting isothermal body 21 is a heat-conducting copper plate or a heat-conducting aluminum plate.

[0050] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or replacements within the technical scope disclosed in the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope recorded in the claims.

Claims

1. A temperature relay performance test platform, used for setting action temperature test of temperature relay, characterized by: It comprises an electric heater (1), a thermal conductivity isothermal test module (2) and a water cooling block (3) which are sequentially arranged from top to bottom; The water cooling block (3) is provided with a water inlet (31) and a water outlet (32), and the water inlet (31) and the water outlet (32) of the water cooling block (3) are respectively connected to the water outlet pipe and the water inlet pipe of the low-temperature water cooling machine; The electric heater (1) is connected in series with the temperature relay (5) to be tested, and both ends of the series connection are connected to an external power supply; or, both ends of the electric heater (1) are connected to an external power supply, and the thermal conductivity isothermal test module (2) is connected in series with the temperature relay (5) to be tested, and both ends of the series connection are connected to an external power supply; A test area is provided on the upper surface of the thermal conductivity isothermal test module (2) near the electric heater (1), and a temperature sensor (4) is mounted on the test area for detecting the temperature value of the thermal conductivity isothermal test module (2); the test area is also used to set a temperature relay (5) to be tested, and the temperature sensor (4) is set in the test area at a position close to the temperature relay (5) to be tested.

2. The temperature relay performance test platform according to claim 1, characterized in that: The two ends of the electric heater (1) are connected to an external power source, the thermal conductivity isothermal test module (2) is connected in series with the temperature relay to be tested (5), and the two ends of the series connection are connected to the external power source; The thermal conductivity isothermal test module (2) comprises a thermal conductivity isothermal body (21) and a semiconductor cooling sheet (22); The semiconductor cooling sheet (22) is connected in series with the temperature relay (5) to be measured, and both ends of the series connection are connected to an external power supply; The cold end of the semiconductor refrigeration sheet (22) is bonded to the lower surface of the heat-conducting isothermal body (21), and the hot end of the semiconductor refrigeration sheet (22) is bonded to the upper surface of the water-cooling block (3); A hot end temperature sensor (23) is provided on the hot end of the semiconductor cooling sheet (22) for detecting the temperature of the hot end of the semiconductor cooling sheet (22).

3. The temperature relay performance test platform according to claim 1, characterized in that: The electric heater (1) is connected in series with the temperature relay (5) to be measured, and both ends of the series connection are connected to an external power supply; The thermal conductivity isothermal test module (2) comprises a thermal conductivity isothermal body (21), and the lower surface of the thermal conductivity isothermal body (21) is in contact with the upper surface of the water cooling block (3).

4. The temperature relay performance test platform according to claim 2, characterized in that: Thermally conductive silicone grease (6) is provided between the water cooling block (3) and the thermally conductive isothermal body (21), between the cold end of the semiconductor cooling sheet (22) and the thermally conductive isothermal body (21), and between the hot end of the semiconductor cooling sheet (22) and the water cooling block (3).

5. The temperature relay performance test platform according to claim 3, characterized in that: Thermally conductive silicone grease (6) is provided between the water cooling block (3) and the thermally conductive isothermal body (21).

6. The temperature relay performance test platform according to any one of claims 2 to 4, characterized in that: The heat-conducting isothermal body (21) is a heat-conducting copper plate or a heat-conducting aluminum plate.

7. The temperature relay performance test platform according to claim 2, characterized in that: The working temperature of the semiconductor cooling plate (22) is not higher than 60°C.

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