Solid-solid contact type notebook computer auxiliary heat dissipation device

Abstract

The utility model discloses a solid-solid contact type notebook computer auxiliary heat dissipation device. A notebook computer heat conduction module, notebook computer end heat dissipation fins, notebook computer end heat conduction fins and straight heat pipes are integrated in the notebook computer, and internal components are connected through brazing to form a heat conduction whole. An external assembly composed of base end heat conduction fins and a base is arranged outside the notebook computer, threaded holes are formed in the base end heat conduction fins, water channels are formed in the base end heat conduction fins, and the base end heat conduction fins can be connected with an external water-cooling radiator through a water-cooling pipe for heat exchange. According to the internal and external assembly, heat conduction is achieved through meshing of the two heat conduction fins, heat in the notebook computer is partially conducted to the external water-cooling radiator, auxiliary heat dissipation of the notebook computer is achieved, and the risk of liquid leakage damage caused by the fact that a water-cooling pipeline is introduced into the notebook computer is effectively avoided.

Description

Technical Field

[0001] The utility model relates to a heat dissipation device for electronic equipment, in particular to heat dissipation for portable and high-power equipment such as notebook computers. Technical Background

[0002] Existing laptops all use heat pipes or heat spreaders to transfer heat to the cooling fins, and have built-in fans to draw in external cold air, so that sufficient air can transfer heat to the cooling fins to complete the heat exchange from the inside of the laptop to the external environment. However, as the performance of computing chips, mainly CPUs and GPUs, continues to increase, the heat generation power is also gradually increasing, and the heat dissipation performance of laptops also needs to be gradually improved. Using the existing laptop cooling solution, the heat dissipation power can only be increased by increasing the area of ​​the cooling fins, which results in a higher weight for high-performance laptops. However, the weight of the laptop cannot increase indefinitely, so there is a need for auxiliary heat dissipation of the laptop. For example, the laptop model "Mechanical Revolution Kuangshi 16super" launched by Mechanical Revolution has a built-in water cooling pipe. Part of the heat generated inside can be transferred to the external water cooling radiator through the water cooling pipe, realizing an increase in the area of ​​the external cooling fins. This solution of using liquid medium for heat transfer has some usage defects. The magnetic water-cooling connector used has the risk of leakage after multiple plugging and unplugging, which may cause water to enter the laptop computer. After being disconnected from the water-cooling radiator, some liquid will still remain in the water-cooling pipe inside the laptop. Long-term retention of liquid will also increase the risk of corrosion and damage to the sealing connector and internal pipes. Utility Model Content

[0003] In order to overcome the risk of leakage in the water cooling pipeline inside the laptop, which may lead to damage to the laptop due to liquid ingress, the utility model designs a solid-solid contact heat conduction structure, which conducts the heat inside the laptop to the external water cooling pipeline through the mutual contact of the solid interface, so as to achieve the same effect of external auxiliary water cooling heat dissipation. There is no water cooling pipeline inside the laptop, which eliminates the risk of damage to the laptop due to liquid ingress.

[0004] The technical solution adopted by the utility model to solve its technical problems is: a solid-solid contact type notebook auxiliary heat dissipation device, including a notebook computer thermal conductivity module, notebook end heat dissipation fins, notebook end thermal conductive fins, straight heat pipes, base end thermal conductive fins, a base, and is assisted by a water-cooled radiator and a water pump on the periphery.

[0005] In the above-mentioned solid-solid contact type notebook auxiliary heat dissipation device, the notebook computer thermal conductivity module is composed of a heat spreader and a heat pipe, and is designed as two heat spreaders of appropriate area. One side of the two heat spreaders is connected to at least three heat pipes by brazing, so that the heat on the heat spreader is well conducted to the heat pipe; the other side of the heat spreader is in direct contact with the CPU and GPU chips, and the two interfaces are filled with a heat conductive medium such as silicone grease to reduce the thermal resistance of thermal conduction; among the at least three heat pipes, at least two of the heat pipes are bent into appropriate shapes and brazed to the notebook end heat dissipation fins, and at least one heat pipe is bent into an appropriate shape and brazed to the notebook end thermal conductive fins; the notebook computer thermal conductivity module is installed inside the notebook computer, forming a heat transfer path from the CPU and GPU chips to the notebook end heat dissipation fins and the notebook end thermal conductive fins.

[0006] In the above-mentioned solid-solid contact type notebook auxiliary heat dissipation device, the notebook end heat dissipation fins are composed of small components formed by bending copper sheets and splicing them into a long rectangular shape, and the length, width and height dimensions meet the internal space requirements of the notebook; the notebook end heat dissipation fins are divided into two groups, distributed on the left and right sides at the air outlet inside the notebook computer; one side of the upper and lower contact surfaces of the notebook end heat dissipation fins are brazed and connected to the heat pipe in the thermal conductive module of the notebook computer, and the other side is brazed and connected to the straight heat pipe to balance the heat of the left and right groups of heat dissipation fins.

[0007] In the above-mentioned solid-solid contact type notebook auxiliary heat dissipation device, the notebook end heat conducting fins are formed by milling comb-shaped heat conducting fins from an integrated aluminum block; the notebook end heat conducting fins are tapped with two threaded holes and fixed inside the notebook computer through threaded connection; the meshing tooth shape of the comb-shaped heat conducting fins is designed as a flat rectangular parallelepiped, extending out of the notebook computer shell and meshing with the base end heat conducting fins outside the notebook computer; the comb-shaped heat conducting fins in the meshing direction of the notebook end heat conducting fins and the base end heat conducting fins are chamfered to facilitate the meshing between the two The notebook-end heat conducting fins are arranged between the two groups of notebook-end heat dissipation fins, and the two can be repeatedly engaged and separated; the engagement between the notebook-end heat conducting fins and the base-end heat conducting fins is an interference connection to ensure the contact pressure of the contact surface and reduce the contact thermal resistance of the solid contact surface between the two; the notebook-end heat conducting fins are arranged between the two groups of notebook-end heat dissipation fins, and the upper and lower contact surfaces thereof are connected to the heat pipes in the thermal conductive module of the notebook computer by brazing on one side and connected to the straight heat pipes by brazing on the other side, so that the excess heat of the notebook-end heat dissipation fins is transferred to the notebook-end heat conducting fins through the straight heat pipes.

[0008] In the above-mentioned solid-solid contact type notebook auxiliary heat dissipation device, the direct heat pipe is connected to the notebook end heat dissipation fins and the notebook end thermal conductive fins by brazing. The two groups of notebook end heat dissipation fins are distributed on the left and right sides of the internal air outlet of the notebook computer, and the notebook end thermal conductive fins are located between the two groups of notebook end heat dissipation fins; the direct heat pipe connects the notebook end heat dissipation fins and the notebook end thermal conductive fins together to balance the heat between the two groups of notebook end heat dissipation fins, and can transfer the excess heat of the notebook end heat dissipation fins to the notebook end thermal conductive fins through the direct heat pipe, and then conduct it to the external water cooling radiator.

[0009] The solid-solid contact type notebook auxiliary heat dissipation device mentioned above has a base end heat conduction fin similar in shape to the notebook end heat conduction fin, which is formed by milling a comb-shaped heat conduction fin from an integrated brass block, and the meshing tooth shape is designed as a flat rectangular parallelepiped; the base end heat conduction fin is tapped with two threaded holes and connected to the base through threads; the base end heat conduction fin has a water channel inside, and two threaded holes are opened on one side of the outer side, each with a water inlet and outlet, which is connected to the external water-cooled radiator through a water cooling pipe and forms a circulation loop with the external water cooling pipeline to achieve the bottom The heat of the base-end thermal fins is transferred to the water-cooled radiator through the coolant, and then heat exchange with the ambient air is achieved through the water-cooled radiator; the comb-shaped thermal fins on the engagement direction of the base-end thermal fins and the notebook-end thermal fins are chamfered to facilitate the engagement between the two, and the two can be repeatedly engaged and separated; the engagement between the base-end thermal fins and the notebook-end thermal fins is an interference fit, and the stiffness and surface hardness of the base-end thermal fins are higher than those of the notebook-end thermal fins to ensure the contact pressure of the contact surface.

[0010] The above-mentioned solid-solid contact type notebook auxiliary heat dissipation device has a base designed to be long and narrow in shape to lift the bottom of the laptop computer at a certain angle, thereby increasing the air intake inside the laptop computer and improving heat dissipation conditions; the base is a hollow structure designed to be made by injection molding, with reinforcing ribs inside to increase the strength of the base; the base has two through holes, which are connected to the heat-conducting fins at the base end by threads.

[0011] The beneficial effect of the utility model is that the solid-solid contact type notebook auxiliary heat dissipation device of the utility model realizes heat conduction between the inside of the notebook computer and the external water cooling radiator through the engagement of the notebook end heat conducting fins and the base end heat conducting fins, thereby avoiding the introduction of water cooling pipes into the notebook computer. The water cooling device is placed outside, and the components of the water cooling device do not need to be disassembled, which effectively reduces the risk of leakage of cooling liquid and liquid intrusion into the notebook computer. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0013] Figure 1 It is a schematic diagram of the utility model;

[0014] Figure 2 For along Figure 1 Schematic diagram of the middle AA line;

[0015] Figure 3 For along Figure 1 Schematic diagram of the middle BB line;

[0016] Figure 4 A schematic diagram of the engagement of the notebook-side thermal fins and the base-side thermal fins;

[0017] Figure 5 This is the assembly drawing of the utility model;

[0018] In the figure, 1. thermal conductivity module of the laptop computer, 11. heat spreader, 12. heat pipe, 2. straight heat pipe, 3. thermal conductivity fins at the laptop end, 4. heat dissipation fins at the laptop end, 5. base, 6. thermal conductivity fins at the base end, and 7. the laptop computer as a whole. DETAILED DESCRIPTION

[0019] The structure and use steps of the utility model are further described below in conjunction with the accompanying drawings, which are intended to explain the utility model rather than to limit it.

[0020] like Figure 1 As shown, it describes the structural schematic diagram of the utility model, which mainly includes a notebook computer thermal conduction module 1, a notebook end heat dissipation fin 4, a notebook end thermal conduction fin 3, a straight heat pipe 2, a base 5, and a base end thermal conduction fin 6;

[0021] The utility model can be divided into two parts: internal components and external components of a laptop computer. The internal components include: a laptop computer heat conduction module 1, a straight heat pipe 2, a laptop end heat conduction fin 3, and a laptop end heat dissipation fin 4. The external components include: a base 5, a base end heat conduction fin 6 (assisted by a water cooling radiator and a water pump);

[0022] The notebook computer thermal conduction module 1 comprises: a heat spreader 11 and a heat pipe 12;

[0023] The internal components are connected by brazing to form an integral component, which is designed to be installed inside the notebook to achieve heat conduction inside the notebook. The heat spreader 11 is in contact with the surface of the CPU and GPU wafers, and the contact surface is filled with a heat-conducting medium such as silicone grease to reduce the contact thermal resistance between the chip and the heat spreader 11; in the external component, the base 5 is fixed to the heat-conducting fins 6 at the base end by threaded connection. The water inlet and outlet leading out of the heat-conducting fins 6 at the base end are connected in series with the water-cooling radiator and the water inlet and outlet of the water pump through the water-cooling pipe in sequence, forming a circulation loop with the external water-cooling pipe. The water pump provides liquid flow pressure to realize that the heat of the heat-conducting fins 6 at the base end in the external component is transported to the water-cooling radiator through the coolant, and then through the water-cooling radiator, heat exchange is performed with the ambient air; when the utility model is used, the heat-conducting fins 3 at the notebook end are pressed into the heat-conducting fins 6 at the base end to achieve the meshing of the two heat-conducting fins, completing the heat conduction between the internal and external components of the laptop computer;

[0024] When the utility model assists heat dissipation, the water-cooled radiator will cool the coolant along the Figure 1 The middle arrow E is pumped into the heat conducting fin 6 at the base end, and the coolant flows along Figure 1 The middle arrow O flows out to realize heat exchange between the heat-conducting fins 6 at the base end and the coolant.

Claims

1. A solid-solid contact notebook auxiliary heat dissipation device, the main components of which include: A notebook computer thermal conductivity module (1), notebook end heat dissipation fins (4), notebook end heat dissipation fins (3), base end heat dissipation fins (6), straight heat pipes (2) and a base (5); characterized in that the notebook computer thermal conductivity module (1) comprises a heat spreader (11) and a heat pipe (12), the heat pipe (12) being fixed to one side of the heat spreader (11) by brazing; at least two bent heat pipes (12) are brazed to one of the upper and lower contact surfaces of the notebook end heat dissipation fins (4), and the notebook end heat dissipation fins (6) are .... The fins are divided into two groups, which are distributed on the left and right sides at the air outlet inside the notebook computer; the notebook-end heat-conducting fins (3) are located between the two groups of notebook-end heat-dissipating fins (4), and one of the upper and lower contact surfaces is brazed and connected to at least one bent heat pipe (12); the straight heat pipe (2) is brazed and connected to the notebook-end heat-dissipating fins (4) and the other side of the notebook-end heat-conducting fins (3); the base-end heat-conducting fins (6) are fixed on the base (5), and the base-end heat-conducting fins (6) can be meshed and connected to the notebook-end heat-conducting fins (3).

2. The solid-solid contact notebook auxiliary heat dissipation device according to claim 1, characterized in that: The notebook end heat conducting fin (3) and the base end heat conducting fin (6) are meshed with each other in an interference fit, and the two can be repeatedly meshed and separated; The meshing tooth shape of the heat conducting fin is designed as a flat rectangular parallelepiped.

3. The solid-solid contact notebook auxiliary heat dissipation device according to claim 1 or 2, characterized in that: The heat-conducting fin (6) at the base end is designed with a water channel for circulating the coolant inside, forming a circulation loop with the external water cooling pipeline.

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