Smart card

Abstract

The utility model discloses a smart card. The intelligent card comprises a ceramic layer, the ceramic layer is provided with a first surface and a second surface which are opposite, and the first surface is provided with a first slot; the plastic-based backboard layer is arranged on one side of the second surface of the ceramic layer, and a first bonding layer is arranged between the plastic-based backboard layer and the ceramic layer; the antenna layer is arranged on the ceramic layer or the plastic-based backboard layer and comprises a coil; and the chip module is arranged in the first slot, and the chip module is electrically connected with the antenna layer. The surface processing technology of a traditional plastic material card can be applied to the surface processing technology, the technology design has more inclusiveness, the material cost is saved, the production efficiency is improved, and the processing difficulty is low. Due to the fact that the ceramic layer is adopted, material hardness and structural strength are higher, deformation is not prone to occurring, and the using performance of the intelligent card is improved.

Description

Technical Field

[0001] The present application relates to the technical field of smart cards, and in particular to a smart card. Background Art

[0002] Smart cards usually refer to cards with chip modules embedded in them. Smart cards include standard cards, which have specific sizes and are made of plastic. Smart cards are used to identify individuals and store their information. Various smart cards, such as work permits, ID cards, various financial transaction cards, membership cards, etc., have been widely used in people's lives.

[0003] Due to the limitation of the structural materials of existing smart cards, the performance of existing smart cards cannot meet the demand. Utility Model Content

[0004] The embodiment of the present application provides a smart card, which can apply the surface processing technology on the traditional plastic material card, with more inclusiveness in process design, saving material cost, improving production efficiency, and low processing difficulty. In addition, due to the use of the ceramic layer, the material hardness and structural strength are higher, and deformation is not easy to occur, thereby improving the performance of the smart card.

[0005] An embodiment of the present application provides a smart card, including: a ceramic layer, the ceramic layer having a first surface and a second surface relative to each other, the first surface being provided with a first groove; a plastic-based backplane layer, provided on one side of the second surface of the ceramic layer, a first adhesive layer being provided between the plastic-based backplane layer and the ceramic layer; an antenna layer, provided on the ceramic layer or the plastic-based backplane layer, the antenna layer including a coil; a chip module, provided in the first groove, the chip module and the antenna layer being electrically connected.

[0006] According to an embodiment provided in the present application, a second groove is provided on the second surface, and the antenna layer is provided in the second groove.

[0007] According to an embodiment provided by the present application, along the thickness direction of the smart card, the depth of the second groove is greater than the thickness of the antenna layer.

[0008] According to an embodiment provided in the present application, a second adhesive layer is provided in the second groove, and the second adhesive layer connects the antenna layer and the ceramic layer respectively.

[0009] According to the embodiment provided in the present application, along the direction from the first surface to the second surface, the plastic-based backplane layer includes a printing layer, a first protective layer, and an information carrier portion arranged on the surface of the first protective layer.

[0010] According to the embodiment provided in the present application, along the direction pointing from the first surface to the second surface, the plastic-based backplane layer includes at least a stacked second protective layer, an antenna layer, a printing layer, a first protective layer and an information carrier portion arranged on the surface of the first protective layer; at least the second protective layer is a transparent protective layer.

[0011] According to the embodiment provided by the present application, the antenna layer, the printed layer, and the first protective layer all include at least one of a polyvinyl chloride layer, a polyethylene terephthalate layer, a polycarbonate layer, and a polystyrene layer.

[0012] According to an embodiment provided in the present application, the color of at least one of the second protective layer, the antenna layer, and the printed layer is the same as the color of the ceramic layer.

[0013] According to an embodiment provided in the present application, the thickness of the second protective layer is less than or equal to 0.04 mm.

[0014] According to an embodiment provided by the present application, the information carrier portion includes at least one of a magnetic stripe, an anti-counterfeiting mark, and a signature strip.

[0015] The smart card provided by the embodiment of the utility model includes a ceramic layer, a plastic-based backplane layer, a first adhesive layer, an antenna layer and a chip module, and is prepared by a ceramic layer including a ceramic material and a plastic-based backplane layer including a plastic material, that is, only one ceramic layer is required. Compared with a double-sided ceramic card, only the front side is provided with a ceramic layer, and no ceramic bottom plate is required. The ceramic bottom plate is replaced by a plastic-based backplane layer made of a plastic material, saving material costs; only one ceramic layer is provided, reducing the ceramic bottom plate can also greatly reduce the time for grinding and polishing the ceramic surface. Ceramic grinding is very time-consuming and requires continuous grinding with a grinding machine, generally measured in days. Only one ceramic layer is provided, and only a single piece of ceramic needs to be ground, which can save half of the grinding time and improve production efficiency; the smart card provided by the embodiment of the utility model adopts a plastic-based backplane layer, so that the surface processing technology on the traditional plastic material card can be applied to it, and the process design is more inclusive and the processing difficulty is low. And because the ceramic layer is used, the material hardness and structural strength are higher, and it is not easy to deform, which improves the performance of the smart card. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1This is a schematic diagram of the structure of a smart card according to an embodiment of the present application;

[0018] Figure 2 This is an embodiment of the present application Figure 1 Schematic diagram of the cross section at AA in the middle;

[0019] Figure 3 Another embodiment of the present application Figure 1 Schematic diagram of the cross section at AA in the middle;

[0020] Figure 4 is a cross-sectional schematic diagram of a plastic-based backplane layer according to an embodiment of the present application;

[0021] Figure 5 It is a cross-sectional schematic diagram of the plastic-based backplane layer of another embodiment of the present application.

[0022] Reference numerals:

[0023] 1. Ceramic layer; 2. Plastic-based backplane layer; 3. First adhesive layer; 4. Chip module; 5. Antenna layer; 6. Printing layer; 7. First protective layer; 8. Information carrier part; 9. Second protective layer; F1. First surface; F2. Second surface; K1. First slot; K2. Second slot. DETAILED DESCRIPTION

[0024] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the following detailed description, many specific details are proposed in order to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without some of these specific details. The following description of the embodiments is only intended to provide a better understanding of the present application by showing examples of the present application.

[0025] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The embodiments will be described in detail below in conjunction with the accompanying drawings.

[0026] Relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation; they do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion; so that a process, method, article or apparatus that includes a series of elements includes not only those elements; but also includes other elements not explicitly listed; or also includes elements inherent to such process, method, article or apparatus. In the absence of more limitations; the elements defined by the sentence "comprises..."; does not exclude the existence of other identical elements in the process, method, article or apparatus that includes the elements.

[0027] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or region, it may mean that it is directly on the other layer or region, or that other layers or regions are included between it and the other layer or region. Furthermore, if the component is turned over, the layer or region will be "below" or "beneath" another layer or region.

[0028] In addition, the term "and / or" in this article is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone; A and B exist at the same time; B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0029] It should be understood that in the embodiment of the present application, "B corresponding to A" means that B is associated with A and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A; B can also be determined according to A and / or other information.

[0030] See also Figure 1 and Figure 3 , Figure 1 This is a schematic diagram of the structure of a smart card according to an embodiment of the present application; Figure 2 This is an embodiment of the present application Figure 1 Schematic diagram of the cross section at AA in the middle; Figure 3 Another embodiment of the present application Figure 1 Schematic diagram of the cross section at AA in the middle.

[0031] An embodiment of the present application provides a smart card, including: a ceramic layer 1, the ceramic layer 1 has a first surface F1 and a second surface F2 relative to each other, and the first surface F1 is provided with a first groove K1; a plastic-based backplane layer 2, arranged on the side of the second surface F2 of the ceramic layer 1, and a first adhesive layer 3 is arranged between the plastic-based backplane layer 2 and the ceramic layer 1; an antenna layer 5, arranged on the ceramic layer 1 or the plastic-based backplane layer 2, and the antenna layer 5 includes a coil; a chip module 4, arranged in the first groove K1, and the chip module 4 and the antenna layer 5 are electrically connected.

[0032] The smart card provided by the embodiment of the utility model includes a ceramic layer 1, a plastic-based backplane layer 2, a first adhesive layer 3, an antenna layer 5 and a chip module 4. The smart card is prepared by a ceramic layer 1 including a ceramic material and a plastic-based backplane layer 2 including a plastic material, that is, only one ceramic layer 1 is required. Compared with a double-sided ceramic card, only the front side is provided with a ceramic layer 1, and no ceramic bottom plate is required. The ceramic bottom plate is replaced by a plastic-based backplane layer 2 made of a plastic material, saving material costs; only one ceramic layer 1 is provided, reducing the ceramic bottom plate and greatly reducing the time for grinding and polishing the ceramic surface. Ceramic grinding is very time-consuming and requires continuous grinding with a grinding machine, generally measured in days. Only one ceramic layer 1 is provided and only a single piece of ceramic needs to be ground, which can save half of the grinding time and improve production efficiency; the smart card provided by the embodiment of the utility model adopts a plastic-based backplane layer 2, so that the surface processing technology on the traditional plastic material card can be applied to it, and the process design is more inclusive and the processing difficulty is low. And because the ceramic layer 1 is used, the material hardness and structural strength are higher, and it is not easy to deform, which improves the performance of the smart card.

[0033] In this embodiment, the ceramic layer 1 can be made of ceramic materials such as zirconium oxide special ceramics, and a first groove K1 is formed on the first surface F1 to accommodate the chip module 4 .

[0034] The first adhesive layer 3 is used to bond the ceramic layer 1 and the plastic-based back plate layer 2 together, and adhesive materials such as AB glue or double-sided cold glue can be used.

[0035] The plastic-based backplane layer 2 may include a multi-layer structural layer to achieve different functions, such as a printing layer 6, a protective layer, etc., and the plastic-based backplane layer 2 may include at least one of a polyvinyl chloride layer, a polyethylene terephthalate layer, a polycarbonate layer, and a polystyrene layer.

[0036] Optionally, the chip module 4 includes a chip and a carrier tape. The front side of the carrier tape has a contact pad for supplying power to the chip during contact payment. The back side of the carrier tape also includes contacts connected to the coil in the antenna unit. During contactless payment, the coil supplies power to the chip.

[0037] Optionally, the carrier tape includes a carrier and a strip. The strip and the chip are conductively connected through leads. The carrier is used to carry the strip and connect components that fix the chip. The strip is used for interface purposes and can adopt a copper-based structure. Nickel-gold elements are electroplated on the contact surface to ensure signal transmission effect while avoiding rust or damage.

[0038] Optionally, the carrier tape is provided with a chip carrying area and several functional areas which are isolated from each other, and these functional areas are, in sequence, an input / output functional area, a clock functional area, a power functional area, a grounding functional area, a reset functional area and a vacant functional area.

[0039] Optionally, the antenna unit comprises a coil.

[0040] Optionally, the antenna units are arranged in a ring shape, specifically in a square or circular shape.

[0041] Optionally, the chip is close to the magnetic field of the card reader, requiring the induced current generated by the coil to be able to provide contactless communication. The larger the coil encirclement area, the greater the induced current generated by the coil.

[0042] Milling grooves on ceramic sheets will have the risk of cracking, the milling groove scrap rate is high, and the milling grooves on ceramics are time-consuming and costly. Therefore, the smart card provided by the embodiment of the utility model does not need to perform additional card element groove milling on the ceramic layer 1, which greatly simplifies the processing flow, improves the yield rate, and saves costs.

[0043] Optionally, depending on the structure of the smart card, the antenna layer 5 can be provided on the ceramic layer 1 or the plastic-based backplane layer 2 .

[0044] For example, when the antenna layer 5 is disposed on the ceramic layer 1, the second surface F2 is provided with a second slot K2, and the antenna layer 5 is disposed in the second slot K2. Figure 3 shown.

[0045] The second slot K2 can be formed in one piece during the sintering stage of the ceramic layer 1 , or can be formed by CNC engraving, laser etching, or other means to accommodate the antenna layer 5 , thereby ensuring that the thickness of the smart card meets the requirements.

[0046] Optionally, the antenna layer 5 includes a flexible circuit board, and no winding is required on the plastic-based backplane layer 2 .

[0047] Optionally, along the thickness direction of the smart card, the depth of the second slot K2 is greater than the thickness of the antenna layer 5 to prevent the antenna layer 5 from protruding relative to the ceramic layer 1 and damaging the antenna layer 5, thereby improving the reliability of the smart card.

[0048] Optionally, no glue layer may be placed between the antenna layer 5 and the second slot K2 of the ceramic sheet, and the first adhesive layer 3 is abutted against the antenna layer 5 to achieve fixation.

[0049] Alternatively, a second adhesive layer is provided in the second slot K2 , and the second adhesive layer connects the antenna layer 5 and the ceramic layer 1 respectively, so as to further improve the stability of the connection between the antenna layer 5 and the ceramic layer 1 .

[0050] See also Figure 4 In some optional embodiments, along the direction from the first surface F1 to the second surface F2, the plastic-based backplane layer 2 includes a printing layer 6, a first protective layer 7, and an information carrier portion 8 disposed on the surface of the first protective layer 7.

[0051] Since the antenna layer 5 has been embedded in the ceramic sheet, the plastic-based backplane layer 2 can be directly composed of the printed layer 6 and the first protective layer 7 after composite lamination. The printed layer 6 can be provided with conventional printing patterns such as offset printing and silk screen printing. The first protective layer 7 is used to protect the ink on the printed layer 6. The surface of the first protective layer 7 is used for carrying the information carrier part 8 for processing.

[0052] See also Figure 5 In some other optional embodiments, along the direction pointing from the first surface F1 to the second surface F2, the plastic-based backplane layer 2 includes at least a stacked second protective layer 9, an antenna layer 5, a printing layer 6, a first protective layer 7 and an information carrier portion 8 arranged on the surface of the first protective layer 7; at least the second protective layer 9 is a transparent protective layer.

[0053] In this embodiment, the antenna layer 5 is arranged on the plastic-based backplane layer 2, that is, the antenna layer 5 is used as a layer in the plastic-based backplane layer 2. The second protective layer 9, the antenna layer 5, the printed layer 6, and the first protective layer 7 can be synthesized to form the plastic-based backplane layer 2, so that it can be bonded and compounded with the ceramic layer 1 through the first adhesive layer 3 as an integral module unit, wherein the antenna layer 5 of the plastic-based backplane layer 2 is wound with enameled wire, and the printed layer 6 has conventional printed patterns such as offset printing and silk screen printing. The second protective layer 9 is used to protect the winding enameled wire from dispersing during the production process, and the first protective layer 7 protects the ink on the printed layer 6, and the surface is used for carrying the information carrier part 8 for processing.

[0054] It should be noted that the second protective layer 9 is used to protect the coil from being scattered, sticky, or falling off when the back panel is peeled off during the split-type production process. Since the offset ink has a certain viscosity, the copper enameled wire on the antenna layer 5 is easy to adhere to the ink on the back of the thickness compensation layer in the preparation process when the card body is peeled off, thus destroying the linear shape and structure of the coil. In order to prevent the enameled wire on the antenna layer 5 from transferring and adhering after hot pressing, the surface of the antenna layer 5 must be protected, which requires adding a second protective layer 9 to the antenna layer 5. After adding this layer, the winding coil is not in direct contact with the ink, so the winding coil can be completely retained on the second protective layer 9 when the card body is peeled off.

[0055] Moreover, the thickness of the second protective layer 9 needs to be extremely thin, otherwise the overall thickness of the plastic-based backplane layer 2 will be too thick, thereby causing the overall thickness of the smart card to be too thick. Generally, the thickness of the second protective layer 9 is less than or equal to 0.04 mm. Optionally, the second protective layer 9 is made of a transparent polyvinyl chloride film. During the manufacturing process of the antenna layer 5, the second protective layer 9 can be compounded with the antenna layer 5 in advance, and then the compounded laminate is used for the manufacturing of the plastic-based backplane layer 2.

[0056] In addition, when adding the second protective layer 9, it is necessary to avoid that the second protective layer 9 blocks the color of the enameled wire, otherwise the high-definition camera cannot capture the enameled wire ends when the equipment picks up the wire, and the automated equipment cannot pick up the wire. Therefore, the second protective layer 9 needs to be made of transparent material, that is, at least the second protective layer 9 is a transparent protective layer to ensure the normal progress of the process.

[0057] In some optional embodiments, the antenna layer 5, the printed layer 6, and the first protective layer 7 all include at least one of a polyvinyl chloride layer (PVC), a polyethylene terephthalate layer (PET), a polycarbonate layer (PC), and a polystyrene layer (PG).

[0058] It should be noted that in order to solve the problem that PVC material is not heat-resistant and has a soft texture, the second protective layer 9, antenna layer 5, and printing layer 6 can be replaced with PET substrate or PC, PG and other high-toughness, high-temperature-resistant materials. The first protective layer 7 is not suitable for heat-resistant and high-toughness materials because it is used for heat-mounting of card elements. PVC or other surface film materials suitable for heat-mounting should be selected as much as possible.

[0059] Optionally, the color of at least one of the second protective layer 9 , the antenna layer 5 , and the printed layer 6 is the same as the color of the ceramic layer 1 .

[0060] The colors of the second protective layer 9, antenna layer 5, and printed layer 6 can be selected according to the color of the upper ceramic layer 1. The black ceramic layer 1 corresponds to a black second protective layer 9, antenna layer 5, and printed layer 6, and the white ceramic layer 1 corresponds to a white second protective layer 9, antenna layer 5, and printed layer 6.

[0061] For example, the second protective layer 9, the antenna layer 5, and the printed layer 6 use a PET substrate. The color of the PET substrate can be selected according to the color of the upper ceramic layer 1. The black ceramic layer 1 corresponds to black PET, and the white ceramic layer 1 corresponds to white PET. The colors of other layers of the plastic-based backplane layer 2 also follow this principle.

[0062] In some optional embodiments, the information carrier portion 8 includes at least one of a magnetic stripe, an anti-counterfeiting mark, and a signature strip. The specific selection is based on specific needs. The information carrier portions 8 with different functions such as the anti-counterfeiting mark and the signature strip can be respectively arranged in different laminated structures to avoid mutual interference.

[0063] The smart card provided in the embodiment of the present application can be used to implement electronic transaction functions. A smart card is a type of card with a predetermined length, width, and thickness, and is also portable and convenient to use. A smart card can be a financial card, a credit card, a stored-value card, a bus card, an access card, or a membership card, but is not limited to the types of cards listed above.

[0064] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A smart card, characterized in that: include: A ceramic layer, the ceramic layer having a first surface and a second surface opposite to each other, the first surface being provided with a first groove; A plastic-based backplane layer is disposed on one side of the second surface of the ceramic layer, and a first adhesive layer is disposed between the plastic-based backplane layer and the ceramic layer; An antenna layer, disposed on the ceramic layer or the plastic-based backplane layer, the antenna layer comprising a coil; A chip module is disposed in the first slot, and the chip module is electrically connected to the antenna layer.

2. The smart card according to claim 1, characterized in that: The second surface is provided with a second groove, and the antenna layer is arranged in the second groove.

3. The smart card according to claim 2, characterized in that: In a thickness direction of the smart card, a depth of the second groove is greater than a thickness of the antenna layer.

4. The smart card according to claim 2, characterized in that: A second adhesive layer is disposed in the second groove, and the second adhesive layer connects the antenna layer and the ceramic layer respectively.

5. The smart card according to claim 2, characterized in that: Along the direction pointing from the first surface to the second surface, the plastic-based backplane layer includes a printing layer, a first protective layer, and an information carrier portion arranged on the surface of the first protective layer.

6. The smart card according to claim 1, characterized in that: Along the direction from the first surface to the second surface, the plastic-based backplane layer at least includes a second protective layer, an antenna layer, a printing layer, a first protective layer, and an information carrier portion arranged on the surface of the first protective layer; At least the second protective layer is a transparent protective layer.

7. The smart card according to claim 6, characterized in that: The antenna layer, the printing layer, and the first protective layer all include at least one of a polyvinyl chloride layer, a polyethylene terephthalate layer, a polycarbonate layer, and a polystyrene layer.

8. The smart card according to claim 6, characterized in that: The color of at least one of the second protective layer, the antenna layer, and the printed layer is the same as the color of the ceramic layer.

9. The smart card according to claim 6, characterized in that: The thickness of the second protective layer is less than or equal to 0.04 mm.

10. The smart card according to claim 5 or 6, characterized in that: The information carrier portion includes at least one of a magnetic stripe, an anti-counterfeiting mark, and a signature strip.

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