M.2 solid state disk and heat dissipation device thereof

Abstract

The utility model relates to the technical field of heat dissipation of M.2 solid state hard disks, and particularly discloses an M.2 solid state hard disk and a heat dissipation device thereof, the heat dissipation device comprises a lower shell and an upper shell, the side surfaces of the lower shell and the upper shell are fixedly connected through bolts; the heat dissipation component comprises a heat conduction plate, a centrifugal fan and heat dissipation fins, the heat conduction plate is clamped and fixed between the lower shell and the upper shell, the centrifugal fan and the heat dissipation fins are fixedly installed on the upper surface of the heat conduction plate, and the heat dissipation fins are arranged on one side of an air outlet of the centrifugal fan in parallel; the heat conduction wrapping layer is arranged in the lower shell; by arranging the heat conducting plate, the cooling fins and the heat conducting wrapping layer, heat dissipated by the hard disk body can be transmitted to the cooling fins, by arranging the centrifugal fan, air flow between the cooling fins can be accelerated, the heat dissipation effect is achieved, and due to the fact that the height of the centrifugal fan is small, the overall thickness of the device is small, and the heat dissipation effect is good. And the device can be conveniently installed in computer equipment for use.

Description

Technical Field

[0001] The utility model belongs to the technical field of M.2 solid state hard disk heat dissipation, and specifically relates to an M.2 solid state hard disk and a heat dissipation device thereof. Background Art

[0002] In recent years, with the rapid development of Internet technology, especially the continuous breakthroughs in key technologies such as big data and cloud platforms, the demand for servers has continued to increase. At the same time, the performance of server products, especially the hard disk response speed, has become increasingly demanding. The M.2 interface solid-state drive has the advantages of small size and fast response speed, making it more and more widely used.

[0003] In a Chinese patent with publication number CN220340903U, an M.2 solid-state hard drive and its heat dissipation device are disclosed. When the heat dissipation fan is working, the airflow shuttles between adjacent long heat sinks, which can greatly improve the heat dissipation efficiency of the fins, and make the M.2 hard drive cooperate with the shell and the fins for heat transfer, so that the M.2 hard drive can dissipate heat in many aspects.

[0004] In the above-mentioned comparative patent, a heat conductive sheet and a long heat sink are provided to transfer the heat generated by the M.2 hard disk during operation to the front end of the heat dissipation fan, so that the airflow generated by the heat dissipation fan blows the air for heat dissipation. However, since the installation direction of the heat dissipation fan is perpendicular to the length direction of the M.2 hard disk, the thickness of the device is greatly increased, so that the device requires a larger installation space, which limits the use of the device. Therefore, an M.2 solid-state hard disk and a heat dissipation device thereof with a small heat dissipation device and good heat dissipation effect are proposed. Utility Model Content

[0005] The purpose of the utility model is to provide an M.2 solid state drive and a heat dissipation device thereof to solve the problems raised in the above-mentioned background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] An M.2 solid state hard disk and a heat dissipation device thereof, comprising:

[0008] A lower shell and an upper shell, wherein the sides of the lower shell and the upper shell are fixedly connected by bolts;

[0009] A heat dissipation component, the heat dissipation component comprises a heat conducting plate, a centrifugal fan and a heat sink, the heat conducting plate is clamped and fixed between the lower shell and the upper shell, the centrifugal fan and the heat sink are both fixedly mounted on the upper surface of the heat conducting plate, and the heat sink is arranged in parallel on one side of the centrifugal fan air outlet;

[0010] A heat-conducting wrapping layer, which is arranged inside the lower shell and is in extrusion contact with the lower surface of the heat-conducting plate;

[0011] The hard disk body is placed inside the heat-conducting wrapping layer, and its two ends are respectively provided with a connecting part for connecting with a computer to exchange data and a fixing part for fixing itself on the mainboard.

[0012] Preferably, a baffle is fixedly mounted on the upper end of the inner side surface of the lower shell, a cover is fixedly mounted on the lower end of the inner side surface of the upper shell, and the upper and lower ends of the heat conducting plate are respectively in contact with the baffle and the cover.

[0013] Preferably, the centrifugal fan includes a shell, a motor and centrifugal blades, the inner cavity of the shell is configured to be in a conch shape, and its air outlet is configured to be at the distal end of the conch shape, the motor is fixedly mounted on the conch-shaped rotating center, the centrifugal blades are fixedly mounted on the driving end of the motor, and an air inlet is opened at the upper end of the shell.

[0014] Preferably, a vent is provided on one side of the top of the upper shell, and the vent is arranged above the air inlet.

[0015] Preferably, the heat-conductive wrapping layer comprises a lower layer and an upper layer, and a placement groove adapted to the hard disk body is provided between the lower layer and the upper layer.

[0016] Preferably, both ends of the heat conducting plate are provided with limit slots, and both side inner walls of the lower shell are fixed with blocks adapted to the limit slots.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] The utility model can transfer the heat emitted by the hard disk body to the heat sink by arranging a heat conduction plate, a heat sink and a heat conduction wrapping layer. By arranging a centrifugal fan, the air flow between the heat sinks can be accelerated to achieve the heat dissipation effect. Since the height of the centrifugal fan is small, the overall thickness of the device is small, which is convenient for installation in the interior of a computer device for use. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0020] Figure 2 It is a three-dimensional structural cross-sectional view of the utility model;

[0021] Figure 3 It is a structural schematic diagram of the heat dissipation component in the utility model;

[0022] Figure 4 It is a structural cross-sectional view of the heat dissipation component in the utility model;

[0023] Figure 5 It is a three-dimensional structural schematic diagram of the lower shell of the utility model;

[0024] Figure 6 It is a side view schematic diagram of the utility model.

[0025] In the figure:

[0026] 1. Lower shell; 11. Baffle; 12. Block; 2. Upper shell; 21. Cover; 22. Vent; 3. Heat dissipation component; 31. Heat conduction plate; 32. Centrifugal fan; 321. Shell; 322. Motor; 323. Centrifugal blades; 33. Heat sink; 34. Limiting slot; 4. Thermal conductive wrapping layer; 41. Lower layer; 42. Upper layer; 5. Hard disk body. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. It should be pointed out that the drawings are schematic and not drawn to scale. For the sake of clarity and convenience in the figures, the relative sizes and proportions of the parts shown in the figures are exaggerated or reduced in size, and any size is only exemplary and not restrictive.

[0028] Example:

[0029] See also Figure 1 - Figure 6 As shown, an M.2 solid state drive and a heat dissipation device thereof include:

[0030] The lower shell 1 and the upper shell 2, and the sides of the lower shell 1 and the upper shell 2 are fixedly connected by bolts;

[0031] The heat dissipation component 3 includes a heat conducting plate 31, a centrifugal fan 32 and a heat sink 33. The heat conducting plate 31 is clamped and fixed between the lower shell 1 and the upper shell 2. The centrifugal fan 32 and the heat sink 33 are both fixedly mounted on the upper surface of the heat conducting plate 31. The heat sink 33 is arranged in parallel on one side of the air outlet of the centrifugal fan 32.

[0032] The heat-conducting wrapping layer 4 is arranged inside the lower shell 1 and is in extrusion contact with the lower surface of the heat-conducting plate 31;

[0033] The hard disk body 5 is placed inside the heat-conducting wrapping layer 4, and its two ends are respectively provided with a connection part for connecting with a computer to exchange data and a fixing part for fixing itself on the motherboard.

[0034] As can be seen from the above, by providing a heat conducting plate 31, a heat sink 33 and a heat conducting wrapping layer 4, the heat emitted by the hard disk body 5 can be transferred to the heat sink 33. By providing a centrifugal fan 32, the air flow between the heat sink 33 can be accelerated to achieve a heat dissipation effect. Since the height of the centrifugal fan 32 is small, the overall thickness of the device is small, which is convenient for installation inside a computer device for use.

[0035] Specifically, by Figure 2 It can be seen that the baffle 11 is fixedly mounted on the upper end of the inner side of the lower shell 1 , the cover plate 21 is fixedly mounted on the lower end of the inner side of the upper shell 2 , and the upper and lower ends of the heat conducting plate 31 are respectively in contact with the baffle 11 and the cover plate 21 .

[0036] As can be seen from the above, by providing the baffle plate 11 and the cover plate 21 , the heat conducting plate 31 can be clamped so that it cannot move up and down.

[0037] Specifically, by Figure 2 , Figure 3 and Figure 4 It can be seen that the centrifugal fan 32 includes a shell 321, a motor 322 and centrifugal blades 323. The inner cavity of the shell 321 is set to be a conch shape, and its air outlet is set at the distal end of the conch shape. The motor 322 is fixedly installed at the center of the conch shape, and the centrifugal blades 323 are fixedly installed at the driving end of the motor 322. An air inlet is opened at the upper end of the shell 321.

[0038] As can be seen from the above, when the centrifugal blades 323 rotate, they draw air from the air inlet above the housing 321 to the air outlet.

[0039] Specifically, by Figure 2 It can be seen that a vent 22 is provided on one side of the top of the upper shell 2, and the vent 22 is arranged above the air inlet.

[0040] As can be seen from the above, by providing the vent 22 , it is convenient for air to enter the interior of the centrifugal fan 32 from the air inlet.

[0041] Specifically, by Figure 2 and Figure 6 It can be seen that the heat-conducting wrapping layer 4 includes a lower layer 41 and an upper layer 42 , and a placement groove adapted to the hard disk body 5 is provided between the lower layer 41 and the upper layer 42 .

[0042] As can be seen from the above, by setting the lower layer 41 and the upper layer 42 to wrap the hard disk body 5, the heat-conductive wrapping layer 4 is in compression contact with the lower surface of the heat-conducting plate 31, that is, after the lower shell 1 and the upper shell 2 are installed, the heat-conducting plate 31 confined between the baffle 11 and the cover plate 21 squeezes the upper layer 42, and the upper layer 42 squeezes the lower layer 41 and the hard disk body 5, so that the hard disk body 5 is fixed.

[0043] Specifically, by Figure 3 and Figure 5 It can be seen that both ends of the heat conducting plate 31 are provided with limit slots 34 , and both inner walls of the lower shell 1 are fixed with blocks 12 adapted to the limit slots 34 .

[0044] As can be seen from the above, by providing the limiting slot 34 and the block 12 , the heat conducting plate 31 restricted between the baffle plate 11 and the cover plate 21 cannot slide forward or backward.

[0045] The standard parts used in this utility model can be purchased from the market, and the special-shaped parts can be customized according to the description and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0046] In the description of the present utility model, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. The meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0047] In the present invention, unless otherwise clearly specified and limited, the terms such as "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0048] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0049] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0050] In the drawings of the embodiments disclosed by the present invention, only the structures related to the embodiments disclosed by the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

[0051] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. An M.2 solid state drive and a heat dissipation device thereof, characterized in that: include: A lower shell (1) and an upper shell (2), wherein the sides of the lower shell (1) and the upper shell (2) are fixedly connected by bolts; A heat dissipation component (3), the heat dissipation component (3) comprising a heat conduction plate (31), a centrifugal fan (32) and a heat sink (33), the heat conduction plate (31) being clamped and fixed between the lower shell (1) and the upper shell (2), the centrifugal fan (32) and the heat sink (33) being fixedly mounted on the upper surface of the heat conduction plate (31), and the heat sink (33) being arranged in parallel on one side of an air outlet of the centrifugal fan (32); A heat-conducting wrapping layer (4), the heat-conducting wrapping layer (4) being arranged inside the lower shell (1) and being in extrusion contact with the lower surface of the heat-conducting plate (31); A hard disk body (5) is placed inside the heat-conducting wrapping layer (4), and two ends of the hard disk body (5) are respectively provided with a connection part for connecting with a computer to exchange data and a fixing part for fixing the hard disk body to a mainboard.

2. The M.2 solid state drive and heat dissipation device thereof according to claim 1, characterized in that: A baffle (11) is fixedly mounted on the upper end of the inner side surface of the lower shell (1), a cover plate (21) is fixedly mounted on the lower end of the inner side surface of the upper shell (2), and the upper and lower ends of the heat conducting plate (31) are respectively in contact with the baffle (11) and the cover plate (21).

3. The M.2 solid state drive and heat dissipation device thereof according to claim 1, characterized in that: The centrifugal fan (32) comprises a shell (321), a motor (322) and centrifugal blades (323); the inner cavity of the shell (321) is arranged in a conch shape, and the air outlet is arranged at the distal end of the conch shape; the motor (322) is fixedly mounted on the conch-shaped rotating center; the centrifugal blades (323) are fixedly mounted on the driving end of the motor (322); and an air inlet is opened at the upper end of the shell (321).

4. The M.2 solid state drive and heat dissipation device thereof according to claim 3, characterized in that: A vent (22) is provided on one side of the top of the upper shell (2), and the vent (22) is arranged above the air inlet.

5. The M.2 solid state drive and heat dissipation device thereof according to claim 1, characterized in that: The heat-conducting wrapping layer (4) comprises a lower layer (41) and an upper layer (42), and a placement groove adapted to the hard disk body (5) is provided between the lower layer (41) and the upper layer (42).

6. The M.2 solid state drive and heat dissipation device thereof according to claim 1, characterized in that: Both ends of the heat conducting plate (31) are provided with limit slots (34), and both side inner walls of the lower shell (1) are fixed with blocks (12) adapted to the limit slots (34).

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