Integrally-formed chip power inductor with high cooling efficiency

Abstract

The utility model discloses an integrated chip power inductor with high cooling efficiency, which comprises a base, a top cover and an inductor, the inductor is embedded in the middle of the upper end of the base, the top cover is embedded in the top of the upper end of the inductor, lower assembly columns are integrally cast on two sides of the upper end of the base, and a positioning groove is formed in the middle of the base. Conductive contacts installed at preset positions of a target circuit board are installed on the two sides of the lower end of the base, a heat dissipation groove for improving the heat dissipation efficiency is formed in the upper end of the top cover, and upper assembly columns are integrally cast on the two sides of the lower end of the heat dissipation groove. When the integrally-formed chip power inductor with the high cooling efficiency is used, the periphery of the whole inductor is fixed through the lower assembling column and the upper assembling column, it is ensured that the inductor is stably installed on the base, meanwhile, the outer diameter of the lower assembling column and the outer diameter of the upper assembling column are matched with the inner diameter of the assembling groove, and the integrally-formed chip power inductor is high in connection strength, stable in structure and high in cooling efficiency. And the possibility that the inductor shakes in use is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of patch inductors, in particular to an integrated patch power inductor with high cooling efficiency. Background Art

[0002] Chip inductors are mostly used in power filter circuits. Inductors are energy storage components that focus on suppressing conducted interference. Chip inductors are widely used in PCB circuits of electronic devices as inductive components and EMI filter components. Chip inductors are electromagnetic induction components wound with insulated wires. They are commonly used inductive components.

[0003] The chip inductor (CN212934376U) of the utility model is provided with a self-shielding kit and an electromagnetic kit, and the electromagnetic kit is arranged on the self-shielding kit. The arrangement of the self-shielding protective shell and the self-shielding carrier board can prevent the external magnetic field from entering the accommodating cavity, thereby preventing the external magnetic field from affecting the normal operation of the electromagnetic kit, and improving the anti-interference ability of the chip inductor; at the same time, the electromagnetic kit is arranged in the accommodating cavity, which can also prevent the magnetic field generated by the electromagnetic kit during the working process from leaking out of the self-shielding kit, improving the self-shielding property of the chip inductor, and avoiding the magnetic field generated by the chip filter from affecting the surrounding components; the arrangement of the accommodating cavity allows the manufacturer to accurately install the top magnetic coil, magnetic ring and bottom magnetic coil into the accommodating cavity without expanding the size of the self-shielding protective shell, that is, the worker can accurately sleeve the top magnetic coil, magnetic ring and bottom magnetic coil on the core column, improving the assembly efficiency and overall compactness of the chip inductor. However, due to its heat dissipation performance problems during use, it is generally necessary to install a heat dissipation system on the PCB circuit board. If a heat dissipation device is installed, the temperature of the entire PCB circuit board may be increased, affecting the normal use of the entire PCB circuit board and causing trouble to the user.

[0004] To this end, we propose an integrated chip power inductor with high cooling efficiency. Utility Model Content

[0005] The purpose of the utility model is to provide an integrated molded chip power inductor with high cooling efficiency to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an integrated molded chip power inductor with high cooling efficiency, comprising a base, a top cover and an inductor, wherein the inductor is embedded in the middle of the upper end of the base, and the top cover is embedded in the top of the upper end of the inductor, lower assembly columns are integrally cast on both sides of the upper end of the base, and a positioning groove is opened in the middle of the base, conductive contacts installed at preset positions of a target circuit board are installed on both sides of the lower end of the base, a heat dissipation groove for accelerating heat dissipation efficiency is opened at the upper end of the top cover, and upper assembly columns are integrally cast on both sides of the lower end of the heat dissipation groove.

[0007] Preferably, the inductor is provided with assembly grooves around its periphery for fixing and connecting the lower assembly column and the upper assembly column, and the lower assembly column and the upper assembly column lock the inductor.

[0008] Preferably, a ceramic column is provided in the middle of the inductor, and the outer diameter of the ceramic column is consistent with the inner diameter of the positioning groove.

[0009] Preferably, heat-conducting columns are vertically installed around the inner wall of the inductor, and a plurality of heat-conducting columns are provided.

[0010] Preferably, the top of the heat-conducting column contacts the top cover for heat transfer, and contacts the top cover to dissipate heat from the inductor.

[0011] Preferably, an outer protective shell is fitted between the top cover and the base, and sealing rings for sealing protection are fitted at the upper and lower ends of the outer protective shell.

[0012] Compared with the prior art, the utility model has the following beneficial effects: when the one-piece molded chip power inductor with high cooling efficiency is used, the entire inductor is fixed on all sides by the lower assembly column and the upper assembly column to ensure that the inductor is firmly installed on the base. At the same time, the outer diameters of the lower assembly column and the upper assembly column match the inner diameter of the assembly groove, and the connection strength is high, the structure is stable, and the possibility of inductor shaking during use is reduced.

[0013] The heat-conducting column is a heat-conducting component, which is made of aluminum material as a whole. It can meet the heat conduction requirements of the inductor to the heating element, ensuring that the inductor can filter and oscillate at a low temperature.

[0014] The outer protective shell serves as a dustproof component and is connected to the top cover and the base through a sealing ring. The connection has a high sealing strength, which reduces the possibility of dust entering and causing short-circuit damage to the internal inductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the split structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the inductor structure of the utility model.

[0018] In the figure: 1. base; 11. conductive contact; 12. positioning groove; 13. lower assembly column; 2. top cover; 21. heat dissipation groove; 22. upper assembly column; 3. inductor; 31. ceramic column; 32. assembly groove; 33. thermal conductive column; 4. outer shell; 5. sealing ring. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-3 The utility model provides a technical solution: an integrated molded chip power inductor with high cooling efficiency, comprising a base 1, a top cover 2 and an inductor 3, the inductor 3 is embedded in the middle of the upper end of the base 1, and the top cover 2 is embedded in the top of the upper end of the inductor 3, the upper ends of the base 1 are integrally cast with lower assembly columns 13 on both sides, and the middle of the base 1 is provided with a positioning groove 12, the lower ends of the base 1 are provided with conductive contacts 11 installed at preset positions of the target circuit board, the upper end of the top cover 2 is provided with a heat dissipation groove 21 for accelerating the heat dissipation efficiency, and the lower ends of the heat dissipation groove 21 are integrally cast with upper assembly columns 22, the inductor 3 Assembly grooves 32 are provided around the inductor 3 for fixing the lower assembly column 13 and the upper assembly column 22, and the lower assembly column 13 and the upper assembly column 22 lock the inductor 3. A ceramic column 31 is provided in the middle of the inductor 3, and the outer diameter of the ceramic column 31 is consistent with the inner diameter of the positioning groove 12. The entire inductor 3 is fixed around by the lower assembly column 13 and the upper assembly column 22 to ensure that the inductor 3 is firmly installed on the base 1. At the same time, the outer diameters of the lower assembly column 13 and the upper assembly column 22 match the inner diameter of the assembly groove 32, so the connection strength is high and the structure is stable, which reduces the possibility of shaking of the inductor 3 during use.

[0021] Heat-conducting columns 33 are vertically installed around the inner wall of the inductor 3, and there are several heat-conducting columns 33. The top of the heat-conducting column 33 contacts the top cover 2 for heat transfer, and contacts the top cover 2 to dissipate heat for the inductor 3. The heat-conducting column 33 is a heat-conducting component, and the whole is made of aluminum material, which can meet the heat conduction of the inductor 3 to the heating element, ensuring that the inductor 3 performs filtering and oscillation under low temperature conditions.

[0022] An outer protective shell 4 is attached between the top cover 2 and the base 1, and sealing rings 5 ​​are attached to the upper and lower ends of the outer protective shell 4 for sealing protection. The outer protective shell 4 serves as a dustproof component and is connected to the top cover 2 and the base 1 through the sealing ring 5. The connection has a high sealing strength, which reduces the possibility of dust entering and causing short circuit damage to the internal inductor 3.

[0023] Working principle: For this type of one-piece molded chip power inductor with high cooling efficiency, first insert the inductor 3 into the upper end of the base 1, and insert the ceramic column 31 of the inductor 3 into the positioning groove 12 to position and fix the inductor 3. At the same time, the lower assembly columns 13 on both sides are embedded along the assembly grooves 32 on both sides of the inductor 3. At this time, the user puts the sealing ring 5 on the outer wall of the base 1 and closes the outer protective shell 4. The outer protective shell 4 seals and protects the inductor 3. Then the user puts another layer of sealing ring 5 on it, and inserts the top cover 2 onto the inductor 3 at the same time. The upper assembly column 22 is vertically inserted into the assembly grooves 32 on both sides of the inductor 3, and the top cover 2 is fitted with the heat-conducting column 33. Finally, the user can install it at the preset position of the target circuit board through the conductive contact 11, and the entire use process of the one-piece molded chip power inductor with high cooling efficiency is completed.

[0024] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An integrated chip power inductor with high cooling efficiency, comprising a base (1), a top cover (2) and an inductor (3), characterized in that: An inductor (3) is embedded in the middle of the upper end of the base (1), and a top cover (2) is embedded in the top of the upper end of the inductor (3); lower assembly columns (13) are integrally cast on both sides of the upper end of the base (1), and a positioning groove (12) is provided in the middle of the base (1); conductive contacts (11) are installed at preset positions of a target circuit board on both sides of the lower end of the base (1); a heat dissipation groove (21) for accelerating heat dissipation efficiency is provided at the upper end of the top cover (2), and upper assembly columns (22) are integrally cast on both sides of the lower end of the heat dissipation groove (21).

2. The one-piece molded chip power inductor with high cooling efficiency according to claim 1, characterized in that: The inductor (3) is provided with assembly grooves (32) around which the lower assembly column (13) and the upper assembly column (22) are fixedly connected, and the lower assembly column (13) and the upper assembly column (22) lock the inductor (3).

3. The one-piece molded chip power inductor with high cooling efficiency according to claim 2, characterized in that: A ceramic column (31) is provided in the middle of the inductor (3), and the outer diameter of the ceramic column (31) is consistent with the inner diameter of the positioning groove (12).

4. The one-piece molded chip power inductor with high cooling efficiency according to claim 3, characterized in that: Heat-conducting columns (33) are vertically installed around the inner wall of the inductor (3), and a plurality of heat-conducting columns (33) are provided.

5. The one-piece molded chip power inductor with high cooling efficiency according to claim 4, characterized in that: The top of the heat-conducting column (33) contacts the top cover (2) for heat transfer, and contacts the top cover (2) for heat dissipation of the inductor (3).

6. The one-piece molded chip power inductor with high cooling efficiency according to claim 1, characterized in that: An outer protective shell (4) is fitted between the top cover (2) and the base (1), and sealing rings (5) for sealing protection are fitted at the upper and lower ends of the outer protective shell (4).

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