Chip packaging pin abnormity repairing device

Abstract

The utility model discloses a chip packaging pin abnormity repairing device. The repairing device comprises a lower bottom plate, an upper bottom plate fixedly installed above the lower bottom plate, a vertical support perpendicularly and fixedly arranged on the lower bottom plate or the upper bottom plate, a downward pressing assembly installed on the vertical support, a material plate installed on the upper bottom plate and opposite to the downward pressing assembly in position, and a mold detachably installed on the material plate. The mold is used for placing a chip package and repairing a pin of the chip package; the downward pressing assembly comprises a first side plate fixedly arranged on the vertical support, a second side plate fixedly arranged on the vertical support and parallel to the first side plate, a first limiting plate fixedly arranged at the top of the first side plate and the top of the second side plate, and a second limiting plate fixedly arranged at the bottom of the first side plate and the bottom of the second side plate. The pressing rod vertically penetrates through the first limiting plate and the second limiting plate, and the handle is rotatably connected with the top end of the first side plate and the top end of the second side plate.

Description

Technical Field

[0001] The utility model relates to the field of chip packaging, and more specifically to a chip packaging pin abnormality repairing device. Background Art

[0002] During the chip packaging process, the pins are prone to deformation, bending and other problems. Currently, the existing tools for repairing the pins of chip packaging products are mostly simple metal blocks, and then the damaged QFP product pins are repaired manually using metal blocks and tweezers. This method is difficult to control, has low efficiency, and has a low repair qualification rate. Utility Model Content

[0003] In view of the above-mentioned defects in the prior art, the utility model provides a chip packaging pin abnormality repairing device.

[0004] The technical solution adopted by the utility model to solve the technical problem is: construct a chip package pin abnormality repair device, the repair device comprises a lower base plate, an upper base plate fixedly installed above the lower base plate, a vertical bracket vertically fixed on the lower base plate or the upper base plate, a pressing component installed on the vertical bracket, a material plate installed on the upper base plate and opposite to the pressing component, and a mold detachably installed on the material plate, the mold is used to place the chip package and to repair the pins of the chip package;

[0005] The pressing assembly includes a first side plate fixedly mounted on the vertical bracket, a second side plate fixedly mounted on the vertical bracket and parallel to the first side plate, a first limiting plate fixedly mounted on the top of the first side plate and the second side plate, a second limiting plate fixedly mounted on the bottom of the first side plate and the second side plate, a pressing rod vertically passing through the first limiting plate and the second limiting plate, a handle rotatably connected to the top end of the first side plate and the second side plate, a connecting seat fixedly connected to the pressing rod and driving the pressing rod to move up and down, a hinge rotatably connected to the handle and the connecting seat respectively, and a pressing head fixedly mounted on the bottom end of the pressing rod, the first limiting plate being provided with a first limiting hole through which the top end of the pressing rod can pass vertically, and the second limiting plate being provided with a second limiting hole through which the bottom end of the pressing rod can pass vertically.

[0006] In the chip package pin abnormality repairing device described in the utility model, the handle is rotatably connected to the first side plate and the second side plate via a first rotating shaft.

[0007] In the chip package pin abnormality repair device described in the utility model, the first end of the hinge is rotatably connected to the handle via a second rotating shaft, and the second end of the hinge is rotatably connected to the connecting seat via a third rotating shaft, and the first rotating shaft, the second rotating shaft and the third rotating shaft are arranged parallel to each other.

[0008] In the chip package pin abnormality repair device described in the utility model, a receiving groove for accommodating and installing the mold is provided on the material plate, at least two positioning columns protruding from the bottom wall of the receiving groove are fixedly provided on the bottom wall of the receiving groove, and at least two positioning holes for inserting and positioning the positioning columns are provided at positions corresponding to the positioning columns on the mold.

[0009] In the chip package pin abnormality repairing device described in the utility model, the lower base plate and the upper base plate are fixedly connected by at least two support plates, and the at least two support plates are fixedly arranged between the lower base plate and the upper base plate.

[0010] In the chip package pin abnormality repairing device described in the utility model, a telescopic cylinder perpendicular to the lower base plate is fixedly provided on the lower base plate, and a telescopic rod of the telescopic cylinder is fixedly connected to the material plate and is used to drive the material plate to move up and down.

[0011] In the chip package pin abnormality repair device described in the utility model, the repair device also includes a control switch installed on the upper base plate and used for controlling the extension and retraction of the telescopic cylinder.

[0012] The implementation of the chip package pin abnormality repair device of the utility model has the following beneficial effects: when using the chip package pin abnormality repair device of the utility model, the chip package is placed on the mold so that the pins of the chip package are located at the edge of the mold. Then the handle is moved downward, the handle drives the hinge to rotate and pushes the connecting seat to move downward, the connecting seat drives the pressure rod and the pressure head to move downward until the pressure head squeezes the pin downward, and the pin is repaired by relying on the mold, thereby realizing rapid repair of the pin. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0014] Figure 1 This is a first structural schematic diagram of the chip package pin abnormality repair device of the utility model;

[0015] Figure 2 This is a second structural schematic diagram of the chip package pin abnormality repair device of the utility model;

[0016] Figure 3 The utility model is a schematic diagram of the structure of the mold and the material plate in the chip packaging pin abnormality repair device. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0018] like Figure 1-3As shown, in the first embodiment of the chip package pin abnormality repair device of the utility model, the repair device 10 includes a lower base plate 11, an upper base plate 12 fixedly installed above the lower base plate 11, a vertical bracket 13 vertically fixed on the lower base plate 11 or the upper base plate 12, a pressing component installed on the vertical bracket 13, a material plate 14 installed on the upper base plate 12 opposite to the pressing component, and a mold 15 detachably installed on the material plate 14, the mold 15 is used to place the chip package and to repair the pins of the chip package.

[0019] The pressing assembly includes a first side plate 16 fixed on the vertical bracket 13, a second side plate fixed on the vertical bracket 13 and parallel to the first side plate 16, a first limiting plate 17 fixed at the top of the first side plate 16 and the second side plate, a second limiting plate 18 fixed at the bottom of the first side plate 16 and the second side plate, a pressing rod 19 vertically passing through the first limiting plate 17 and the second limiting plate 18, a handle 20 rotatably connected to the top of the first side plate 16 and the second side plate, a connecting seat 21 fixedly connected to the pressing rod 19 and driving the pressing rod 19 to move up and down, a hinge 22 rotatably connected to the handle 20 and the connecting seat 21 respectively, and a pressing head 23 fixed at the bottom end of the pressing rod 19, the first limiting plate 17 is provided with a first limiting hole for the top end of the pressing rod 19 to pass vertically, and the second limiting plate 18 is provided with a second limiting hole for the bottom end of the pressing rod 19 to pass vertically.

[0020] When using the chip package pin abnormality repair device 10 of the utility model, the chip package is placed on the mold 15 so that the pins of the chip package are located at the edge of the mold 15. Then the handle 20 is moved downward, the handle 20 drives the hinge 22 to rotate and pushes the connecting seat 21 to move downward, and the connecting seat 21 drives the pressing rod 19 and the pressing head 23 to move downward until the pressing head 23 presses the pin downward, and the pin is repaired by relying on the mold 15, so as to achieve rapid repair of the pin.

[0021] It can be understood that the top surface of the mold 15 is provided with a plurality of convex strips protruding from the top surface of the mold 15, and the plurality of convex strips form a rectangular shape. When repairing the pins, the main part of the chip package is placed in the middle rectangular frame, and the pins on the periphery are placed on the plurality of convex strips. During the process of pressing down the pressure head 23, the pins are squeezed against the convex strips, and the pins are bent at a uniform angle, thereby repairing the bent and deformed pins.

[0022] Specifically, the handle 20 is rotatably connected to the first side plate 16 and the second side plate via a first rotating shaft 24. The first end of the hinge 22 is rotatably connected to the handle 20 via a second rotating shaft 25, and the second end of the hinge 22 is rotatably connected to the connecting seat 21 via a third rotating shaft 26. The first rotating shaft 24, the second rotating shaft 25 and the third rotating shaft 26 are arranged parallel to each other.

[0023] When the handle 20 is moved, the handle 20 rotates around the first rotation axis 24. At this time, the two ends of the hinge 22 rotate around the second rotation axis 25 and the third rotation axis 26 respectively. At the same time, the hinge 22 and the handle 20 push the connecting seat 21 and the pressure rod 19 downward to move downward.

[0024] Specifically, in order to facilitate the accurate installation and positioning of the mold 15, the material plate 14 is provided with a receiving groove 27 for accommodating and installing the mold 15, and at least two positioning columns 28 protruding from the bottom wall of the receiving groove 27 are fixedly provided on the bottom wall of the receiving groove 27, and at least two positioning holes 29 for inserting the positioning columns 28 for positioning are provided at positions corresponding to the positioning columns 28 on the mold 15.

[0025] In this embodiment, the lower base plate 11 and the upper base plate 12 are fixedly connected via at least two support plates 30 , and the at least two support plates 30 are fixedly disposed between the lower base plate 11 and the upper base plate 12 .

[0026] Furthermore, in order to facilitate the adjustment of the height of the material plate 14 and the mold 15, a telescopic cylinder 31 perpendicular to the lower bottom plate 11 is fixedly provided on the lower bottom plate 11, and a telescopic rod of the telescopic cylinder 31 is fixedly connected to the material plate 14 and is used to drive the material plate 14 to move up and down. The repair device 10 also includes a control switch 32 installed on the upper bottom plate 12 and used to control the telescopic cylinder 31 to extend and retract.

[0027] During the repair process, the telescopic cylinder 31 can also be used to drive the adjustment plate 14 and the mold 15 to move toward the pressing head 23 to repair the pin.

[0028] In addition, in the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", "stacked" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A chip packaging pin abnormality repair device, characterized in that: The repair device comprises a lower base plate, an upper base plate fixedly mounted above the lower base plate, a vertical bracket vertically fixed on the lower base plate or the upper base plate, a pressing assembly mounted on the vertical bracket, a material plate mounted on the upper base plate opposite to the pressing assembly, and a mold detachably mounted on the material plate, wherein the mold is used to place the chip package and to repair the pins of the chip package; The pressing assembly includes a first side plate fixedly mounted on the vertical bracket, a second side plate fixedly mounted on the vertical bracket and parallel to the first side plate, a first limiting plate fixedly mounted on the top of the first side plate and the second side plate, a second limiting plate fixedly mounted on the bottom of the first side plate and the second side plate, a pressure rod vertically passing through the first limiting plate and the second limiting plate, a handle rotatably connected to the top end of the first side plate and the second side plate, a connecting seat fixedly connected to the pressure rod and driving the pressure rod to move up and down, a hinge rotatably connected to the handle and the connecting seat respectively, and a pressure head fixedly mounted on the bottom end of the pressure rod, the first limiting plate is provided with a first limiting hole for the top end of the pressure rod to pass vertically, and the second limiting plate is provided with a second limiting hole for the bottom end of the pressure rod to pass vertically.

2. The chip package pin abnormality repair device according to claim 1, characterized in that: The handle is rotatably connected to the first side plate and the second side plate via a first rotating shaft.

3. The chip package pin abnormality repair device according to claim 2, characterized in that: The first end of the hinge is rotatably connected to the handle via a second rotating shaft, the second end of the hinge is rotatably connected to the connecting seat via a third rotating shaft, and the first rotating shaft, the second rotating shaft and the third rotating shaft are arranged parallel to each other.

4. The chip package pin abnormality repair device according to claim 1, characterized in that: The material plate is provided with a receiving groove for accommodating and installing the mold, the bottom wall of the receiving groove is fixed with at least two positioning columns protruding from the bottom wall of the receiving groove, and the mold is provided with at least two positioning holes for inserting and positioning the positioning columns at positions corresponding to the positioning columns.

5. The chip package pin abnormality repair device according to claim 1, characterized in that: The lower base plate and the upper base plate are fixedly connected via at least two support plates, and the at least two support plates are fixedly arranged between the lower base plate and the upper base plate.

6. The chip package pin abnormality repair device according to claim 5, characterized in that: A telescopic cylinder perpendicular to the lower bottom plate is fixedly provided on the lower bottom plate, and a telescopic rod of the telescopic cylinder is fixedly connected to the material plate and is used for driving the material plate to move up and down.

7. The chip package pin abnormality repair device according to claim 6, characterized in that: The repair device also includes a control switch installed on the upper base plate and used for controlling the extension and retraction of the telescopic cylinder.

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