Feeding mechanism of packaging machine

Abstract

The packaging machine feeding mechanism comprises a base and an installation frame, a containing frame is vertically installed on the surface of the top of the base, an electric push rod is vertically installed in the containing frame, a first supporting plate is arranged at the output end of the electric push rod, and a spring is vertically installed on the surface of the top of the first supporting plate; a second supporting plate is vertically mounted at the top ends of the springs, and a base plate is placed on the surface of the top of the second supporting plate. Through cooperative use of the conveying frame, the conveying rollers, the electric ejector rod and the rubber head, packaged chips can be conveyed conveniently, after packaging is completed, the chips are adsorbed by the negative pressure suction cup to continue to rotate, after the chips rotate to the position above the conveying frame, the adsorbed negative pressure suction cup is powered off, and then the chips are conveyed to the conveying frame under the action of the weight. According to the mode, operation is easy, and the packaged chips can be conveyed conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging machine feeding, in particular to a packaging machine feeding mechanism. Background Art

[0002] Chips need to be packaged during the manufacturing process to achieve sealing and protection of the chips. Current chip packaging machines manually place the substrate on a packaging table and then press the chip onto the substrate to achieve chip packaging. This packaging method is relatively inefficient, and there is a certain deviation in the position of the manually placed substrate, which affects the chip packaging accuracy.

[0003] After massive searches, it was found that in the prior art, such as publication number CN212380404U, a chip packaging machine loading device includes a base, a support plate is installed at one end of the base, a U-shaped frame is fixed on the top of the support plate, side panels are installed on both sides of the U-shaped frame, and a packaging table is provided on the side panels; a storage bin is provided on the base directly below the packaging table; a driving motor is installed on one side panel, a hollow disc is rotatably connected to the driving motor, a plurality of suction cups are evenly distributed circumferentially on the hollow disc, and a suction mechanism is provided on the side panel on the opposite side of the driving motor. The chip packaging machine loading device absorbs the substrate through the suction cup on the hollow disc and clamps it into the packaging table, thereby realizing continuous automatic loading of the substrate, with high loading efficiency, precise positioning, and a stable and reliable process; the suction cup is used to absorb the back of the substrate to avoid scratches on the front of the substrate and ensure product quality; a spring is set at the bottom of the support plate to keep the topmost substrate in a stable height range at all times to ensure the stability of the suction cup. Although the substrate can be adsorbed by the hollow disc in this utility model, since the spring is always in its original state, it is easy to cause the suction cup to push the substrate away when the hollow turntable rotates, making it difficult to adsorb. Therefore, further improvements are needed.

[0004] Therefore, it is necessary to provide a packaging machine feeding mechanism to solve the above technical problems. Utility Model Content

[0005] The utility model provides a feeding mechanism for a packaging machine, which solves the problems in the background technology.

[0006] In order to solve the above technical problems, the utility model provides a packaging machine feeding mechanism, including a base and a mounting frame, a placement frame is vertically installed on the top surface of the base, an electric push rod is vertically installed inside the placement frame, a first support plate is arranged at the output end of the electric push rod, a spring is vertically installed on the top surface of the first support plate, a second support plate is vertically installed on the top of the spring, and a substrate is placed on the top surface of the second support plate.

[0007] Preferably, the mounting frame is installed on the top surface of the base, a mounting plate is installed on the surface of the mounting frame, a packaging table is arranged between the two mounting plates, a hollow turntable is movably installed between the two mounting plates, one end of the hollow turntable is connected to a rotating motor, a negative pressure mechanism is movably arranged through the other end of the hollow turntable, and a negative pressure suction cup is arranged on the side surface of the hollow turntable.

[0008] Preferably, a conveying frame is movably installed inside the mounting frame, a conveying roller is movably installed inside the conveying frame, an electric push rod is vertically installed on the top surface of the base, a rubber head is provided at the output end of the electric push rod, and the rubber head is in contact with the bottom surface of the conveying frame.

[0009] Preferably, a plurality of conveying rollers are provided, and the plurality of conveying rollers are installed at equal distances inside the installation frame.

[0010] Preferably, two groups of electric push rods are provided, and the two groups of electric push rods are symmetrically installed on the top surface of the base.

[0011] Preferably, a plurality of springs are provided, and the plurality of springs are installed equidistantly between the first support plate and the second support plate.

[0012] Preferably, a controller is mounted on the outer surface of the mounting plate.

[0013] Compared with the related art, the packaging machine feeding mechanism provided by the utility model has the following advantages:

[0014] Beneficial effects:

[0015] 1. Compared with the prior art, the loading mechanism of the packaging machine is convenient for lifting the substrate on the second supporting plate by setting the placement frame, the electric push rod, the first supporting plate, the spring and the second supporting plate, so that it can be smoothly adsorbed by the negative pressure suction cup. When the driving motor drives the hollow rotating disk to rotate the negative pressure suction cup to the top of the substrate, the electric push rod is started, and then the electric push rod drives the first supporting plate to move upward, and then the second supporting plate drives the substrate to move upward through the spring, so that the uppermost substrate contacts the negative pressure suction cup, and then the substrate is adsorbed. By setting the spring, when the electric push rod is pushed upward, the negative pressure suction cup can be compressed to move upward. The spring makes the substrate contact with the negative pressure suction cup precisely, and then after being adsorbed and fixed, it is restored to its original position by the electric push rod, and then the same method is used. This method is simple to operate, avoids the phenomenon of the substrate falling, and ensures the smooth adsorption of the substrate by the negative pressure suction cup. By setting the coordinated use of the conveying frame, conveying roller, electric ejector and rubber head, it is convenient to convey the packaged chip. After the packaging is completed, the chip is adsorbed by the negative pressure suction cup and continues to rotate. When it rotates to the top of the conveying frame, the adsorbed negative pressure suction cup is powered off. After that, the chip falls onto the conveying frame under the action of weight, and then is conveyed down by the conveying roller. This method is simple to operate and convenient for conveying the packaged chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the structure of the feeding mechanism of the packaging machine provided by the utility model;

[0017] Figure 2 A front view of the feeding mechanism of the packaging machine provided by the utility model;

[0018] Figure 3 A schematic diagram of the conveying frame structure of the feeding mechanism of the packaging machine provided by the utility model;

[0019] Figure 4 This is a schematic diagram of the second support plate structure of the packaging machine feeding mechanism provided by the utility model.

[0020] Numbers in the figure:

[0021] 1. Base; 2. Electric push rod; 3. Conveying frame; 4. Rubber head; 5. Mounting frame; 6. Controller; 7. Mounting plate; 8. Negative pressure mechanism; 9. Hollow turntable; 10. Negative pressure suction cup; 11. Placement frame; 12. Electric push rod; 13. Rotating motor; 14. First support plate; 15. Spring; 16. Second support plate; 17. Conveying roller. DETAILED DESCRIPTION

[0022] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0023] First embodiment

[0024] Please refer to Figure 1-4 The feeding mechanism of the packaging machine includes a base 1 and a mounting frame 5, a placing frame 11 is vertically mounted on the top surface of the base 1, an electric push rod 12 is vertically mounted inside the placing frame 11, a first support plate 14 is arranged at the output end of the electric push rod 12, a spring 15 is vertically mounted on the top surface of the first support plate 14, a second support plate 16 is vertically mounted on the top of the spring 15, and a substrate is placed on the top surface of the second support plate 16.

[0025] By setting the placement frame 11, the electric push rod 12, the first support plate 14, the spring 15 and the second support plate 16 for coordinated use, it is convenient to lift the substrate on the second support plate 16 so that it can be smoothly adsorbed by the negative pressure suction cup 10. In operation, when the driving motor drives the hollow turntable 9 to rotate, the negative pressure suction cup 10 rotates to the top of the substrate, the electric push rod 12 is started, and then the electric push rod 12 drives the first support plate 14 to move upward, and then the second support plate 16 drives the substrate upward through the spring 15, so that the uppermost substrate contacts the negative pressure suction cup 10, and then the substrate is adsorbed. By setting the spring 15, when the electric push rod 12 is pushed upward, the substrate can be precisely contacted with the negative pressure suction cup 10 by compressing the spring 15, and then after being adsorbed and fixed, it is restored to its original position through the electric push rod 12, and then the like. This method is simple to operate, avoids the phenomenon of substrate falling, and ensures the smooth adsorption of the substrate by the negative pressure suction cup 10.

[0026] The working principle of the feeding mechanism of the packaging machine provided by the utility model is as follows:

[0027] By setting the placement frame 11, the electric push rod 12, the first support plate 14, the spring 15 and the second support plate 16 for coordinated use, it is convenient to lift the substrate on the second support plate 16 so that it can be smoothly adsorbed by the negative pressure suction cup 10. During operation, when the driving motor drives the hollow turntable 9 to rotate and the negative pressure suction cup 10 rotates to just above the substrate, the electric push rod 12 is started, and then the electric push rod 12 drives the first support plate 14 to move upward, and then the spring 15 drives the second support plate 16 to move upward, so that the uppermost substrate contacts the negative pressure suction cup 10, and then the substrate is adsorbed. By setting the spring 15, when the electric push rod 12 is pushed upward, the spring 15 can be compressed to 5 makes the substrate contact with the negative pressure suction cup 10 precisely, and then after being adsorbed and fixed, it is restored to the original position by the electric push rod 12, and then the same method is used. This method is simple to operate, avoids the phenomenon of substrate falling, and ensures the smooth adsorption of the substrate by the negative pressure suction cup 10. By setting the conveying frame 3, the conveying roller 17, the electric push rod 2 and the rubber head 4, it is convenient to convey the packaged chip. After the packaging is completed, the chip is adsorbed by the negative pressure suction cup 10 and continues to rotate. When it rotates to the top of the conveying frame 3, the adsorbed negative pressure suction cup 10 is powered off. After that, the chip falls onto the conveying frame 3 under the action of weight, and then is conveyed down by the conveying roller 17. This method is simple to operate and is convenient for conveying the packaged chip.

[0028] Compared with the related art, the packaging machine feeding mechanism provided by the utility model has the following advantages:

[0029] Beneficial effects:

[0030] By setting the placement frame 11, the electric push rod 12, the first support plate 14, the spring 15 and the second support plate 16 for coordinated use, it is convenient to lift the substrate on the second support plate 16 so that it can be smoothly adsorbed by the negative pressure suction cup 10. During operation, when the driving motor drives the hollow turntable 9 to rotate and the negative pressure suction cup 10 rotates to just above the substrate, the electric push rod 12 is started, and then the electric push rod 12 drives the first support plate 14 to move upward, and then the spring 15 drives the second support plate 16 to move upward, so that the uppermost substrate contacts the negative pressure suction cup 10, and then the substrate is adsorbed. By setting the spring 15, when the electric push rod 12 is pushed upward, the spring 15 can be compressed to 5 makes the substrate contact with the negative pressure suction cup 10 precisely, and then after being adsorbed and fixed, it is restored to the original position by the electric push rod 12, and then the same method is used. This method is simple to operate, avoids the phenomenon of substrate falling, and ensures the smooth adsorption of the substrate by the negative pressure suction cup 10. By setting the conveying frame 3, the conveying roller 17, the electric push rod 2 and the rubber head 4, it is convenient to convey the packaged chip. After the packaging is completed, the chip is adsorbed by the negative pressure suction cup 10 and continues to rotate. When it rotates to the top of the conveying frame 3, the adsorbed negative pressure suction cup 10 is powered off. After that, the chip falls onto the conveying frame 3 under the action of weight, and then is conveyed down by the conveying roller 17. This method is simple to operate and is convenient for conveying the packaged chip.

[0031] Second embodiment

[0032] Please refer to Figure 1-4 Based on the packaging machine feeding mechanism provided by the first embodiment of the present application, the second embodiment of the present application proposes another packaging machine feeding mechanism. The second embodiment is only a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0033] Specifically, the difference of the packaging machine feeding mechanism provided by the second embodiment of the present application is that the mounting frame 5 is installed on the top surface of the base 1, a mounting plate 7 is installed on the surface of the mounting frame 5, a packaging table is arranged between the two mounting plates 7, a hollow turntable 9 is movably installed between the two mounting plates 7, one end of the hollow turntable 9 is connected to a rotating motor 13, and the other end of the hollow turntable 9 is movably provided with a negative pressure mechanism 8, and a negative pressure suction cup 10 is arranged on the side surface of the hollow turntable 9.

[0034] According to this technical solution, a conveying frame 3 is movably installed inside the mounting frame 5, a conveying roller 17 is movably installed inside the conveying frame 3, an electric push rod 2 is vertically installed on the top surface of the base 1, and a rubber head 4 is provided at the output end of the electric push rod 2, and the rubber head 4 contacts the bottom surface of the conveying frame 3. By setting the conveying frame 3, the conveying roller 17, the electric push rod 2 and the rubber head 4 for coordinated use, it is convenient to convey the packaged chips, so that after the packaging is completed, the chip is adsorbed by the negative pressure suction cup 10 and continues to rotate. When it rotates to the top of the conveying frame 3, the adsorbed negative pressure suction cup 10 is powered off, and then the chip falls onto the conveying frame 3 under the action of weight, and then is conveyed down by the conveying roller 17. This method is simple to operate and is convenient for conveying the packaged chips.

[0035] With this technical solution, a plurality of conveying rollers 17 are provided, and the plurality of conveying rollers 17 are installed at equal distances inside the installation frame. By providing the conveying rollers 17, it is convenient to transport the packaged chips.

[0036] With this technical solution, two groups of electric push rods 2 are provided, and the two groups of electric push rods 2 are symmetrically installed on the top surface of the base 1. By providing two groups of electric push rods 2, the stability of the conveying frame 3 during adjustment is improved.

[0037] With this technical solution, a plurality of springs 15 are provided, and the plurality of springs 15 are installed equidistantly between the first support plate 14 and the second support plate 16 . By providing a plurality of springs 15 , the stability between the first support plate 14 and the second support plate 16 is improved.

[0038] With this technical solution, a controller 6 is installed on the outer surface of the mounting plate 7. By setting up the controller 6, it is convenient to control the electrical components inside the device. The control circuit of the controller 6 can be realized by simple programming by technicians in this field. It is common knowledge in this field and is only used without modification. Therefore, the control method and circuit connection will not be described in detail.

[0039] It should be noted that all kinds of components used in this application document are standard parts and can be purchased on the market. The specific connection methods of each part adopt conventional means such as mature bolts, rivets and welding in the existing technology. Machinery, parts and electrical equipment all adopt conventional models in the existing technology. Circuit connections adopt conventional connection methods in the existing technology. Electrical equipment are connected to an external safe power supply, and no specific description is given here.

[0040] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A feeding mechanism for a packaging machine, comprising a base (1) and a mounting frame (5), characterized in that: A placement frame (11) is vertically mounted on the top surface of the base (1), an electric push rod (12) is vertically mounted inside the placement frame (11), a first support plate (14) is provided at the output end of the electric push rod (12), a spring (15) is vertically mounted on the top surface of the first support plate (14), a second support plate (16) is vertically mounted on the top end of the spring (15), and a substrate is placed on the top surface of the second support plate (16).

2. The packaging machine feeding mechanism according to claim 1, characterized in that: The mounting frame (5) is mounted on the top surface of the base (1); a mounting plate (7) is mounted on the surface of the mounting frame (5); a packaging platform is arranged between the two mounting plates (7); a hollow turntable (9) is movably mounted between the two mounting plates (7); a rotating motor (13) is connected to one end of the hollow turntable (9); a negative pressure mechanism (8) is movably arranged through the other end of the hollow turntable (9); and a negative pressure suction cup (10) is arranged on the peripheral side of the hollow turntable (9).

3. The packaging machine feeding mechanism according to claim 1, characterized in that: A conveying frame (3) is movably mounted inside the mounting frame (5), a conveying roller (17) is movably mounted inside the conveying frame (3), an electric push rod (2) is vertically mounted on the top surface of the base (1), a rubber head (4) is provided at the output end of the electric push rod (2), and the rubber head (4) is in contact with the bottom surface of the conveying frame (3).

4. The packaging machine feeding mechanism according to claim 3, characterized in that: A plurality of conveying rollers (17) are provided, and the plurality of conveying rollers (17) are installed at equal distances inside the installation frame.

5. The packaging machine feeding mechanism according to claim 3, characterized in that: The electric push rods (2) are provided in two groups, and the two groups of electric push rods (2) are symmetrically mounted on the top surface of the base (1).

6. The feeding mechanism of the packaging machine according to claim 1, characterized in that: A plurality of springs (15) are provided, and the plurality of springs (15) are installed at equal distances between the first support plate (14) and the second support plate (16).

7. The packaging machine feeding mechanism according to claim 2, characterized in that: A controller (6) is mounted on the outer surface of the mounting plate (7).

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