PCBA heat dissipation assembly
By designing a PCBA heat dissipation component including metal plates, rectangular grooves, heat dissipation holes and copper sheets, the problem of poor heat dissipation effect of PCBA plates in the prior art is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202421325504.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-12
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2034-06-12
AI Technical Summary
The heat dissipation method of existing PCBA boards mainly relies on aluminum substrates or thermal conductivity glue, and heat dissipation is performed by opening heat dissipation holes, but this restricts the design of PCB boards, and the processing technology is difficult, resulting in poor heat dissipation effect.
A PCBA heat dissipation component is designed, including a heat dissipation structure provided at the bottom of the PCBA plate. The heat dissipation structure consists of a metal plate made of metal aluminum, a rectangular groove, a heat dissipation hole and a copper plate. The PCBA plate is fixed to the surface of the copper plate through thermally conductive silicone, so that it is located in the rectangular groove, heat is guided away by the copper plate, and heat is further dissipated through the heat dissipation holes in the inner wall of the rectangular groove.
Through this heat dissipation component, the heat dissipation effect of the PCBA board is significantly improved, and the problem of poor heat dissipation effect in the prior art is solved.
Smart Images
Figure CN222776366U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of PCBA heat dissipation, in particular to a PCBA heat dissipation component. Background Art
[0002] Printed circuit board, also known as printed circuit board, printed circuit board, often uses the English abbreviation PCB, is an important electronic component, a support for electronic components, and a provider of circuit connections for electronic components. PCBA is a circuit board assembled with components.
[0003] At present, the heat dissipation of components on PCBA boards is mainly achieved by using aluminum substrates or thermal conductive adhesives, and by opening heat dissipation holes on the PCB boards. However, the heat dissipation method of aluminum substrates has certain restrictions on the design of PCB boards, and the PCBA processing technology is relatively difficult, resulting in certain limitations in the heat dissipation of PCBA boards and poor heat dissipation effects. Utility Model Content
[0004] The utility model aims to solve the problem that the heat dissipation of components on the current PCBA board is mainly achieved by means of an aluminum substrate or thermally conductive adhesive, and heat is dissipated by opening heat dissipation holes on the PCB board. However, the heat dissipation method of the aluminum substrate has certain restrictions on the design of the PCB board, and the PCBA processing technology is relatively difficult, resulting in certain limitations in the heat dissipation of the PCBA board and poor heat dissipation effect. A PCBA heat dissipation component is proposed.
[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a PCBA heat dissipation component, including a PCBA board, a heat dissipation structure is arranged at the bottom end of the PCBA board, the heat dissipation structure includes a metal plate, through holes are opened at the four corners of the metal plate, a rectangular groove is opened on the outer surface of the metal plate, a plurality of heat dissipation holes are opened on the inner wall of the rectangular groove, a copper sheet is fixedly connected to the inner wall of the rectangular groove, the bottom end of the PCBA board and the top end of the copper sheet are bonded by thermal conductive silicone, and the metal plate is made of metal aluminum.
[0006] The effects achieved by the above components are as follows: by setting a metal plate, applying thermal conductive silicone on the surface of the copper sheet, and then placing the PCBA board on the surface of the copper sheet and bonding it through the thermal conductive silicone so that the PCBA board is located inside the rectangular groove, the heat of the PCBA board during operation is conducted away through the copper sheet, and the heat at the bottom of the PCBA board is further dissipated through a number of heat dissipation holes on the inner wall of the rectangular groove, thereby improving the heat dissipation effect of the PCBA board.
[0007] Preferably, a plurality of positioning holes are formed on the outer surface of the metal plate, bolts are threadedly connected to the inner walls of the positioning holes, and a pressure block is rotatably connected to the outer surface of the bolt.
[0008] The effect achieved by the above components is: when the PCBA board is installed inside the rectangular groove, the bolt can be inserted into the positioning hole and the bolt can be turned downward to make one end of the pressing block stuck on one side of the inner wall of the rectangular groove and pressed tightly on the top of the four corners of the PCBA board, thereby further fixing the position of the PCBA board inside the rectangular groove.
[0009] Preferably, a circular ring is fixedly connected to the top end of the bolt, and the circular ring is a rubber ring made of rubber material.
[0010] The effect achieved by the above components is that the outer surface of the rubber ring held at the top of the bolt can more conveniently rotate the bolt without slipping.
[0011] Preferably, a cylinder is fixedly connected to the inner wall of the heat dissipation hole, and the cylinder is made of metal copper.
[0012] The effect achieved by the above components is: by arranging the copper cylinder, the heat dissipation effect of the heat dissipation hole on the bottom of the PCBA board can be further increased.
[0013] Preferably, a plurality of heat sinks are fixedly connected to the bottom end of the metal plate, and the heat sinks are made of metal aluminum.
[0014] The effect achieved by the above components is: by setting up an aluminum heat sink, the heat dissipation from the bottom of the metal plate can be accelerated, further improving the heat dissipation effect on the PCBA board.
[0015] Preferably, a cleaning device is provided on one side of the metal plate, and the cleaning device includes a T-shaped block, and a plurality of scraping rods are fixedly connected to one side of the T-shaped block, and the outer surface of the scraping rods slides on the outer surface of the heat dissipation plate. A T-shaped groove is opened on one side of the metal plate, and the outer surface of the T-shaped block slides on the inner wall of the T-shaped groove.
[0016] The effect achieved by the above components is that when the heat dissipation structure is used, the T-shaped block can be pushed to control the T-shaped block to slide on the inner wall of the T-shaped groove, so that the scraper moves on the surface of the heat dissipation plate to clean the dust in the gap of the heat dissipation plate.
[0017] Preferably, one end of the scraper rod is fixedly connected to a positioning plate, and one side of the positioning plate slides on one side of the heat sink.
[0018] The effect achieved by the above components is that when the T-shaped block is pushed to move the scraper rod, one side of the positioning piece will slide on one side of the heat sink. The positioning piece can limit the angle between the scraper rod and the heat sink, thereby avoiding the scraper rod from being deflected as much as possible.
[0019] Preferably, a slot block is fixedly connected to one side of the T-shaped block, and two grooves are formed on the outer surface of the slot block.
[0020] The effect achieved by the above components is that pinching the two grooves on the outer surface of the groove block can more conveniently push the T-shaped block to control the movement of the T-shaped block and the scraper to clean the gap of the heat sink.
[0021] Compared with the prior art, the advantages and positive effects of the utility model are:
[0022] In the utility model, by setting a heat dissipation structure, the PCBA board is fixed on the surface of the copper sheet by heat-conducting silica gel so that the PCBA board is located inside the rectangular groove. When the PCBA board is in operation, the heat is conducted away by the copper sheet, and the heat at the bottom of the PCBA board is further dissipated through a plurality of heat dissipation holes on the inner wall of the rectangular groove, thereby improving the heat dissipation effect of the PCBA board. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;
[0024] Figure 2 It is a schematic diagram of the three-dimensional structure of the metal plate of the utility model;
[0025] Figure 3 It is a schematic diagram of the three-dimensional structure of the copper sheet of the utility model;
[0026] Figure 4 It is a schematic diagram of the three-dimensional structure of the scraper rod of the utility model.
[0027] Legend: 1. PCBA board; 2. Heat dissipation structure; 3. Cleaning device; 21. Metal plate; 22. Rectangular groove; 23. Heat dissipation hole; 24. Copper sheet; 25. Bolt; 26. Positioning hole; 27. Press block; 28. Ring; 29. Cylinder; 210. Heat dissipation plate; 31. T-slot; 32. T-block; 33. Scraper rod; 34. Slot block; 35. Positioning sheet. DETAILED DESCRIPTION
[0028] Embodiment 1, as Figure 1-3As shown, a PCBA heat dissipation component includes a PCBA board 1, a heat dissipation structure 2 is arranged at the bottom end of the PCBA board 1, and the heat dissipation structure 2 includes a metal plate 21, through holes are opened at the four corners of the metal plate 21, a rectangular groove 22 is opened on the outer surface of the metal plate 21, a plurality of heat dissipation holes 23 are opened on the inner wall of the rectangular groove 22, a copper sheet 24 is fixedly connected to the inner wall of the rectangular groove 22, the bottom end of the PCBA board 1 and the top end of the copper sheet 24 are bonded by thermal conductive silicone, the metal plate 21 is made of metal aluminum, by setting the metal plate 21, by coating the surface of the copper sheet 24 with thermal conductive silicone, and then placing the PCBA board 1 on the surface of the copper sheet 24, the PCBA board 1 is located inside the rectangular groove 22 through the thermal conductive silicone, the heat of the PCBA board 1 during operation is conducted away through the copper sheet 24, and the heat at the bottom of the PCBA board 1 is further dissipated through the plurality of heat dissipation holes 23 on the inner wall of the rectangular groove 22, thereby improving the heat dissipation effect of the PCBA board 1.
[0029] Reference Figure 1-3 As shown, in this embodiment: a plurality of positioning holes 26 are opened on the outer surface of the metal plate 21, and the inner wall of the positioning hole 26 is threadedly connected with a bolt 25, and the outer surface of the bolt 25 is rotatably connected with a pressing block 27. When the PCBA board 1 is installed inside the rectangular groove 22, the bolt 25 can be inserted into the positioning hole 26 and the bolt 25 can be rotated to move downward so that one end of the pressing block 27 is stuck on one side of the inner wall of the rectangular groove 22 and pressed against the top of the four corners of the PCBA board 1, so as to further fix the position of the PCBA board 1 inside the rectangular groove 22. A ring 28 is fixedly connected to the top of the bolt 25, and the ring 28 is a rubber ring made of rubber material. The outer surface of the rubber ring 28 held at the top of the bolt 25 can more conveniently rotate the bolt 25 without slipping.
[0030] Reference Figure 1-3 As shown, in this embodiment: the inner wall of the heat dissipation hole 23 is fixedly connected with a cylinder 29, and the cylinder 29 is made of metal copper. By setting the copper cylinder 29, the heat dissipation effect of the heat dissipation hole 23 on the bottom end of the PCBA board 1 can be further increased. The bottom end of the metal plate 21 is fixedly connected with a plurality of heat dissipation plates 210, and the heat dissipation plates 210 are made of metal aluminum. By setting the aluminum heat dissipation plates 210, the heat dissipation conducted from the bottom of the metal plate 21 can be accelerated, thereby further improving the heat dissipation effect on the PCBA board 1.
[0031] Reference Figure 1-4As shown, in this embodiment: a cleaning device 3 is provided on one side of the metal plate 21, and the cleaning device 3 includes a T-shaped block 32, and a plurality of scraper rods 33 are fixedly connected to one side of the T-shaped block 32, and the outer surface of the scraper rod 33 slides on the outer surface of the heat sink 210. A T-shaped groove 31 is provided on one side of the metal plate 21, and the outer surface of the T-shaped block 32 slides on the inner wall of the T-shaped groove 31. When the heat dissipation structure 2 is used, the T-shaped block 32 can be pushed to control the T-shaped block 32 to slide on the inner wall of the T-shaped groove 31, so that the scraper rod 33 moves on the surface of the heat sink 210 to clean the dust in the gap of the heat sink 210.
[0032] Reference Figure 1-4 As shown, in the present embodiment: one end of the scraper rod 33 is fixedly connected with a positioning piece 35, one side of the positioning piece 35 slides on one side of the heat sink 210, and when the T-shaped block 32 is pushed to move the scraper rod 33, one side of the positioning piece 35 will slide on one side of the heat sink 210, and the angle between the scraper rod 33 and the heat sink 210 can be limited by the positioning piece 35 to avoid the angle of the scraper rod 33 from being deflected as much as possible, and one side of the T-shaped block 32 is fixedly connected with a groove block 34, and the outer surface of the groove block 34 is provided with two grooves, and pinching the two grooves on the outer surface of the groove block 34 can more conveniently push the T-shaped block 32 to control the movement of the T-shaped block 32 and the scraper rod 33 to clean the gap of the heat sink 210.
[0033] Working principle: When installing the PCBA board 1, first place the metal plate 21 inside the device, use screws to pass through the through holes at the four corners of the metal plate 21 to connect the metal plate 21 to the device, then apply thermal conductive silicone on the surface of the copper sheet 24, place the PCBA board 1 on the surface of the copper sheet 24, and bond the PCBA board 1 to the inside of the rectangular groove 22 through the thermal conductive silicone, then insert several bolts 25 into several positioning holes 26 on the outer surface of the metal plate 21 and turn the bolts 25 to move downward so that one end of the pressing block 27 is stuck on one side of the inner wall of the rectangular groove 22 and pressed tightly on the PCB. The top ends at the four corners of the A board 1 further fix the position of the PCBA board 1 inside the rectangular groove 22. When the PCBA board 1 is in operation, the heat of the PCBA board 1 is conducted away through the copper sheet 24 and the heat at the bottom of the PCBA board 1 is dissipated through the heat dissipation holes 23. The heat dissipation effect of the PCBA board 1 is further improved through the aluminum metal plate 21 and the heat dissipation plate 210. By pushing the T-shaped block 32 to control the T-shaped block 32 to slide on the inner wall of the T-shaped groove 31, the scraper rod 33 can be moved on the surface of the heat dissipation plate 210 to clean the dust in the gap of the heat dissipation plate 210.
Claims
1. A PCBA heat dissipation assembly, comprising a PCBA board (1), characterized in that: A heat dissipation structure (2) is provided at the bottom end of the PCBA board (1), the heat dissipation structure (2) comprising a metal plate (21), through holes are provided at four corners of the metal plate (21), a rectangular groove (22) is provided on the outer surface of the metal plate (21), a plurality of heat dissipation holes (23) are provided on the inner wall of the rectangular groove (22), a copper sheet (24) is fixedly connected to the inner wall of the rectangular groove (22), the bottom end of the PCBA board (1) and the top end of the copper sheet (24) are bonded by thermally conductive silicone, and the metal plate (21) is made of metal aluminum.
2. A PCBA heat dissipation assembly according to claim 1, characterized in that: The outer surface of the metal plate (21) is provided with a plurality of positioning holes (26), the inner walls of the positioning holes (26) are threadedly connected with bolts (25), and the outer surfaces of the bolts (25) are rotatably connected with pressure blocks (27).
3. A PCBA heat dissipation assembly according to claim 2, characterized in that: A circular ring (28) is fixedly connected to the top end of the bolt (25), and the circular ring (28) is a rubber ring made of rubber material.
4. A PCBA heat dissipation assembly according to claim 3, characterized in that: A cylinder (29) is fixedly connected to the inner wall of the heat dissipation hole (23), and the cylinder (29) is made of metal copper.
5. A PCBA heat dissipation assembly according to claim 4, characterized in that: A plurality of heat dissipation plates (210) are fixedly connected to the bottom end of the metal plate (21), and the heat dissipation plates (210) are made of metal aluminum.
6. A PCBA heat dissipation assembly according to claim 1, characterized in that: A cleaning device (3) is provided on one side of the metal plate (21), and the cleaning device (3) comprises a T-shaped block (32). A plurality of scraping rods (33) are fixedly connected to one side of the T-shaped block (32), and the outer surfaces of the scraping rods (33) slide on the outer surface of the heat dissipation plate (210). A T-shaped groove (31) is provided on one side of the metal plate (21), and the outer surface of the T-shaped block (32) slides on the inner wall of the T-shaped groove (31).
7. A PCBA heat dissipation assembly according to claim 6, characterized in that: One end of the scraper rod (33) is fixedly connected to a positioning piece (35), and one side of the positioning piece (35) slides on one side of the heat dissipation plate (210).
8. The PCBA heat dissipation assembly according to claim 6, characterized in that: A slot block (34) is fixedly connected to one side of the T-shaped block (32), and two grooves are formed on the outer surface of the slot block (34).