Structure for FPC (Flexible Printed Circuit) reinforcing and pressing

Abstract

The utility model discloses a structure used for FPC reinforcement lamination, comprising an FPC mother board, the FPC mother board comprises an FPC single body part, an FPC reinforcement part and a waste copper part, the FPC reinforcement part comprises a lamination area laminated on the FPC single body part and an external expansion area connected with the lamination area; the FPC monomer part and the waste copper part are arranged at intervals, and the FPC monomer part and the waste copper part and the external expansion area and the waste copper part are arranged at intervals, so that the height difference during pressing of the FPC reinforcing part can be effectively reduced, the flatness is improved, the pressure required by pressing is ensured to be uniform, and the adverse phenomenon that the FPC reinforcing part rebounds or is not pressed tightly after being pressed is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of flexible circuit boards, in particular to a structure used for reinforcing and pressing an FPC. Background Art

[0002] Flexible circuit board, abbreviated as FPC in English, is a printed circuit made of polyester film (PET) or polyimide (PI) as the substrate, by etching the circuit on copper foil. It is generally laminated with FPC reinforcement sheet or FPC reinforcement to strengthen the structural strength of FPC.

[0003] When the FPC is reinforced and pressed, the outer edge of the existing FPC reinforcement covers the copper sheet in the waste area of ​​the FPC motherboard. Due to the height difference between the FPC reinforcement and the copper sheet in the waste area, the pressure required for pressing is uneven, resulting in undesirable phenomena such as easy rebound or incomplete pressing after the FPC reinforcement is pressed. Utility Model Content

[0004] To this end, in order to solve the above-mentioned problem, the utility model provides a structure for FPC reinforcement pressing, which can effectively reduce the height difference of the FPC reinforcement part during pressing to improve the flatness, thereby ensuring that the pressure required for pressing is uniform, so as to avoid rebound or incomplete pressing after the FPC reinforcement part is pressed.

[0005] To achieve the above purpose, the technical solution provided by the utility model is as follows:

[0006] The utility model provides a structure for FPC reinforcement pressing, comprising an FPC motherboard, wherein the FPC motherboard comprises an FPC monomer part, an FPC reinforcement part and a waste copper part, wherein the FPC reinforcement part comprises a pressing area pressed on the FPC monomer part and an outer expansion area connected to the pressing area; the FPC monomer part and the outer expansion area are respectively arranged at a distance from the waste copper part.

[0007] Furthermore, the distance between the outer edge of the outward expansion area and the outer edge of the waste copper portion is at least 0.3 mm.

[0008] Furthermore, the distance between the outer edge of the FPC monomer portion and the outer edge of the waste copper portion is at least 0.3 mm.

[0009] Furthermore, the distance between the outer edge of the outward expansion area and the outer edge of the FPC monomer portion is at least 1.0 mm.

[0010] Furthermore, the pressing area corresponds to the gold finger plugging area of ​​the FPC monomer part.

[0011] The technical solution provided by the utility model has the following beneficial effects:

[0012] By setting the FPC monomer part and the external expansion area at a distance from the waste copper part respectively, it is ensured that there is no copper skin in the external expansion area of ​​the FPC reinforcement part, so that the height difference of the FPC reinforcement part during pressing can be effectively reduced to improve the flatness, thereby ensuring that the pressure required for pressing is uniform, so as to avoid rebound or incomplete pressing of the FPC reinforcement part after pressing, and obtain better bonding force, so as to ensure that the FPC reinforcement part is not easy to fall off from the FPC motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 Shown is a schematic diagram of a structure for FPC reinforcement and pressing in an embodiment;

[0014] Figure 2 Shown is a schematic diagram of an FPC motherboard in an embodiment. DETAILED DESCRIPTION

[0015] To further illustrate the various embodiments, the present invention provides drawings. These drawings are part of the disclosure of the present invention, which are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, a person of ordinary skill in the art should be able to understand other possible implementations and advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0016] The utility model is now further described in conjunction with the accompanying drawings and specific implementation methods.

[0017] Reference Figure 1 and Figure 2 As shown, this embodiment provides a structure for FPC reinforcement and pressing, including an FPC motherboard, the FPC motherboard includes an FPC monomer part 1, an FPC reinforcement part 2 and a waste copper part 3, the FPC reinforcement part 2 includes a pressing area 21 pressed on the FPC monomer part 1 and an external expansion area 22 connected to the pressing area 21, and the FPC monomer part 1 and the external expansion area 22 are respectively arranged at a distance from the waste copper part 3.

[0018] In this embodiment, the waste copper portion 3 of the FPC motherboard has copper skin that needs to be discharged, and is surrounded by the outer periphery of at least one FPC monomer portion 1 on the FPC motherboard.

[0019] The pressing area 21 corresponds to the gold finger plugging area 11 of the FPC monomer part 1, and the FPC motherboard obtains the processed FPC monomer part 1 after punching. At this time, three outer edges of the pressing area 21 of the FPC reinforcement part 2 completely overlap or substantially overlap with the outer edge of the gold finger plugging area 11 of the FPC monomer part 1.

[0020] By setting the FPC monomer part 1 and the external expansion area 22 at a distance from the waste copper part 3 respectively, it is ensured that there is no copper skin in the external expansion area 22 of the FPC reinforcement part 2, which can effectively reduce the height difference of the FPC reinforcement part 2 during pressing, so as to improve the flatness, and then ensure that the pressure required for pressing is uniform, so as to avoid the undesirable phenomena such as rebound or incomplete pressing of the FPC reinforcement part 2 after pressing, and obtain better bonding force, so as to ensure that the FPC reinforcement part 2 is not easy to fall off from the FPC motherboard.

[0021] In another preferred embodiment, the distance between the outer edge of the expanded area 22 and the outer edge of the waste copper portion 3 is at least 0.3 mm.

[0022] During specific implementation, the outer edge of the FPC reinforcement part 2 is extended beyond the outer edge of the FPC monomer part 1 to form an outward expansion area 22. At the same time, the outer edge of the area where the waste copper part 3 is located is away from the outward expansion area 22 of the FPC reinforcement part 2, and the first distance L1 between them is at least 0.3 mm, so as to ensure that the copper skin in the outward expansion area 22 of the FPC reinforcement part 2 is etched cleanly, so as to improve the flatness required for pressing, and obtain better bonding force, so as to ensure that the FPC reinforcement part 2 is not easy to fall off from the FPC motherboard.

[0023] Further preferably, a first distance L2 between the outer edge of the FPC monomer portion 1 and the outer edge of the waste copper portion 3 is at least 0.3 mm to ensure that the circuit of the FPC monomer portion 1 is not affected by the copper skin of the waste copper portion 3 .

[0024] Further preferably, a first distance L3 between the outer edge of the outward expansion area 22 and the outer edge of the FPC monomer part 1 is at least 1.0 mm to ensure that the alignment deviation during pressing will not affect the FPC reinforcement part 2 to completely cover the gold finger plugging area 11 of the FPC monomer part 1, and sufficient surplus spacing can be reserved to ensure that the pressing area 21 of the FPC reinforcement part 2 and the FPC monomer part 1 are tightly fitted and not affected by punching.

[0025] Although the present invention has been specifically demonstrated and described in conjunction with the preferred embodiments, those skilled in the art should understand that various changes may be made to the present invention in form and detail without departing from the spirit and scope of the present invention as defined in the appended claims, all of which are within the scope of protection of the present invention.

Claims

1. A structure for FPC reinforcement and pressing, comprising an FPC motherboard, wherein the FPC motherboard comprises an FPC monomer portion, an FPC reinforcement portion and a waste copper portion, characterized in that: The FPC reinforcing part comprises a pressing area pressed on the FPC monomer part and an outward expansion area connected to the pressing area; the FPC monomer part and the outward expansion area are respectively arranged at a distance from the waste copper part.

2. The structure for reinforcing and pressing FPC according to claim 1, characterized in that: The outer edge of the outward expansion area and the outer edge of the waste copper portion are spaced at least 0.3 mm apart.

3. The structure for reinforcing and pressing FPC according to claim 1 or 2, characterized in that: The distance between the outer edge of the FPC single body part and the outer edge of the waste copper part is at least 0.3 mm.

4. The structure for reinforcing and pressing FPC according to claim 1 or 2, characterized in that: The outer edge of the outward expansion area and the outer edge of the FPC single body are spaced at least 1.0 mm apart.

5. The structure for reinforcing and pressing FPC according to claim 1 or 2, characterized in that: The pressing area corresponds to the gold finger plugging area of ​​the FPC monomer part.

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