Multi-layer PCB
By designing the bottom plate, installation groove and baffle structure of the multi-layer PCB board, fixing operation without positioning blocks is achieved, the fixing process is simplified, and the heat dissipation effect is improved, solving the problems of cumbersome operation and space occupation in the prior art.
Patent Information
- Application Number
- CN202421365714.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-14
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2034-06-14
AI Technical Summary
The existing multi-layer PCB boards are cumbersome during the fixing process, and positioning blocks are required to be installed on the board body to occupy space.
A multi-layer PCB board is designed, adopting a structure of a bottom plate, an installation groove and a baffle. The main body of the PCB board is inserted into the installation groove, and the coordination of the baffle and the insert block is used to achieve fixation without the need for positioning blocks. The baffle can be cancelled by toggling the baffle.
The fixing operation of the PCB board is simplified, avoiding the problem of the positioning block occupying space. At the same time, the heat dissipation effect of the PCB board is improved by setting up a thermal copper sheet and a heat sink.
Smart Images

Figure CN222776370U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of PCB boards, and specifically relates to a multi-layer PCB board. Background Technique
[0002] The PCB board is also called a printed circuit board or a printed wiring board. The multi-layer PCB board refers to a PCB board with more than two layers. The multi-layer PCB board is a composite circuit board composed of multiple single-layer circuit boards stacked together. The circuit wiring of the multi-layer PCB board is dispersed on different layers, and a more complex circuit system can be realized on a relatively small board area.
[0003] The heat dissipation capacity of the existing multi-layer PCB board is poor. Therefore, some people usually set heat-conducting copper foil sheets and heat sinks on the PCB board to improve the heat dissipation capacity. For example, the Chinese utility model patent with the publication number CN220383295U specifically discloses a multi-layer PCB board.
[0004] However, in the actual use process of the above multi-layer PCB board, people will find that the PCB board is fixed by setting a pressing plate to clamp the side of the board body. However, during the fixing process, it is necessary to rotate the guide rod and use the threaded connection between the guide rod and the vertical plate to push the pressing plate to clamp the board body, which is more cumbersome to operate. And this clamping structure also needs to set positioning blocks on the PCB board. However, installing the positioning blocks will occupy the space on the surface of the board body. Therefore, this application proposes a multi-layer PCB board that can fix the PCB board without setting positioning blocks on the board body. Content of the Utility Model
[0005] The purpose of the utility model is to provide a multi-layer PCB board to solve the problems raised in the above background technique.
[0006] To achieve the above purpose, the utility model provides the following technical solution: A multi-layer PCB board, including a bottom plate, an installation groove and a baffle. A support plate is fixed on the side of the bottom plate. An L-shaped plate is arranged on the side of the support plate. A plurality of installation grooves are evenly arranged inside the support plate. The installation grooves are U-shaped. A PCB board body is inserted into the installation grooves. The baffle is arranged at the end of the installation groove to limit the PCB board body, and the baffle is attached to the end of the installation groove. A dial is fixed on one side of the baffle, and a slot is opened on the other side of the baffle. An expansion rod and a spring are arranged between the dial and the L-shaped plate. The spring is sleeved outside the expansion rod, and both ends of the expansion rod and the spring are respectively fixed on the dial and the L-shaped plate. A plug block matched with the slot is fixed at the end of the installation groove, and the plug block is inserted into the slot. By setting the baffle, the PCB board body is limited in the installation groove, and structures such as positioning blocks do not need to be set on the PCB board body, and the baffle can be pushed backward to move the baffle away from the end of the installation groove to cancel the fixation of the PCB board.
[0007] Preferably, a thermally conductive copper sheet is provided on the PCB board, and a heat sink is provided on the thermally conductive copper sheet. The thermally conductive copper sheet and the heat sink can play a role in heat conduction and heat dissipation during the use of the PCB board.
[0008] Preferably, a plurality of heat dissipation holes are evenly formed on the mounting groove, and the heat dissipation holes can be used to dissipate heat from the PCB board body during use, thereby improving the heat dissipation effect.
[0009] Preferably, a plurality of pads are provided below the bottom plate, and a plurality of through holes are provided on the pads, wherein the through holes are provided for cooperating with screws to fix the device to other external equipment.
[0010] Preferably, a plurality of protrusions are provided on the paddle plate, and the protrusions are provided mainly to facilitate pressing the paddle plate backwards and to play a certain anti-slip role.
[0011] Preferably, a positioning block is fixed to the end of the insert block, and the insert block and the positioning block are mainly used to limit the baffle plate to improve the limiting effect of the baffle plate.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] The utility model inserts the PCB board into the installation slot, and then limits the PCB board body through the baffle plate arranged at the end of the installation slot, so that the PCB board body is installed in the installation slot, and the insert block and the positioning block are arranged to improve the limiting effect of the baffle plate.
[0014] By pressing the dial plate toward the L-shaped plate, the baffle is removed from the mounting groove, thereby removing the restriction of the PCB board body, and the PCB board body can be removed. The operation is simple and easy to understand, which effectively improves the practicality of the device. In addition, by arranging a thermal conductive copper sheet and a heat sink on the PCB board body, and arranging heat dissipation holes on the mounting groove, the overall heat dissipation effect of the PCB board body can be improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 The three-dimensional structure of the utility model is shown in FIG. Figure 1 ;
[0016] Figure 2 The three-dimensional structure of the utility model is shown in FIG. Figure 2 ;
[0017] Figure 3 For this utility model Figure 1 Schematic diagram of the enlarged structure of part A in the middle.
[0018] In the figure: 1. bottom plate; 2. support plate; 3. L-shaped plate; 4. mounting slot; 5. heat dissipation hole; 6. PCB board body; 7. thermal conductive copper sheet; 8. heat sink; 9. limiting baffle; 10. dial plate; 11. telescopic rod; 12. spring; 13. plug-in block; 14. positioning block; 15. slot; 16. bump; 17. pad. DETAILED DESCRIPTION
[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0020] In the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0021] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0022] See also Figure 1-3, the present utility model provides a technical solution: a multi-layer PCB board, including a bottom plate 1, mounting grooves 4 and a baffle. A support plate 2 is fixed to the side of the bottom plate 1. An L-shaped plate 3 is arranged on the side of the support plate 2. A plurality of mounting grooves 4 are evenly arranged inside the support plate 2. The mounting grooves 4 are U-shaped. A PCB board main body 6 is inserted into the mounting grooves 4. The baffle is arranged at the end of the mounting groove 4 to limit the PCB board main body 6, and the baffle fits with the end of the mounting groove 4. A dial plate 10 is fixed to one side of the baffle. A slot 15 is opened on the other side of the baffle. An expansion rod 11 and a spring 12 are arranged between the dial plate 10 and the L-shaped plate 3. The spring 12 is sleeved outside the expansion rod 11, and both ends of the expansion rod 11 and the spring 12 are respectively fixed to the dial plate 10 and the L-shaped plate 3. A plug block 13 matching with the slot 15 is fixed to the end of the mounting groove 4, and the plug block 13 is inserted into the slot 15. By arranging the baffle, the PCB board main body 6 is restricted in the mounting groove 4, and there is no need to arrange structures such as a positioning block 14 on the PCB board main body 6. Moreover, the baffle can be pushed backward, and the baffle is moved away from the end of the mounting groove 4 to cancel the fixation of the PCB board.
[0023] Furthermore, a heat-conducting copper sheet 7 is arranged on the PCB board, and a heat sink 8 is arranged on the heat-conducting copper sheet 7. Arranging the heat-conducting copper sheet 7 and the heat sink 8 can play a role in heat conduction and heat dissipation during the use of the PCB board.
[0024] Furthermore, a plurality of heat dissipation holes 5 are evenly opened on the mounting groove 4. The arranged heat dissipation holes 5 can be used for the PCB board main body 6 to dissipate heat during use, improving the heat dissipation effect.
[0025] Furthermore, a plurality of cushion blocks 17 are arranged below the bottom plate 1, and a plurality of through holes are opened on the cushion blocks 17. The through holes are arranged to cooperate with screws to fix the device on other external devices.
[0026] Furthermore, a plurality of convex blocks 16 are arranged on the dial plate 10. Arranging the convex blocks 16 mainly facilitates pressing the dial plate 10 backward and plays a certain anti-slip role at the same time.
[0027] Furthermore, a positioning block 14 is fixed to the end of the plug block 13. The arranged plug block 13 and positioning block 14 are mainly used to limit the baffle 9, improving the limiting effect of the baffle.
[0028] In summary, when the PCB board body 6 needs to be installed, it is only necessary to manually press the dial plate 10 toward the direction of the L-shaped plate 3, so that the dial plate 10 squeezes the telescopic rod 11 and the spring 12, so that the telescopic rod 11 and the spring 12 are deformed and contracted, and at the same time, the dial plate 10 drives the baffle to move away from the end of the installation slot 4, and then the PCB board body 6 can be inserted into the installation slot 4. After it is fully inserted, the dial plate 10 is released, so that the spring 12 rebounds due to the lack of pressure, so that the spring 12 pushes the baffle back to make the baffle return to its position, and at the same time, the slot 15 of the baffle is inserted into the plug block 13, and the baffle is used to restrict the PCB board body 6 in the installation slot 4 to prevent the PCB board body 6 from falling off. When removing, it is only necessary to press the dial plate 10 backward again to remove the baffle from the end of the installation slot 4, so that the restriction of the PCB board body 6 can be cancelled and it can be removed.
[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A multi-layer PCB board, characterized in that: It includes a bottom plate (1), mounting grooves (4) and a baffle. A support plate (2) is fixed to the side of the bottom plate (1). An L-shaped plate (3) is arranged on the side of the support plate (2). A plurality of mounting grooves (4) are evenly arranged inside the support plate (2). The mounting grooves (4) are U-shaped. A PCB board main body (6) is inserted into the mounting grooves (4). The baffle is arranged at the end of the mounting groove (4) to limit the PCB board main body (6), and the baffle is in contact with the end of the mounting groove (4). A dial plate (10) is fixed to one side of the baffle. A slot (15) is formed on the other side of the baffle. An expansion rod (11) and a spring (12) are arranged between the dial plate (10) and the L-shaped plate (3). The spring (12) is sleeved outside the expansion rod (11), and both ends of the expansion rod (11) and the spring (12) are fixed to the dial plate (10) and the L-shaped plate (3) respectively. A plug block (13) matched with the slot (15) is fixed to the end of the mounting groove (4), and the plug block (13) is inserted into the slot (15).
2. A multilayer PCB according to claim 1, characterized in that: A heat-conducting copper sheet (7) is arranged on the PCB board, and a heat sink (8) is arranged on the heat-conducting copper sheet (7).
3. A multi-layer PCB board according to claim 1, characterized in that: A plurality of heat dissipation holes (5) are evenly formed in the mounting groove (4).
4. The multi-layer PCB according to claim 1, characterized in that: A plurality of cushion blocks (17) are arranged below the bottom plate (1), and a plurality of through holes are formed in the cushion blocks (17).
5. The multi-layer PCB according to claim 1, characterized in that: A plurality of bumps (16) are arranged on the dial plate (10).
6. The multi-layer PCB according to claim 1, characterized in that: A positioning block (14) is fixed to the end of the plug block (13).
Citation Information
Patent Citations
Multi-layer PCB
CN220383295U