Anti-interference FPC

Abstract

The utility model discloses an anti-interference FPC, which comprises an FPC flexible circuit board, an internal central interlayer of the FPC flexible circuit board is a base material layer, the top and the bottom of the base material layer are respectively adhered with an insulating layer, the top and the bottom of each insulating layer are respectively adhered with a shielding layer, the shielding layers are formed by compacting conductive powder, and the shielding layers are arranged on the base material layer. According to the utility model, the base material layer is made of the polyimide flexible insulating material, the conductive coating of the conductive layer, the electromagnetic shielding film of the film coating layer and the conductive powder of the shielding layer, and the base material layer, the conductive layer, the film coating layer and the shielding layer are bonded together by using the adhesive; the electromagnetic shielding film on the film covering layer can effectively block interference of external electromagnetic wave signals on the FPC, the anti-interference performance of the base material layer, the shielding layer and the conducting layer is overlapped together, the anti-interference performance of the FPC is remarkably improved, and therefore strong electromagnetic wave signal interference can be shielded, and the anti-interference performance of the FPC is improved. And normal operation of the FPC flexible circuit board is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of FPC flexible circuit boards, in particular to an anti-interference FPC. Background Art

[0002] FPC is the abbreviation of Flexible Printed Circuit, and its Chinese name is "flexible printed circuit board" or "flexible printed circuit board". It is a new type of circuit material made of polyimide or polyester film as the base material, with the characteristics of high wiring density, light weight, thin thickness and good bendability. FPC is widely used in many products such as mobile phones, laptops, PDAs, digital cameras, LCMs, etc., and has the triple functions of connection, conduction and support. Compared with the rigid boards that were widely used in the past, FPC reduces the number of parts and reduces weight, and its bendability is better, which greatly reduces the product size and is suitable for electronic products such as mobile communications.

[0003] At present, the FPC structure is divided into a substrate layer, an insulating layer, a conductive layer and a coating layer. In order to prevent electromagnetic signals from interfering with the connection signals of the FPC, the conductive layer is usually made of copper foil material. Copper foil has good conductivity and can also play an electromagnetic shielding effect.

[0004] However, if you only rely on the copper foil material of the conductive layer as the signal shielding of the FPC, when the FPC is subject to strong electromagnetic interference signals, it will still affect the normal operation of the circuit board.

[0005] Therefore, an anti-interference FPC is proposed to solve the above problems. Utility Model Content

[0006] 1. Technical problems to be solved by the utility model

[0007] In view of the shortcomings of the prior art, the purpose of the utility model is to provide an anti-interference FPC, aiming to solve the problem that the prior art only relies on the copper foil material of the conductive layer as the signal shielding treatment of the FPC, which will still affect the normal operation of the circuit board when the FPC is subjected to a strong electromagnetic interference signal.

[0008] 2. Technical solution

[0009] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0010] An anti-interference FPC comprises an FPC flexible circuit board, wherein the inner central interlayer of the FPC flexible circuit board is a substrate layer, the top and bottom of the substrate layer are both adhered with an insulating layer, the top and bottom of the insulating layer are adhered with a shielding layer, and the shielding layer is formed by compacting conductive powder.

[0011] As a preferred solution of the utility model, the top and bottom of the FPC flexible circuit board are both coating layers, and the coating layer is an electromagnetic shielding film, which is a composite film material composed of a conductive material and a substrate.

[0012] As a preferred solution of the utility model, a conductive layer is adhered to the inner side surfaces of the coating layer at the top and bottom of the inner layer structure of the FPC flexible circuit board. The conductive layer is made of metal copper foil, and the surface of the conductive layer is covered with a conductive coating.

[0013] As a preferred solution of the utility model, the inner side surface of the conductive layer is bonded to one side surface of the shielding layer on two insulating layers respectively, and the insulating layer and the two shielding layers at the top and bottom thereof are sandwiched between the conductive layer and the substrate layer.

[0014] As a preferred solution of the utility model, the substrate layer is mainly made of polyimide flexible insulating material, and the top and bottom of the substrate layer are bonded to the two shielding layers by an adhesive.

[0015] As a preferred solution of the utility model, the coating layer and the conductive layer are adhered together by an adhesive, and the electromagnetic shielding film used on the coating layer is adhered to the conductive coating on the conductive layer.

[0016] 3. Beneficial effects

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] The utility model uses a polyimide flexible insulating material for the substrate layer, a conductive coating for the conductive layer, an electromagnetic shielding film for the coating layer, and a conductive powder for the shielding layer, and uses an adhesive to bond the substrate layer, the conductive layer, the coating layer, and the shielding layer together. The electromagnetic shielding film on the coating layer can effectively block the interference of external electromagnetic wave signals on the FPC flexible circuit board 1. The anti-interference properties of the substrate layer 11, the shielding layer 122, and the conductive layer 13 are superimposed together, which significantly improves the anti-interference performance of the FPC flexible circuit board 1, thereby being able to shield strong electromagnetic wave signal interference and ensure the normal operation of the FPC flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the overall structure of an anti-interference FPC of the utility model;

[0020] Figure 2 This is a schematic diagram of the overall cross-section layering of an anti-interference FPC of the utility model;

[0021] Figure 3 This is a layered diagram of the insulation layer and the shielding layer of an anti-interference FPC of the utility model.

[0022] In the figure: 1, FPC flexible circuit board; 11, base material layer; 12, insulation layer; 13, conductive layer; 14, coating layer; 122, shielding layer. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0024] Example:

[0025] See also Figure 1-3 The present embodiment provides an anti-interference FPC, including an FPC flexible circuit board 1, characterized in that: the inner central interlayer of the FPC flexible circuit board 1 is a substrate layer 11, the top and bottom of the substrate layer 11 are both bonded with an insulating layer 12, the top and bottom of the insulating layer 12 are bonded with a shielding layer 122, and the shielding layer 122 is compacted by conductive powder. Since the top and bottom of the substrate layer 11 are both bonded with the shielding layer on the insulating layer 12, the shielding layer 122 is made of conductive powder, which can effectively block the interference of electromagnetic waves and improve the anti-interference ability of the FPC.

[0026] In this embodiment, if Figure 1 and Figure 2 As shown, the top and bottom of the FPC flexible circuit board 1 are both coated layers 14, and the coating layer 14 is an electromagnetic shielding film, which is a composite film material composed of a conductive material and a substrate. When a voltage is applied to the FPC electromagnetic shielding film, the conductive material will form an effective shielding current and electromagnetic wave reflection, thereby achieving the effect of shielding electromagnetic interference.

[0027] In this embodiment, if Figure 1 and Figure 2 As shown, in the inner layer structure of the FPC flexible circuit board 1, a conductive layer 13 is attached to the inner side surfaces of the coating layer 14 at the top and bottom. The conductive layer 13 is made of metal copper foil, and the surface of the conductive layer 13 is covered with a conductive coating, which can reduce the radiation and leakage of electromagnetic waves and improve the electromagnetic compatibility of the FPC.

[0028] In this embodiment, if Figure 1 , Figure 2 and Figure 3As shown, the inner side of the conductive layer 13 is bonded to one side of the shielding layer 122 on the two insulating layers 12 respectively, and the insulating layer 12 and the two shielding layers 122 at the top and bottom thereof are sandwiched between the conductive layer 13 and the substrate layer 11. The substrate layer 11 is mainly made of polyimide flexible insulating material. The top and bottom of the substrate layer 11 are bonded to the two shielding layers 122 by adhesive. The anti-interference performance of the substrate layer 11, the shielding layer 122 and the conductive layer 13 itself are superimposed, which significantly improves the anti-interference performance of the FPC flexible circuit board 1.

[0029] In this embodiment, if Figure 2 As shown, the coating layer 14 and the conductive layer 13 are adhered together by an adhesive, and the electromagnetic shielding film used on the coating layer 14 is adhered to the conductive coating on the conductive layer 13, thereby effectively blocking the interference of external electromagnetic wave signals on the FPC flexible circuit board 1.

[0030] Working principle: When the FPC flexible circuit board is in use, since the top and bottom of the substrate layer 11 are both in contact with the shielding layer on the insulating layer 12, and the shielding layer 122 is made of conductive powder, it can effectively block the interference of electromagnetic waves and improve the anti-interference ability of the FPC. When voltage is applied to the FPC electromagnetic shielding film on the coating layer, the conductive material will form an effective shielding current and electromagnetic wave reflection, thereby achieving the effect of shielding electromagnetic interference and blocking the interference of external electromagnetic wave signals on the FPC flexible circuit board 1. The conductive coating on the conductive layer 13 can reduce the radiation and leakage of electromagnetic waves and improve the electromagnetic compatibility of the FPC. Finally, due to the superposition of the anti-interference properties of the substrate layer 11, the shielding layer 122 and the conductive layer 13 itself, the anti-interference performance of the FPC flexible circuit board 1 is significantly improved.

[0031] All technical features in this embodiment can be freely combined according to actual needs.

[0032] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the protection scope of the present invention.

Claims

1. An anti-interference FPC, comprising an FPC flexible circuit board (1), characterized in that: The inner central sandwich layer of the FPC flexible circuit board (1) is a base material layer (11), the top and bottom of the base material layer (11) are both adhered with an insulating layer (12), the top and bottom of the insulating layer (12) are adhered with a shielding layer (122), and the shielding layer (122) is formed by compacting conductive powder.

2. The anti-interference FPC according to claim 1, characterized in that: The top and bottom of the FPC flexible circuit board (1) are both coating layers (14), and the coating layer (14) is an electromagnetic shielding film, which is a composite film material composed of a conductive material and a base material.

3. The anti-interference FPC according to claim 2, characterized in that: In the inner layer structure of the FPC flexible circuit board (1), conductive layers (13) are bonded to the inner side surfaces of the coating layers (14) at the top and bottom. The conductive layers (13) are made of metal copper foil, and the surface of the conductive layers (13) is covered with a conductive coating.

4. The anti-interference FPC according to claim 3, characterized in that: The inner side surface of the conductive layer (13) is bonded to one side surface of the shielding layer (122) on the two insulating layers (12); the insulating layer (12) and the two shielding layers (122) at the top and bottom thereof are sandwiched between the conductive layer (13) and the substrate layer (11).

5. The anti-interference FPC according to claim 1, characterized in that: The substrate layer (11) is made of polyimide flexible insulating material, and the top and bottom of the substrate layer (11) are bonded to the two shielding layers (122) via an adhesive.

6. The anti-interference FPC according to claim 2, characterized in that: The coating layer (14) and the conductive layer (13) are bonded together by an adhesive, and the electromagnetic shielding film used on the coating layer (14) is bonded to the conductive coating on the conductive layer (13).

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