Developing, etching and film removing equipment for high-density circuit board production

By designing a device including a developing groove, an etching groove and a film removal groove, the sliding cooperation between the sleeve and the fixing rod and the hydraulic telescopic rod and the nozzle system are used to solve the problems of low etching and film removal efficiency and complex double-sided etching treatment in existing equipment, and an efficient and stable circuit board film removal effect is achieved.

CN222776393UActive Publication Date: 2025-04-18SHANDONG WEIENTHALPY TECH CO LTD
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Patent Information

Application Number
CN202421362427.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-14
Publication Date
2025-04-18
Estimated Expiration
2034-06-14

AI Technical Summary

Technical Problem

The existing development etching and film removal equipment for high-density circuit board production is inefficient in the etching and film removal process, especially for double-sided etching circuit boards, which increases the workload and is not conducive to efficient and stable film removal.

Method used

A device including a developing groove, an etching groove and a film removal groove is designed. Through the sliding cooperation of the sleeve and the fixing rod, the high-density circuit board swings back and forth in the developer and improves the development etching and film removal efficiency. At the same time, the hydraulic telescopic rod and nozzle system are used to achieve rapid circulating flow of the solution and double-sided spraying, improving the etching and film removal efficiency.

Benefits of technology

The efficiency of high-density circuit board development, etching and film removal treatment is improved, especially the treatment of double-sided etching, which reduces the workload and achieves a more efficient and stable film removal effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of high-density circuit board production, in particular to developing, etching and film removing equipment for high-density circuit board production, which comprises a box body, a control panel is mounted on the box body, a developing tank, a first flushing tank, an etching tank, a second flushing tank and a film removing tank are arranged in the box body, and a fixing rod is arranged in the box body. A sleeve is arranged on the fixing rod in a sliding mode, a wave-shaped sliding groove is formed in the fixing rod, a first sliding block is arranged in the sleeve, a hydraulic telescopic rod is arranged on the sleeve, a second fixing plate is fixedly arranged at the extending end of the hydraulic telescopic rod, and a clamping assembly is arranged on the second fixing plate. According to the utility model, the sleeve can slide on the outer side of the fixed rod and simultaneously repeatedly rotate back and forth, so that the efficiency of developing, etching, film removing and the like of the high-density circuit board is improved; and then the solution is sprayed to the two end surfaces of the high-density circuit board through the two rows of first nozzles, so that the two-sided high-density circuit board can be quickly subjected to developing, etching, film removing and the like.
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Description

Technical Field

[0001] The utility model relates to the technical field of high-density circuit board production, in particular to a developing, etching and film removing device for high-density circuit board production. Background Art

[0002] During the production of high-density circuit boards, the original board can be used for production finalization, and then large-scale production can be carried out. When the circuit boards are etched and film-removed, etching is a technology that removes electrical component materials by chemical reaction or physical impact. The circuit boards need to be etched and film-removed, and the development and etching film-removal process can magnify the surface of the circuit board several times and take microscopic photos of the molecular structure.

[0003] Existing developing, etching and film removal equipment for high-density circuit board production usually places the high-density circuit board into a container filled with solution, and then heats the solution in the container through a quartz heating tube to accelerate the etching and film removal reaction rate of the high-density circuit board. However, after the high-density circuit board is placed in the solution, the surface of the solution is calm, which affects the efficiency of etching and film removal of the high-density circuit board. In addition, some high-density circuit boards require double-sided etching. When etching and film removal of high-density circuit boards with double-sided etching, the high-density circuit board needs to be flanged after single-sided etching and film removal, and then placed in a container filled with sodium hydroxide for etching and film removal, which undoubtedly greatly increases the workload and is not conducive to efficient and stable film removal of high-density circuit boards with double-sided etching. Utility Model Content

[0004] The utility model aims to provide a developing, etching and film removing device for producing high-density circuit boards, which is used to overcome the above-mentioned defects in the prior art.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a developing, etching and film removing device for producing high-density circuit boards, comprising a box body, a control panel is installed on one side of the box body, an inlet is installed at the front end of the box body, an outlet is installed at the rear end of the box body, a plurality of first partitions are fixedly arranged at intervals inside the box body, a developing tank, a first rinsing tank, an etching tank, a second rinsing tank and a film removing tank are separated by the plurality of first partitions inside the box body, a fixing rod is fixedly arranged on the upper side of the inner part of the box body, a sleeve is sleeved on the outer side of the fixing rod, the inner side of the sleeve is in sliding contact with the outer side of the fixing rod, two wave-shaped slide grooves are respectively provided on both sides of the fixing rod, two first sliders are respectively fixedly arranged on both sides of the inner part of the sleeve, and the two first sliders slide in the two wave-shaped slide grooves respectively, a hydraulic telescopic rod is installed on one side of the sleeve, a first fixing plate is fixedly arranged on the protruding end of the hydraulic telescopic rod, a second fixing plate is fixedly arranged on one side of the first fixing plate, and a plurality of clamping components for clamping the high-density circuit board are spaced apart on the second fixing plate.

[0006] Preferably, the clamping assembly includes a fixed frame, the fixed frame is fixed to the second fixed plate, the fixed frame is provided with a rotating shaft for rotation inside, a rotating plate is provided at one end of the rotating shaft, a shift rod is provided on the outside of the rotating shaft located inside the fixed frame, one end of the shift rod is in sliding contact with the outside of the rotating shaft, a torsion spring is connected between one end of the shift rod and one end of the rotating plate, the torsion spring is located on the outside of the rotating shaft, one end of the rotating plate is fixedly connected to one end of the rotating shaft, and a pressure plate is rotatably provided on the other end of the rotating plate.

[0007] Preferably, a first clamping plate is fixedly provided on the lower part of the second fixing plate toward the clamping assembly, and a second clamping plate is fixedly provided on the pressure plate toward the first clamping plate. Both the first clamping plate and the second clamping plate are made of rubber.

[0008] Preferably, a T-shaped block is fixedly provided on one side of the lever, a hole is provided inside the fixing frame on one side facing the T-shaped block, and the inner diameter of the T-shaped block is slightly larger than the outer diameter of the larger end of the T-shaped block.

[0009] Preferably, a motor is installed on the upper side of one end of the interior of the box body, a screw rod is provided at the output end of the motor, a moving block is provided in threaded contact on the outer side of the screw rod, a guide rod is fixedly provided on the upper side of the interior of the box body, the moving block is in sliding contact with the outer side of the guide rod, a groove is provided on the side of the moving block facing the fixed rod, two arc-shaped sliding grooves are respectively provided on both sides of the interior of the groove, a second sliding block is provided for sliding between the two arc-shaped sliding grooves, two ends of the second sliding block respectively slide in an arc shape in the two arc-shaped sliding grooves, and a connecting rod is fixedly connected between the second sliding block and the sleeve.

[0010] Preferably, two second partitions are fixedly provided on both sides of the developing tank, two third partitions are fixedly provided on both sides near the middle of the developing tank, a storage tank is provided between the two third partitions, two circulation tanks are provided between the two third partitions and the two second partitions, and two filter plates are inclinedly provided on the upper sides of the two circulation tanks.

[0011] Preferably, the inclined lower end of each filter plate is fixedly connected to the upper end of the third partition plate, and the inclined upper end of each filter plate is fixedly connected to the second partition plate. Two first water pumps are respectively installed on the outer sides of the two second partitions, and a plurality of first nozzles are spaced apart on the upper inner sides of the two second partitions. The plurality of first nozzles are connected to each other, and one end of each of the first water pumps is connected to the circulation tank, and the other end of each of the first water pumps is connected to one of the first nozzles. The internal structures of the developing tank, etching tank, and film removal tank are the same.

[0012] Preferably, a plurality of second nozzles are spaced apart on both sides of the upper portion of the first flushing trough, and the plurality of second nozzles are connected to each other. Two second water pumps are respectively installed on both sides of the lower portion of the first flushing trough, and one end of each of the second water pumps is connected to a water tank outside the box body, and the other end of each of the second water pumps is connected to one of the second nozzles. The internal structure of the first flushing trough is the same as the internal structure of the second flushing trough.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] The utility model can firstly slide a sleeve on the outer side of a fixed rod and cooperate with two first sliding blocks to slide in two wave-shaped slide grooves respectively, so that under the action of the wave-shaped structure of the wave-shaped slide groove, the sleeve slides on the outer side of the fixed rod and rotates back and forth repeatedly, so as to make the high-density circuit board swing back and forth in the developing tank, the etching tank and the film stripping tank, so as to improve the efficiency of developing, etching, film stripping and other treatments of the high-density circuit board; then start the first water pump to make the solution in the developing tank, the etching tank and the film stripping tank circulate rapidly, so as to further improve the efficiency of developing, etching, film stripping and other treatments of the high-density circuit board; finally, the solution in the developing tank, the etching tank and the film stripping tank is sprayed onto the two end surfaces of the high-density circuit board through two rows of first nozzles, so as to quickly carry out developing, etching, film stripping and other treatments on the double-sided high-density circuit board.

[0015] The utility model can firstly guide the two filter plates obliquely, so that the dry films separated from the high-density circuit board are moved into the storage tank; then the filtered solution is filtered into the circulation tank through the filtering effect of the two filter plates; finally, the two first water pumps are started to spray the solution in the circulation tank through a plurality of first nozzles to treat the two end surfaces of the high-density circuit board, and the solution is circulated and used and the solution is continuously circulated to avoid the solution surface being calm, thereby affecting the efficiency of developing, etching and film removal of the high-density circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The utility model is further explained below in conjunction with the accompanying drawings and embodiments:

[0017] Figure 1 It is an isometric structural schematic diagram of the utility model.

[0018] Figure 2 It is a schematic diagram of the top structure of the utility model.

[0019] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure at AA in the middle.

[0020] Figure 4 for Figure 3 Schematic diagram of the cross-sectional structure at BB in the middle.

[0021] Figure 5 It is an isometric structural schematic diagram of the internal structure of the box body in the utility model.

[0022] Figure 6 It is an isometric structural schematic diagram of the related structure of the sleeve and the moving block in the utility model.

[0023] Figure 7 for Figure 6 Schematic diagram of the top view structure.

[0024] Figure 8 for Figure 7 Schematic diagram of the cross-sectional structure at CC in the middle.

[0025] Fig. 9 It is an isometric structural schematic diagram of the clamping assembly in the utility model.

[0026] In the figure, the box 10, the control panel 11, the inlet 12, the outlet 13, the first partition 14, the developing tank 15, the first rinsing tank 16, the etching tank 17, the second rinsing tank 18, the film removal tank 19, the fixing rod 20, the wave-shaped slide 21, the sleeve 22, the hydraulic telescopic rod 23, the first fixing plate 24, the second fixing plate 25, the first clamping plate 26, the fixing frame 27, the rotating shaft 28, the lever 29, the torsion spring 30, the rotating plate 31, the T-shaped block 32, the pressure plate 33, the second clamping plate 34, the first slider 35, the clamping hole 36, the moving block 37, the groove 38, the arc-shaped slide 39, the second slider 40, the connecting rod 41, the motor 42, the screw 43, the guide rod 44, the second partition 45, the first water pump 46, the first nozzle 47, the third partition 48, the storage tank 49, the filter plate 50, the circulation tank 51, the second nozzle 52, and the second water pump 53. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0028] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be given below with reference to the relevant literature, and several embodiments of the present invention are provided. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0029] See also Figure 1-6The utility model provides a technical solution: a developing, etching and film stripping device for high-density circuit board production, comprising a box body 10, a control panel 11 is installed on one side of the box body 10, an inlet 12 is arranged at the front end of the box body 10, an outlet 13 is arranged at the rear end of the box body 10, a plurality of first partitions 14 are welded and fixedly arranged inside the box body 10, a developing tank 15, a first rinsing tank 16, an etching tank 17, a second rinsing tank 18 and a film stripping tank 19 are separated inside the box body 10 by the plurality of first partitions 14, a fixing rod 20 is fixedly arranged on the upper side of the inside of the box body 10, and the outer side of the fixing rod 20 A sleeve 22 is provided, the inner side of the sleeve 22 is in sliding contact with the outer side of the fixed rod 20, two wave-shaped grooves 21 are provided on both sides of the fixed rod 20, two first sliders 35 are fixed on both sides of the inner side of the sleeve 22, and the two first sliders 35 slide in the two wave-shaped grooves 21 respectively, a hydraulic telescopic rod 23 is installed on one side of the sleeve 22, a first fixed plate 24 is fixed on the protruding end of the hydraulic telescopic rod 23, a second fixed plate 25 is fixed on one side of the first fixed plate 24, and a plurality of clamping components for clamping the high-density circuit board are arranged at intervals on the second fixed plate 25.

[0030] Further, such as Figure 6-9 As shown, the clamping assembly includes a fixed frame 27, which is fixed on the second fixed plate 25. A rotating shaft 28 is rotatably provided inside the fixed frame 27, and a rotating plate 31 is provided at one end of the rotating shaft 28. A lever 29 is provided on the outside of the rotating shaft 28 located inside the fixed frame 27, and one end of the lever 29 is in sliding contact with the outside of the rotating shaft 28. A torsion spring 30 is connected between one end of the lever 29 and one end of the rotating plate 31, and the torsion spring 30 is located on the outside of the rotating shaft 28. One end of the rotating plate 31 is fixedly connected to one end of the rotating shaft 28, and a pressure plate 33 is rotatably provided on the other end of the rotating plate 31.

[0031] Further, such as Figure 6-9 As shown, a first clamping plate 26 is fixedly disposed on the lower part of the second fixing plate 25 facing the clamping assembly, and a second clamping plate 34 is fixedly disposed on the pressing plate 33 facing the first clamping plate 26 . Both the first clamping plate 26 and the second clamping plate 34 are made of rubber.

[0032] Further, such as Figure 6-9 As shown, a T-shaped block 32 is fixedly provided on one side of the lever 29 , and a clamping hole 36 is provided inside the fixed frame 27 on one side facing the T-shaped block 32 . The inner diameter of the T-shaped block 32 is slightly larger than the outer diameter of the larger end of the T-shaped block 32 .

[0033] Further, such as Figure 5-8As shown, a motor 42 is installed on the upper side of one end of the interior of the box body 10, and a screw rod 43 is provided at the output end of the motor 42. A moving block 37 is provided on the outer threaded contact of the screw rod 43. A guide rod 44 is fixedly provided on the upper side of the interior of the box body 10. The moving block 37 is in sliding contact with the outer side of the guide rod 44. A groove 38 is provided on the side of the moving block 37 facing the fixed rod 20. Two arc-shaped slide grooves 39 are respectively provided on both sides of the interior of the groove 38. A second slider 40 is slidably provided between the two arc-shaped slide grooves 39. The two ends of the second slider 40 slide in an arc shape in the two arc-shaped slide grooves 39 respectively. A connecting rod 41 is fixedly connected between the second slider 40 and the sleeve 22.

[0034] Further, such as Figure 3-4 As shown, two second partitions 45 are fixedly provided on both sides of the developing tank 15, two third partitions 48 are fixedly provided on both sides near the middle of the developing tank 15, a storage tank 49 is provided between the two third partitions 48, two circulation grooves 51 are provided between the two third partitions 48 and the two second partitions 45, and two filter plates 50 are obliquely provided on the upper sides of the two circulation grooves 51.

[0035] Further, such as Figure 3-4 As shown, the inclined lower end of each filter plate 50 is fixedly connected to the upper end of the third partition plate 48, and the inclined upper end of each filter plate 50 is fixedly connected to the second partition plate 45. Two first water pumps 46 are respectively installed on the outer sides of the two second partition plates 45, and a plurality of first nozzles 47 are spaced apart on the inner sides of the upper parts of the two second partition plates 45. The plurality of first nozzles 47 are interconnected, one end of each first water pump 46 is connected to the circulation tank 51, and the other end of each first water pump 46 is connected to one of the first nozzles 47; the internal structures of the developing tank 15, the etching tank 17, and the film removal tank 19 are all the same.

[0036] Further, such as Figure 3 As shown, a plurality of second nozzles 52 are spaced apart on both sides of the upper part of the first flushing trough 16, and the plurality of second nozzles 52 are connected to each other. Two second water pumps 53 are respectively installed on both sides of the lower part of the first flushing trough 16, and one end of each second water pump 53 is connected to the water tank outside the box body 10, and the other end of each second water pump 53 is connected to one of the second nozzles 52. The internal structure of the first flushing trough 16 is the same as the internal structure of the second flushing trough 18.

[0037] When in use, the staff places the upper end of the high-density circuit board on the first clamping plate 26, and then the staff operates the lever 29 to rotate toward the inner direction of the fixed frame 27. The rotation of the lever 29 drives the rotating plate 31 to rotate through the torsion spring 30, and the rotation of the rotating plate 31 drives the second clamping plate 34 to move through the pressure plate 33; first, the second clamping plate 34 moves to cooperate with the first clamping plate 26 to fix, so as to clamp and fix the upper end of the high-density circuit board; then, the lever 29 moves to make the larger end of the T-shaped clamping block 32 enter the clamping hole 36, so that the lever 29 can be limited and fixed by the T-shaped clamping block 32 and the clamping hole 36, so as to maintain the clamping and fixing effect on the upper end of the high-density circuit board; finally, the first clamping plate 26 and the second clamping plate 34 are both made of rubber, so that the friction between the upper ends of the high-density circuit board and the first clamping plate 26 and the second clamping plate 34 is relatively large, so as to strengthen the clamping and fixing effect on the upper end of the high-density circuit board.

[0038] Secondly, the system in the control panel 11 controls the hydraulic telescopic rod 23 to extend, and the hydraulic telescopic rod 23 extends and drives the second fixed plate 25 to move downward through the first fixed plate 24. The second fixed plate 25 moves downward and drives several high-density circuit boards to move downward through several clamping components and enter the developer in the developer tank 15 to dissolve. The developer is used to dissolve the dry film on the opaque part of the high-density circuit board to expose the copper surface; at this time, the motor 42 starts to drive the screw rod 43 to rotate clockwise, and the screw rod 43 rotates through the screw rod 43 and the moving block 37 threaded contact, and the moving block 37 is in sliding contact with the outer side of the guide rod 44, so that the moving block 37 moves on the outer side of the screw rod 43 and the guide rod 44; the movement of the moving block 37 drives the sleeve 22 to move through the connecting rod 41, and the sleeve 22 slides on the outer side of the fixed rod 20, and the sleeve 22 drives the two first sliding The block 35 slides in the two wave-shaped grooves 21 respectively, and the wave-shaped structure of the wave-shaped groove 21 allows the sleeve 22 to slide on the outer side of the fixed rod 20 and rotate back and forth repeatedly. The sleeve 22 rotates back and forth to drive the second fixed plate 25 to swing back and forth through the hydraulic telescopic rod 23. The second fixed plate 25 swings back and forth through a plurality of clamping components to drive a plurality of high-density circuit boards to swing back and forth in the developer, thereby accelerating the efficiency of the developer dissolving the dry film on the opaque part of the high-density circuit board; wherein, the sleeve 22 rotates back and forth to drive the connecting rod 41 to swing back and forth, and the connecting rod 41 swings back and forth to drive the second slider 40 to slide back and forth in the arc groove 39, so that one end of the connecting rod 41 is always located in the groove 38, so as to keep the movement of the moving block 37 to drive the sleeve 22 to move through the connecting rod 41, and avoid one end of the connecting rod 41 from being separated from the groove 38.

[0039] Next, the dry film separated from the high-density circuit board falls, a part of the dry film falls directly into the storage tank 49, and the other part of the dry film falls onto the filter plate 50, so that the filter plate 50 is arranged obliquely so that the dry film moves obliquely downward into the storage tank 49, and the developer in the developer tank 15 is filtered by the filter plate 50 and enters the circulation tank 51; at this time, the first water pump 46 is started to move the filtered developer in the circulation tank 51 to the first nozzle 47, and then the first nozzles 47 are interconnected to spray the filtered developer out of the first nozzles 47, and the first nozzles 47 are divided into two rows and located on both sides of the high-density circuit board, so that the developer is sprayed onto both sides of the high-density circuit board, so that the opaque parts of the dry film on both end surfaces of the double-sided high-density circuit board can be quickly dissolved at the same time to expose the copper surface, thereby improving the development efficiency of the double-sided high-density circuit board.

[0040] After the high-density circuit board is fully developed in the developing tank 15, the hydraulic telescopic rod 23 contracts and drives the second fixed plate 25 to move upward through the first fixed plate 24, and the second fixed plate 25 moves upward through a plurality of clamping components to drive a plurality of high-density circuit boards to move upward; at this time, the lower end of the high-density circuit board is higher than the upper end of the first partition plate 14, and the motor 42 is started to drive the screw rod 43 to rotate clockwise, and the screw rod 43 rotates and contacts with the moving block 37 through the screw rod 43 and the moving block 37 slidingly contacts with the outer side of the guide rod 44, so that the moving block 37 moves on the outer side of the screw rod 43 and the guide rod 44; The movable block 37 moves through the connecting rod 41 to drive the sleeve 22 to move, and the movement of the sleeve 22 drives the several high-density circuit boards to move to the top of the first flushing tank 16. At this time, the hydraulic telescopic rod 23 extends through the first fixed plate 24 to drive the second fixed plate 25 to move downward, and the second fixed plate 25 moves downward through several clamping components to drive the several high-density circuit boards to move downward into the first flushing tank 16; the two second water pumps 53 in the first flushing tank 16 are started to spray the clean water in the water tank through several second nozzles 52 to the two end surfaces of the high-density circuit boards, so as to quickly clean the high-density circuit boards.

[0041] When the high-density circuit board is fully cleaned in the first flushing tank 16, the hydraulic telescopic rod 23 contracts and drives the second fixed plate 25 to move upward through the first fixed plate 24, and the second fixed plate 25 moves upward through a number of clamping components to drive a number of high-density circuit boards to move upward; at this time, the lower end of the high-density circuit board is higher than the upper end of the first partition 14, and the motor 42 starts to drive the screw rod 43 to rotate clockwise, and the screw rod 43 rotates through the screw rod 43 and the moving block 37 threaded contact, and the moving block 37 is in sliding contact with the outer side of the guide rod 44, so that the moving block 37 moves on the outer side of the screw rod 43 and the guide rod 44; the movement of the moving block 37 drives the sleeve 22 to move through the connecting rod 41, and the movement of the sleeve 22 drives a number of high-density circuit boards to move to the top of the etching tank 17 At this time, the hydraulic telescopic rod 23 extends out through the first fixed plate 24 to drive the second fixed plate 25 to move downward, and the second fixed plate 25 moves downward through a plurality of clamping components to drive a plurality of high-density circuit boards to move downward into the etching solution in the etching tank 17, and the exposed copper surface is etched away by the etching solution to obtain the required pattern, and what remains is the copper trace covered with the dry film; wherein, the sleeve 22 repeatedly rotates back and forth while sliding on the outer side of the fixed rod 20, and the sleeve 22 rotates back and forth to drive the second fixed plate 25 to swing back and forth through the hydraulic telescopic rod 23, and the second fixed plate 25 swings back and forth to drive a plurality of high-density circuit boards to swing back and forth in the etching solution through a plurality of clamping components, thereby accelerating the efficiency of the etching solution to etch away the exposed copper surface to obtain the required pattern.

[0042] After the high-density circuit board is etched in the etching tank 17, the high-density circuit board moves into the second rinsing tank 18, and the two second water pumps 53 in the second rinsing tank 18 are started to make the second nozzles 52 spray clean water to clean the high-density circuit board.

[0043] Finally, the high-density circuit board is moved into the film removal tank 19, and the dry film remaining on the board surface after etching is removed by high-pressure washing, thereby forming the required circuit pattern.

[0044] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is limited by the appended claims and their equivalents.

Claims

1. A developing, etching and film removing device for producing high-density circuit boards, comprising a housing (10), characterized in that: A control panel (11) is installed on one side of the box (10); an inlet (12) is provided at the front end of the box (10); an outlet (13) is provided at the rear end of the box (10); a plurality of first partitions (14) are fixedly provided inside the box (10) at intervals; a developing tank (15), a first rinsing tank (16), an etching tank (17), a second rinsing tank (18), and a film removal tank (19) are separated inside the box (10) by the plurality of first partitions (14); a fixing rod (20) is fixedly provided on the upper side of the inside of the box (10); a sleeve (22) is sleeved on the outer side of the fixing rod (20); and the inner side of the sleeve (22) is provided with a plurality of first partitions (14). The sleeve (22) is in sliding contact with the outer side of the fixing rod (20), two wave-shaped slide grooves (21) are respectively provided on both sides of the fixing rod (20), two first sliders (35) are respectively fixedly provided on both sides of the interior of the sleeve (22), and the two first sliders (35) slide in the two wave-shaped slide grooves (21) respectively, a hydraulic telescopic rod (23) is installed on one side of the sleeve (22), a first fixing plate (24) is fixedly provided on the protruding end of the hydraulic telescopic rod (23), a second fixing plate (25) is fixedly provided on one side of the first fixing plate (24), and a plurality of clamping components for clamping a high-density circuit board are arranged at intervals on the second fixing plate (25).

2. The developing, etching and film removing equipment for producing high-density circuit boards according to claim 1, characterized in that: The clamping assembly comprises a fixed frame (27), wherein the fixed frame (27) is fixed on the second fixed plate (25), a rotating shaft (28) is rotatably provided inside the fixed frame (27), one end of the rotating shaft (28) is provided with a rotating plate (31), and a lever (29) is provided outside the rotating shaft (28) located inside the fixed frame (27), one end of the lever (29) is in sliding contact with the outside of the rotating shaft (28), a torsion spring (30) is connected between one end of the lever (29) and one end of the rotating plate (31), and the torsion spring (30) is located outside the rotating shaft (28), one end of the rotating plate (31) is fixedly connected to one end of the rotating shaft (28), and a pressing plate (33) is rotatably provided at the other end of the rotating plate (31).

3. The developing, etching and film removing equipment for producing high-density circuit boards according to claim 2, characterized in that: A first clamping plate (26) is fixedly provided on the lower part of the second fixing plate (25) on the side facing the clamping assembly, and a second clamping plate (34) is fixedly provided on the side of the pressing plate (33) facing the first clamping plate (26), and both the first clamping plate (26) and the second clamping plate (34) are made of rubber.

4. The developing, etching and film removing equipment for producing high-density circuit boards according to claim 3, characterized in that: A T-shaped clamping block (32) is fixedly provided on one side of the shifting rod (29), and a clamping hole (36) is provided inside the fixing frame (27) on one side facing the T-shaped clamping block (32), and the inner diameter of the T-shaped clamping block (32) is slightly larger than the outer diameter of the larger end of the T-shaped clamping block (32).

5. The developing, etching and film removing equipment for producing high-density circuit boards according to claim 1, characterized in that: A motor (42) is installed on the upper side of one end of the inner part of the box body (10), and a screw rod (43) is provided at the output end of the motor (42). A moving block (37) is provided on the outer side of the screw rod (43) in threaded contact. A guide rod (44) is fixedly provided on the upper side of the inner part of the box body (10), and the moving block (37) is in sliding contact with the outer side of the guide rod (44). A groove (38) is provided on one side of the moving block (37) facing the fixed rod (20), and two arc-shaped sliding grooves (39) are respectively provided on both sides of the inner part of the groove (38). A second sliding block (40) is slidably provided between the two arc-shaped sliding grooves (39), and the two ends of the second sliding block (40) slide in an arc shape in the two arc-shaped sliding grooves (39) respectively. A connecting rod (41) is fixedly connected between the second sliding block (40) and the sleeve (22).

6. The developing, etching and film removing equipment for producing high-density circuit boards according to claim 1, characterized in that: Two second partitions (45) are fixedly provided on both sides of the developing tank (15), two third partitions (48) are fixedly provided on both sides near the middle of the developing tank (15), a storage tank (49) is provided between the two third partitions (48), two circulation tanks (51) are provided between the two third partitions (48) and the two second partitions (45), and two filter plates (50) are obliquely provided on the upper sides of the two circulation tanks (51).

7. The developing, etching and film removing equipment for producing high-density circuit boards according to claim 6, characterized in that: The inclined lower end of each filter plate (50) is fixedly connected to the upper end of the third partition plate (48), and the inclined upper end of each filter plate (50) is fixedly connected to the second partition plate (45). Two first water pumps (46) are respectively installed on the outer sides of the two second partition plates (45). A plurality of first nozzles (47) are spaced apart on the inner sides of the upper parts of the two second partition plates (45). The plurality of first nozzles (47) are interconnected. One end of each first water pump (46) is connected to the circulation tank (51), and the other end of each first water pump (46) is connected to one of the first nozzles (47). The internal structures of the developing tank (15), etching tank (17), and film removal tank (19) are the same.

8. The developing, etching and film removing equipment for producing high-density circuit boards according to claim 1, characterized in that: A plurality of second nozzles (52) are arranged at intervals on both sides of the upper part of the first flushing tank (16), and the plurality of second nozzles (52) are connected to each other. Two second water pumps (53) are respectively installed on both sides of the lower part of the first flushing tank (16), and one end of each of the second water pumps (53) is connected to the water tank outside the box body (10), and the other end of each of the second water pumps (53) is connected to one of the second nozzles (52). The internal structure of the first flushing tank (16) is the same as the internal structure of the second flushing tank (18).