Dry cleaning device

Abstract

The utility model provides a dry cleaning device, relates to the field of photovoltaic equipment cleaning, and solves the technical problem that a dry cleaning device is poor in workpiece cleaning effect. The dry cleaning device comprises: a cavity having a process chamber configured to accommodate a workpiece; a gas delivery device configured to provide a cleaning gas; the microwave generation assembly is configured to ionize at least part of the cleaning gas to generate plasma, and the plasma is configured to clean the surface of the workpiece; and the at least two opposite polar plates are arranged in the process chamber and are configured to ionize the clean gas in the process chamber into plasmas. The microwave generation assembly and the polar plate can ionize the cleaning gas to generate the plasma, so that compared with a single plasma generation device, the ionization rate of ionizing the cleaning gas into the plasma is improved, and the cleaning effect on the workpiece can be improved.

Description

Technical Field

[0001] The present application relates to the field of photovoltaic equipment cleaning, and in particular to a dry cleaning device. Background Art

[0002] In the process of processing solar cells, quartz boats, graphite boats, etc. are often used as carriers for solar cells, and the carriers are placed in a reactor to coat the solar cells. However, when coating solar cells, the surfaces of quartz boats, graphite boats and other parts in the reactor are also easily coated, so the quartz boats, graphite boats and other parts in the reactor need to be cleaned regularly.

[0003] Currently, the commonly used method for cleaning the film layer is wet cleaning, which is to soak the workpiece in an acidic cleaning solution. However, this method often requires the workpiece to be soaked for a long time (such as a graphite boat needs to be soaked for more than 20 hours), the cleaning efficiency is low, and the acidic cleaning solution after use needs to be processed before it can be discharged, which is costly. Utility Model Content

[0004] In order to solve the above technical problems, the present application is proposed. The embodiment of the present application provides a dry cleaning device.

[0005] In a first aspect, an embodiment of the present application provides a dry cleaning device, comprising: a cavity having a process chamber, the process chamber being configured to accommodate a workpiece; a gas delivery device being configured to provide a cleaning gas; a microwave generating component being configured to ionize at least part of the cleaning gas to generate plasma, wherein the plasma is configured to clean the surface of the workpiece; and at least two oppositely disposed electrode plates being disposed in the process chamber and configured to ionize the cleaning gas in the process chamber into plasma.

[0006] In some embodiments, the gas delivery device is configured to provide a cleaning gas to the process chamber; the microwave generating assembly is configured to provide microwaves to the process chamber, and the microwaves are used to ionize at least part of the cleaning gas in the process chamber into plasma.

[0007] In some embodiments, the gas delivery device is configured to provide a cleaning gas to the microwave generating assembly; the microwave generating assembly is configured to ionize the cleaning gas provided by the gas delivery device into plasma and deliver the plasma to the process chamber.

[0008] In some embodiments, the cavity is a strip-shaped structure, and there are multiple microwave generating components, which are arranged along the extension direction of the cavity.

[0009] In some embodiments, the process chamber has a first side wall and a second side wall disposed opposite to each other; the at least two oppositely disposed electrode plates include: a first electrode plate disposed on the first side wall of the process chamber; and a second electrode plate disposed on the second side wall of the process chamber.

[0010] In some embodiments, the dry cleaning device further includes: an insulating block disposed at the bottom of the process chamber and located between the first electrode plate and the second electrode plate, and configured to support the workpiece to insulate the workpiece from the chamber.

[0011] In some embodiments, the material of the insulating block includes any one of aluminum oxide, aluminum nitride, polytetrafluoroethylene, quartz, silicon carbide, silicon nitride, and yttrium oxide.

[0012] In some embodiments, the microwave generating assembly includes: a microwave power supply configured to generate microwaves, the microwave power supply including a magnetron or a solid-state power supply.

[0013] In some embodiments, the chamber has an exhaust port, and the dry cleaning apparatus further includes: a vacuum pump, which is connected to the process chamber through the exhaust port and is configured to exhaust gas in the process chamber.

[0014] In some embodiments, the microwave generating assembly is disposed outside the process chamber, the cavity has a first opening, and the microwave generating assembly is in communication with the process chamber through the first opening.

[0015] In some embodiments, the gas delivery device is disposed outside the process chamber, and the cavity further has a second opening, and the gas delivery device is connected to the process chamber through the second opening.

[0016] The dry cleaning device provided in the embodiment of the present application, first, because both the microwave generating component and the electrode plate can ionize the cleaning gas to generate plasma, and the ionization rate of the microwave plasma generated by the microwave generating component is relatively high, the ionization rate of the cleaning gas to plasma is improved; second, if the microwave plasma recombines into a molecular state after a period of time, the electrode plate can re-ionize the recombined molecules into a capacitively coupled plasma; third, the electrode plate can also improve the stability of the microwave plasma and reduce the probability of the microwave plasma recombining into a molecular state. In summary, this structure can greatly improve the ionization rate of the cleaning gas to plasma, increase the concentration of the plasma, and thus improve the cleaning effect on the workpiece. In addition, the electrode plate can make the plasma have a stronger bombardment ability, thereby improving the cleaning effect on the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0018] Figure 1 Shown is a schematic diagram of a cross section of a dry cleaning device provided by an exemplary embodiment of the present application.

[0019] Figure 2 Shown is a schematic diagram of a cross section of a dry cleaning device provided by another exemplary embodiment of the present application.

[0020] Reference numerals:

[0021] 100, dry cleaning device; 110, cavity; 111, process chamber; 112, first opening; 113, second opening; 114, exhaust port; 120, microwave generating assembly; 121, waveguide; 122, plasma input channel; 123, microwave power supply; 130, electrode plate; 131, first electrode plate; 132, second electrode plate; 140, radio frequency power supply; 150, gas delivery device; 160, insulating block; 170, insulating pad; 200, workpiece. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0023] Application Overview

[0024] Since the invention of solar cells, the continuous progress in production technology of silicon-based and non-silicon materials, as well as the continuous development and optimization of solar cell manufacturing equipment, have continuously reduced the processing cost of photovoltaic solar cells. Therefore, photovoltaic solar energy is currently the fastest growing green energy. Since 2022, with the gradual maturity of N-type tunnel oxide passivated contact (TOPCon) cell technology, more and more cell manufacturers have chosen the TOPCon process route. In the TOPCon cell production process, the cell needs to go through multiple complex processes, including but not limited to growing an oxide layer, plating polycrystalline silicon (commonly known as Poly silicon), and plating an anti-reflection film.

[0025] In the process of growing oxide layer and coating Poly silicon, a quartz boat is usually used as a carrier to carry silicon wafers and placed in a low pressure chemical vapor deposition (LPCVD) furnace for reaction. After long-term use, a layer of Poly silicon will adhere to the surface of the quartz boat. Too thick Poly silicon will affect the production process, so the quartz boat needs to be cleaned regularly after a period of use. In the process of coating anti-reflection film, a graphite boat is usually used as a carrier to carry silicon wafers and placed in a plasma enhanced chemical vapor deposition (PECVD) furnace for reaction. After long-term use, a layer of silicon nitrogen compound (SiNx) film will adhere to the surface of the graphite boat. Too thick film layer will affect the normal use of the graphite boat, so the graphite boat needs to be cleaned regularly after a period of use.

[0026] Currently, the commonly used method for cleaning the film layer is wet cleaning, which is to soak the workpiece in an acidic cleaning solution. However, this method often requires the workpiece to be soaked for a long time (such as a graphite boat needs to be soaked for more than 20 hours), the cleaning efficiency is low, and the acidic cleaning solution after use needs to be processed before it can be discharged, which is costly.

[0027] In view of this, the present application proposes a dry cleaning device comprising: a cavity having a process chamber, the process chamber being configured to accommodate a workpiece; a gas delivery device being configured to provide a cleaning gas; a microwave generating component being configured to ionize at least a portion of the cleaning gas to generate plasma, wherein the plasma is configured to clean the surface of the workpiece; and at least two oppositely disposed electrode plates being disposed in the process chamber and configured to ionize the cleaning gas in the process chamber into plasma.

[0028] First, since both the microwave generating assembly and the electrode plate can ionize the clean gas to generate plasma, the ionization rate is higher than that of a single plasma generating device, and the ionization rate of the microwave plasma generated by the microwave generating assembly is higher, thus improving the ionization rate of the clean gas to plasma; second, if the microwave plasma recombines into a molecular state after a period of time, the electrode plate can re-ionize the recombined molecules into a capacitively coupled plasma; third, the electrode plate can also improve the stability of the microwave plasma and reduce the probability of the microwave plasma recombining into a molecular state. In summary, this structure can greatly improve the ionization rate of the clean gas to plasma, increase the concentration of the plasma, and thus improve the cleaning effect on the workpiece. In addition, the electrode plate can make the plasma have a stronger bombardment ability, thereby improving the cleaning effect on the workpiece.

[0029] Exemplary Devices

[0030] Figure 1 FIG. 1 is a schematic diagram showing a cross section of a dry cleaning device provided by an exemplary embodiment of the present application. Figure 2 Shown is a schematic diagram of a cross section of a dry cleaning device provided by another exemplary embodiment of the present application.

[0031] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides a dry cleaning device 100, comprising: a cavity 110, having a process chamber 111, the process chamber 111 is configured to accommodate a workpiece 200; a gas delivery device 150, configured to provide a cleaning gas; a microwave generating component 120, configured to ionize at least part of the cleaning gas to generate plasma, wherein the plasma is configured to clean the surface of the workpiece 200; at least two oppositely disposed electrode plates 130, disposed in the process chamber 111, and configured to ionize the cleaning gas to generate plasma.

[0032] Specifically, the workpiece 200 may exemplarily include: a graphite boat, a quartz boat, and metal or ceramic parts (such as an air intake pipe) in a reactor, etc. The cleaning gas may exemplarily be nitrogen trifluoride (NF3), carbon tetrafluoride (CF4) or sulfur hexafluoride (SF6), etc. The film layer to be removed on the workpiece 200 may exemplarily be polycrystalline silicon (commonly known as Poly silicon), silicon nitride (SiNx) film, etc. The microwave generating component 120 may exemplarily be a remote plasma source (RPS).

[0033] First, since both the microwave generating assembly 120 and the electrode plate 130 can ionize the cleaning gas to generate plasma, the ionization rate is higher than that of using a single plasma generating device, and the ionization rate of the microwave plasma generated by the microwave generating assembly 120 is higher, thereby improving the ionization rate of the cleaning gas to plasma; second, if the microwave plasma recombines into a molecular state after a period of time, the electrode plate 130 can re-ionize the recombined molecules into a capacitively coupled plasma; third, the electrode plate 130 can also improve the stability of the microwave plasma and reduce the probability of the microwave plasma recombining into a molecular state. In summary, this structure can greatly improve the ionization rate of the cleaning gas to plasma, increase the concentration of the plasma, and thus improve the cleaning effect on the workpiece 200. In addition, the electrode plate 130 can make the plasma have a strong bombardment ability, thereby improving the cleaning effect on the workpiece 200.

[0034] In some embodiments, Figure 1As shown, the gas delivery device 150 is configured to provide a cleaning gas to the process chamber 111; the microwave generating assembly 120 is configured to provide microwaves to the process chamber 111, and the microwaves are used to ionize at least part of the cleaning gas in the process chamber 111 into plasma. Through this structure, the microwaves and the electric field between the two plates 130 can act on the cleaning gas in the process chamber 111 at the same time, so that the cleaning gas is ionized into plasma.

[0035] In other embodiments, Figure 2 As shown, the gas delivery device 150 is configured to provide a cleaning gas to the microwave generating assembly 120; the microwave generating assembly 120 is configured to ionize the cleaning gas provided by the gas delivery device 150 into plasma, and deliver the plasma to the process chamber 111. With this structure, the microwave generating assembly 120 first ionizes the cleaning gas into plasma, and then delivers the plasma to the process chamber 111. If the plasma is partially recombined into a cleaning gas in the process chamber, the electrode plate 130 can ionize the recombined cleaning gas into plasma again.

[0036] In some embodiments, the microwave generating assembly 120 includes: a microwave power supply 123, configured to generate microwaves, and the microwave power supply 123 includes a magnetron or a solid-state power supply (solid-state microwave source). Among them, the magnetron has the advantages of low cost and high power, so the magnetron is preferably used as the microwave power supply 123. Microwave plasma has a higher density and ionization rate, so the microwave plasma generated by the microwave generating assembly 120 can improve the cleaning effect.

[0037] In some embodiments, the microwave generating assembly 120 includes a power source (not shown) for supplying power to the microwave power source 123 .

[0038] In some embodiments, the frequency of the microwave power source 123 is preferably in the microwave frequency band, exemplarily 915 Mhz or 2.45 Ghz.

[0039] In other embodiments, the microwave generating component 120 may also generate plasma through high temperature, radiation or other ionization methods, such as inductively coupled discharge to generate inductively coupled plasma.

[0040] In some embodiments, Figure 1 As shown, the microwave generating assembly 120 includes: a waveguide 121, the waveguide 121 is connected to the process chamber 111, and the waveguide 121 is configured to transmit the microwave generated by the microwave power supply 123 to the process chamber 111. The waveguide 121 is a structure for directional guiding electromagnetic waves, and the waveguide 121 can be exemplarily a metal tube.

[0041] In other embodiments, Figure 2As shown, the microwave generating assembly 120 includes a plasma input channel 122 , which is connected to the process chamber 111 , and is configured to transport plasma generated by ionizing the cleaning gas by a microwave power source 123 to the process chamber 111 .

[0042] In some embodiments, the cavity 110 may be a strip-shaped structure, and at least two electrode plates 130 may be disposed opposite to each other in the width direction (horizontal direction perpendicular to the extension direction) of the cavity 110 .

[0043] In some embodiments, the chamber 110 has a first side wall and a second side wall that are disposed oppositely, and at least two oppositely disposed electrode plates 130 include: a first electrode plate 131, disposed on the first side wall of the process chamber 111; and a second electrode plate 132, disposed on the second side wall of the process chamber 111. Specifically, the first electrode plate 131 and the second electrode plate 132 can allow plasma to impact the workpiece 200, so preferably, the workpiece 200 can be disposed between the first electrode plate 131 and the second electrode plate 132. If the first electrode plate 131 and the second electrode plate 132 are disposed on the first side wall and the second side wall, respectively, sufficient space can be reserved for placing the workpiece 200. Exemplarily, the first side wall and the second side wall can be inner walls of the process chamber 111 disposed in the horizontal direction, or the first side wall and the second side wall can be inner walls of the top and bottom of the process chamber 111, respectively.

[0044] In some embodiments, the microwave generating assembly 120 is disposed above the cavity 110 .

[0045] In some embodiments, Figure 1 and Figure 2 As shown, the dry cleaning device 100 also includes: an RF power supply 140, and at least two plates 130 are electrically connected to the RF power supply 140; wherein the RF power supply 140 has a grounding interface and a power supply interface, at least one plate 130 is electrically connected to the grounding interface, and the other plates 130 are electrically connected to the power supply interface; or, at least one plate 130 is electrically connected to the RF power supply 140, and the other plates 130 are grounded.

[0046] In some embodiments, the frequency of the RF power source 140 is 13.56Mhz or 40khz. If the frequency of the RF power source 140 is a lower frequency, the plasma has a stronger ion bombardment capability under the action of the electric field formed by the lower radio frequency, and the high-speed ions hit the surface of the workpiece 200, so that the film layer on the surface of the workpiece can be cleaned.

[0047] In some embodiments, the cavity 110 is a strip-shaped structure, and the number of microwave generating assemblies 120 is multiple, and the multiple microwave generating assemblies 120 are arranged along the extension direction of the cavity 110. By arranging multiple microwave generating assemblies 120 along the extension direction of the cavity 110, microwaves or plasma can be uniformly provided to the strip-shaped cavity 110, so that the plasma in the strip-shaped cavity 110 is uniformly distributed, thereby improving the cleaning effect of the workpiece 200 in the process chamber 111.

[0048] In some embodiments, Figure 1 and Figure 2 As shown, the microwave generating assembly 120 is disposed outside the process chamber 111 , the cavity 110 has a first opening 112 , and the microwave generating assembly 120 is communicated with the process chamber 111 through the first opening 112 .

[0049] Specifically, if the microwave generating component 120 is used to input microwaves into the process chamber 111, the microwave generating component 120 has a waveguide 121, and the waveguide 121 is connected to the process chamber 111 through the first opening 112. If the microwave generating component 120 is used to input plasma into the process chamber 111, the microwave generating component 120 has a plasma input channel 122, and the plasma input channel 122 is connected to the process chamber 111 through the first opening 112.

[0050] In some embodiments, Figure 1 As shown, the gas delivery device 150 is disposed outside the process chamber 111. The chamber 110 further has a second opening 113. The gas delivery device 150 is connected to the process chamber 111 through the second opening 113. By providing the second opening 113, the gas delivery device 150 can pass the cleaning gas into the process chamber 111.

[0051] In some embodiments, the cross-sectional shape of the cavity 110 is circular or rectangular, that is, the cavity 110 may be a cylindrical structure or a rectangular parallelepiped structure.

[0052] In some embodiments, the cavity 110 may be made of metal.

[0053] In some embodiments, Figure 1 and Figure 2 As shown, the chamber 110 has an exhaust port 114, and the dry cleaning device 100 further includes a vacuum pump, which is connected to the process chamber 111 through the exhaust port 114 and is configured to exhaust the gas in the process chamber 111. The exhaust gas in the process chamber 111 can be quickly exhausted by setting the vacuum pump.

[0054] In some embodiments, Figure 1 and Figure 2As shown, the dry cleaning device 100 includes: an insulating block 160, which is disposed at the bottom of the process chamber 111 and is located between the first electrode plate 131 and the second electrode plate 132, and is configured to support the workpiece 200 so as to insulate the workpiece 200 from the cavity 110. Specifically, the plasma strikes the metal cavity 110, which will make the metal cavity 110 charged, so the cavity 110 is set to be grounded to prevent leakage. If the workpiece 200 is directly placed on the cavity 110, the workpiece 200 is also grounded, so that the plasma striking the workpiece 200 loses its effect. Therefore, by setting the insulating block 160, the workpiece 200 can be prevented from being connected to the cavity 110.

[0055] In some embodiments, the material of the insulating block 160 includes any one of aluminum oxide, aluminum nitride, polytetrafluoroethylene, quartz, silicon carbide, silicon nitride, and yttrium oxide.

[0056] In some embodiments, the workpiece 200 is a quartz boat or a graphite boat, the quartz boat or the graphite boat has a boat foot, and the insulating block 160 has a groove, which is configured to accommodate the boat foot. By providing the groove, the workpiece 200 can be more stably carried to prevent the workpiece 200 from moving.

[0057] In some embodiments, Figure 1 and Figure 2 As shown, the dry cleaning device 100 further includes: an insulating pad 170, which is connected between the cavity 110 and the electrode plate 130 and is configured to insulate the electrode plate 130 from the cavity 110. Specifically, the cavity 110 is grounded. If the electrode plate 130 is directly connected to the cavity 110, the charge on the electrode plate 130 will be lost. Therefore, the insulating pad 170 is arranged between the electrode plate 130 and the cavity 110 to prevent the charge on the electrode plate 130 from being lost.

[0058] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0059] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0060] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0061] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0062] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A dry cleaning device, characterized in that: include: a chamber having a process chamber configured to accommodate a workpiece; a gas delivery device configured to provide a clean gas; a microwave generating assembly configured to ionize at least a portion of the cleaning gas to generate plasma, wherein the plasma is configured to clean the surface of the workpiece; At least two oppositely disposed electrode plates are disposed in the process chamber and are configured to ionize the cleaning gas in the process chamber into the plasma.

2. The dry cleaning device according to claim 1, characterized in that: The gas delivery device is configured to provide the cleaning gas to the process chamber; The microwave generating assembly is configured to provide microwaves to the process chamber, and the microwaves are used to ionize at least a portion of the cleaning gas in the process chamber into the plasma.

3. The dry cleaning device according to claim 1, characterized in that: The gas delivery device is configured to provide a clean gas to the microwave generating assembly; The microwave generating assembly is configured to ionize the cleaning gas provided by the gas delivery device into the plasma and deliver the plasma to the process chamber.

4. The dry cleaning device according to any one of claims 1 to 3, characterized in that: The cavity is a strip-shaped structure, and the number of the microwave generating components is multiple, and the multiple microwave generating components are arranged along the extension direction of the cavity.

5. The dry cleaning device according to any one of claims 1 to 3, characterized in that: The process chamber has a first side wall and a second side wall which are arranged opposite to each other; At least two of the oppositely disposed plates include: A first electrode plate, disposed on a first side wall of the process chamber; The second electrode plate is arranged on the second side wall of the process chamber.

6. The dry cleaning device according to claim 5, characterized in that: Also includes: The insulating block is disposed at the bottom of the process chamber and is located between the first electrode plate and the second electrode plate, and is configured to support the workpiece so as to insulate the workpiece from the chamber.

7. The dry cleaning device according to claim 6, characterized in that: The materials of the insulating block include: Any of alumina, aluminum nitride, polytetrafluoroethylene, quartz, silicon carbide, silicon nitride, and yttrium oxide.

8. The dry cleaning device according to any one of claims 1 to 3, characterized in that: The microwave generating assembly comprises: A microwave power supply is configured to generate microwaves, wherein the microwave power supply includes a magnetron or a solid-state power supply.

9. The dry cleaning device according to any one of claims 1 to 3, characterized in that: The cavity has an exhaust port, and the dry cleaning device further comprises: A vacuum pump is connected to the process chamber through the exhaust port and is configured to exhaust gas in the process chamber.

10. The dry cleaning device according to any one of claims 1 to 3, characterized in that: The microwave generating assembly is disposed outside the process chamber, the cavity has a first opening, and the microwave generating assembly is communicated with the process chamber through the first opening.

11. The dry cleaning device according to claim 10, characterized in that: The gas delivery device is arranged outside the process chamber, and the cavity body further has a second opening, and the gas delivery device is communicated with the process chamber through the second opening.

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