Heating and refrigerating cushion
By using the design of TEC semiconductor module and fan in the seat cushion, the cooling or heating effect is achieved by using airflow circulation, which solves the problem of difficulty in temperature adjustment of existing seat cushions in high or low temperature environments, and significantly improves the temperature adjustment effect.
Patent Information
- Application Number
- CN202421624290.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-10
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2034-07-10
AI Technical Summary
The existing seat cushions are difficult to effectively adjust the temperature in high or low temperature environments, resulting in users who may suffer burns or be too cold during use.
A heating and cooling seat cushion is designed, using a TEC semiconductor module and a fan to circulate airflow through the air inlet passage and ventilation passage to achieve cooling or heating effect.
By optimizing the structural layout and airflow circulation, the cooling and heating effects are significantly improved, and the cushion temperature can be effectively adjusted to avoid scalds or overcooling.
Smart Images

Figure CN222780520U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of seat cushions, in particular to a heating and cooling seat cushion. Background Art
[0002] The following technical problems are common in the existing electric vehicle seats, bicycle seats, motorcycle seats, sightseeing car seats or golf cart seats on the market: under the scorching sun, the surface temperature of the seat is very high, and when the user uses it, it is easy to burn the buttocks when it comes into contact with the buttocks; and in the cold winter, the surface temperature of the seat is too low, and when it comes into contact with the buttocks, it causes a situation that it is too cold.
[0003] In view of the above situation, existing seat cushions are usually implemented using semiconductor refrigeration modules, but due to the small space of some seat cushions, for example, the unreasonable structural layout adopted has defects, resulting in poor cooling or heating effects of electric vehicle seat cushions.
[0004] Therefore, improvements need to be made. Utility Model Content
[0005] The technical problem solved by the utility model is to provide a heating and cooling cushion for the defects existing in the above-mentioned prior art, so as to solve the problems raised in the above-mentioned background technology.
[0006] In order to solve the above technical problems, the technical solution adopted by the utility model is as follows: a heating and cooling cushion, comprising: a cushion body, wherein the end surface of the cushion body is provided with one or more first holes for circulating ventilation and one or more second holes for circulating ventilation arranged above a fan, and a control switch is provided on the side of the cushion body; a shell, wherein the shell is arranged at the lower part of the cushion body, and the shell and the front end of the cushion body are provided with an air inlet channel for air intake, the right end of the air inlet channel is connected to the fan, and the right end of the fan is connected to a TEC semiconductor module, the TEC semiconductor module is a single body or multiple, and the air outlet of the TEC semiconductor module is respectively connected to the ventilation channel and the exhaust channel, the ventilation channel is communicated with the first hole, and the exhaust channel extends to the air outlet at the right end of the cushion body for exhaust; wherein the control switch drives the TEC semiconductor module to work, and the TEC semiconductor module drives cold air or hot air to be transported to the end surface of the cushion body through the ventilation channel.
[0007] Furthermore, the TEC semiconductor module includes a cooling surface and a heat dissipation surface arranged below the cooling surface, the cooling surface and the heat dissipation surface are in communication with the fan, the cooling surface is in communication with the ventilation channel, and the heat dissipation surface is in communication with the exhaust channel.
[0008] Furthermore, the ventilation channel and the exhaust channel are arranged separately.
[0009] Furthermore, the ventilation channel is provided with one or more guide strips, and the guide strips are used to guide cold air or hot air to the first hole position.
[0010] Furthermore, the second hole position is arranged above the fan, and the fan is provided with an upward opening, and the fan is driven to circulate the cold air or hot air from the second hole position to the ventilation channel.
[0011] Furthermore, it includes a ventilation net for cold air or hot air circulation, and the ventilation net is laid on the first hole position and the second hole position.
[0012] Furthermore, it includes an air guide member arranged at the air outlet at the right end of the seat cushion body and an air guide decorative member arranged on the air guide member.
[0013] Furthermore, the control switch includes a compound button and a gear button, the compound button is used to switch the heating function, the cooling function and the off function, and the gear button is used to adjust the heating gear or the cooling gear.
[0014] Compared with the prior art, the beneficial effects of the utility model are:
[0015] 1. Optimize the structural layout. The external airflow is carried out through the air inlet channel of the seat cushion, and the external airflow is transported to the TEC semiconductor module through the fan. The first external airflow enters the ventilation duct and is guided to the first hole of the seat cushion. The second external airflow enters the exhaust channel and is guided out of the seat cushion. At the same time, the first external airflow guided to the first hole is guided to the TEC semiconductor module under the action of the fan, forming an airflow circulation, which improves the cooling or heating effect.
[0016] 2. Easy to use. The user can switch the cooling or heating function of the TEC semiconductor module through the control switch to meet the user's needs. It has cooling and heating functions.
[0017] 3. According to the direction of the vehicle, the air inlet channel, ventilation channel and exhaust channel are reasonably designed to facilitate the flow of external air to blow on the TEC semiconductor module, thereby improving the cooling and heating functions. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a schematic diagram of the structure of the utility model.
[0019] Figure 2 yes Figure 1 Schematic diagram of the structure from another angle.
[0020] Figure 3 It is a partial structural schematic diagram of the utility model.
[0021] Figure 4 It is a structural schematic diagram of the utility model from another angle.
[0022] Figure 5 It is a partial structural schematic diagram of the utility model.
[0023] Figure 6 It is a top view of the utility model.
[0024] Figure 7 It is an AA sectional schematic diagram of the utility model.
[0025] Figure 8 It is a BB sectional schematic diagram of the utility model.
[0026] Fig. 9 It is a cross-sectional schematic diagram of the fan and TEC semiconductor module.
[0027] Fig.10 It is a partial structural schematic diagram of the utility model.
[0028] Fig.11 This is a partial schematic diagram of the exhaust duct.
[0029] Figure numerals: 1. seat cushion body; 2. first hole position; 3. second hole position; 4. control switch; 5. shell; 6. air inlet channel; 7. fan; 8. TEC semiconductor module; 9. ventilation channel; 10. exhaust channel; 11. cooling surface; 12. heat dissipation surface; 13. guide strip; 14. ventilation net; 15. air guide member; 16. air guide decorative member. DETAILED DESCRIPTION
[0030] The utility model is further described in detail below in conjunction with the accompanying drawings.
[0031] The embodiments described with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and cannot be understood as limiting the present application. In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meanings of "several" and "multiple" are two or more, unless otherwise clearly and specifically defined. In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a communication between the two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances. In this application, unless otherwise clearly specified and limited, the first feature "above" or "below" the second feature can include the first and second features being in direct contact, or it can include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, the first feature "above", "above" and "above" the second feature include the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature "below", "below" and "below" the second feature include the first feature being directly above and obliquely above the second feature, or simply means that the first feature is lower in level than the second feature.
[0032] like Figure 1-8As shown, a heating and cooling cushion is provided, comprising: a cushion body 1, wherein the end surface of the cushion body 1 is provided with one or more first holes 2 for circulating ventilation and one or more second holes 3 for circulating ventilation arranged above a fan 7, and a control switch 4 is arranged on the side of the cushion body 1; a shell 5, wherein the shell 5 is arranged at the lower part of the cushion body 1, and the shell 5 and the front end of the cushion body 1 are provided with an air inlet channel 6 for air intake, the right end of the air inlet channel 6 is connected to the fan 7, and the right end of the fan 7 is connected to a TEC semiconductor module 8, the TEC semiconductor module 8 is a single body or multiple, and the air outlet of the TEC semiconductor module 8 is respectively connected to a ventilation channel 9 and an exhaust channel 10, the ventilation channel 9 is communicated with the first hole 2, and the exhaust channel 10 extends to the air outlet at the right end of the cushion body 1 for exhaust; wherein the control switch 4 drives the TEC semiconductor module 8 to work, and the TEC semiconductor module 8 drives cold air or hot air to be transported to the end surface of the cushion body 1 via the ventilation channel 9.
[0033] The heating and cooling seat cushion is applied to electric vehicle seats, bicycle seats, motorcycle seats, sightseeing car seats, golf cart seats and other seats. When applied to electric vehicle seats, the lithium battery of the electric vehicle can be used as a power source, or an independently arranged battery can be used for power supply.
[0034] In practice, an appropriate number of the first hole positions 2 and the second hole positions 3 can be selected according to actual conditions, and this is not limited. During use, the user can turn on the control switch 4 according to their own needs. For example, in summer, the user can turn on the cooling function through the control switch 4, and in winter, the user can turn on the heating function through the control switch 4.
[0035] The TEC semiconductor module 8 is a single unit or multiple units. Multiple units can be selected according to actual needs to improve the cooling function or heating function. There is no restriction on this. In the cooling function, the upper layer of the TEC semiconductor module 8 is the cold surface, and the lower layer of the TEC semiconductor module 8 is the hot surface. The fan 7 drives to generate negative pressure, and the external airflow passes through the air inlet channel 6 and passes through the position of the TEC semiconductor module 8. The upper layer of the TEC semiconductor module 8 is the cold surface. After passing through the cold surface, the external airflow passes through the ventilation channel 9 to the first hole position 2 of the seat cushion end face for cooling. Under the second hole position 3, the cooled external airflow is guided to the TEC semiconductor module 8 under the negative pressure of the fan 7 to participate in the airflow circulation; the lower layer of the TEC semiconductor module 8 is the hot surface. After passing through the hot surface, the external airflow is discharged through the exhaust channel 10 to dissipate heat at the hot surface position, thereby improving the cooling effect.
[0036] When the heating function is used, the upper layer of the TEC semiconductor module 8 becomes the hot surface, and the lower layer becomes the cold surface. The remaining process can refer to the above-mentioned cooling process and will not be described in detail.
[0037] refer to Fig. 9 As shown, the TEC semiconductor module 8 includes a cooling surface 11 and a heat dissipation surface 12 arranged below the cooling surface 11, the cooling surface 11 and the heat dissipation surface 12 are communicated with the fan 7, the cooling surface 11 is communicated with the ventilation channel 9, and the heat dissipation surface 12 is communicated with the exhaust channel 10.
[0038] The cooling surface 11 and the heat dissipation surface 12 of the TEC semiconductor module 8 are arranged in an upper and lower structure, the ventilation channel 9 is connected to the cooling surface 11, and the exhaust channel 10 is connected to the heat dissipation surface 12. The ventilation channel 9 and the exhaust channel 10 are separated. When the cooling function is used, the external airflow is cooled by the cooling surface 11 of the TEC semiconductor module 8 and guided to the first hole position 2 through the ventilation channel 9; the external airflow is cooled by the heat dissipation surface 12 of the TEC semiconductor module 8 and discharged through the exhaust channel 10.
[0039] Reference Figure 5 As shown, the ventilation channel 9 is provided with one or more guide strips 13 , and the guide strips 13 are used to guide cold air or hot air to the first hole position 2 .
[0040] The number of the guide bars 13 is set according to the distribution of the first hole positions 2. The airflow flowing through the cold surface of the TEC semiconductor module 8 is guided to the first hole positions 2 through the guide bars 13, thereby facilitating the cooling of the seat cushion by the refrigerated external airflow.
[0041] Specifically, the second hole position 3 is arranged above the fan 7 , and the fan 7 is provided with an upward opening. The fan 7 is driven to circulate the cold air or hot air from the second hole position 3 to the ventilation passage 9 .
[0042] When the fan 7 is driven, negative pressure is generated. Part of the external airflow enters through the air inlet channel 6, and the other part enters through the second hole 3 above the fan 7. By sucking the airflow from the second hole 3, the cold air or hot air from the second hole 3 can be involved in the circulation, thereby improving the cooling and heating functions.
[0043] like Fig.10 As shown, the utility model further includes a ventilation net 14 for cold air or hot air circulation, and the ventilation net 14 is laid on the first hole position 2 and the second hole position 3. The ventilation net 14 is a hole position evenly distributed on the end surface, which can facilitate hot air or cold air to participate in the circulation, that is, under the action of the ventilation net 14, a part of the cold air or hot air derived from the first hole position 2 enters the fan 7 through the second hole position 3 and participates in the circulation.
[0044] like Fig.11As shown, the utility model includes an air guide member 15 arranged at the air outlet at the right end of the cushion body 1 and an air guide decorative member 16 arranged on the air guide member 15 .
[0045] The control switch 4 includes a composite button and a gear button. The composite button is used to switch between the heating function, the cooling function and the off function. The gear button is used to adjust the heating gear or the cooling gear.
[0046] The control switch 4 can be implemented by independently setting a heating button, a cooling button, a switch button and a gear button. In order to reduce the number of buttons, the heating button, the cooling button and the switch can be compounded, such as being designed to be edited as a switch by a single click, edited as a heating mode by a double click, edited as a cooling mode by a triple click, or a short press for a heating mode, and a long press for a cooling mode. The cooling gear is designed to be a three-gear mode, the first gear is a cooling temperature of 24 degrees and a heating temperature of 45 degrees; the second gear is a cooling temperature of 26 degrees and a heating temperature of 40 degrees; the third gear is a cooling temperature of 28 degrees and a heating temperature of 30 degrees.
[0047] The above does not limit the technical scope of the present invention. Any modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.
Claims
1. A heating and cooling cushion, characterized in that: include: A cushion body, wherein the end surface of the cushion body is provided with at least one first hole for circulating ventilation and at least one second hole for circulating ventilation above the fan, and a control switch is provided on the side of the cushion body; A shell, the shell is arranged at the lower part of the cushion body, the shell and the front end of the cushion body are provided with an air inlet channel for air intake, the right end of the air inlet channel is connected to the fan, the right end of the fan is connected to the TEC semiconductor module, the TEC semiconductor module is a single body or multiple, the air outlet of the TEC semiconductor module is respectively connected to the ventilation channel and the exhaust channel, the ventilation channel is communicated with the first hole, and the exhaust channel extends to the air outlet at the right end of the cushion body for exhaust; The control switch drives the TEC semiconductor module to operate, and the TEC semiconductor module drives cold air or hot air to be delivered to the end surface of the seat cushion body through the ventilation channel.
2. The heating and cooling cushion according to claim 1, characterized in that: The TEC semiconductor module includes a cooling surface and a heat dissipation surface arranged below the cooling surface, the cooling surface and the heat dissipation surface are in communication with the fan, the cooling surface is in communication with the ventilation channel, and the heat dissipation surface is in communication with the exhaust channel.
3. The heating and cooling cushion according to claim 2, characterized in that: The ventilation channel and the exhaust channel are separated and arranged.
4. The heating and cooling cushion according to claim 1, characterized in that: The ventilation channel is provided with one or more guide strips, and the guide strips are used to guide cold air or hot air to the first hole position.
5. The heating and cooling cushion according to claim 1, characterized in that: The second hole is arranged above the fan, and the fan is provided with an upward opening. The fan is driven to circulate the cold air or hot air from the second hole to the ventilation passage.
6. The heating and cooling cushion according to claim 1, characterized in that: It comprises a ventilation net for cold air or hot air circulation, and the ventilation net is laid on the first hole position and the second hole position.
7. The heating and cooling cushion according to claim 1, characterized in that: It comprises an air guide member arranged at the air outlet at the right end of the seat cushion body and an air guide decorative member arranged on the air guide member.
8. The heating and cooling cushion according to claim 1, characterized in that: The control switch includes a compound button and a gear button. The compound button is used to switch between a heating function, a cooling function and an off function. The gear button is used to adjust the heating gear or the cooling gear.