Magnetron sputtering device and magnetron sputtering equipment

Abstract

The utility model provides a magnetron sputtering device and magnetron sputtering equipment, and belongs to the technical field of batteries and magnetron sputtering. The magnetron sputtering device comprises a mounting base, an impeller assembly, a connecting assembly and a magnet assembly, the impeller assembly is rotatably connected with the mounting base, and the connecting assembly is connected with the side, away from the mounting base, of the impeller assembly. The magnet assembly is connected with the side, away from the impeller assembly, of the connecting assembly. The mounting base is provided with a first inlet, and the impeller assembly covers the first inlet and is provided with a first outlet. Under the condition that fluid is injected into the first inlet, the fluid pushes the impeller assembly to rotate, and the fluid flows out of the first outlet. According to the magnetron sputtering device, the magnet assembly can be driven to rotate, the magnetron sputtering device can also be cooled, a rotating assembly and a cooling assembly do not need to be arranged in the magnetron sputtering device at the same time, the number of parts of the magnetron sputtering device is reduced, the size of the magnetron sputtering device is reduced, and the occupied space of the magnetron sputtering device is small.

Description

Technical Field

[0001] The present application relates to the technical field of batteries and magnetron sputtering, and in particular to a magnetron sputtering device and a magnetron sputtering equipment. Background Art

[0002] Energy conservation and emission reduction are the key to the sustainable development of the automobile industry. Electric vehicles have become an important part of the sustainable development of the automobile industry due to their advantages in energy conservation and environmental protection. For electric vehicles, battery technology is an important factor in their development.

[0003] Magnetron sputtering technology is an important technology in the production process of batteries. For example, magnetron sputtering equipment is used to prepare electrode materials, solid electrolytes and diaphragms. Magnetron sputtering equipment generates heat during use, and high temperature may cause damage to the target material. A cooling component is required to cool the magnetron sputtering equipment, which makes the magnetron sputtering equipment larger in size. Utility Model Content

[0004] The present application aims to solve at least one of the technical problems existing in the background technology. To this end, one object of the present application is to provide a magnetron sputtering device and a magnetron sputtering equipment to reduce the volume of the magnetron sputtering device and the magnetron sputtering equipment.

[0005] An embodiment of the first aspect of the present application provides a magnetron sputtering device, which includes: a mounting seat having a first inlet; an impeller assembly rotatably connected to the mounting seat, the impeller assembly cover being provided with a first inlet, and the impeller assembly having a first outlet; a connecting assembly connected to a side of the impeller assembly facing away from the mounting seat; a magnet assembly connected to a side of the connecting assembly away from the impeller assembly; wherein the impeller assembly is configured to, when a fluid is injected into the first inlet, the fluid drives the impeller assembly to rotate, and the fluid flows out from the first outlet.

[0006] In the technical solution of the embodiment of the present application, the magnet assembly is installed on the connecting assembly. During the magnetron sputtering process, a fluid is injected into the first inlet, the fluid drives the impeller assembly to rotate, and the impeller assembly drives the connecting assembly and the magnet assembly to rotate. At the same time, the fluid exchanges heat with the magnetron sputtering device to reduce the temperature of the magnetron sputtering device. That is, the magnetron sputtering device provided in the embodiment of the present application can drive the magnet assembly to rotate, and can also cool the magnetron sputtering device. The magnetron sputtering device can realize the functions of rotation and cooling at the same time, but there is no need to set a rotating assembly and a cooling assembly at the same time in the magnetron sputtering device, which reduces the number of components of the magnetron sputtering device, reduces the volume of the magnetron sputtering device, and occupies less space.

[0007] In some embodiments, the impeller assembly includes: an impeller housing having a second inlet, the second inlet is connected to the first inlet, the first outlet is located in the impeller housing, the impeller housing is connected to the mounting seat, a first mounting space is formed between the impeller housing and the mounting seat, the second inlet and the first outlet are both connected to the first mounting space, and the connecting assembly is located on the side of the impeller housing away from the mounting seat; an impeller is located in the first mounting space; a rotating shaft extends along a first direction, the first direction is parallel to the arrangement direction of the connecting assembly and the magnet assembly, one end of the rotating shaft is rotatably connected to the mounting seat, the middle of the rotating shaft passes through the impeller and is connected to the impeller, and the other end of the rotating shaft passes through the impeller housing and is connected to the connecting assembly. During the magnetron sputtering process, the fluid is injected from the first inlet, the fluid flows to the second inlet through the first inlet, and flows to the first mounting space through the second inlet, the fluid flows in the first mounting space to drive the impeller to rotate, and then flows out from the first outlet. The fluid in the first mounting space and the fluid flowing out from the first outlet can be in contact with other components in the magnetron sputtering device for heat exchange to reduce the temperature of the magnetron sputtering device.

[0008] In some embodiments, the impeller includes a plurality of blades, and the plurality of blades are arranged circumferentially around the rotating shaft, and the rotation direction of the blades and the tilt direction of the blades meet one of the following conditions: the blades tilt in a counterclockwise direction from one end close to the rotating shaft to one end away from the rotating shaft, and the fluid pushes the blades to rotate clockwise; the blades tilt in a clockwise direction from one end close to the rotating shaft to one end away from the rotating shaft, and the fluid pushes the blades to rotate counterclockwise. The tilt direction of the blades is set opposite to the rotation direction of the blades, so that the fluid can more easily push the blades to rotate after flowing out from the second inlet, and it is more labor-saving to control the rotation of the blades.

[0009] In some embodiments, the surface of one side of the mounting seat facing the impeller has a first mounting groove, and the impeller assembly also includes: a first bearing, which is located in the first mounting groove, and one end of the rotating shaft is connected to the inner ring of the first bearing. The mounting seat does not rotate, and the rotating shaft will rotate with the blades. During the rotation of the rotating shaft, there is friction between the mounting seat and the rotating shaft, and the friction will affect the rotation of the rotating shaft, that is, it will affect the rotation of the blades. In an embodiment of the present application, a first bearing is arranged between the mounting seat and the rotating shaft. When the rotating shaft rotates, the mounting seat and the rotating shaft will not be in direct contact, and the inner ring and outer ring of the first bearing rotate with each other. The friction between the inner ring and outer ring of the first bearing is small, which reduces the influence of friction on the rotation of the blades.

[0010] In some embodiments, the surface of the mounting seat facing the impeller has a second mounting groove, the first mounting groove passes through the bottom surface of the second mounting groove, and the impeller assembly further includes: a bearing pressure plate, which is located in the second mounting groove, the rotating shaft passes through the bearing pressure plate, the bearing pressure plate is located on the side of the first bearing close to the impeller, and the bearing pressure plate is connected to the mounting seat. The bearing pressure plate is provided to limit the first bearing in the first mounting groove to prevent the first bearing from falling out of the first mounting groove during rotation, thereby improving the stability of the first bearing and improving the safety of the magnetron sputtering device during operation.

[0011] In some embodiments, the mounting seat includes: a mounting base plate, a first inlet is located at the mounting base plate, and the impeller assembly is rotatably connected to the mounting base plate; a mounting shell is fixedly connected to the mounting base plate, and a second mounting space is formed between the mounting shell and the mounting base plate, and the impeller assembly, the connecting assembly and the magnet assembly are all located in the second mounting space. The mounting seat is set in the form of a mounting base plate and a mounting shell, and the mounting shell can cover the impeller assembly, the connecting assembly and the magnet assembly in the second mounting space formed by the mounting shell and the mounting base plate, that is, the impeller assembly and the connecting assembly are protected to prevent other components from bumping against the impeller assembly, the connecting assembly and the magnet assembly, causing damage to the impeller assembly, the connecting assembly and the magnet assembly, thereby increasing the service life of the magnetron sputtering device 1.

[0012] In some embodiments, the mounting base plate has a second outlet, the second outlet is adjacent to the impeller assembly, and the mounting housing covers the second outlet. During the magnetron sputtering process, a fluid is injected from the first inlet, the fluid flows to the second inlet through the first inlet, and flows to the first installation space through the second inlet. The fluid flows in the first installation space to drive the impeller to rotate, and then the fluid flows out from the first outlet to the second installation space. The fluid contacts other components in the magnetron sputtering device for heat exchange, thereby reducing the temperature of the magnetron sputtering device. After the heat exchange, the fluid is discharged from the second outlet, and the fluid can be continuously injected into the magnetron sputtering device to drive the impeller to rotate, and the magnetron sputtering device is cooled at the same time, so that the entire magnetron sputtering process can be carried out continuously.

[0013] In some embodiments, the mounting housing and the mounting base are sealed and connected, and the magnetron sputtering device further includes: a pipe, which is located in the second mounting space, one end of the pipe is connected to the second outlet, and the other end of the pipe faces the side of the impeller assembly away from the mounting base. After the fluid flows into the second mounting space from the first outlet, it needs to flow to the second outlet through the pipe and be discharged from the second outlet. Since the fluid needs to pass through the pipe to enter the second outlet, the fluid needs to stay in the second mounting space for a longer time, and the heat exchange time between the fluid and the magnetron sputtering device is longer, so that the heat exchange between the fluid and the magnetron sputtering device is more thorough, and the fluid can take away more heat, thereby improving the cooling effect of the magnetron sputtering device.

[0014] In some embodiments, the other end of the pipe is located on the side of the connecting assembly away from the impeller assembly. The magnet assembly is installed on the connecting assembly, and the magnet assembly will generate more heat. In the embodiments of the present application, since the other end of the pipe is located on the side of the connecting assembly away from the impeller assembly, the fluid needs to enter the second outlet from the other end of the pipe, and the liquid level of the fluid in the second installation space needs to be equal to or higher than the height of the fluid from the other end of the pipe before the fluid can enter the second outlet through the other end of the pipe, that is, the fluid in the second installation space can contact the magnet assembly, and the fluid can directly cool the magnet assembly, thereby improving the cooling effect on the magnet assembly.

[0015] In some embodiments, the magnet assembly includes: a yoke connected to the connecting assembly; and a magnet connected to a side of the yoke away from the connecting assembly. The yoke is provided to connect the magnet and the connecting assembly, so as to facilitate the connection between the magnet and the connecting assembly, and can rotate with the magnet assembly when the connecting assembly rotates. At the same time, the yoke can make the magnetic field of the magnet more concentrated, so that more magnetic field can act on the target material, thereby improving the utilization rate of the magnetic field.

[0016] In some embodiments, the magnet includes: a square magnet; and a plurality of circular magnets surrounding the square magnet. The square magnet has opposite magnetic properties to the circular magnet, and the square magnet and the circular magnet form a plurality of annular magnetic fields surrounding the square magnet, which can expand the sputtering area and improve the utilization rate of the target material.

[0017] In some embodiments, the magnetron sputtering device further comprises: a target pressure plate, which is located on a side of the mounting seat away from the impeller assembly, and the target pressure plate is located on a side of the magnet assembly away from the connecting assembly, and the target pressure plate is connected to the mounting seat. The target is located between the target pressure plate and the mounting seat, and the target pressure plate can limit the movement of the target, improve the stability of the target, and improve the safety of the magnetron sputtering device during operation.

[0018] In some embodiments, the magnetron sputtering device further comprises: a fluid flange connected to a side of the mounting seat away from the impeller assembly, the fluid flange having a third inlet and a third outlet, the third inlet being connected to the first inlet, and the third outlet being connected to the first outlet. The fluid flange is provided to facilitate connecting the magnetron sputtering device to the fluid storage device through the third inlet, and connecting the magnetron sputtering device to the fluid waste device through the third outlet, so that fluid can be continuously input into the magnetron sputtering device, and the discharged waste fluid can be stored and then centrally processed.

[0019] In some embodiments, the magnetron sputtering device further comprises: a shielding cover, which is provided with a mounting seat, an impeller assembly, a connecting assembly and a magnet assembly, and the shielding cover is connected to a fluid flange. The shielding cover can shield the sputtering particles and reduce pollution.

[0020] In some embodiments, the magnetron sputtering device further includes: an insulating pad located between the mounting seat and the fluid flange. The material of the fluid flange is generally metal. The insulating pad is arranged between the mounting seat and the fluid flange to reduce the influence of the fluid flange on the magnetron sputtering and improve the safety of the magnetron sputtering device during operation.

[0021] In some embodiments, the magnetron sputtering device further comprises: a mounting flange, the fluid flange passes through the mounting flange, and the mounting flange is located on a side of the fluid flange away from the mounting seat. The mounting flange can be connected to other devices, so as to facilitate the magnetron sputtering device 1 to be connected to other devices.

[0022] An embodiment of the second aspect of the present application provides a magnetron sputtering device, which includes the magnetron sputtering device in the above embodiment; a target material, installed on a mounting seat.

[0023] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0025] Figure 1 A schematic diagram of the structure of a magnetron sputtering device according to some embodiments of the present application;

[0026] Figure 2 An exploded schematic diagram of a magnetron sputtering device according to some embodiments of the present application;

[0027] Figure 3 A partial structural schematic diagram of a magnetron sputtering device according to some embodiments of the present application;

[0028] Figure 4 A partial structural cross-sectional schematic diagram of a magnetron sputtering device according to some embodiments of the present application;

[0029] Figure 5 A bottom view of the impeller and the impeller housing in some embodiments of the present application;

[0030] Figure 6 This is a schematic diagram of the structure of the mounting base of some embodiments of the present application;

[0031] Figure 7 Schematic cross-sectional view of a magnetron sputtering device according to some other embodiments of the present application;

[0032] Figure 8 An exploded diagram of a rotating shaft and a flat key provided in an embodiment of the present application;

[0033] Fig. 9 A cross-sectional view of a magnetron sputtering device provided for some other embodiments of the present application;

[0034] Fig.10 A schematic structural diagram of a magnetron sputtering device provided for some other embodiments of the present application.

[0035] Description of reference numerals:

[0036] 10. Mounting seat; 11. First inlet; 12. First mounting groove; 13. Second mounting groove; 14. Mounting base plate; 141. Second outlet; 142. First sealing groove; 143. First connecting hole; 144. Third connecting hole; 15. Mounting housing; 151. First through hole; 152. Target mounting groove; 153. Second sealing groove; 154. Fourth connecting hole; 16. Second mounting space; 17. Connecting channel; 18. Block; 20. Impeller assembly; 21. First outlet; 22. Impeller housing; 221. Second inlet; 222. First mounting space; 223. Second connecting hole; 23. Impeller; 231. Blade; 2311. First blade; 232. Second keyway; 24. Rotating shaft; 241. First keyway; 25. First bearing; 26. Bearing pressure plate; 261, second bolt; 27, first sleeve; 28, second bearing; 29, second sleeve; 210, third sleeve; 211, flat key; 30, connecting assembly; 31, first bolt; 40, pipeline; 50, magnet assembly; 51, yoke; 511, magnet mounting groove; 52, magnet; 521, square magnet; 522, circular magnet; 60, target pressure plate; 61, second through hole; 62, limiting protrusion; 63, fifth connecting hole; 70, shielding cover; 80, fluid flange; 81, third inlet; 82, third outlet; 90, insulating pad; 91, third through hole; 100, mounting flange; 110, sealing ring; 120, inlet joint; 130, outlet joint; 200, target; 201, target mounting plate; 1, magnetron sputtering device. DETAILED DESCRIPTION

[0037] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0039] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0040] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0041] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0042] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0043] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0044] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0045] At present, from the perspective of market development, the application of power batteries is becoming more and more extensive. Power batteries are not only used in energy storage power systems such as hydropower, thermal power, wind power and solar power stations, but also widely used in electric vehicles such as electric bicycles, electric motorcycles, electric cars, as well as military equipment and aerospace and other fields. With the continuous expansion of the application field of power batteries, the market demand is also constantly expanding.

[0046] Magnetron sputtering is a type of physical vapor deposition that can be used to prepare multiple materials such as metals, semiconductors, and insulators. Battery electrode materials, solid electrolytes, and diaphragms can all be prepared using magnetron sputtering technology. During the magnetron sputtering process, the high temperature of the magnetron sputtering equipment can easily damage the target material. Therefore, a cooling component needs to be set up in the magnetron sputtering equipment to cool the magnetron sputtering equipment. The magnetron sputtering equipment has many components, which results in a larger size of the magnetron sputtering equipment and occupies more space.

[0047] An embodiment of the present application provides a magnetron sputtering device, which can drive the magnet assembly to rotate and also can cool the magnetron sputtering device. The magnetron sputtering device can realize the functions of rotation and cooling at the same time, but there is no need to set a rotating assembly and a cooling assembly at the same time in the magnetron sputtering device, which reduces the number of components of the magnetron sputtering device, reduces the volume of the magnetron sputtering device, and occupies less space.

[0048] The magnetron sputtering device and the battery cells prepared by the magnetron sputtering device disclosed in the embodiments of the present application can be used, but not limited to, in electrical devices such as vehicles, ships or aircraft.

[0049] The present application provides a magnetron sputtering device, Figure 1 Schematic diagram of the structure of the magnetron sputtering device in some embodiments of the present application. Figure 1 The magnetron sputtering device 1 comprises a mounting seat 10, an impeller assembly 20, a connecting assembly 30 and a magnet assembly 50. The impeller assembly 20 is rotatably connected to the mounting seat 10, and the connecting assembly 30 is connected to a side of the impeller assembly 20 that is away from the mounting seat 10. The magnet assembly 50 is connected to a side of the connecting assembly 30 that is away from the impeller assembly 20. Figure 2This is a schematic diagram of an explosion of a magnetron sputtering device according to some embodiments of the present application. Figure 1 and Figure 2 The mounting seat 10 has a first inlet 11, the impeller assembly 20 covers the first inlet 11, and the impeller assembly 20 has a first outlet 21. The impeller assembly 20 is configured to, when a fluid is injected into the first inlet 11, the fluid drives the impeller assembly 20 to rotate, and the fluid flows out from the first outlet 21.

[0050] In the embodiment of the present application, the mounting seat 10 is used to mount the impeller assembly 20 to improve the stability of the impeller assembly 20 .

[0051] Exemplarily, the mounting base 10 may be a plate-shaped structure, a block-shaped structure, a frame-shaped structure, etc., which is not limited in the embodiments of the present application.

[0052] In the embodiment of the present application, the impeller assembly 20 is rotatably connected to the mounting seat 10 , which can be characterized as: a part of the structure of the impeller assembly 20 is rotatably connected to the mounting seat 10 , and the impeller assembly 20 as a whole is rotatably connected to the mounting seat 10 .

[0053] In the embodiment of the present application, the connection assembly 30 is located on a side of the impeller assembly 20 away from the mounting seat 10 , which can be characterized as: the connection assembly 30 and the mounting seat 10 are located on opposite sides of the impeller assembly 20 .

[0054] In the embodiment of the present application, the connection assembly 30 is connected to the impeller assembly 20 , and when the impeller assembly 20 rotates, the connection assembly 30 can rotate along with the impeller assembly 20 .

[0055] In some embodiments of the present application, the connection assembly 30 may be connected to the impeller assembly 20 by bonding.

[0056] In other implementations of this application, see Figure 2 The connecting assembly 30 can be connected to the impeller assembly 20 via a first bolt 31 .

[0057] In the embodiment of the present application, the connection component 30 may be a connection plate or a connection block, etc.

[0058] In some embodiments of the present application, the first inlet 11 is located on a side surface of the mounting base 10 away from the impeller assembly 20. Figure 3 This is a partial structural schematic diagram of a magnetron sputtering device according to some embodiments of the present application. Figure 4 This is a schematic cross-sectional view of a portion of the structure of a magnetron sputtering device according to some embodiments of the present application. Figure 3 and Figure 4 , the first inlet 11 is located on the lower surface of the mounting base 10. In other implementations, the first inlet 11 may be located on the side of the mounting base 10.

[0059] In the embodiment of the present application, the impeller assembly 20 is provided with a first inlet 11 , which can be characterized as: fluid can be input into the impeller assembly 20 through the first inlet 11 .

[0060] In the embodiments of the present application, the fluid may be a liquid or a gas. For example, the fluid may be a coolant or water, or the fluid may be cold air.

[0061] In the embodiment of the present application, the side surface of the connecting assembly 30 away from the impeller assembly 20 can be used to install the magnet assembly 50. That is, when the impeller assembly 20 rotates, the connecting assembly 30 can drive the magnet assembly 50 to rotate with the impeller assembly 20.

[0062] In the magnetron sputtering device provided in the embodiment of the present application, the magnet assembly 50 is installed on the connecting assembly 30. During the magnetron sputtering process, a fluid is injected into the first inlet 11, and the fluid drives the impeller assembly 20 to rotate, and the impeller assembly 20 drives the connecting assembly 30 and the magnet assembly 50 to rotate. At the same time, the fluid exchanges heat with the magnetron sputtering device to reduce the temperature of the magnetron sputtering device. That is, the magnetron sputtering device 1 provided in the embodiment of the present application can drive the magnet assembly 50 to rotate, and can also cool the magnetron sputtering device. The magnetron sputtering device 1 can realize the functions of rotation and cooling at the same time, but there is no need to set a rotating assembly and a cooling assembly at the same time in the magnetron sputtering device, which reduces the number of components of the magnetron sputtering device, reduces the volume of the magnetron sputtering device, and occupies less space.

[0063] In the related art, during magnetron sputtering, the magnet assembly is fixed, that is, the magnet assembly does not rotate, the sputtered area on the target is small, and the utilization rate of the target is low. In the embodiment of the present application, the impeller assembly 20 drives the connecting assembly 30 and the magnet assembly 50 to rotate. During the rotation of the magnet assembly 50, the sputtered area on the target changes, thereby increasing the sputtered area on the target and improving the utilization rate of the target.

[0064] According to some embodiments of the present application, see Figure 2 and Figure 4 The impeller assembly 20 includes an impeller housing 22, an impeller 23 and a rotating shaft 24. The impeller housing 22 is connected to the mounting seat 10, and a first mounting space 222 is formed between the impeller housing 22 and the mounting seat 10. The impeller 23 is located in the first mounting space 222. The rotating shaft 24 extends along the first direction Z. One end of the rotating shaft 24 is rotatably connected to the mounting seat 10. The middle of the rotating shaft 24 passes through the impeller 23 and is connected to the impeller 23. The other end of the rotating shaft 24 passes through the impeller housing 22 and is fixedly connected to the connecting assembly 30. Figure 1 , Figure 3 and Figure 4The first outlet 21 is located in the impeller housing 22, the impeller housing 22 has a second inlet 221, the second inlet 221 and the first outlet 21 are both connected to the first installation space 222, the second inlet 221 is connected to the first inlet 11, the connecting component 30 is located on the side of the impeller housing 22 away from the mounting seat 10, and the first direction Z is parallel to the arrangement direction of the connecting component 30 and the magnet assembly 50.

[0065] In an embodiment of the present application, the impeller housing 22 may be a hollow structure with one end open, and the open end of the impeller housing 22 is connected to the mounting seat 10 so that a first mounting space 222 may be formed between the impeller housing 22 and the mounting seat 10 .

[0066] In the embodiment of the present application, the middle of the rotating shaft 24 passes through the impeller 23 and is connected to the impeller 23. When the impeller 23 rotates, the rotating shaft 24 also rotates. It can be understood that the impeller 23 rotates with the central axis of the rotating shaft 24 as the central axis. The impeller 23 includes a plurality of blades. During the rotation of the impeller 23, the plurality of blades rotate around the central axis. In the embodiment of the present application, the fluid enters the first installation space 222 from the second inlet 221 to drive the blades to rotate.

[0067] In the embodiment of the present application, during the magnetron sputtering process, a fluid is injected from the first inlet 11, the fluid flows to the second inlet 221 through the first inlet 11, and flows to the first installation space 222 through the second inlet 221, the fluid flows in the first installation space 222 to drive the impeller 23 to rotate, and then flows out from the first outlet 21. The fluid in the first installation space 222 and the fluid flowing out from the first outlet 21 can both contact with other components in the magnetron sputtering device for heat exchange, thereby reducing the temperature of the magnetron sputtering device.

[0068] Figure 5 This is a bottom view of the impeller and impeller housing in some embodiments of the present application. Figure 5 The impeller 23 includes a plurality of blades 231. Figure 2 and Figure 5 , a plurality of blades 231 are arranged circumferentially around the rotating shaft 24. According to some embodiments of the present application, the rotation direction of the blades 231 and the tilt direction of the blades 231 satisfy one of the following conditions:

[0069] The blade 231 is inclined in a counterclockwise direction from one end close to the rotating shaft 24 to the other end far away from the rotating shaft 24, and the fluid pushes the blade 231 to rotate clockwise;

[0070] The blade 231 is inclined in a clockwise direction from one end close to the rotating shaft 24 to the other end far from the rotating shaft 24 , and the fluid pushes the blade 231 to rotate counterclockwise.

[0071] In the embodiment of the present application, the number of blades 231 included in the impeller 23 is not limited. For example, the impeller 23 may include 10 blades 231 ; or the impeller 23 may include 12 blades 231 .

[0072] In some embodiments of the present application, the plurality of blades 231 may be evenly spaced and circumferentially arranged around the rotating shaft 24. In other embodiments of the present application, the plurality of blades 231 may be arranged circumferentially around the rotating shaft 24 at different intervals, which is not limited in the embodiments of the present application.

[0073] Exemplarily, the plurality of blades 231 include a first blade 2311. Figure 5 The first blade 2311 is the blade that the fluid flowing out of the second inlet 221 first contacts. Along the flow direction of the fluid, the first blade 2311 is located downstream of the second inlet 221. The first blade 2311 tilts toward the second inlet 221 from the end close to the rotation axis 24 to the end away from the rotation axis 24, that is, the first blade 2311 tilts in the counterclockwise direction, and the flow direction of the fluid is clockwise. In other implementations, the first blade 2311 may also tilt in the clockwise direction, and the flow direction of the fluid is counterclockwise.

[0074] In the embodiment of the present application, the inclination direction of the blade 231 is set opposite to the rotation direction of the blade 231, so that the fluid can more easily push the blade 231 to rotate after flowing out from the second inlet 221, and controlling the rotation of the blade 231 is more labor-saving.

[0075] In an embodiment of the present application, when the flow rate of the fluid is fast, the rotation speed of the blade 231 is fast when the fluid pushes the blade 231 to rotate, and when the flow rate of the fluid is slow, the rotation speed of the blade 231 is slow when the fluid pushes the blade 231 to rotate. Therefore, the rotation speed of the blade 231 can be controlled by controlling the flow rate of the injected fluid, thereby controlling the rotation speed of the magnetic field.

[0076] See also Figure 5 , the fluid flowing out of the first outlet 21 pushes the blade 231 to rotate clockwise, and at the same time, the blade 231 drives the fluid to rotate clockwise, and when the fluid rotates to the first outlet 21, it flows out from the first outlet 21. Figure 5 The arrows in the middle indicate the flow direction of the fluid.

[0077] According to some embodiments of the present application, Figure 6 This is a schematic diagram of the structure of the mounting base of some embodiments of the present application. Figure 4 and Figure 6 The side surface of the mounting seat 10 facing the impeller 23 has a first mounting groove 12 . The impeller assembly 20 also includes a first bearing 25 . The first bearing 25 is located in the first mounting groove 12 . One end of the rotating shaft 24 is connected to the inner ring of the first bearing 25 .

[0078] In the embodiment of the present application, the shape of the first installation groove 12 matches the shape of the first bearing 25 , so that the first bearing 25 can be placed in the first installation groove 12 .

[0079] During magnetron sputtering, the mounting seat 10 does not rotate, and the rotating shaft 24 rotates with the blade 231. During the rotation of the rotating shaft 24, there is friction between the mounting seat 10 and the rotating shaft 24, and the friction will affect the rotation of the rotating shaft 24, that is, it will affect the rotation of the blade 231. In the embodiment of the present application, a first bearing 25 is arranged between the mounting seat 10 and the rotating shaft 24. When the rotating shaft 24 rotates, the mounting seat 10 and the rotating shaft 24 will not be in direct contact, and the inner ring and the outer ring of the first bearing 25 rotate with each other. The friction between the inner ring and the outer ring of the first bearing 25 is small, which reduces the influence of the friction on the rotation of the blade 231.

[0080] According to some embodiments of the present application, Figure 4 and Figure 6 The side surface of the mounting seat 10 facing the impeller 23 has a second mounting groove 13, and the first mounting groove 12 passes through the bottom surface of the second mounting groove 13. Figure 2 and Figure 4 The impeller assembly 20 also includes a bearing pressure plate 26, which is located in the second mounting groove 13, and the rotating shaft 24 passes through the bearing pressure plate 26. The bearing pressure plate 26 is located on the side of the first bearing 25 close to the impeller 23, and the bearing pressure plate 26 is connected to the mounting seat 10.

[0081] In an embodiment of the present application, the first bearing 25 and the bearing pressure plate 26 are arranged along the first direction Z, the orthographic projection of the first bearing 25 on the first projection plane is located within the orthographic projection of the bearing pressure plate 26 on the first projection plane and does not completely overlap, and the first projection plane is perpendicular to the first direction Z.

[0082] In the embodiment of the present application, the shape of the second mounting groove 13 matches the shape of the bearing pressure plate 26, so that the bearing pressure plate 26 can be placed in the second mounting groove 13. In the embodiment of the present application, the first mounting groove 12 passes through the bottom surface of the second mounting groove 13, so that the second mounting groove 13 is connected to the first mounting groove 12.

[0083] See also Figure 2 The bearing pressure plate 26 can be connected to the mounting seat 10 by a second bolt 261 .

[0084] Figure 7 Schematic cross-sectional view of a magnetron sputtering device according to some other embodiments of the present application. Figure 2 , Figure 4 and Figure 7The impeller assembly 20 also includes a first sleeve 27, which is sleeved on the rotating shaft 24. The first sleeve 27 is located between the first bearing 25 and the impeller 23. The thickness of the first sleeve 27 along the first direction Z is greater than the thickness of the bearing pressure plate 26 along the first direction Z, so that there is no direct contact between the bearing pressure plate 26 and the impeller 23, thereby reducing the friction force borne by the impeller 23 and reducing the wear of the impeller 23 due to friction.

[0085] In an embodiment of the present application, a bearing pressure plate 26 is provided to limit the first bearing 25 in the first mounting groove 12 to prevent the first bearing 25 from escaping from the first mounting groove 12 during rotation, thereby improving the stability of the first bearing 25 and improving the safety of the magnetron sputtering device during operation.

[0086] In the embodiments of the present application, Figure 2 , Figure 4 and Figure 7 The impeller assembly 20 further includes a second bearing 28, which is sleeved on the rotating shaft 24. The rotating shaft 24 is connected to the inner ring of the second bearing 28, and the second bearing 28 is located between the impeller housing 22 and the rotating shaft 24. During the magnetron sputtering process, the impeller housing 22 does not rotate, and the rotating shaft 24 will rotate with the blades 231. During the rotation of the rotating shaft 24, there is friction between the impeller housing 22 and the rotating shaft 24, and the friction will affect the rotation of the rotating shaft 24, that is, it will affect the rotation of the blades 231. In the embodiment of the present application, the second bearing 28 is arranged between the impeller housing 22 and the rotating shaft 24. When the rotating shaft 24 rotates, the impeller housing 22 and the rotating shaft 24 will not directly contact each other, and the inner ring and outer ring of the second bearing 28 rotate with each other. The friction between the inner ring and the outer ring of the second bearing 28 is small, which reduces the influence of the friction on the rotation of the blades 231.

[0087] In the embodiment of the present application, both ends of the rotating shaft 24 are respectively connected to the first bearing 25 and the second bearing 28 , so that the rotating shaft 24 is more stable when rotating.

[0088] In the embodiments of the present application, Figure 2 , Figure 4 and Figure 7 The impeller assembly 20 also includes a second sleeve 29, which is sleeved on the rotating shaft 24. The second sleeve 29 is located between the second bearing 28 and the impeller 23. The second sleeve 29 prevents direct contact between the second bearing 28 and the impeller 23, thereby reducing the friction force on the impeller 23 and reducing the wear of the impeller 23 due to friction.

[0089] In the embodiments of the present application, Figure 2 , Figure 4 and Figure 7The impeller assembly 20 also includes a third sleeve 210, which is sleeved on the rotating shaft 24. The second sleeve 29 is located between the second bearing 28 and the connecting assembly 30. The second sleeve 29 eliminates direct contact between the second bearing 28 and the connecting assembly 30, thereby reducing the friction force borne by the connecting assembly 30 and reducing the wear of the connecting assembly 30 due to friction.

[0090] In the examples of this application, see Figure 2 The impeller assembly 20 further includes a flat key 211, Figure 8 This is an exploded view of a rotating shaft and a flat key provided in an embodiment of the present application. Figure 8 The rotating shaft 24 has a first keyway 241, see Figure 5 The impeller 23 has a second keyway 232, the first keyway 241 and the second keyway 232 are opposite, a part of the flat key 211 is located in the first keyway 241, and the other part of the flat key 211 is located in the second keyway 232. The flat key 211 can block the mutual rotation between the rotating shaft 24 and the impeller 23, so that the rotating shaft 24 can rotate with the impeller 23.

[0091] According to some embodiments of the present application, see Figure 6 and Figure 7 The mounting base 10 includes a mounting base plate 14 and a mounting housing 15. The first inlet 11 is located on the mounting base plate 14, the impeller assembly 20 is rotatably connected to the mounting base plate 14, the mounting housing 15 is fixedly connected to the mounting base plate 14, and a second mounting space 16 is formed between the mounting housing 15 and the mounting base plate 14, and the impeller assembly 20, the connecting assembly 30 and the magnet assembly 50 are all located in the second mounting space 16.

[0092] In the embodiments of the present application, the shape of the board surface of the mounting base plate 14 can be circular, square, or any other regular or irregular shape, and the embodiments of the present application are not limited thereto.

[0093] In an embodiment of the present application, the mounting shell 15 may be a hollow structure with one end open, and the open end of the mounting shell 15 is connected to the mounting base plate 14 so that a second mounting space 16 may be formed between the mounting shell 15 and the mounting base plate 14 .

[0094] In the embodiment of the present application, the first mounting groove 12 and the second mounting groove 13 are both located on the mounting base plate 14 , and the mounting shell 15 also covers the first mounting groove 12 and the second mounting groove 13 .

[0095] In an embodiment of the present application, the mounting base 10 is configured to be in the form of a mounting base plate 14 and a mounting shell 15. The mounting shell 15 can cover the impeller assembly 20, the connecting assembly 30 and the magnet assembly 50 in a second mounting space 16 formed by the mounting shell 15 and the mounting base plate 14, that is, the impeller assembly 20, the connecting assembly 30 and the magnet assembly 50 are protected to prevent other components from colliding with the impeller assembly 20, the connecting assembly 30 and the magnet assembly 50, causing damage to the impeller assembly 20, the connecting assembly 30 and the magnet assembly 50, thereby increasing the service life of the magnetron sputtering device 1.

[0096] According to some embodiments of the present application, see Figure 2 , Figure 3 , Figure 4 , Figure 6 and Figure 7 The mounting base plate 14 has a second outlet 141 , the second outlet 141 is adjacent to the impeller assembly 20 , and the mounting housing 15 covers the second outlet 141 .

[0097] In the embodiment of the present application, the second outlet 141 is adjacent to the impeller assembly 20, that is, the second outlet 141 is located outside the first installation space 222. The installation housing 15 covers the second outlet 141, that is, the second outlet 141 is located inside the second installation space 16.

[0098] In the embodiment of the present application, the second outlet 141 can be connected to a fluid waste device.

[0099] In an embodiment of the present application, during the magnetron sputtering process, a fluid is injected from the first inlet 11, the fluid flows to the second inlet 221 through the first inlet 11, and flows to the first installation space 222 through the second inlet 221, the fluid flows in the first installation space 222 to drive the impeller 23 to rotate, and then the fluid flows out from the first outlet 21 to the second installation space 16. The fluid contacts other components in the magnetron sputtering device for heat exchange, thereby reducing the temperature of the magnetron sputtering device. After the heat exchange, the fluid is discharged from the second outlet 141, and the fluid can be continuously injected into the magnetron sputtering device to drive the impeller 23 to rotate, and the magnetron sputtering device is cooled at the same time, so that the entire magnetron sputtering process can be carried out continuously.

[0100] According to some embodiments of the present application, the mounting housing 15 and the mounting base plate 14 are sealed and connected. Figure 1 , Figure 2 and Figure 7 The magnetron sputtering device 1 further includes a pipe 40 , which is located in the second installation space 16 , one end of the pipe 40 is connected to the second outlet 141 , and the other end of the pipe 40 faces the side of the impeller assembly 20 away from the installation base plate 14 .

[0101] In the embodiment of the present application, the mounting housing 15 and the mounting base plate 14 can be connected by bolts, see Figure 7 A sealing ring 110 may be provided between the mounting shell 15 and the mounting base plate 14 to achieve a sealed connection between the mounting shell 15 and the mounting base plate 14 .

[0102] For example, see Figure 6 A first sealing groove 142 is provided on one side where the mounting base plate 14 is connected to the mounting housing 15 , and the sealing ring 110 is located in the first sealing groove 142 .

[0103] In the related art, a rotating assembly and a cooling assembly are simultaneously provided in a magnetron sputtering device, and more components for sealing need to be provided. In the embodiments of the present application, a rotating assembly and a cooling assembly do not need to be simultaneously provided in the magnetron sputtering device, fewer components for sealing are provided in the magnetron sputtering device, and the structure of the magnetron sputtering device is simpler, thereby reducing the cost of manufacturing the magnetron sputtering device and also reducing the risk of sealing failure.

[0104] For example, when installing the magnetron sputtering device 1, the impeller assembly 20 can be connected to the mounting base plate 14 first, and then the connecting assembly 30 can be connected to the impeller assembly 20, and then the magnet assembly 50 can be installed on the connecting assembly 30, and then the mounting shell 15 and the mounting base plate 14 can be connected.

[0105] In the examples of this application, see Figure 6 The surface where the mounting base plate 14 is connected to the impeller housing 22 has a first connecting hole 143, see Figure 5 The surface where the impeller housing 22 is connected to the mounting base plate 14 has a second connection hole 223, and the mounting base plate 14 and the impeller housing 22 can be connected through the first connection hole 143 and the second connection hole 223. Exemplarily, the second connection hole 223 has an internal thread, and a bolt passes through the first connection hole 143 and is threadedly connected to the second connection hole 223.

[0106] In the examples of this application, see Figure 6 The surface where the mounting base plate 14 is connected to the mounting shell 15 has a third connection hole 144, and the surface where the mounting shell 15 is connected to the mounting base plate 14 has a connection hole (not shown in the drawings). The mounting base plate 14 and the mounting shell 15 can be connected through the third connection hole 144 and the connection hole on the mounting shell 15. Exemplarily, the connection hole on the mounting shell 15 has an internal thread, and the bolt passes through the third connection hole 144 and is threadedly connected to the connection hole on the mounting shell 15.

[0107] In the embodiment of the present application, the pipe 40 may extend along the first direction Z.

[0108] In some embodiments of the present application, the second outlet 141 may have an internal thread, one end of the pipe 40 may have an external thread, and the pipe 40 is threadedly connected to the second outlet 141; or one end of the pipe 40 is connected to the second outlet 141 through a connecting flange.

[0109] In the embodiment of the present application, after the fluid flows into the second installation space 16 from the first outlet 21, it needs to flow to the second outlet 141 through the pipe 40 and be discharged from the second outlet 141. Since the fluid needs to enter the second outlet 141 through the pipe 40, the fluid needs to stay in the second installation space 16 for a longer time, and the heat exchange time between the fluid and the magnetron sputtering device is longer, so that the heat exchange between the fluid and the magnetron sputtering device is more thorough, and the fluid can take away more heat, thereby improving the cooling effect of the magnetron sputtering device.

[0110] exist Figure 4 and Figure 7 In the figure, the straight line with an arrow indicates the flow direction of the fluid.

[0111] According to some embodiments of the present application, see Figure 7 The other end of the pipeline 40 is located on the side of the connecting assembly 30 away from the impeller assembly 20.

[0112] In the embodiment of the present application, the fluid enters the second outlet 141 from the other end of the pipeline 40 .

[0113] During the magnetron sputtering process, the magnet assembly 50 is installed on the connecting assembly 30, and the magnet assembly 50 will generate more heat. In the embodiment of the present application, since the other end of the pipe 40 is located on the side of the connecting assembly 30 away from the impeller assembly 20, the fluid needs to enter the second outlet 141 from the other end of the pipe 40, and the fluid level in the second installation space 16 needs to be equal to or higher than the height of the fluid from the other end of the pipe 40 before the fluid can enter the second outlet 141 through the other end of the pipe 40, that is, the fluid in the second installation space 16 can contact the magnet assembly 50, and the fluid can directly cool the magnet assembly 50, thereby improving the cooling effect on the magnet assembly 50.

[0114] According to some embodiments of the present application, the first inlet 11 passes through opposite sides of the mounting seat 10 along the first direction Z, and the orthographic projections of the opposite ends of the first inlet 11 on the first projection plane do not overlap at all, and the first projection plane is perpendicular to the first direction Z. One end of the first inlet 11 that is connected to the second inlet 221 is close to the outside, and the other end of the first inlet 11 is close to the inside. In some embodiments of the present application, the extension direction of the first inlet 11 may intersect with the first direction Z, so that the orthographic projections of the opposite ends of the first inlet 11 on the first projection plane do not overlap at all. In other embodiments of the present application, the mounting seat 10 further has a connecting channel 17, the extension direction of the connecting channel 17 intersects with the extension direction of the first inlet 11, and the connecting channel 17 is connected to the middle part of the first inlet 11 along the first direction Z, so that the orthographic projections of the opposite ends of the first inlet 11 on the first projection plane do not overlap at all.

[0115] According to other embodiments of the present application, the first inlet 11 passes through a side of the mounting seat 10 close to the impeller assembly along a first direction Z, and the mounting seat 10 also has a connecting channel, the extension direction of the connecting channel intersects with the extension direction of the first inlet 11, and the connecting channel is connected to an end of the first inlet 11 away from the impeller assembly 20.

[0116] In some embodiments of the present application, the arrangement of the second outlet 141 may be the same as that of the first inlet 11, for example, the middle of the second outlet 141 is connected to the connecting passage 17. In other embodiments of the present application, the arrangement of the second outlet 141 may be different from that of the first inlet 11, and the embodiments of the present application are not limited thereto.

[0117] In the embodiment of the present application, one end of the communication channel 17 passes through the side of the mounting seat 10 to facilitate the manufacture of the communication channel 17. Figure 6 and Figure 7 One end of the connecting channel 17 that passes through the side of the mounting seat 10 is provided with a blocking block 18, and the blocking block 18 blocks the one end of the connecting channel 17 that passes through the side of the mounting seat 10, so that the fluid flowing into the connecting channel 17 will not leak through the open end of the connecting channel 17, and more fluid flows to the second inlet 221 through the connecting channel 17.

[0118] According to some embodiments of the present application, see Figure 1 , Figure 2 and Figure 7 The magnet assembly 50 includes a yoke 51 and a magnet 52. The yoke 51 is connected to the connecting assembly 30, and the magnet 52 is connected to a side of the yoke 51 away from the connecting assembly 30.

[0119] The yoke 51 usually does not generate a magnetic field itself, but plays a role in transmitting magnetic lines of force in the magnetic circuit.

[0120] Exemplarily, the material of the yoke 51 may include soft iron or soft magnetic alloy.

[0121] In the embodiment of the present application, a yoke 51 is provided to connect the magnet 52 and the connecting assembly 30, so as to facilitate the connection between the magnet 52 and the connecting assembly 30, and the magnet assembly 50 can be rotated when the connecting assembly 30 rotates. At the same time, the yoke 51 can make the magnetic field of the magnet 52 more concentrated, so that more magnetic field can act on the target material, thereby improving the utilization rate of the magnetic field.

[0122] For example, the yoke 51 is bonded to the connection assembly 30 or connected by bolts, see Figure 2 The yoke 51 has a magnet mounting groove 511 that matches the shape of the magnet 52 , and the magnet 52 is placed in the magnet mounting groove 511 .

[0123] According to some embodiments of the present application, see Figure 1 and Figure 2 The magnet 52 includes a square magnet 521 and a plurality of circular magnets 522 , and the plurality of circular magnets 522 surround the square magnet 521 .

[0124] In the embodiment of the present application, the square magnet 521 may be a rectangular parallelepiped magnet, and the circular magnet 522 may be a cylindrical magnet.

[0125] In the embodiment of the present application, the square magnet 521 and the circular magnet 522 have opposite magnetism, and the square magnet 521 and the circular magnet 522 form a plurality of annular magnetic fields around the square magnet 521 , which can expand the sputtering area and improve the utilization rate of the target material.

[0126] According to some embodiments of the present application, see Figure 7 The magnetron sputtering device 1 also includes a target pressing plate 60, which is located on a side of the mounting seat 10 away from the impeller assembly 20, and the target pressing plate 60 is located on a side of the connecting assembly 30 away from the impeller assembly 20, and the target pressing plate 60 is connected to the mounting seat 10.

[0127] In the embodiment of the present application, the target 200 is mounted on the mounting seat 10 , and the target 200 is located on a side of the magnet assembly 50 away from the connecting assembly 30 . Exemplarily, the target 200 is mounted on the mounting housing 15 .

[0128] In the examples of this application, see Figure 6 and Figure 7 A surface of the mounting housing 15 facing away from the magnet assembly 50 has a target mounting groove 152 , and the target 200 is mounted in the target mounting groove 152 .

[0129] For example, see Figure 7 The target 200 can be installed in the target mounting groove 152 through the target mounting plate 201.

[0130] In the examples of this application, see Figure 6 The mounting shell 15 has a first through hole 151, which passes through the bottom surface of the target mounting groove 152, so that the interval between the target 200 installed later and the magnet assembly 50 is reduced, so that more magnetic field of the magnet assembly 50 acts on the target 200.

[0131] For example, the target mounting plate 201 is located in the target mounting groove 152, and the target 200 is located on the side of the target mounting plate 201 away from the magnet assembly 50. Then, the target pressing plate 60 is placed on the side of the target 200 away from the target mounting plate 201, and the target pressing plate 60 is connected to the mounting housing 15. The target pressing plate 60 and the mounting housing 15 sandwich the target 200 and the target mounting plate 201 therebetween, thereby achieving the installation of the target 200.

[0132] In the examples of this application, see Figure 6 The mounting shell 15 also has an annular second sealing groove 153, which surrounds the first through hole 151 and penetrates the bottom surface of the target mounting groove 152. A sealing ring 110 is provided in the second sealing groove 153, thereby improving the sealing performance of the second mounting space 16 and reducing the possibility of fluid flowing out from the gap between the mounting shell 15 and the target mounting plate 201.

[0133] In the examples of this application, see Figure 7 The target pressing plate 60 has a second through hole 61, which is opposite to the target 200, so that the target 200 can be exposed through the second through hole 61. The inner side wall of the second through hole 61 has a limiting protrusion 62, which extends toward the inner side of the second through hole 61. The limiting protrusion 62 is located on the side of the target 200 away from the target mounting plate 201. The limiting protrusion 62 is used to limit the target 200 to prevent the target 200 from falling out of the second through hole 61.

[0134] In an embodiment of the present application, the limiting protrusion 62 may surround the opening of the second through hole 61 , or the target pressing plate 60 includes a plurality of limiting protrusions 62 arranged at intervals around the opening of the second through hole 61 .

[0135] In the examples of this application, see Figure 6 and Figure 7The surface of the mounting shell 15 facing the target pressing plate 60 has a plurality of fourth connection holes 154, and the plurality of fourth connection holes 154 surround the opening of the first through hole 151. The surface of the target pressing plate 60 facing the target pressing plate 60 has a plurality of fifth connection holes 63 corresponding to the fourth connection holes 154, and the plurality of fifth connection holes 63 surround the opening of the second through hole 61. The mounting shell 15 and the target pressing plate 60 are connected through the plurality of fourth connection holes 154 and the plurality of fifth connection holes 63. Exemplarily, the fourth connection hole 154 has an internal thread, and a bolt passes through the fifth connection hole 63 and is threadedly connected to the fourth connection hole 154, thereby connecting the mounting shell 15 and the target pressing plate 60.

[0136] In the embodiment of the present application, the target material is located between the target material pressing plate 60 and the mounting seat 10. The target material pressing plate 60 can limit the movement of the target material, improve the stability of the target material, and improve the safety of the magnetron sputtering device during operation.

[0137] According to some embodiments of the present application, Fig. 9 A cross-sectional view of a magnetron sputtering device provided in some other embodiments of the present application. Fig. 9 The magnetron sputtering device also includes a fluid flange 80, which is connected to the side of the mounting seat 10 away from the impeller assembly 20. The fluid flange 80 has a third inlet 81 and a third outlet 82. The third inlet 81 is connected to the first inlet 11, and the third outlet 82 is connected to the first outlet 21.

[0138] In the examples of this application, see Fig. 9 The magnetron sputtering device may further include an inlet connector 120 and an outlet connector 130 , wherein the inlet connector 120 is connected to the third inlet 81 , and the outlet connector 130 is connected to the third outlet 82 .

[0139] For example, the inlet connector 120 or the outlet connector 130 may be connected to a speed regulating valve for adjusting the speed at which the fluid flows in or out.

[0140] In the embodiment of the present application, the third outlet 82 may be directly connected to the first outlet 21 ; or the first outlet 21 may be indirectly connected to the third outlet 82 via the pipeline 40 and the second outlet 141 .

[0141] In the embodiment of the present application, the third inlet 81 may be in communication with a fluid storage device, and the outlet connector 130 may be in communication with a fluid waste device.

[0142] For example, the inlet connector 120 or the outlet connector 130 may be connected to a speed regulating valve for adjusting the speed at which the fluid flows in or out.

[0143] In an embodiment of the present application, a fluid flange 80 is provided to facilitate connecting the magnetron sputtering device with the fluid storage device through the third inlet 81, and connecting the magnetron sputtering device with the fluid waste device through the third outlet 82. The fluid can be continuously input into the magnetron sputtering device, and the discharged waste fluid can be stored and centrally processed.

[0144] According to some embodiments of the present application, Fig.10 This is a schematic diagram of the structure of a magnetron sputtering device provided in some other embodiments of the present application. Fig. 9 and Fig.10 The magnetron sputtering device further includes a shielding cover 70 , which covers the mounting seat 10 , the impeller assembly 20 , the connecting assembly 30 and the magnet assembly 50 , and the shielding cover 70 is connected to the fluid flange 80 .

[0145] In the embodiment of the present application, the fluid flange 80 has an external thread, the shielding cover 70 has an internal thread, and the shielding cover 70 and the fluid flange 80 can be connected by threads.

[0146] Magnetron sputtering is to increase the sputtering rate by introducing a magnetic field on the cathode surface of the target material and using the magnetic field to constrain charged particles to increase the plasma density. Under the action of the electric field, electrons collide with argon atoms in the process of flying toward the substrate, ionizing them to produce Ar + and new electrons. The new electrons fly to the substrate, Ar + Under the action of the electric field, it is accelerated to fly toward the cathode target material, and the target surface is bombarded with high energy, causing the target material to sputter. During the sputtering process, some electrons and negative ions enter the anode, some positive ions enter the cathode, and some charged particles collide with the wall of the device and recombine. These particles that recombine with the wall seriously pollute the cavity of the magnetron chamber. When the sputtering experiment is repeated again, the sputtering substrate and target material will be polluted again. Since the structure of the magnetron chamber is relatively complex, cleaning is troublesome and cannot be cleaned completely. Therefore, it is necessary to protect the sputtering target material, shield the charged particles, and avoid or reduce the impact of charged ions on the magnetron chamber during the sputtering process.

[0147] In the embodiment of the present application, the shielding cover 70 can shield the sputtered particles and reduce pollution.

[0148] According to some embodiments of the present application, see Fig. 9 The magnetron sputtering device further includes an insulating pad 90 , which is located between the mounting seat 10 and the fluid flange 80 .

[0149] In the embodiment of the present application, the insulating pad 90 is located between the mounting base 14 and the fluid flange 80 .

[0150] In the examples of this application, see Fig. 9The insulating pad 90 has a third through hole 91 , and the third through hole 91 is used to connect the third inlet 81 with the first inlet 11 , and to connect the third outlet 82 with the second outlet 141 .

[0151] In the embodiment of the present application, a sealing ring 110 is provided between the insulating pad 90 and the mounting base 14, and between the insulating pad 90 and the fluid flange 80. Exemplarily, one sealing ring 110 surrounds one third through hole 91 or one surrounds two third through holes 91.

[0152] exist Fig. 9 In the figure, the straight line with an arrow indicates the flow direction of the fluid.

[0153] In the embodiment of the present application, the material of the fluid flange 80 is generally metal, and an insulating pad 90 is arranged between the mounting seat 10 and the fluid flange 80 to reduce the influence of the fluid flange 80 on magnetron sputtering and improve the safety of the magnetron sputtering device during operation.

[0154] According to some embodiments of the present application, see Fig. 9 and Fig.10 The magnetron sputtering device further includes a mounting flange 100 , the fluid flange 80 passes through the mounting flange 100 , and the mounting flange 100 is located on a side of the mounting seat 10 close to the fluid flange 80 .

[0155] In the embodiment of the present application, the mounting flange 100 is sleeved on the fluid flange 80 .

[0156] In some embodiments of the present application, an insulating gasket 90 is also provided between the mounting flange 100 and the fluid flange 80 .

[0157] In the embodiment of the present application, the mounting flange 100 can be connected to other devices, so as to facilitate the connection of the magnetron sputtering device 1 with other devices.

[0158] An embodiment of the present application further provides a magnetron sputtering device, which includes the magnetron sputtering apparatus of any one of the above embodiments and a target material 200 , wherein the target material 200 is mounted on a mounting seat 10 .

[0159] An embodiment of the present application provides a magnetron sputtering device, wherein the magnetron sputtering device 1 includes a mounting seat 10, an impeller assembly 20, a connecting assembly 30, a pipeline 40, a magnet assembly 50, a target material pressing plate 60, a shielding cover 70, a fluid flange 80, an insulating pad 90, and a mounting flange 100.

[0160] The mounting base 10 includes a mounting base plate 14 and a mounting shell 15. The mounting shell 15 is sealed and connected to the mounting base plate 14. A second mounting space 16 is formed between the mounting shell 15 and the mounting base plate 14. The impeller assembly 20, the connecting assembly 30 and the magnet assembly 50 are all located in the second mounting space 16. The mounting base plate 14 has a first inlet 11 and a second outlet 141. The mounting base plate 14 has a first mounting groove 12 and a second mounting groove 13 on one side of the mounting shell 15. The first mounting groove 12 passes through the bottom surface of the second mounting groove 13. The mounting shell 15 is provided with a second outlet 141, and the second outlet 141 is connected to the second mounting space 16.

[0161] The impeller assembly 20 includes an impeller housing 22, an impeller 23 and a rotating shaft 24. The impeller housing 22 is connected to the mounting base 14. A first mounting space 222 is formed between the impeller housing 22 and the mounting base 14. The impeller 23 is located in the first mounting space 222. The rotating shaft 24 extends along the first direction Z. One end of the rotating shaft 24 is rotatably connected to the mounting seat 10. The middle of the rotating shaft 24 passes through the impeller 23 and is connected to the impeller 23. The other end of the rotating shaft 24 passes through the impeller housing 22 and is fixedly connected to the connecting assembly 30. The impeller housing 22 has a first outlet 21, which communicates with the first mounting space 222 and the second mounting space 16. The impeller housing 22 has a second inlet 221, which communicates with the first mounting space 222 and the first inlet 11. When a fluid is injected into the first inlet 11, the fluid drives the impeller 23 to rotate.

[0162] The connecting assembly 30 is located on the side of the impeller housing 22 away from the mounting seat 10 , the magnet assembly 50 is connected to the side of the connecting assembly 30 away from the impeller assembly 20 , and the first direction Z is parallel to the arrangement direction of the connecting assembly 30 and the magnet assembly 50 .

[0163] The impeller 23 includes a plurality of blades 231. The plurality of blades 231 are arranged circumferentially around the rotating shaft 24. The rotation direction of the blades 231 and the tilt direction of the blades 231 satisfy one of the following conditions: the blades 231 tilt in a counterclockwise direction from one end close to the rotating shaft 24 to one end away from the rotating shaft 24, and the fluid pushes the blades 231 to rotate clockwise; the blades 231 tilt in a clockwise direction from one end close to the rotating shaft 24 to one end away from the rotating shaft 24, and the fluid pushes the blades 231 to rotate counterclockwise.

[0164] The impeller assembly 20 also includes a first bearing 25 and a bearing pressure plate 26. The first bearing 25 is located in the first mounting groove 12. One end of the rotating shaft 24 is connected to the inner ring of the first bearing 25. The bearing pressure plate 26 is located in the second mounting groove 13. The rotating shaft 24 passes through the bearing pressure plate 26. The bearing pressure plate 26 is located on the side of the first bearing 25 close to the impeller 23. The bearing pressure plate 26 is connected to the mounting seat 10.

[0165] The pipeline 40 is located in the second installation space 16 , one end of the pipeline 40 is communicated with the second outlet 141 , and the other end of the pipeline 40 is located on a side of the connecting assembly 30 away from the impeller assembly 20 .

[0166] The magnet assembly 50 includes a yoke 51 and a magnet 52. The yoke 51 is connected to the connection assembly 30, and the magnet 52 is connected to a side of the yoke 51 away from the connection assembly 30. The magnet 52 includes a square magnet 521 and a plurality of circular magnets 522, and the plurality of circular magnets 522 surround the square magnet 521.

[0167] The target pressing plate 60 is located on a side of the mounting seat 10 away from the impeller assembly 20 , and the target pressing plate 60 is located on a side of the connecting assembly 30 away from the impeller assembly 20 , and the target pressing plate 60 is connected to the mounting seat 10 .

[0168] The fluid flange 80 is connected to a side of the mounting seat 10 away from the impeller assembly 20 . The fluid flange 80 has a third inlet 81 and a third outlet 82 . The third inlet 81 is communicated with the first inlet 11 , and the third outlet 82 is communicated with the first outlet 21 .

[0169] The shielding cover 70 covers the mounting seat 10, the impeller assembly 20, the connecting assembly 30 and the magnet assembly 50, and the shielding cover 70 is connected to the fluid flange 80. The insulating pad 90 is located between the mounting seat 10 and the fluid flange 80. The fluid flange 80 passes through the mounting flange 100, and the mounting flange 100 is located on the side of the mounting seat 10 close to the fluid flange 80.

[0170] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A magnetron sputtering device, characterized in that: The magnetron sputtering device comprises: A mounting seat (10) having a first inlet (11); An impeller assembly (20) is rotatably connected to the mounting seat (10), the impeller assembly (20) is provided with the first inlet (11), and the impeller assembly (20) has a first outlet (21); A connecting assembly (30) connected to a side of the impeller assembly (20) facing away from the mounting seat (10); A magnet assembly (50) connected to a side of the connection assembly (30) away from the impeller assembly (20); The impeller assembly (20) is configured to, when fluid is injected into the first inlet (11), drive the impeller assembly (20) to rotate, and the fluid flows out from the first outlet (21).

2. The magnetron sputtering device according to claim 1, characterized in that: The impeller assembly (20) comprises: An impeller housing (22) having a second inlet (221), the second inlet (221) being in communication with the first inlet (11), the first outlet (21) being located on the impeller housing (22), the impeller housing (22) being connected to the mounting seat (10), a first mounting space (222) being formed between the impeller housing (22) and the mounting seat (10), the second inlet (221) and the first outlet (21) both being in communication with the first mounting space (222), and the connecting assembly (30) being located on a side of the impeller housing (22) facing away from the mounting seat (10); An impeller (23) located in the first installation space (222); The rotating shaft (24) extends along a first direction, the first direction being parallel to the arrangement direction of the connecting assembly (30) and the magnet assembly (50); one end of the rotating shaft (24) is rotatably connected to the mounting seat (10); a middle portion of the rotating shaft (24) passes through the impeller (23) and is connected to the impeller (23); and the other end of the rotating shaft (24) passes through the impeller housing (22) and is connected to the connecting assembly (30).

3. The magnetron sputtering device according to claim 2, characterized in that: The impeller (23) comprises a plurality of blades (231), the plurality of blades (231) being arranged circumferentially around the rotating shaft (24), and the rotation direction of the blades (231) and the inclination direction of the blades (231) satisfying one of the following conditions: The blade (231) is inclined in a counterclockwise direction from an end close to the rotating shaft (24) to an end far from the rotating shaft (24), and the fluid pushes the blade (231) to rotate clockwise; The blade (231) is inclined in a clockwise direction from an end close to the rotating shaft (24) to an end far from the rotating shaft (24), and the fluid pushes the blade (231) to rotate counterclockwise.

4. The magnetron sputtering device according to claim 2, characterized in that: A first mounting groove (12) is provided on a side surface of the mounting seat (10) facing the impeller (23), and the impeller assembly (20) further comprises: The first bearing (25) is located in the first mounting groove (12), and one end of the rotating shaft (24) is connected to the inner ring of the first bearing (25).

5. The magnetron sputtering device according to claim 4, characterized in that: A second mounting groove (13) is provided on a side surface of the mounting seat (10) facing the impeller (23), and the first mounting groove (12) passes through a bottom surface of the second mounting groove (13). The impeller assembly (20) further comprises: A bearing pressure plate (26) is located in the second mounting groove (13); the rotating shaft (24) passes through the bearing pressure plate (26); the bearing pressure plate (26) is located on a side of the first bearing (25) close to the impeller (23); and the bearing pressure plate (26) is connected to the mounting seat (10).

6. The magnetron sputtering device according to any one of claims 1 to 5, characterized in that: The mounting seat (10) comprises: A mounting base plate (14), wherein the first inlet (11) is located on the mounting base plate (14), and the impeller assembly (20) is rotatably connected to the mounting base plate (14); A mounting shell (15) is fixedly connected to the mounting base plate (14); a second mounting space (16) is formed between the mounting shell (15) and the mounting base plate (14); and the impeller assembly (20), the connecting assembly (30) and the magnet assembly (50) are all located in the second mounting space (16).

7. The magnetron sputtering device according to claim 6, characterized in that: The mounting base plate (14) has a second outlet (141), the second outlet (141) is adjacent to the impeller assembly (20), and the mounting housing (15) covers the second outlet (141).

8. The magnetron sputtering device according to claim 7, characterized in that: The mounting housing (15) and the mounting base plate (14) are sealed and connected to each other, and the magnetron sputtering device further comprises: A pipeline (40) is located in the second installation space (16), one end of the pipeline (40) is connected to the second outlet (141), and the other end of the pipeline (40) faces a side of the impeller assembly (20) away from the installation base plate (14).

9. The magnetron sputtering device according to claim 8, characterized in that: The other end of the pipeline (40) is located on a side of the connecting assembly (30) facing away from the impeller assembly (20).

10. The magnetron sputtering device according to any one of claims 1 to 5, characterized in that: The magnet assembly (50) comprises: A magnetic yoke (51) connected to the connecting assembly (30); A magnet (52) is connected to a side of the yoke (51) away from the connecting component (30).

11. The magnetron sputtering device according to claim 10, characterized in that: The magnet (52) comprises: Square magnet (521); A plurality of circular magnets (522) surround the square magnet (521).

12. The magnetron sputtering device according to any one of claims 1 to 5, characterized in that: The magnetron sputtering device also includes: The target material pressure plate (60) is located on a side of the mounting seat (10) away from the impeller assembly (20), and the target material pressure plate (60) is located on a side of the magnet assembly (50) away from the connecting assembly (30), and the target material pressure plate (60) is connected to the mounting seat (10).

13. The magnetron sputtering device according to any one of claims 1 to 5, characterized in that: The magnetron sputtering device also includes: A fluid flange (80) is connected to a side of the mounting seat (10) away from the impeller assembly (20), and the fluid flange (80) has a third inlet (81) and a third outlet (82), the third inlet (81) is in communication with the first inlet (11), and the third outlet (82) is in communication with the first outlet (21).

14. The magnetron sputtering device according to claim 13, characterized in that: The magnetron sputtering device also includes: A shielding cover (70) covers the mounting seat (10), the impeller assembly (20), the connecting assembly (30) and the magnet assembly (50), and the shielding cover (70) is connected to the fluid flange (80).

15. The magnetron sputtering device according to claim 14, characterized in that: The magnetron sputtering device also includes: An insulating pad (90) is located between the mounting seat (10) and the fluid flange (80).

16. The magnetron sputtering device according to claim 14 or 15, characterized in that: The magnetron sputtering device also includes: The fluid flange (80) passes through the mounting flange (100), and the mounting flange (100) is located on a side of the fluid flange (80) away from the mounting seat (10).

17. A magnetron sputtering device, characterized in that: The magnetron sputtering equipment comprises: The magnetron sputtering device according to any one of claims 1 to 16; The target material (200) is mounted on the mounting seat (10).

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