Flow uniformizing assembly and coating equipment

Abstract

The embodiment of the utility model provides a flow uniformizing assembly and coating equipment. The flow uniformizing assembly is used for uniformizing flow of gas and comprises a first-stage flow uniformizing plate, a second-stage flow uniformizing plate and a third-stage flow uniformizing plate, and the second-stage flow homogenizing plate is located on the downstream of the first-stage flow homogenizing plate in the airflow direction of the gas, and a plurality of first vent holes are formed in the second-stage flow homogenizing plate. The film coating equipment comprises a film coating cavity and a film coating device, wherein the film coating cavity comprises a film coating chamber for placing a base material to be coated; and the flow uniformizing assembly is arranged in the coating chamber.

Description

Technical Field

[0001] The utility model relates to the technical field of film coating, in particular to a flow-uniform component and a film coating device comprising the flow-uniform component. Background Art

[0002] In current coating equipment, monomer gas enters the coating chamber from the air inlet and then diffuses in the coating chamber. The gas density of the upper and lower layers of monomer gas in the coating chamber is uneven, resulting in inconsistent deposition rates of the upper and lower substrates, and then resulting in uneven thickness of the upper and lower coating layers, thereby affecting the protective performance of the product. Utility Model Content

[0003] In order to solve the above technical problems, an embodiment of the utility model provides a uniform flow component and a coating device including the uniform flow component, which can evenly disperse the monomer gas in the coating chamber, thereby improving the uniformity of the film layer between the upper and lower layers.

[0004] According to one aspect of the utility model, a flow uniformity component is provided for uniform flow of gas, comprising: a primary flow uniformity plate for diffusing the gas to the surroundings; and a secondary flow uniformity plate located downstream of the primary flow uniformity plate along the gas flow direction, the secondary flow uniformity plate being provided with a plurality of first air vents.

[0005] In some embodiments, the flow uniformity assembly further includes: a third-stage flow uniformity plate, located downstream of the second-stage flow uniformity plate along the gas flow direction of the gas.

[0006] In some embodiments, the three-stage flow equalizer is provided with a plurality of second vent holes.

[0007] In some embodiments, the three-stage flow equalizer plate includes multiple layers of slotted plates arranged in an alternating manner.

[0008] In some embodiments, the three-stage flow plate includes a plurality of convection structures.

[0009] According to another aspect of the present invention, a coating device is provided, which comprises: a coating chamber, comprising a coating chamber for placing a substrate to be coated; and a flow-uniform component, which is arranged in the coating chamber.

[0010] In some embodiments, the coating chamber includes an air inlet and an air exhaust port, the air inlet is located at the top of the coating chamber, the air exhaust port is located at the bottom of the coating chamber, and the various levels of the flow equalizer plates of the flow equalizer assembly are arranged in sequence and overlapped along the vertical direction.

[0011] In some embodiments, the coating chamber includes an air inlet and an air exhaust port, the air inlet is located on one side of the coating chamber, and the air exhaust port is located on the other side of the coating chamber, and the various levels of the flow equalizer plates of the flow equalizer assembly are arranged in sequence and overlapped along the horizontal direction.

[0012] In some embodiments, a rotating support or a solid support for placing the substrate is disposed in the coating chamber.

[0013] In some embodiments, a temperature control device is provided on the cavity wall of the coating cavity.

[0014] In the uniform flow assembly according to the embodiment of the utility model, the monomer gas enters the coating chamber, passes through the first-level uniform flow plate, forms a trend of diffusing horizontally from the center to the entire plane along the first-level uniform flow plate, and then diffuses further evenly after passing through the second-level uniform flow plate, thereby improving the uniformity of the film layer between the upper and lower layers. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Other features and advantages of the present invention will be better understood through the optional embodiments described in detail below in conjunction with the accompanying drawings, in which the same reference numerals represent the same or similar components, wherein:

[0016] Figure 1 A schematic structural diagram of a coating device according to an embodiment of the utility model is shown;

[0017] Figure 2 Shows Figure 1 A schematic structural diagram of a solid feeding device of a coating device;

[0018] Figure 3 Shows Figure 2 A schematic diagram of the structure of a turntable unloading mechanism of a solid feeding device;

[0019] Figure 4 Shows Figure 2 A cross-sectional schematic diagram of a turntable unloading mechanism of a solid feeding device;

[0020] Figure 5 Shows Figure 2 A schematic diagram of the structure of a photoelectric counting device of a solid feeding device;

[0021] Figure 6 Shows Figure 1 A schematic diagram of the structure of a cracking furnace of a coating device;

[0022] Figure 7 Shows Figure 1 A schematic cross-sectional view of a cracking furnace of a coating device;

[0023] Fig. 8A Shows Figure 1A schematic diagram of the structure of the coating chamber of the coating equipment;

[0024] Figure 8B Shows Figure 1 A schematic structural diagram of another coating chamber of the coating equipment;

[0025] Fig. 9 Shows Figure 1 A schematic diagram of the structure of a uniform flow component of a coating device;

[0026] Fig.10 Shows Figure 1 A schematic diagram of the structure of an external plasma discharge mechanism of a coating device;

[0027] Fig.11 Shows Figure 1 Schematic diagram of the structure of the built-in plasma discharge mechanism of the coating equipment. DETAILED DESCRIPTION

[0028] The implementation and use of the embodiments are discussed in detail below. However, it should be understood that the specific embodiments discussed are merely exemplary of specific ways to implement and use the present invention, and are not intended to limit the scope of the present invention. When describing the structural positions of the various components, such as up, down, top, bottom, etc., the expressions of directions are not absolute, but relative. When the various components are arranged as shown in the figure, these directional expressions are appropriate, but when the positions of the various components in the figure change, these directional expressions also change accordingly.

[0029] like Figure 1 As shown in FIG. 1 , the coating device 100 includes a coating chamber 10, a gas feeding device 20 (see FIG. Figure 7 ), a liquid feeding device 30, and a solid feeding device 40. The coating chamber 10 includes a coating chamber 11 for placing a substrate to be coated. The liquid feeding device 30 is connected to the coating chamber 11, and is used to convey a first gas raw material after the liquid raw material is vaporized to the coating chamber 11. The solid feeding device 40 is connected to the coating chamber 11, and is used to convey a second gas raw material after the solid raw material is sublimated and cracked to the coating chamber 11. The gas feeding device 20 is connected to the coating chamber 11, and is used to convey a third gas raw material to the coating chamber 11. In some embodiments, the coating equipment 100 may not include the gas feeding device 20, and only include the liquid feeding device 30 and the solid feeding device 40.

[0030] Combination Figures 2 to 4As shown in the figure, the solid feeding device 40 includes: a silo 41, a sublimation chamber 42, a turntable unloading mechanism 43, and a cracking furnace 44. The silo 41 is used to place a plurality of solid raw materials, such as pellet-shaped parylene, sheet-shaped parylene or granular parylene, which may be referred to as pellets hereinafter. The silo 41 can accommodate more than thousands of pellets. An end cover (not shown) is provided on the top of the silo 41. A sealing ring is provided between the end cover and the silo 41 to achieve the sealing of the silo 41. The end cover can be opened by a flip cover mechanism, which is composed of a shaft, a spring, and a plane bearing. When the silo 41 is in a normal pressure state, the handle on the silo 41 is removed, and the spring in the flip cover mechanism can overcome the gravity of the end cover, so that the end cover can be bounced upward, and the end cover can be easily rotated horizontally around the axis, thereby opening the silo 41. The end cover of the silo 41 is equipped with a plurality of glass windows for detecting the feeding status of the residual material and pellets in the silo.

[0031] The turntable unloading mechanism 43 is located in the silo 41, and is used to transport the solid raw material in the silo 41 to the sublimation chamber 42. The sublimation chamber 42 is used to heat and sublimate the solid raw material. The cracking furnace 44 is used to crack the gas after the sublimation of the solid raw material into a second gas raw material, and transport the second gas raw material to the coating chamber 11.

[0032] The turntable unloading mechanism 43 controllably conveys the solid raw material into the sublimation chamber 42 at a set feeding rate. Specifically, the turntable unloading mechanism 43 includes a turntable 431, a unloading channel 432 and a stopper 433. The turntable 431 is arranged in the silo 41 and can rotate around its own central axis. The turntable 431 has a central protrusion 4311 and a plurality of turntable holes 4312 evenly arranged around the central protrusion 4311. The size of the turntable hole 4312 corresponds to the size of the solid raw material or the pellet. One turntable hole 4312 is used to accommodate one solid raw material or pellet. A magnetic fluid sealing transmission device 434 is provided below the turntable 431. The servo motor outside the silo drives the magnetic fluid sealing transmission device 434 to rotate through a pulley, thereby driving the turntable 431 to rotate. The unloading channel 432 is located below the turntable 431, connecting the silo 41 and the sublimation chamber 42. The block 433 may be one, two or more blocks, which are located above the turntable 431, allowing the solid raw materials or pellets in the turntable hole 4312 to rotate to the discharge channel 432, and blocking the remaining solid raw materials except the solid raw materials or pellets in the turntable hole 4312 from rotating to the discharge channel 432, and the solid raw materials or pellets in the discharge channel 432 continue to enter the sublimation chamber 42.

[0033] According to the embodiment of the utility model, the feeding system of the coating equipment can realize gas feeding, liquid feeding and solid feeding at the same time. The multifunctional feeding method provides conditions for the coating equipment to deposit different film layers. By matching different methods and types of raw materials, the coating equipment can deposit multifunctional composite film layers one after another or simultaneously, integrating ordinary CVD, PECVD, and ICVD technologies, solving the problem that the existing coating equipment can only realize a single CVD deposition technology, that is, only a single type of raw material can be introduced, and only one film layer can be deposited at a time, and the composite film layer needs to be completed by starting and stopping the equipment and adding materials multiple times, thereby causing the problem of poor film quality and long coating cycle.

[0034] In some embodiments, the turntable unloading mechanism 43 further includes a dividing device for controlling the rotation angle of the turntable 431. For example, when there are six turntable holes 4312, the angle between two adjacent turntable holes 4312 is 60°, and the dividing device can control the turntable 431 to rotate 60° each time, so that the solid raw materials or pellets in the turntable holes 4312 can fall into the unloading channel 432, and then be transported to the sublimation chamber 42. The dividing device can be a photoelectric dividing mechanism, so as to improve the accuracy of the rotation of the turntable 431 and solve the errors of the synchronous wheel slipping and the servo motor rotation.

[0035] Combination Figure 5 As shown in , in some embodiments, the turntable unloading mechanism 43 further includes a photoelectric detection device 435 for detecting the feeding state of the solid raw material.

[0036] In some embodiments, the turntable 431 is provided with a waiting position and a material discharge position, and the waiting position and the material discharge position correspond to two adjacent turntable holes 4312 of the turntable 431, respectively. The photoelectric detection device 435 includes a first photoelectric switch sensor 4351 and a second photoelectric switch sensor 4352. The first photoelectric switch sensor 4351 is used to detect whether there is solid raw material at the waiting position of the turntable 431, and the second photoelectric switch sensor 4352 is used to detect whether there is solid raw material at the material discharge position of the turntable 431. The stopper 433 is provided with a first channel 4331 corresponding to the waiting position and a second channel 4332 corresponding to the material discharge position. The first photoelectric switch sensor 4351 is installed in the first channel 4331, and the second photoelectric switch sensor 4352 is installed in the second channel 4332.

[0037] When the first photoelectric switch sensor 4351 of the material waiting position detects that there are pills, and the second photoelectric switch sensor 4352 of the material discharging position does not detect pills, it is recorded as material presence once; when the first photoelectric switch sensor 4351 of the material waiting position detects that there are pills, and the second photoelectric switch sensor 4352 of the material discharging position detects that there are pills, it is recorded as material jamming once; when the first photoelectric switch sensor 4351 of the material waiting position does not detect pills, and the second photoelectric switch sensor 4352 of the material discharging position does not detect pills, it is recorded as empty material once. When pills are detected, the control valve is actuated, and the pills enter the sublimation chamber 42, and the number of system feedings increases by 1; when stuck material and empty material are detected, the control valve does not actuate, the number of system feedings does not increase, and the material tray 431 continues to rotate for the next feeding.

[0038] In some embodiments, the photoelectric detection device 435 further includes a third photoelectric switch sensor 4353 , which is disposed above the center of the central protrusion 4311 and is used to detect whether there is solid raw material or pellets in the center of the central protrusion 4311 of the turntable 431 .

[0039] In some embodiments, the photoelectric detection device 435 further includes an alarm (not shown). When the third photoelectric switch sensor 4353 detects that there is no solid raw material or pellets in the center of the central protrusion 4311 of the turntable 431, the alarm sends an alarm signal.

[0040] Specifically, when a certain amount of solid raw materials or pellets remain, the screw at the center of the turntable 431 leaks out, triggering a pellet remaining alarm line, and an alarm is sounded through the alarm to remind the silo of material shortage.

[0041] In some embodiments, a groove (not shown) is further provided under the turntable 431, and the groove can solve the problem of broken materials caused by half of the pellets in the turntable 431. During normal operation, the silo 41 is filled with pellets, and the pellets enter the turntable holes 4312 of the outer ring of the turntable 431, and rotate with the rotation of the turntable 431. When it rotates to the waiting position, the block 433 blocks the remaining pellets on the turntable 431, and only the pellets in the turntable holes 4312 can enter the waiting position, and then continue to rotate to the unloading position for unloading. When an incomplete or broken pill enters the turntable hole 4312, if the incomplete pill is small in size, the turntable 431 rotates and the pill falls into the groove below the turntable 431, and the next pill continues to enter the turntable hole 431. The pill in the groove will be rotated synchronously with the groove without affecting the rotation of other pills. The pills in the turntable hole 431 are discharged when passing the discharge position; if the incomplete pill is large in size, the pill will rotate with the turntable 431, and there will be a complete pill above the pill. When it reaches the position of the stopper 433, the complete pill will be pushed out of the turntable hole 431, and only the pills in the turntable hole 431 will be discharged.

[0042] In some embodiments, the sublimation chamber 42 includes a sublimation chamber 421 and an outlet 422. A quick-change receiving tray 423 is provided in the sublimation chamber 421 for receiving solid raw materials. The outlet 422 is connected to the sublimation chamber 421 and is used to discharge the gas after the solid raw materials are sublimated into the cracking furnace 44. The sublimation chamber 421 is heated by the chamber wall, and the pellets are discharged into the quick-change receiving tray 423. The quick-change receiving tray 423 can be quickly replaced according to the process requirements, which is convenient for equipment maintenance and conducive to the cleanliness of the sublimation chamber 421.

[0043] In some embodiments, the sublimation chamber 42 further includes a flip cover 424 for sealing the sublimation chamber 421. The slope of the flip cover 424 is less than 90°, and the sublimation chamber 421 is sealed by the gravity of the flip cover 424 and the negative pressure in the sublimation chamber 421.

[0044] In some embodiments, the sublimation chamber 42 further includes a control valve assembly 425 for controlling the delivery of the solid raw material into the sublimation chamber 421. The control valve assembly 425 includes a first control valve and a second control valve. The first control valve and the second control valve are arranged at intervals from each other, and are used to control the opening and closing of the feed channel 432 respectively.

[0045] The first control valve and the second control valve can be a gate valve, a ball valve, a plug valve, etc., as long as they can realize the opening and closing of the discharge channel 432. The embodiment of the utility model is not limited to this.

[0046] The first control valve and the second control valve are in a normally closed state. When the pellets are discharged, the first control valve is opened, and the pellets are discharged to the middle of the first control valve and the second control valve through the discharge channel 432. Then the first control valve is closed, the second control valve is opened, and the pellets are discharged to the sublimation chamber 421, and the second control valve is closed. By normally closing the first control valve and the second control valve, the silo 41 and the sublimation chamber 421 are separated, which is conducive to the pressure stability of the silo 41, and at the same time can prevent dust from being deposited in other areas, thereby improving the service life of the first control valve and the second control valve.

[0047] In some embodiments, each control valve includes a valve core and a heating element, the valve core can move back and forth or rotate to open and close the feed channel 432, and the heating element is used to adjust the temperature of the position of the valve core. The heating element can realize the temperature control of the valve core position to prevent the valve core from dust deposition and stuck faults.

[0048] like Figure 6 and Figure 7As shown in the figure, the cracking furnace 44 includes a cracking furnace pipeline 441 and a plurality of fins 442. The plurality of fins 442 are located in the cracking furnace pipeline 441, and each fin 442 is provided with a plurality of grooves (not shown) for compensating for thermal deformation. The material of the cracking furnace pipeline 441 and the plurality of fins 442 can be stainless steel materials such as 310S stainless steel and 316 stainless steel. The plurality of fins 442 can increase the contact area between the cracking furnace 44 and the monomer gas molecules and improve the cracking efficiency. Other structures of the cracking furnace 44 are known to those skilled in the art, so the utility model will not be described in detail.

[0049] According to the embodiment of the utility model, the upper part of the solid feeding device 40 is a silo 41, which is filled with pellets of the same size. When the turntable 431 rotates to a specific position, the pellets in the silo 41 are discharged, and the pellets enter the sublimation chamber 42 through the control valve assembly 425 to be vaporized into gas, and then are cracked into monomer gas through the cracking chamber 44, and then enter the coating chamber 11. The solid feeding device 40 can control the feeding rate by controlling the time interval of the turntable 431 rotating to discharge the material, and control the vaporization and cracking rates by controlling the temperature of the sublimation chamber 42 and the cracking chamber 44, so that the density and rate of the monomer gas entering the coating chamber 11 are controllable, which greatly accelerates the coating rate, improves the protective quality of the film layer, and improves the powder utilization rate in the coating process, solving the problems of one-time feeding, uncontrollable coating process, limited deposition rate, low powder utilization rate, and poor protective effect in the prior art.

[0050] like Fig. 8A and 8B As shown in , a rotating bracket 111 for placing a substrate is provided in the coating chamber 11. The motor 112 at the bottom of the coating chamber 10 drives the magnetic fluid sealing transmission device to rotate, and the magnetic fluid sealing transmission device drives the rotating bracket 111 to rotate through the transmission mechanism. The rotating bracket 111 can be a circular rotating rack, and the circular rotating rack can have a variety of structures, including a fan-shaped rotating rack or a large flat rotating rack. The fan-shaped rotating rack can achieve adjustable interlayer spacing through a support plate, and the large flat rotating rack can achieve adjustable interlayer spacing through a spacer column. The substrate 80 is driven to rotate by the rotating bracket 111, which can improve the uniformity of the film layer.

[0051] In other embodiments, a fixed support for placing the substrate is provided in the coating chamber 11. The fixed support can achieve greater production efficiency when the uniformity of the film layer is better.

[0052] In some embodiments, a flow homogenizing assembly 12 for homogenizing the flow of the second gas raw material is disposed in the coating chamber 11 .

[0053] like Fig. 9As shown in the figure, the flow equalizer assembly 12 includes a primary flow equalizer plate 121 and a secondary flow equalizer plate 122. The primary flow equalizer plate 121 is used to diffuse the second gas raw material to the surroundings, and the secondary flow equalizer plate 122 is located downstream of the primary flow equalizer plate 121 along the gas flow direction of the second gas raw material, and the secondary flow equalizer plate 122 is provided with a plurality of first vents 1221.

[0054] In some embodiments, the flow equalizer assembly 12 further includes a three-stage flow equalizer plate 123. The three-stage flow equalizer plate 123 is located downstream of the two-stage flow equalizer plate 122 along the gas flow direction of the second gas raw material.

[0055] In some embodiments, the third-stage flow equalizer 123 is provided with a plurality of second vent holes.

[0056] In some embodiments, the three-stage flow equalizer plate 123 includes multiple layers of slotted plates arranged in a staggered manner.

[0057] In some embodiments, the three-stage flow plate 123 includes a plurality of convection structures 1231. The convection structure 1231 includes two convection plates 12311, which are arranged opposite to each other to form a V-shaped structure, and the top of the V-shaped structure faces the gas flow direction of the second gas raw material.

[0058] The monomer gas after cracking in the cracking furnace enters the coating chamber 11 through the air inlet 113 of the coating chamber 10, and forms a trend of diffusing horizontally from the center to the entire plane along the first-level flow plate 121, and then diffuses further evenly after passing through the second-level flow plate 122 and the third-level flow plate 123.

[0059] exist Fig. 8A In the embodiment shown, the second gas raw material adopts a top-bottom air intake method, the air inlet 113 is located at the top and communicated with the solid feeding device 40, and the air extraction port 114 is located at the bottom and communicated with the air extraction pipeline 51. The first-level flow equalizer 121 is a disc, which converts the airflow flowing in the vertical direction into the airflow flowing in the horizontal direction, and can diffuse rapidly in the horizontal direction. The second-level flow equalizer 122 is provided with a plurality of first vents 1221, which increases the uniformity of the airflow. The third-level flow equalizer 123 can further increase the uniformity, and at the same time, by increasing the airflow path, the airflow velocity is slowed down.

[0060] exist Figure 8BIn the embodiment shown, the second gas raw material is fed by a side-in and side-extraction air intake method, the air inlet 113 is located on one side and is connected to the solid feeding device 40, and the air extraction port 114 is located on the other side and is connected to the air extraction pipeline 51. The uniformity of the airflow in the side-in and side-extraction air intake method is easier to control, and does not need to be regulated by the upper and lower temperatures of the cavity. At the same time, it can also prevent large particles from settling downward under the dual effects of gravity and suction, thereby affecting the quality of the film layer. In addition, the uniformity of the film layer in the side-in and side-extraction air intake method can be achieved by rotating the bracket, and the upper and lower uniformity mainly depends on the air uniformity component to make the air intake uniform in the vertical direction.

[0061] In some embodiments, the coating chamber 11 is further provided with a flow-uniform component for uniform flow of the first gas raw material and / or a flow-uniform component for uniform flow of the third gas raw material. The flow-uniform component may include a single flow-uniform plate, which may be a short baffle or a long perforated baffle covering a plurality of single gas inlets. The single gas enters the cavity and is evenly dispersed by the single flow-uniform plate, thereby improving the uniformity of the film layer between the upper and lower layers.

[0062] In some embodiments, the wall of the coating chamber 10 is provided with a temperature control device, which can realize multi-zone control of the wall temperature. By adjusting the wall temperature of the coating chamber 10, the deposition rates of the upper and lower layers of monomer gas are consistent under the combined influence of the monomer gas density and temperature, so that the thickness of the upper and lower coating layers is uniform.

[0063] According to the embodiment of the utility model, a flow-uniform component is provided in the coating chamber, which optimizes and improves the uniformity of gas deposition, including adding a flow-uniform component between the air inlet and the rotating rack, multi-point control to adjust the temperature of the cavity wall, and using a rotating rack. The monomer gas cracked by the cracking furnace enters the coating chamber through the air inlet of the coating chamber, passes through the first-level flow-uniform plate to form a trend of diffusing horizontally from the center to the entire plane along the first-level flow-uniform plate, and then passes through the second-level flow-uniform plate and the third-level flow-uniform plate to further diffuse evenly; the temperature of the cavity wall of the coating chamber is adjusted to make the deposition rate of the upper and lower layers of monomer gas consistent under the joint influence of the monomer gas density and temperature, so that the thickness of the upper and lower coating layers is uniform; at the same time, during the coating process, the substrate revolves around the central rotation axis to avoid the uneven thickness of the substrate film layer in a fixed area caused by the uneven density of the chemical monomer gas in each area.

[0064] Recombination Figure 1 As shown in , the coating equipment 100 further includes a vacuum system 50 for evacuating the coating chamber 11 .

[0065] The vacuum system 50 includes an exhaust pipeline 51, which is provided with a pump group for extracting air in the coating chamber 11. The exhaust pipeline 51 includes a rough exhaust pipeline and a fine exhaust pipeline. The rough exhaust pipeline is connected to the coating chamber 11, and the fine exhaust pipeline is connected to the coating chamber 11 through a cold trap 52. The cold trap 52 is used to capture condensable gases in the extracted air. Before coating, the chamber is evacuated by first roughly exhausting the chamber, and then fine exhausting the chamber after reaching a certain vacuum degree.

[0066] In some embodiments, the coating equipment 100 further includes an exhaust gas treatment device 60, which is connected to the exhaust pipeline 51 and is used to treat and discharge the gas extracted through the exhaust pipeline 51. The exhaust gas treatment device 60 includes but is not limited to recycling or pollution-free treatment of nitrogen, inert gas, hydrogen, hydrocarbon gas and other reaction raw materials, process gas or auxiliary gas of doping elements, and then discharges them to the outside to prevent pollution to the environment and achieve recycling.

[0067] According to the embodiment of the utility model, the coating chamber 11 is connected to the pump group through two pipelines, namely the rough pumping pipeline and the fine pumping pipeline. The rough pumping pipeline is directly connected to the coating chamber 11, and a cold trap 52 is added between the fine pumping pipeline and the coating chamber 11. In the vacuuming stage, the rough pumping pipeline is first opened to quickly remove most of the air in the coating chamber 11, and the fine pumping pipeline is opened after reaching a certain pressure. The low-temperature condensation and adsorption of the cold trap 52 can accelerate the vacuuming rate and enable the coating chamber 11 to obtain a lower ultimate vacuum degree. In the coating process, the fine pumping pipeline is used, and the process mixed gas extracted from the coating chamber 11 is low-temperature condensed and adsorbed by the cold trap 52 and then extracted by the pump group, and discharged after passing through the exhaust gas treatment device 60, which greatly reduces the impurities entering the pump group and extends the service life of the pump group. At the same time, the exhaust gas is effectively filtered out, and the equipment is more environmentally friendly.

[0068] In some embodiments, the vacuum system 50 further includes a valve 53 whose opening can be controlled, which is used to adjust the exhaust speed of the exhaust pipeline 51 to control the vacuum pressure stability in the coating chamber 11 .

[0069] In some embodiments, the vacuum system 50 further includes a first vacuum pressure sensor 54 for detecting the pressure in the exhaust pipeline 51 .

[0070] In some embodiments, the sublimation chamber 42 includes a second vacuum pressure sensor 426 for detecting the pressure within the sublimation chamber 42 .

[0071] In some embodiments, Fig. 8A As shown in , the coating device 100 further includes a plasma discharge device 70. The plasma discharge device 70 includes an external plasma discharge mechanism or a built-in plasma discharge mechanism.

[0072] In some embodiments, Fig. 8A As shown in the figure, the coating equipment 100 also includes a real-time film thickness monitoring system 90, which monitors the thickness of the film layer on the substrate 80. When the thickness of the film layer reaches a predetermined thickness, the gas feeding device, the liquid feeding device and / or the solid feeding device are closed.

[0073] like Fig.10 and 11 As shown in , the plasma discharge device 70 includes an external plasma discharge mechanism 71 and / or an internal plasma discharge mechanism 72. In the external plasma discharge mechanism, a plasma discharge device is installed on the outer wall of the cavity to perform plasma treatment on the substrate in the cavity. The plasma discharge device may include a plasma excitation power supply, a matcher, a discharge coil or electrode, a quartz / ceramic plate, a glass cover plate, and a uniform gas flange; through the plasma excitation power supply and the matcher, the discharge coil or electrode generates a glow discharge in the coating cavity; the cavity wall is connected and sealed with the quartz / ceramic plate through the uniform gas flange, and the uniform gas flange is connected with a plurality of air inlets, and the side connected to the cavity is densely covered with air outlets, which can realize the function of uniform air intake into the cavity; the glass cover plate can prevent the film layer from being deposited on the quartz / ceramic plate. In the internal plasma discharge mechanism, the plasma excitation power supply applies voltage to the carrier, so that the carrier acts as an electrode to discharge and generate plasma. The plasma excitation power supply can be a radio frequency, medium frequency or pulse power supply. The plasma excitation power source generates high-energy plasma in the coating chamber 11, excites the raw material gas to generate active radicals, which are deposited on the surface of the substrate 80 to form a cross-linked structure, thereby forming a film layer on the surface of the substrate 80. On the other hand, the bombardment of the film layer by high-energy ions and electrons in the plasma can make the film layer dense and improve the quality of the film layer.

[0074] In other embodiments, in the built-in plasma discharge mechanism, a plasma excitation power source (such as a radio frequency power source) generates a radio frequency electric field in the coating chamber 11 of the coating chamber 10 by directly loading on the electrode plate in the chamber to act on the gas in the coating chamber 11. Specifically, during coating, the radio frequency power source discharges gases such as nitrogen or inert gas and reaction raw material gas in the coating chamber 11 by providing a radio frequency electric field so that the coating chamber 11 is in a plasma environment and the reaction gas raw material is in a high energy state.

[0075] According to the embodiments of the utility model, the side wall discharge coil of the coating chamber is connected to the matcher and the RF power supply. After the coating chamber is evacuated, the alternating current of the RF power supply excites the introduced argon / helium / oxygen and other gases to generate plasma, which acts on the surface of the substrate to perform surface treatment on the substrate, thus solving the cumbersome processing steps of the existing process that requires the use of plasma equipment to perform surface treatment on the substrate before coating and then perform coating.

[0076] The technical content and technical features of the utility model have been disclosed above. However, it can be understood that under the creative idea of ​​the utility model, technicians in this field can make various changes and improvements to the above-disclosed concepts, but they all belong to the protection scope of the utility model. The description of the above implementation mode is illustrative rather than restrictive, and the protection scope of the utility model is determined by the claims.

Claims

1. A flow-uniform component for uniform flow of gas, characterized in that: include: A primary flow plate, used to diffuse the gas to all sides; as well as The secondary flow equalizer plate is located downstream of the primary flow equalizer plate along the gas flow direction of the gas, and the secondary flow equalizer plate is provided with a plurality of first vent holes.

2. The flow-uniform assembly according to claim 1, characterized in that: The flow equalizer assembly further includes: a third-stage flow equalizer plate, which is located downstream of the second-stage flow equalizer plate along the gas flow direction.

3. The flow-uniform assembly according to claim 2, characterized in that: The three-stage flow equalizer plate is provided with a plurality of second vent holes.

4. The flow-uniform assembly according to claim 2, characterized in that: The three-stage flow equalizer plate includes multiple layers of slotted plates arranged in an alternating manner.

5. The flow-uniform assembly according to claim 2, characterized in that: The three-stage flow plate includes a plurality of convection structures.

6. A coating device, characterized in that: include: The coating chamber includes a coating chamber for placing a substrate to be coated; as well as The flow homogenizing assembly according to any one of claims 1 to 5 is arranged in the coating chamber.

7. The coating device according to claim 6, characterized in that: The coating chamber comprises an air inlet and an air exhaust port, wherein the air inlet is located at the top of the coating chamber, and the air exhaust port is located at the bottom of the coating chamber, and the flow equalizer plates of each stage of the flow equalizer assembly are arranged in an overlapping manner in a vertical direction.

8. The coating device according to claim 6, characterized in that: The coating chamber comprises an air inlet and an air exhaust port, wherein the air inlet is located on one side of the coating chamber, and the air exhaust port is located on the other side of the coating chamber, and the flow equalizer plates of each stage of the flow equalizer assembly are arranged in an overlapping manner in the horizontal direction.

9. The coating device according to any one of claims 6 to 8, characterized in that: The coating chamber is provided with a rotating support or a solid support for placing the substrate.

10. The coating device according to any one of claims 6 to 8, characterized in that: The cavity wall of the coating cavity is provided with a temperature control device.

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