Cooling device for SMT patch processing

Abstract

The utility model relates to the technical field of SMT patch processing, and solves the problem that the SMT patch processing device comprises a placing plate, the bottom of the placing plate is provided with a connecting plate, the surface of the connecting plate is provided with a square groove, one side of the bottom of the connecting plate is fixedly connected with a baffle, and one side of the connecting plate is fixedly connected with a connecting block. And a cooling assembly used for reducing the temperature is sleeved with the connecting block. The cooling device for SMT patch processing comprises a placing plate, a connecting plate is arranged at the bottom of the placing plate, a square groove is formed in the surface of the connecting plate, a baffle is fixedly connected to one side of the bottom of the connecting plate, a connecting block is fixedly connected to one side of the connecting plate, and a cooling assembly used for reducing the temperature is connected into the connecting block in a sleeved mode. The cooling assembly comprises a water barrel connected into the connecting block in a sleeved mode, an embedding groove is formed in the surface of the water barrel, a semiconductor chilling plate is arranged in the embedding groove, and the refrigerating end of the semiconductor chilling plate is attached to the inner bottom face of the embedding groove.

Description

Technical Field

[0001] The utility model relates to the technical field of SMT patch processing, in particular to a cooling device for SMT patch processing. Background Art

[0002] A cooling device for SMT patch processing disclosed by publication number CN212086624U includes a workbench, a protective cover is fixedly connected to the upper surface of the workbench, a cooling fan is fixedly connected to the upper surface of the protective cover, and an air outlet end of the cooling fan passes through the upper surface of the protective cover and extends to the inner top wall of the protective cover, an air inlet cover is fixedly connected to the inner top wall of the protective cover, a water tank is fixedly connected to the back of the workbench, a circulating pump is fixedly connected to the side of the water tank, the water inlet end of the circulating pump passes through the side of the water tank and extends to the inner wall of the water tank, a water outlet end of the circulating pump is provided with a water outlet pipe, and a spiral tube is fixedly connected to the end of the water outlet pipe away from the circulating pump.

[0003] The cooling fan, air inlet cover, circulating pump and spiral tube are arranged to facilitate the start of the circulating pump so that the coolant circulates on the inner wall of the spiral tube, and the cooling fan blows cold air onto the PCB board, so as to achieve better cooling effect and effectively ensure the quality of welding.

[0004] However, the use of water circulation to assist heat dissipation is affected by the ambient temperature, causing the water source temperature to rise, which in turn makes its temperature higher in the circulation state, thereby reducing the heat dissipation efficiency. This solution is not efficient for cooling SMT patch processing. Utility Model Content

[0005] In view of the shortcomings of the prior art, the utility model provides a cooling device for SMT patch processing, which solves the problem that the use of water circulation flow to assist heat dissipation is affected by the ambient temperature, causing the water source temperature to rise, thereby making its temperature higher in the circulation state, thereby reducing the heat dissipation efficiency.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a cooling device for SMT patch processing, comprising a placement plate, a connecting plate is arranged at the bottom of the placement plate, and a square groove is opened on the surface of the connecting plate, a baffle is fixedly connected to one side of the bottom of the connecting plate, and a connecting block is fixedly connected to one side of the connecting plate, and a cooling component for reducing the temperature is sleeved inside the connecting block.

[0007] In a specific embodiment, the cooling component includes a water cylinder that is sleeved inside the connecting block, and an embedding groove is provided on the surface of the water cylinder, and a semiconductor refrigeration plate is provided inside the embedding groove, and the cooling end of the semiconductor refrigeration plate is in contact with the inner bottom surface of the embedding groove, and the surface of the semiconductor refrigeration plate is electrically connected to a temperature controller, and the surface of the temperature controller is electrically connected to a battery.

[0008] In a specific embodiment, a chain water pipe is arranged inside the square groove, and one end of the chain water pipe passes through one side of the connecting plate and is connected to one end of the water cylinder, while the other end of the chain water pipe passes through the other side of the connecting plate and is connected to a water pump.

[0009] In a specific embodiment, an L-tube is connected through the bottom of the water pump, and one end of the L-tube is connected through a box body, and a water tank is sleeved inside the box body, and a first connecting pipe is connected through one side of the water tank, and the first connecting pipe is connected to the L-tube.

[0010] In a specific embodiment, a grid plate is sleeved inside the water tank, and a plurality of water holes are opened inside the grid plate in a rectangular array.

[0011] In a specific embodiment, a second connecting pipe is connected to the other side of the water tank, and one end of the second connecting pipe passes through one side of the box body and is connected to a hose, and one end of the hose is connected to the other end of the water cylinder. A fan groove is axially symmetrically provided on the surface of the box body, and a cooling fan is embedded in the fan groove.

[0012] Compared with the prior art, the utility model provides a cooling device for SMT patch processing, which has the following beneficial effects:

[0013] In the technical solution disclosed by the utility model, by utilizing the setting of the cooling component, during the SMT patch processing, the SMT patch is placed on the surface of the placement board, the temperature controller can be turned on to energize the semiconductor refrigeration sheet and the battery, and the temperature controller is used to adjust the refrigeration temperature of the semiconductor refrigeration sheet to an appropriate temperature, so that the refrigeration end of the semiconductor refrigeration sheet conducts cold air to the inside of the water cylinder, thereby causing the water source inside the water cylinder to begin to cool down. At this time, the water pump is connected to an external power supply to extract the water source inside the water cylinder, and through the water tank, it is transported to the inside of the chain water pipe to complete a cycle, and the low-temperature water source inside the chain water pipe will conduct the cold air to the inside of the placement board, thereby starting to cool the SMT patch placed on the top of the placement board to cool it down. At the same time, when the low-temperature water source circulates through the inside of the water tank, it is affected by the cooling fan and blows out the cold air. The staff can also place the SMT patch near the cooling fan so that the cold air cools it down, thereby further improving the cooling efficiency of the SMT patch processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0015] Figure 1It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the placement plate of the utility model;

[0017] Figure 3 This is a schematic diagram of the cooling assembly structure of the utility model;

[0018] Figure 4 This is a schematic diagram of the water tank structure of the utility model.

[0019] In the figure: 1. placement plate; 2. connecting plate; 3. square groove; 4. baffle; 5. connecting block; 6. cooling assembly; 61. water cylinder; 62. embedded groove; 63. semiconductor refrigeration plate; 64. temperature controller; 65. battery; 7. chain water pipe; 8. water pump; 9. L-tube; 10. box body; 11. water tank; 12. first connecting pipe; 13. grid plate; 14. water hole; 15. second connecting pipe; 16. hose; 17. cooling fan. DETAILED DESCRIPTION

[0020] The following will describe the implementation methods of the present application in detail with the help of accompanying drawings and examples, so that the implementation process of how the present application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0021] Figure 1-Figure 4 One embodiment of the utility model is a cooling device for SMT patch processing, including a placement plate 1, a connecting plate 2 is arranged at the bottom of the placement plate 1, and a square groove 3 is opened on the surface of the connecting plate 2, and a baffle 4 is fixedly connected to one side of the bottom of the connecting plate 2, and a connecting block 5 is fixedly connected to one side of the connecting plate 2, and a cooling component 6 for reducing the temperature is sleeved inside the connecting block 5.

[0022] The specific problem addressed by this specific embodiment is to solve the problem that the use of water circulation to assist heat dissipation is affected by the ambient temperature, causing the water source temperature to rise, thereby making its temperature higher in the circulation state, thereby reducing the heat dissipation efficiency. The utility model utilizes the setting of the cooling component 6. During the SMT patch processing, the SMT patch is placed on the surface of the placement board 1, and the temperature controller 64 can be turned on to power the semiconductor refrigeration chip 63 and the battery 65. The temperature controller 64 is used to adjust the cooling temperature of the semiconductor refrigeration chip 63 to a suitable temperature, so that the cooling end of the semiconductor refrigeration chip 63 conducts cold air to the inside of the water cylinder 61, and the water source inside the water cylinder 61 begins to cool down. At this time, the water pump 8 is connected to an external power supply to extract the water source inside the water cylinder 61 and pass it through the water pump 8. The cold air is transported to the inside of the linked water pipe 7 through the water tank 11 to complete a cycle. The low-temperature water source inside the linked water pipe 7 will conduct the cold air to the inside of the placement board 1, and then begin to cool the SMT patch placed on the top of the placement board 1 to cool it down. At the same time, when the low-temperature water source circulates through the inside of the water tank 11, it is affected by the cooling fan 17 to blow out the cold air. The staff can also place the SMT patch near the cooling fan 17 so that the cold air can cool it down, thereby further improving the cooling efficiency of the SMT patch processing.

[0023] The cooling assembly 6 includes a water cylinder 61 which is sleeved inside the connecting block 5, and an embedding groove 62 is provided on the surface of the water cylinder 61, and a semiconductor cooling sheet 63 is provided inside the embedding groove 62, and the cooling end of the semiconductor cooling sheet 63 is in contact with the inner bottom surface of the embedding groove 62, and the surface of the semiconductor cooling sheet 63 is electrically connected to a temperature controller 64, and the surface of the temperature controller 64 is electrically connected to a battery 65. During the SMT patch processing, the SMT patch is placed on the surface of the placement board 1, and the temperature controller 64 can be turned on to energize the semiconductor cooling sheet 63 and the battery 65, and the temperature controller 64 is used to adjust the cooling temperature of the semiconductor cooling sheet 63 to a suitable temperature, so that the cooling end of the semiconductor cooling sheet 63 transmits cold air. The cold air is led to the inside of the water cylinder 61, so that the water source inside the water cylinder 61 begins to cool down. At this time, the water pump 8 is connected to the external power supply to extract the water source inside the water cylinder 61, and through the water tank 11, it is transported to the inside of the chain water pipe 7 to complete a cycle. The low-temperature water source inside the chain water pipe 7 will conduct the cold air to the inside of the placement board 1, and then begin to cool the SMT patch placed on the top of the placement board 1 to cool it down. At the same time, when the low-temperature water source circulates through the inside of the water tank 11, it is affected by the cooling fan 17 and blows out the cold air. The staff can also place the SMT patch near the cooling fan 17 so that the cold air cools it down, thereby further improving the cooling efficiency of the SMT patch processing.

[0024] In this specific embodiment, a chain water pipe 7 is arranged inside the square groove 3, and one end of the chain water pipe 7 penetrates one side of the connecting plate 2 and is connected to one end of the water cylinder 61, and the other end of the chain water pipe 7 penetrates the other side of the connecting plate 2 and is connected to a water pump 8, and the bottom of the water pump 8 is connected to an L-tube 9, and one end of the L-tube 9 is connected to a box body 10, and a water tank 11 is sleeved inside the box body 10, and one side of the water tank 11 is connected to a first connecting pipe 12, and the first connecting pipe 1 2 is connected to the L tube 9, a grid plate 13 is sleeved inside the water tank 11, and a plurality of water holes 14 are formed in a rectangular array inside the grid plate 13, a second connecting pipe 15 is connected to the other side of the water tank 11, and one end of the second connecting pipe 15 passes through one side of the box body 10 and is connected to the hose 16, and one end of the hose 16 is connected to the other end of the water cylinder 61, and a fan slot is formed on the surface of the box body 10 in an axisymmetric manner, and a heat dissipation fan 17 is embedded in the fan slot.

[0025] The control method of the present invention is automatic control through a controller. The control circuit of the controller can be realized by simple programming by technicians in this field. The provision of power is also common knowledge in this field. The present invention is mainly used to protect mechanical devices, so the present invention will no longer explain the control method and circuit connection in detail.

[0026] It should be noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cooling device for SMT patch processing, comprising a placement plate (1), characterized in that: A connecting plate (2) is provided at the bottom of the placement plate (1), and a square groove (3) is provided on the surface of the connecting plate (2), a baffle (4) is fixedly connected to one side of the bottom of the connecting plate (2), and a connecting block (5) is fixedly connected to one side of the connecting plate (2), and a cooling component (6) for reducing the temperature is sleeved inside the connecting block (5); The cooling assembly (6) comprises a water cylinder (61) sleeved inside the connecting block (5), and the surface of the water cylinder (61) is provided with an embedding groove (62), and a semiconductor cooling sheet (63) is arranged inside the embedding groove (62), and the cooling end of the semiconductor cooling sheet (63) is in contact with the inner bottom surface of the embedding groove (62), and the surface of the semiconductor cooling sheet (63) is electrically connected to a temperature controller (64), and the surface of the temperature controller (64) is electrically connected to a storage battery (65).

2. A cooling device for SMT patch processing according to claim 1, characterized in that: A chain water pipe (7) is arranged inside the square groove (3), and one end of the chain water pipe (7) passes through one side of the connecting plate (2) and is connected to one end of the water cylinder (61), while the other end of the chain water pipe (7) passes through the other side of the connecting plate (2) and is connected to a water pump (8).

3. A cooling device for SMT patch processing according to claim 2, characterized in that: The bottom of the water pump (8) is connected to an L-tube (9), one end of the L-tube (9) is connected to a box body (10), a water tank (11) is sleeved inside the box body (10), and one side of the water tank (11) is connected to a first connecting tube (12), and the first connecting tube (12) is connected to the L-tube (9).

4. A cooling device for SMT patch processing according to claim 3, characterized in that: The water tank (11) is sleeved with a grid plate (13) inside, and a plurality of water holes (14) are provided in a rectangular array inside the grid plate (13).

5. A cooling device for SMT patch processing according to claim 4, characterized in that: The other side of the water tank (11) is connected to a second connecting pipe (15), and one end of the second connecting pipe (15) passes through one side of the box body (10) and is connected to a hose (16), and one end of the hose (16) is connected to the other end of the water cylinder (61).

6. A cooling device for SMT patch processing according to claim 3, characterized in that: The surface of the box (10) is provided with fan slots in an axisymmetric manner, and a heat dissipation fan (17) is embedded in the fan slots.

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