Low-temperature condensing device for producing chemical reagent additive
By using a low-temperature condensation device in the production of chemical reagent additives, using semiconductor refrigeration sheets to cool down and speed up the condensation speed by controlling air circulation, the problem of low condensation efficiency in high-temperature environments is solved, and a more efficient condensation effect is achieved.
Patent Information
- Application Number
- CN202421478247.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-26
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2034-06-26
AI Technical Summary
During the production process of chemical reagent additives, the high temperature around the test tube will lead to poor results in the method of speeding up the condensation speed by accelerating the air flow rate, affecting the condensation efficiency.
A low-temperature condensation device is adopted, which includes a condensing box, a semiconductor refrigeration sheet, a test tube rack and a hair dryer/exhaust fan. The cooling is reduced by the semiconductor refrigeration sheet, and the air circulation is controlled through the hair dryer and the exhaust fan, forming a circulating circulation to accelerate the condensation speed.
It effectively accelerates the condensation speed of chemical reagents, avoids the problem of poor condensation effect caused by accelerating the air flow rate in high temperature environments, and improves the condensation efficiency.
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Figure CN222783955U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of chemical reagent production, and in particular to a low-temperature condensation device for producing chemical reagent additives. Background Art
[0002] Chemical reagent additives are a type of auxiliary chemicals used in medicine and industrial production that can promote reaction speed, increase production efficiency or improve product performance. Common chemical reagent additives include catalysts, surfactants and stabilizers. The use of chemical reagent additives can optimize chemical processes, improve product performance and quality, and promote technological progress and innovation. In the process of producing and processing chemical reagent additives, it is usually necessary to condense the chemical reagent additives.
[0003] In the related art, during the production of chemical reagent additives, the test tubes containing the chemical reagent additives are usually kept stationary to wait for the condensation of the chemical reagent additives. However, since the air flow rate around the test tubes is slow, the condensation time of the chemical reagent additives inside the test tubes is longer. Therefore, during the condensation of the chemical reagent additives, the staff adds fans around the test tubes to speed up the flow of air near the test tubes to speed up the condensation speed of the chemical reagent additives inside the test tubes. However, when the temperature around the test tubes is high, this method of speeding up the condensation speed by speeding up the air flow rate may result in poor condensation effect.
[0004] Therefore, those skilled in the art provide a low-temperature condensation device for producing chemical reagent additives to solve the problems raised in the above-mentioned background technology. Utility Model Content
[0005] In order to solve the problem raised in the above background technology that when the temperature around the test tube is high, the method of accelerating the condensation speed by increasing the air flow rate may lead to poor condensation effect, the present application provides a low-temperature condensation device for the production of chemical reagent additives.
[0006] The present application provides a low temperature condensation device for producing chemical reagent additives, which adopts the following technical solution:
[0007] A low-temperature condensation device for producing chemical reagent additives comprises a condensation box, a semiconductor refrigeration sheet is fixedly connected to the bottom of the condensation box, a test tube rack is placed inside the condensation box, a plurality of chemical test tubes are evenly placed on the test tube rack, a through cavity is opened inside the condensation box, two ends of the through cavity are respectively connected to a first through hole and a second through hole opened on both sides of the inner wall of the condensation box, a hair dryer and an exhaust fan, the hair dryer is located inside the first through hole, and the exhaust fan is located inside the second through hole, so as to control the air circulation inside the condensation box.
[0008] By adopting the above technical solution, chemical test tubes containing chemical reagent additives are placed on a test tube rack and placed inside a condensation box. The inside of the condensation box can be cooled by a semiconductor refrigeration sheet. By starting the hair dryer and the exhaust fan, the air inside the condensation box can be controlled to circulate through the through cavity, the first through hole, the test tube rack and the second through hole, thereby accelerating the condensation speed of the chemical reagent additives inside the chemical test tubes.
[0009] Preferably, the condensing box comprises a rectangular box, the through cavity, the first through hole and the second through hole are all opened inside the rectangular box, a protective cover is placed on the upper surface of the rectangular box, a plurality of supporting legs are evenly and fixedly connected to the lower surface of the rectangular box, a storage groove is opened on the lower surface of the rectangular box, and the semiconductor refrigeration plate is located inside the storage groove.
[0010] By adopting the above technical scheme, when the protective cover is closed, the space inside the rectangular box can be isolated from the outside, the storage groove can limit the installation position of the semiconductor cooling plate, and a certain supporting effect can be played on the bottom of the rectangular box through a number of supporting legs, which can facilitate the heat dissipation of the semiconductor cooling plate.
[0011] Preferably, the test tube rack includes a base plate, the bottom ends of several chemical test tubes are located inside the base plate, several support bars are evenly fixedly connected to the upper surface of the base plate, several upper end surfaces of the support bars are fixedly connected to a placement plate, several chemical test tubes pass through the placement plate, and a handle is fixedly connected to the upper surface of the placement plate.
[0012] By adopting the above technical solution, the bottom plate can limit the placement position of the bottom of the chemical test tube, the position between the bottom plate and the placement plate can be limited by a plurality of support bars, the placement plate can limit the placement position of the chemical test tube, and the handle can facilitate personnel to take and place the test tube rack from the inside of the condensation box.
[0013] Preferably, a heat conducting sheet is fixedly connected to the lower surface of the semiconductor refrigeration sheet, and a plurality of heat dissipating fins are evenly and fixedly connected to the lower surface of the heat conducting sheet.
[0014] By adopting the above technical solution, the heat conducting sheet can conduct the heat emitted by the semiconductor cooling sheet to several heat dissipating fins to accelerate the heat dissipation speed of the semiconductor cooling sheet.
[0015] Preferably, a liquid inlet pipe communicating with the through cavity is fixedly connected to one side of the rectangular box, a cooling liquid is arranged inside the through cavity, and a liquid discharge pipe communicating with the through cavity is fixedly connected to the other side of the rectangular box.
[0016] By adopting the above technical solution, the liquid inlet pipe can add cooling liquid into the interior of the through cavity, the cooling liquid can enhance the cooling effect on the interior of the rectangular box, and the cooling liquid can be discharged to the outside through the liquid discharge pipe.
[0017] Preferably, a protruding block is fixedly connected to the lower surface of the protective cover, and the protruding block is located inside the rectangular box. A sealing gasket is fixedly connected to the lower surface of the protective cover, and the sealing gasket is located outside the protruding block.
[0018] By adopting the above technical solution, when the protective cover is closed, the protruding block can be located inside the rectangular box, and the sealing gasket can be located between the contact surface of the protective cover and the rectangular box, thereby enhancing the sealing effect between the protective cover and the rectangular box.
[0019] In summary, this application includes the following beneficial technical effects:
[0020] 1. The low-temperature condensation device for the production of chemical reagent additives has a test tube rack for placing chemical test tubes containing chemical reagent additives and placing them inside a condensation box. The semiconductor refrigeration sheet can cool the inside of the condensation box. The blower and the exhaust fan can be started to control the air inside the condensation box to circulate through the cavity, the first through hole, the test tube rack and the second through hole, thereby accelerating the condensation speed of the chemical reagent additive inside the chemical test tube, and avoiding as much as possible the situation where the method of accelerating the condensation speed by accelerating the air flow speed is ineffective due to the high temperature around the chemical test tube;
[0021] 2. The low-temperature condensation device for the production of chemical reagent additives has a protective cover that, when closed, can have the protruding block located inside the rectangular box, and the sealing gasket located between the contact surface of the protective cover and the rectangular box, thereby enhancing the sealing effect between the protective cover and the rectangular box. The storage groove can limit the installation position of the semiconductor cooling sheet, and can provide a certain support to the bottom of the rectangular box through a plurality of supporting legs, which can facilitate the heat dissipation of the semiconductor cooling sheet. The heat conducting sheet can conduct the heat emitted by the semiconductor cooling sheet to a plurality of heat dissipation fins to accelerate the heat dissipation speed of the semiconductor cooling sheet.
[0022] 3. The low-temperature condensation device for producing chemical reagent additives can add cooling liquid to the inside of the through cavity through the opened liquid inlet pipe, and the cooling liquid can enhance the cooling effect on the inside of the rectangular box. The cooling liquid can be discharged to the outside through the discharge pipe, so that personnel can transport the application. The bottom plate can limit the placement position of the bottom of the chemical test tube, and the position between the bottom plate and the placement plate can be limited by a number of support bars. The placement plate can limit the placement position of the chemical test tube, and the handle can facilitate personnel to take and place the test tube rack from the inside of the condensation box. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1This is a schematic cross-sectional view of a low-temperature condensation device for producing chemical reagent additives in an embodiment of the present application;
[0024] Figure 2 This is a schematic structural diagram of a low-temperature condensation device for producing chemical reagent additives in an embodiment of the present application;
[0025] Figure 3 This is a low temperature condensation device for producing chemical reagent additives in the embodiment of the present application. Figure 2 A schematic diagram of the structure enlargement at point A;
[0026] Figure 4 It is a schematic diagram of the test tube rack structure of a low-temperature condensation device for producing chemical reagent additives in an embodiment of the present application.
[0027] Explanation of the reference numerals: 1. Condensation box; 101. Rectangular box; 102. Protective cover; 103. Support leg; 104. Storage slot; 2. Test tube rack; 201. Bottom plate; 202. Support bar; 203. Placement plate; 204. Handle; 3. Chemical test tube; 4. Semiconductor refrigeration plate; 5. Through cavity; 6. First through hole; 7. Second through hole; 8. Cooling liquid; 9. Liquid inlet pipe; 10. Liquid discharge pipe; 11. Hair dryer; 12. Exhaust fan; 13. Protrusion; 14. Sealing pad; 15. Heat conductive plate; 16. Heat sink fin. DETAILED DESCRIPTION
[0028] The following is combined with Figure 1-4 This application is described in further detail.
[0029] The present application discloses a low temperature condensation device for producing chemical reagent additives. Figure 1 , Figure 2 and Figure 3 A low-temperature condensation device for producing chemical reagent additives comprises a condensation box 1, a semiconductor refrigeration sheet 4 is fixedly connected to the bottom of the condensation box 1, a test tube rack 2 is placed inside the condensation box 1, a number of chemical test tubes 3 are evenly placed on the test tube rack 2, a through cavity 5 is opened inside the condensation box 1, and the two ends of the through cavity 5 are respectively connected with a first through hole 6 and a second through hole 7 opened on both sides of the inner wall of the condensation box 1, a hair dryer 11 and an exhaust fan 12, the hair dryer 11 is located inside the first through hole 6, and the exhaust fan 12 is located inside the second through hole 7, so as to control the air circulation inside the condensation box 1.
[0030] In this embodiment, the semiconductor refrigeration sheet 4 provided in the low-temperature condensation device for producing chemical reagent additives can cool the interior of the condensation box 1. The interior of the condensation box 1 is used to place a test tube rack 2. The test tube rack 2 is used to place a chemical test tube 3 containing chemical reagent additives. The test tube rack 2 can prevent the chemical test tube 3 from tilting, so that when the present application is in use, the condensation box 1 can isolate the internal and external air. The semiconductor refrigeration sheet 4 makes the air temperature inside the condensation box 1 lower than the air temperature outside the condensation box 1. By placing the chemical test tube 3 containing the chemical reagent additive into the interior of the condensation box 1, the condensation speed of the chemical reagent additive inside the chemical test tube 3 can be accelerated to achieve the effect of low-temperature condensation of the chemical reagent additive. Furthermore, a through cavity 5 is opened inside the condensation box 1 to A first through hole 6 and a second through hole 7 are provided on both sides of the inner wall of the condensation box 1 and are connected to the through cavity 5. The through cavity 5 is located between the semiconductor refrigeration sheet 4 and the test tube rack 2. A hair dryer 11 is provided inside the first through hole 6, and an exhaust fan 12 is provided inside the second through hole 7. The hair dryer 11 and the exhaust fan 12 are respectively located on both sides of the test tube rack 2. When the hair dryer 11 and the exhaust fan 12 are started, the air inside the condensation box 1 can be controlled to circulate through the through cavity 5, the first through hole 6, the test tube rack 2 and the second through hole 7, so that the condensation speed of the chemical reagent additive inside the chemical test tube 3 can be accelerated again, and the situation in which the method of accelerating the condensation speed by accelerating the air flow speed is not effective due to the high temperature around the chemical test tube 3 can be avoided as much as possible, so that the present application can be more conducive to practical use.
[0031] In a further preferred embodiment of the present invention, Figure 1 and Figure 2 As shown, the condensing box 1 includes a rectangular box 101, the through cavity 5, the first through hole 6 and the second through hole 7 are all opened inside the rectangular box 101, a protective cover 102 is placed on the upper surface of the rectangular box 101, a plurality of supporting legs 103 are evenly and fixedly connected to the lower surface of the rectangular box 101, a storage groove 104 is opened on the lower surface of the rectangular box 101, and the semiconductor refrigeration plate 4 is located inside the storage groove 104.
[0032] In this embodiment, the protective cover 102 can be opened and closed as needed. When the protective cover 102 is closed, the space inside the rectangular box 101 can be isolated from the outside. The storage slot 104 can limit the installation position of the semiconductor refrigeration plate 4. The several supporting legs 103 can provide a certain support for the bottom of the rectangular box 101, leaving a certain space between the lower surface of the rectangular box 101 and the placement surface, thereby facilitating the heat dissipation of the semiconductor refrigeration plate 4.
[0033] In a further preferred embodiment of the present invention, Figure 2As shown, a liquid inlet pipe 9 communicating with the through cavity 5 is fixedly connected to one side of the rectangular box 101 , a cooling liquid 8 is arranged inside the through cavity 5 , and a liquid discharge pipe 10 communicating with the through cavity 5 is fixedly connected to the other side of the rectangular box 101 .
[0034] In this embodiment, cooling liquid 8 can be added to the interior of the through cavity 5 through the liquid inlet pipe 9. The cooling liquid 8 can be a low-temperature liquid. The cooling effect on the interior of the rectangular box 101 can be enhanced through the cooling liquid 8, and the cooling liquid 8 can be continuously cooled by starting the semiconductor refrigeration plate 4 to maintain the temperature of the cooling liquid 8. The drain pipe 10 and the inlet pipe 9 are fixedly installed with a control water valve. The cooling liquid 8 can be discharged outward through the drain pipe 10 to facilitate personnel to transport this application, and through the cooperation of the inlet pipe 9 and the drain pipe 10, the cooling liquid 8 can also be circulated to the interior of the through cavity 5, which can further enhance the cooling effect on the interior of the rectangular box 101. It should be noted that when adding the cooling liquid 8, a cavity for air circulation needs to be reserved inside the through cavity 5.
[0035] In a further preferred embodiment of the present invention, Figure 2 As shown, a protruding block 13 is fixedly connected to the lower surface of the protective cover 102 , and the protruding block 13 is located inside the rectangular box 101 . A sealing gasket 14 is fixedly connected to the lower surface of the protective cover 102 , and the sealing gasket 14 is located outside the protruding block 13 .
[0036] In this embodiment, when the protective cover 102 is closed, the protruding block 13 can be located inside the rectangular box 101, and the sealing gasket 14 can be located between the contact surfaces of the protective cover 102 and the rectangular box 101, thereby enhancing the sealing effect after the protective cover 102 and the rectangular box 101 are closed.
[0037] In a further preferred embodiment of the present invention, Figure 2 and Figure 4 As shown, the test tube rack 2 includes a bottom plate 201, the bottom ends of several chemical test tubes 3 are all located inside the bottom plate 201, several support bars 202 are evenly fixedly connected to the upper surface of the bottom plate 201, the upper end surfaces of several support bars 202 are fixedly connected to a placement plate 203, several chemical test tubes 3 all penetrate the placement plate 203, and a handle 204 is fixedly connected to the upper surface of the placement plate 203.
[0038] In this embodiment, a plurality of hemispherical grooves evenly arranged on the bottom plate 201 can limit the placement position of the bottom of the chemical test tube 3, a plurality of support bars 202 can limit the position between the bottom plate 201 and the placement plate 203, and the placement plate 203 can limit the placement position of the chemical test tube 3, thereby enhancing the stability of the chemical test tube 3 when placed, and the handle 204 can facilitate personnel to take and place the test tube rack 2 from the inside of the condensation box 1.
[0039] In a further preferred embodiment of the present invention, Figure 2 and Figure 3 As shown, a heat conducting sheet 15 is fixedly connected to the lower surface of the semiconductor cooling sheet 4 , and a plurality of heat dissipating fins 16 are evenly and fixedly connected to the lower surface of the heat conducting sheet 15 .
[0040] In this embodiment, the heat conducting sheet 15 may be made of copper sheet, and the heat emitted by the semiconductor cooling sheet 4 can be conducted to the plurality of heat dissipating fins 16 through the heat conducting sheet 15 , thereby accelerating the heat dissipation speed of the semiconductor cooling sheet 4 .
[0041] The implementation principle of a low-temperature condensation device for producing chemical reagent additives in the embodiment of the present application is as follows:
[0042] When in use, the chemical test tube 3 containing the chemical reagent auxiliary is placed on the test tube rack 2 and placed inside the condensation box 1. The condensation box 1 is used to isolate the internal and external air. The semiconductor refrigeration sheet 4 is used to make the air temperature inside the condensation box 1 lower than the air temperature outside the condensation box 1. The hair dryer 11 and the exhaust fan 12 are started to control the air inside the condensation box 1 to circulate through the cavity 5, the first through hole 6, the test tube rack 2 and the second through hole 7, so as to accelerate the condensation speed of the chemical reagent auxiliary inside the chemical test tube 3, and can avoid as much as possible the situation that the method of accelerating the condensation speed by accelerating the air flow speed is not effective due to the high temperature around the chemical test tube 3, so that the present application can be more conducive to practical use.
[0043] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A low temperature condensation device for producing chemical reagent additives, comprising a condensation box (1), characterized in that: A semiconductor refrigeration sheet (4) is fixedly connected to the bottom of the condensation box (1); A test tube rack (2) is placed inside the condensation box (1), and a plurality of chemical test tubes (3) are evenly placed on the test tube rack (2); A through cavity (5) is provided inside the condensation box (1), and two ends of the through cavity (5) are respectively connected to a first through hole (6) and a second through hole (7) provided on both sides of the inner wall of the condensation box (1); A blower (11) and an exhaust fan (12), wherein the blower (11) is located inside the first through hole (6), and the exhaust fan (12) is located inside the second through hole (7), so as to control the air circulation inside the condensation box (1).
2. A low temperature condensation device for producing chemical reagent additives according to claim 1, characterized in that: The condensing box (1) comprises a rectangular box (101), the through cavity (5), the first through hole (6) and the second through hole (7) are all opened inside the rectangular box (101), a protective cover (102) is placed on the upper surface of the rectangular box (101), a plurality of supporting legs (103) are evenly and fixedly connected to the lower surface of the rectangular box (101), a storage groove (104) is opened on the lower surface of the rectangular box (101), and the semiconductor refrigeration plate (4) is located inside the storage groove (104).
3. The low temperature condensation device for producing chemical reagent additives according to claim 1, characterized in that: The test tube rack (2) comprises a bottom plate (201), the bottom ends of the plurality of chemical test tubes (3) are all located inside the bottom plate (201), the upper surface of the bottom plate (201) is evenly and fixedly connected with a plurality of support bars (202), the upper end surfaces of the plurality of support bars (202) are fixedly connected with a placement plate (203), the plurality of chemical test tubes (3) all pass through the placement plate (203), and the upper surface of the placement plate (203) is fixedly connected with a handle (204).
4. The low temperature condensation device for producing chemical reagent additives according to claim 1, characterized in that: A heat conducting sheet (15) is fixedly connected to the lower surface of the semiconductor cooling sheet (4), and a plurality of heat dissipating fins (16) are evenly and fixedly connected to the lower surface of the heat conducting sheet (15).
5. The low temperature condensation device for producing chemical reagent additives according to claim 2, characterized in that: A liquid inlet pipe (9) communicating with the through cavity (5) is fixedly connected to one side of the rectangular box (101), a cooling liquid (8) is provided inside the through cavity (5), and a liquid discharge pipe (10) communicating with the through cavity (5) is fixedly connected to the other side of the rectangular box (101).
6. A low temperature condensation device for producing chemical reagent additives according to claim 2, characterized in that: The lower surface of the protective cover (102) is fixedly connected to a protruding block (13), and the protruding block (13) is located inside the rectangular box (101). The lower surface of the protective cover (102) is fixedly connected to a sealing gasket (14), and the sealing gasket (14) is located outside the protruding block (13).