Movement and thermal imager

Abstract

The utility model discloses a machine core and a thermal imager, the machine core is applied to the thermal imager, the thermal imager comprises a housing, and the machine core is arranged in the housing. The machine core comprises a circuit board and a heat dissipation piece which are fixedly installed in a shell, and the heat dissipation piece is respectively connected with the circuit board and the shell in a heat conduction mode. According to the thermal imager, through the design of the heat dissipation piece, on the premise that the size, heat and power consumption of the thermal imager are not increased, heat generated on the machine core circuit board can be conducted to the shell through the heat dissipation piece, and then heat is dissipated outwards through the shell. The heat gathered in the internal space of the thermal imager is quickly and timely diffused, so that the thermal interference generated by the internal heat of the machine core and the thermal imager can be properly reduced, the thermal imager is ensured to capture effective infrared radiation signals, the imaging definition and accuracy are improved, the internal temperature rise level of the thermal imager can be effectively controlled, and the imaging quality is improved. And the movement and the thermal imager are ensured to work normally in an environment with relatively high external air temperature.

Description

Technical Field

[0001] The utility model belongs to the technical field of thermal imagers, and in particular relates to a movement and a thermal imager. Background Art

[0002] A thermal imager is a device that uses infrared thermal imaging technology to detect infrared radiation emitted by an object and convert it into a visible image. With the development of technology, thermal imagers have been used more and more widely. The core component of a thermal imager is the infrared detector, which is responsible for receiving and converting infrared radiation emitted by an object into an electrical signal. If the internal heat dissipation of the thermal imager is not good, the temperature of the infrared detector may rise, affecting its sensitivity and response speed. This will cause the infrared radiation signal captured by the thermal imager to deviate, which in turn affects the clarity and accuracy of the imaging. Therefore, the thermal imager needs to be heat-dissipated. Secondly, the infrared detector and the components on the internal circuit board of the thermal imager have a certain normal operating temperature range. If the internal temperature of the thermal imager is too high, it will not work properly.

[0003] In the prior art, active heat dissipation components such as built-in fans or heat pipes are used to increase air flow, heat radiation and conduction inside the thermal imager to improve heat dissipation efficiency. For explosion-proof thermal imagers with sealed shells, heat conduction is the most economical, direct and effective method. Heat radiation and air convection have limited effects on heat dissipation inside the shell. Other methods may increase the power consumption of the thermal imager, create unnecessary noise, and even increase the size and weight, which is also not economical.

[0004] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to a person skilled in the art. Utility Model Content

[0005] The utility model aims to provide a movement and a thermal imager, which can diffuse the heat generated inside the thermal imager without increasing the volume, heat and power consumption of the thermal imager, thereby improving the clarity and accuracy of imaging.

[0006] In order to achieve the above purpose, the technical solution provided by a specific embodiment of the utility model is as follows:

[0007] A movement is applied to a thermal imager, the thermal imager comprises a shell, the movement is arranged in the shell, the movement comprises a circuit board and a heat sink fixedly installed in the shell, the heat sink is thermally connected to the circuit board and the shell respectively.

[0008] In one or more embodiments of the present utility model, the heat sink includes a main body portion thermally connected to the circuit board, a first heat sink portion arranged beside the main body portion, and a second heat sink portion arranged between the main body portion and the shell, the main body portion is thermally connected to the circuit board, and the first heat sink portion and / or the second heat sink portion are thermally connected to the shell.

[0009] In one or more embodiments of the present invention, the first heat dissipation portion includes a first connecting plate connected to the main body, a plurality of first heat sinks spaced apart on the first connecting plate, and a first ring plate connecting the plurality of first heat sinks, the first heat sinks extending away from the circuit board, and the first ring plate being thermally connected to the shell.

[0010] In one or more embodiments of the present invention, a plurality of through slots are arranged at intervals along the length direction of the first heat sink.

[0011] In one or more embodiments of the present invention, the second heat dissipation portion includes a second connecting plate connected to the main body, a plurality of second heat sinks spaced apart on the second connecting plate, and a second ring plate connecting the plurality of second heat sinks, the second heat sinks extending away from the circuit board, and the second ring plate being thermally connected to the shell.

[0012] In one or more embodiments of the present invention, a plurality of grooves are arranged on the inner wall of the second ring plate at intervals along the circumferential direction.

[0013] In one or more embodiments of the present invention, a heat conducting member is provided between the outer wall of the first heat dissipation portion and / or the outer wall of the second heat dissipation portion and the inner wall of the shell.

[0014] In one or more embodiments of the present invention, the heat conducting member is heat conducting silicone.

[0015] In one or more embodiments of the present invention, the circuit board includes a body and a mounting post disposed on the body, the mounting post is thermally connected to a heat sink, and the heat sink is fixedly mounted on the mounting post via a fixing member.

[0016] Another specific embodiment of the present invention provides a technical solution as follows:

[0017] A thermal imager comprises the aforementioned movement.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] The utility model provides a movement and a thermal imager. Through the design of a heat sink, the heat generated on the circuit board can be conducted to the shell through the heat sink, and then the heat is dissipated outwardly through the shell without increasing the volume, heat and power consumption of the thermal imager, so that the heat accumulated in the internal space of the thermal imager can be quickly and timely diffused, which can not only appropriately reduce the thermal interference generated by the internal heat of the movement and the thermal imager, ensure that the thermal imager captures effective infrared radiation signals, and improve the clarity and accuracy of imaging, but also effectively control the internal temperature rise level of the thermal imager, and ensure that the movement and the thermal imager work normally in an environment with a high external temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 This is a schematic diagram of the three-dimensional structure of the movement in the first embodiment of the utility model arranged in the housing;

[0022] Figure 2 It is a three-dimensional structural schematic diagram of the movement in the first embodiment of the utility model;

[0023] Figure 3 It is a schematic diagram of the three-dimensional structure of the heat sink in the first embodiment of the utility model;

[0024] Figure 4 for Figure 1 A magnified view of the local structure at point A.

[0025] Description of main reference numerals:

[0026] Shell 1;

[0027] Movement 2; circuit board 21; body 211; mounting column 212; heat sink 22; body 221; first heat sink 222; first connecting plate 2221; first heat sink 2222; through groove 22221; first ring plate 2223; second heat sink 223; second connecting plate 2231; second heat sink 2232; second ring plate 2233; groove 22331;

[0028] Fixing member 3;

[0029] Heat conducting member 4. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0031] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0032] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0033] The technical solution of the present utility model will be described below in conjunction with the accompanying drawings.

[0034] Embodiment 1:

[0035] Reference Figure 1 As shown, the movement 2 in this embodiment is applied to a thermal imager, which includes a housing 1, and the movement 2 is arranged in the housing 1. The movement 2 includes a circuit board 21 and a heat sink 22 fixedly installed in the housing 1, and the heat sink 22 is thermally connected to the circuit board 21 and the housing 1 respectively.

[0036] The movement 2 is installed in the thermal imager. During the use of the thermal imager, through the design of the heat sink 22, the heat generated on the circuit board 21 can be conducted to the housing 1 through the heat sink 22 without increasing the volume, heat, and power consumption of the thermal imager, and then dissipated outwardly through the housing 1, thereby quickly and timely diffusing the heat accumulated in the internal space of the thermal imager, which can not only appropriately reduce the thermal interference generated by the heat inside the movement and the thermal imager, ensure that the thermal imager captures effective infrared radiation signals, and improve the clarity and accuracy of imaging, but also effectively control the internal temperature rise level of the thermal imager, ensure that the movement and the thermal imager work normally in an environment with a high external temperature, and avoid the generation of noise, with high economy.

[0037] In order to install the heat sink 22 on the circuit board 21 so that the heat sink 22 is disposed in the housing 1, while ensuring the heat conduction connection effect between the heat sink 22 and the circuit board 21, refer to Figure 2As shown, the circuit board 21 in this embodiment includes a body 211 and a mounting post 212 disposed on the body 211, the mounting post 212 is thermally connected to the heat sink 22, and the heat sink 22 is fixedly mounted on the mounting post 212 through a fixing member 3. The fixing member 3 can be a structure such as a pin, a screw, or a bolt for fixing and connecting two parts.

[0038] Reference Figure 2 , Figure 3 As shown, the heat sink 22 in this embodiment includes a main body 221 thermally connected to the circuit board 21, a first heat sink 222 disposed beside the main body 221, and a second heat sink 223 disposed between the main body 221 and the housing 1. The main body 221 is thermally connected to the circuit board 21, and the first heat sink 222 and the second heat sink 223 are both thermally connected to the housing 1. According to this design, the heat generated on the circuit board 21 can pass through the main body 221, and then be conducted to the first heat sink 222 and the second heat sink 223, and then be conducted to the housing 1, so that the thermal imager can be timely heat-conducted and heat-dissipated through natural convection between the housing 1 and the outside air.

[0039] Of course, in other embodiments, one of the first heat sink 22 and the second heat sink 22 is thermally connected to the housing 1 , which can also quickly transfer the heat of the circuit board 21 to the housing 1 to achieve the purpose of heat dissipation.

[0040] Specifically, refer to Figure 3 As shown, the first heat dissipation part 222 in this embodiment includes a first connecting plate 2221 connected to the main body 221, a plurality of first heat sinks 2222 spaced apart on the first connecting plate 2221, and a first ring plate 2223 connecting the plurality of first heat sinks 2222, the first heat sinks 2222 extending away from the circuit board 21, and the first ring plate 2223 being thermally connected to the housing 1. The thickness of the first ring plate 2223 determines the size of the thermally conductive connection area between the first heat dissipation part 222 and the housing 1, and when the thickness of the first ring plate 2223 is greater than the thickness of the first connecting plate 2221, the thermally conductive connection area between the first heat dissipation part 222 and the housing 1 is increased, thereby improving the thermally conductive connection effect between the first heat dissipation part 222 and the housing 1.

[0041] Further, refer to Figure 3 As shown, the first heat sink 2222 in this embodiment is provided with a plurality of through slots 22221 at intervals along its length direction. The exemplary through slots 22221 are provided with three. Of course, in other embodiments, the through slots 22221 may be provided with one, two, or more than three. The design of the through slots 22221 can increase the outer surface area of ​​the first heat dissipation portion 222, so as to improve the heat conduction efficiency and heat dissipation efficiency of the heat sink 22.

[0042] Specifically, refer to Figure 3 As shown, the second heat dissipation part 223 in this embodiment includes a second connecting plate 2231 connected to the main body 221, a plurality of second heat sinks 2232 spaced apart on the second connecting plate 2231, and a second ring plate 2233 connecting the plurality of second heat sinks 2232, the second heat sinks 2232 extending away from the circuit board 21, and the second ring plate 2233 being thermally connected to the housing 1. The thickness of the second ring plate 2233 determines the size of the thermally conductive connection area between the second heat dissipation part 223 and the housing 1, and when the thickness of the second ring plate 2233 is greater than the thickness of the second connecting plate 2231, the thermally conductive connection area between the second heat dissipation part 223 and the housing 1 is increased, thereby improving the thermally conductive connection effect between the second heat dissipation part 223 and the housing 1.

[0043] In order to further expand the heat dissipation area and improve the heat conduction efficiency and heat dissipation efficiency of the heat dissipation element 22, refer to Figure 3 As shown, in this embodiment, a plurality of grooves 22331 are arranged at intervals along the circumferential direction on the inner wall of the second ring plate 2233. Since every two adjacent second heat sinks 2232 and second connecting plates 2231 can enclose and form a heat conducting groove, the heat conducting groove is connected with the grooves 22331, so as to conduct heat to the second ring plate 2233 faster and better, thereby conducting heat and dissipating heat in a timely manner.

[0044] In order to increase the heat conduction connection effect between the outer wall of the first heat dissipation part 222 and the outer wall of the second heat dissipation part 223 and the inner wall of the shell 1, so as to better conduct the heat on the first heat dissipation part 222 and the second heat dissipation part 223 to the shell 1, refer to Figure 4 As shown, in this embodiment, a heat conductor 4 is provided between the outer wall of the first heat dissipation part 222 and the outer wall of the second heat dissipation part 223 and the inner wall of the shell 1. Preferably, the heat conductor 4 in this embodiment is a thermally conductive silicone. Of course, the present application is not limited thereto, and the heat conductor 4 in other embodiments may also be a heat dissipation paste, or a thermally conductive silicone grease, or a silicone sheet, etc. In addition, when only a heat conductor 4 is provided between the outer wall of the first heat dissipation part 222 or the outer wall of the second heat dissipation part 223 and the inner wall of the shell 1, the thermal conductive connection effect between the heat dissipation part 22 and the shell 1 can also be increased.

[0045] Embodiment 2:

[0046] The thermal imager in this embodiment includes the movement in Embodiment 1. Through the design of the movement, the heat generated inside the thermal imager can be efficiently and timely diffused to improve the clarity and accuracy of imaging, and to avoid the generation of noise.

[0047] It can be seen from the above technical solutions that the utility model has the following beneficial effects:

[0048] The utility model provides a movement and a thermal imager. Through the design of a heat sink, the heat generated on the circuit board can be conducted to the shell through the heat sink, and then the heat is dissipated outwardly through the shell without increasing the volume, heat and power consumption of the thermal imager, so that the heat accumulated in the internal space of the thermal imager can be quickly and timely diffused, which can not only appropriately reduce the thermal interference generated by the internal heat of the movement and the thermal imager, ensure that the thermal imager captures effective infrared radiation signals, and improve the clarity and accuracy of imaging, but also effectively control the internal temperature rise level of the thermal imager, and ensure that the movement and the thermal imager work normally in an environment with a high external temperature.

[0049] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0050] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A movement, applied to a thermal imager, the thermal imager comprising a housing, the movement being arranged in the housing, characterized in that: The core comprises a circuit board and a heat sink fixedly mounted in the housing, and the heat sink is thermally connected to the circuit board and the housing respectively.

2. The movement according to claim 1, characterized in that: The heat sink includes a main body portion thermally connected to the circuit board, a first heat sink portion arranged beside the main body portion, and a second heat sink portion arranged between the main body portion and the shell. The main body portion is thermally connected to the circuit board, and the first heat sink portion and / or the second heat sink portion are thermally connected to the shell.

3. The movement according to claim 2, characterized in that: The first heat dissipation part includes a first connecting plate connected to the main body, a plurality of first heat sinks spaced apart on the first connecting plate, and a first ring plate connecting the plurality of first heat sinks, the first heat sinks extending away from the circuit board, and the first ring plate being thermally connected to the shell.

4. The movement according to claim 3, characterized in that: The first heat sink is provided with a plurality of through slots at intervals along the length direction thereof.

5. The movement according to claim 2, characterized in that: The second heat dissipation part includes a second connecting plate connected to the main body, a plurality of second heat sinks spaced apart on the second connecting plate, and a second ring plate connecting the plurality of second heat sinks, the second heat sinks extending away from the circuit board, and the second ring plate being thermally connected to the shell.

6. The movement according to claim 5, characterized in that: A plurality of grooves are arranged on the inner wall of the second ring plate at intervals along the circumferential direction.

7. The movement according to claim 2, characterized in that: A heat conducting member is provided between the outer wall of the first heat dissipation portion and / or the outer wall of the second heat dissipation portion and the inner wall of the shell.

8. The movement according to claim 7, characterized in that: The heat conducting member is heat conducting silica gel.

9. The movement according to claim 1, characterized in that: The circuit board comprises a body and a mounting post arranged on the body, the mounting post is thermally connected to a heat sink, and the heat sink is fixedly mounted on the mounting post via a fixing member.

10. A thermal imager, characterized in that: The thermal imager comprises the movement as claimed in any one of claims 1 to 9.

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