Source signal line routing structure, array substrate and display panel

Abstract

The utility model discloses a source signal line routing structure, an array substrate and a display panel. The source signal line routing structure comprises a source signal line, a test pad and an anti-static structure, the test pad is connected with the Source signal line through the anti-static structure, and when the test is not performed, the internal insulation of the anti-static structure is disconnected so as to prevent static electricity on the test pad from flowing into the Source signal line, and when the test needs to be performed, the internal of the anti-static structure is conducted and connected through laser melting. Through laser fusion conduction connection, static electricity is prevented from flowing into pixels of the display panel, and the problem of abnormal display caused by the static electricity of the display panel is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of display screen testing, and in particular to a source signal line routing structure, an array substrate and a display panel. Background Art

[0002] Thin Film Transistor Liquid Crystal Display (TFT LCD) is the mainstream display device in the current market due to its advantages such as light weight and low power consumption. The preparation process of the display panel usually includes an array substrate process, a color film substrate process and a cell process of the array substrate and the color film substrate.

[0003] With the continuous development of the display panel industry and the continuous improvement of panel technology, there are many signal test pads in the internal structure of the panel. These pads can capture the voltage, waveform and other data of various signals in the panel, and solve problems with the panel through analysis of these data.

[0004] Some of these signals are used only when the panel has problems. These pads connect the GIP circuit and pixel circuit of the panel. If these pads do not have an anti-static structure, static electricity from the pads may flow into the GIP and pixel circuits during the various panel tests, causing abnormal panel operation. Summary of the invention

[0005] The existing display screen test PAD has no anti-static structure, which causes the risk of abnormal operation of the display panel during the test process.

[0006] In view of the above problems, a source signal line routing structure, an array substrate and a display panel are proposed. An anti-static structure is set between the test pad and the source signal line. When no test is performed, the internal insulation of the anti-static structure is disconnected to prevent static electricity on the test pad from flowing into the Source signal line. When testing is required, the connection is made through laser melting to prevent static electricity from flowing into the pixels of the display panel, thereby solving the problem of display abnormality caused by static electricity on the display panel.

[0007] In a first aspect, a source signal line routing structure includes:

[0008] Source signal line;

[0009] Test pad;

[0010] Anti-static structure;

[0011] The test pad is connected to the Source signal line through the anti-static structure, and:

[0012] When no test is performed, the internal insulation of the anti-static structure is disconnected to prevent static electricity on the test pad from flowing into the Source signal line. When a test is required, the internal conduction connection of the anti-static structure is made through laser melting.

[0013] In combination with the source signal line routing structure described in the utility model, in a first possible implementation manner, the anti-static structure includes:

[0014] a first metal connection layer;

[0015] a first insulating layer;

[0016] a second metal connection layer;

[0017] The first insulating layer is disposed between the first metal connection layer and the second metal connection layer for insulation;

[0018] The first metal connection layer and the Source signal line are located in the same metal layer and connected;

[0019] The second metal connection layer and the test pad are located on the same metal layer and connected.

[0020] In combination with the first possible implementation manner of the utility model, in a second possible implementation manner, the first metal connection layer includes:

[0021] a first connecting portion;

[0022] The second metal connection layer comprises:

[0023] a second connecting portion;

[0024] The second connection portion overlaps with the first connection portion at intervals so as to be connected by laser melting during testing.

[0025] In combination with the source signal line routing structure described in the utility model, in a third possible implementation manner, the anti-static structure includes:

[0026] A third metal connection layer;

[0027] a second insulating layer;

[0028] a fourth metal connection layer;

[0029] The second insulating layer is disposed between the third metal connection layer and the fourth metal connection layer for insulation;

[0030] The third metal connection layer comprises:

[0031] The third connection part and the fourth connection part are disconnected;

[0032] The third connection part, the fourth connection part, the Source signal line, and the test pad are located on the same metal layer;

[0033] The third connection part and the fourth connection part are connected to the Source signal line and the test pad respectively.

[0034] In combination with the third possible implementation manner of the utility model, in a fourth possible implementation manner, the third connecting portion and the fourth connecting portion are partially overlapped with the fourth metal layer so as to be connected by laser melting during testing.

[0035] In combination with the source signal line routing structure described in the utility model, in a fifth possible implementation manner, the anti-static structure includes:

[0036] a fifth metal connection layer;

[0037] A third insulating layer;

[0038] The third insulating layer is located between the fifth metal connection layer and the Source signal line;

[0039] The fifth metal connection layer and the test pad are located on the same metal layer and connected to each other.

[0040] In combination with the fifth possible implementation manner of the utility model, in a sixth possible implementation manner, the Source signal line and the fifth metal connection layer are partially overlapped with each other so as to be connected by laser melting during testing.

[0041] In a second aspect, an array substrate adopts the source signal line routing structure described in the first aspect.

[0042] In a third aspect, a display panel comprises the array substrate described in the second aspect.

[0043] The source signal line routing structure, array substrate and display panel described in the utility model are implemented by setting an anti-static structure between the test pad and the source signal line. When no test is performed, the internal insulation of the anti-static structure is disconnected to prevent static electricity on the test pad from flowing into the Source signal line. When testing is required, the connection is made through laser melting to prevent static electricity from flowing into the pixels of the display panel, thereby solving the display abnormality problem caused by static electricity on the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0045] Figure 1 This is a schematic diagram of the existing source signal line routing structure;

[0046] Figure 2 This is a schematic diagram of the wiring structure of the source signal line in the utility model;

[0047] Figure 3 This is a schematic diagram of an anti-static structure embodiment 1 of a source signal line routing structure in the present utility model;

[0048] Figure 4 This is a schematic diagram of an anti-static structure embodiment 2 of a source signal line routing structure in the present utility model;

[0049] Figure 5 This is a schematic diagram of embodiment 3 of the anti-static structure of the source signal line routing structure in the present invention. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the utility model to clearly and completely describe the technical solution in the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, other embodiments obtained by ordinary technicians in this field without creative work are all within the scope of protection of the utility model.

[0051] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0052] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0053] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0054] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0055] The existing display screen test PAD 120 has no anti-static structure 130, so there is a risk that the display panel 100 may work abnormally during the panel test. Figure 1 , Figure 1 The schematic diagram of the existing source signal line 110 routing structure is shown in FIG. S1 is the Source signal line 110 of the first column of sub-pixels in the AA area, and S2160 is the Source signal line 110 of the 2160th column of sub-pixels in the AA area. The test pad 120 is overlapped on the Source signal line 110 through the same layer of metal material to capture the Source signal. However, the use of the same layer of metal to directly overlap the signal line 110 will cause static electricity on the pad 120 to flow into the pixel area, resulting in abnormal panel display.

[0056] In view of the above problems, a source signal line 110 routing structure, an array substrate and a display panel 100 are proposed.

[0057] Example 1

[0058] First, as Figure 2 , Figure 2 This is a schematic diagram of the routing structure of the source signal line 110 in the utility model, a routing structure of the source signal line 110, including a Source signal line 110, a test pad 120, and an anti-static structure 130; the test pad 120 is connected to the Source signal line 110 through the anti-static structure 130, and when no test is performed, the internal insulation of the anti-static structure 130 is disconnected to prevent static electricity on the test pad 120 from flowing into the Source signal line 110. When testing is required, the anti-static structure 130 is internally conductively connected by laser melting.

[0059] Preferably, if Figure 3 , Figure 3 This is a schematic diagram of Example 1 of the antistatic structure 130 of the routing structure of the source signal line 110 in the utility model; the antistatic structure 130 includes a first metal connection layer 131, a first insulating layer 133, and a second metal connection layer 132; the first insulating layer 133 is arranged between the first metal connection layer 131 and the second metal connection layer 132 for insulation; the first metal connection layer 131 and the Source signal line 110 are located in the same metal layer and are connected; the second metal connection layer 132 and the test pad 120 are located in the same metal layer and are connected.

[0060] Furthermore, the first metal connection layer 131 includes a first connection portion 1311 , and the second metal connection layer 132 includes a second connection portion 1321 ; the second connection portion 1321 overlaps with the first connection portion 1311 at intervals so as to be connected by laser melting during testing.

[0061] In this embodiment, the source signal line 110 and the test pad 120 are respectively located on the same metal layer as the corresponding metal layer and are insulated from each other by the first insulating layer 133. When testing is required, the first connection part 1311 and the second connection part 1321 are connected by laser melting.

[0062] Example 2

[0063] like Figure 4 , Figure 4 This is a schematic diagram of Example 2 of the antistatic structure 130 of the routing structure of the source signal line 110 in the utility model; the antistatic structure 130 includes a third metal connection layer, a second insulating layer 136, and a fourth metal connection layer 135; the second insulating layer 136 is arranged between the third metal connection layer and the fourth metal connection layer 135 for insulation; the third metal connection layer includes a disconnected third connection part 1341 and a fourth connection part 1342; the third connection and the fourth connection part 1342 are located in the same metal layer as the Source signal line 110 and the test pad 120; the third connection and the fourth connection part 1342 are connected to the Source signal line 110 and the test pad 120, respectively.

[0064] Furthermore, the third connection portion 1341 and the fourth connection portion 1342 are partially overlapped with the fourth metal layer so as to be connected by laser melting during testing.

[0065] In this embodiment, the source signal line 110 and the third metal connection layer are located in the same metal layer. The third metal connection layer includes a disconnected third connection portion 1341 and a fourth connection portion 1342, which partially overlap with the fourth metal connection layer 135. When testing is required, the overlapping portions are overlapped by laser melting.

[0066] The disconnected third connection part 1341 and the fourth connection part 1342 can block the inflow of static electricity and prevent the display panel 100 from abnormal problems. By setting the anti-static structure 130 between the test pad 120 and the source signal line 110, and when not testing, the internal insulation of the anti-static structure 130 is disconnected to prevent the static electricity on the test pad 120 from flowing into the Source signal line 110. When testing is required, the connection is made by laser melting to prevent static electricity from flowing into the pixels of the display panel 100, thereby solving the display abnormality problem caused by static electricity of the display panel 100.

[0067] Example 3

[0068] Preferably, if Figure 5 , Figure 5 The schematic diagram of the anti-static structure 130 of the source signal line 110 routing structure in the utility model is shown in Example 3. The anti-static structure 130 includes a fifth metal connection layer 137 and a third insulating layer 138; the third insulating layer 138 is located between the fifth metal connection layer 137 and the Source signal line 110; the fifth metal connection layer 137 and the test pad 120 are located in the same metal layer and connected.

[0069] Furthermore, the Source signal line 110 and the fifth metal connection layer 137 are partially overlapped with each other so as to be connected by laser melting during testing.

[0070] In this embodiment, the fifth metal connection layer 137 of the antistatic structure 130 is insulated from the metal layer where the source signal line 110 is located by the third insulating layer 138 to prevent static electricity from flowing in. When testing is required, the overlapping parts are overlapped by laser melting.

[0071] In a second aspect, an array substrate adopts the source signal line 110 routing structure of the first aspect.

[0072] In a third aspect, a display panel 100 includes the array substrate of the second aspect.

[0073] The source signal line 110 routing structure, array substrate and display panel 100 of the utility model are implemented by setting an anti-static structure 130 between the test pad 120 and the source signal line 110. When no test is performed, the internal insulation of the anti-static structure 130 is disconnected to prevent static electricity on the test pad 120 from flowing into the Source signal line 110. When testing is required, the connection is made through laser melting to prevent static electricity from flowing into the pixels of the display panel 100, thereby solving the display abnormality problem caused by static electricity in the display panel 100.

[0074] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A source signal line routing structure, characterized in that: include: Source signal line; Test pad; Anti-static structure; The test pad is connected to the Source signal line through the anti-static structure, and: When no test is performed, the internal insulation of the anti-static structure is disconnected to prevent static electricity on the test pad from flowing into the Source signal line. When a test is required, the internal conduction connection of the anti-static structure is made through laser melting.

2. The source signal line routing structure according to claim 1, characterized in that: The antistatic structure comprises: a first metal connection layer; a first insulating layer; a second metal connection layer; The first insulating layer is disposed between the first metal connection layer and the second metal connection layer for insulation; The first metal connection layer and the Source signal line are located in the same metal layer and connected; The second metal connection layer and the test pad are located on the same metal layer and connected.

3. The source signal line routing structure according to claim 2, characterized in that: The first metal connection layer comprises: a first connecting portion; The second metal connection layer comprises: a second connecting portion; The second connection portion overlaps with the first connection portion at intervals so as to be connected by laser melting during testing.

4. The source signal line routing structure according to claim 1, characterized in that: The antistatic structure comprises: A third metal connection layer; a second insulating layer; a fourth metal connection layer; The second insulating layer is disposed between the third metal connection layer and the fourth metal connection layer for insulation; The third metal connection layer comprises: The third connection part and the fourth connection part are disconnected; The third connection part, the fourth connection part, the Source signal line, and the test pad are located on the same metal layer; The third connection part and the fourth connection part are connected to the Source signal line and the test pad respectively.

5. The source signal line routing structure according to claim 4, characterized in that: The third connection portion and the fourth connection portion are partially overlapped with the fourth metal connection layer so as to be connected by laser melting during testing.

6. The source signal line routing structure according to claim 1, characterized in that: The antistatic structure comprises: a fifth metal connection layer; A third insulating layer; The third insulating layer is located between the fifth metal connection layer and the Source signal line; The fifth metal connection layer and the test pad are located on the same metal layer and connected to each other.

7. The source signal line routing structure according to claim 6, characterized in that: The Source signal line is partially overlapped with the fifth metal connection layer so as to be connected by laser melting during testing.

8. An array substrate, characterized in that: A source signal line routing structure as described in any one of claims 1 to 7 is adopted.

9. A display panel, characterized in that: Comprising the array substrate as claimed in claim 8.

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