Semiconductor tail gas treatment device and semiconductor process system

By designing a semiconductor exhaust gas treatment device, using purity analysis and recovery modules to efficiently process special process gases, the problems of waste and low efficiency in the prior art are solved, and efficient gas recovery and clean exhaust gas generation are achieved.

CN222785260UActive Publication Date: 2025-04-22SHANGHAI LONGWELL M & E CO LTD
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Patent Information

Application Number
CN202323510835.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-22
Publication Date
2025-04-22
Estimated Expiration
2033-12-22

AI Technical Summary

Technical Problem

In the prior art, there is a waste problem that special process gas is directly passed into the adsorption tank for reaction and absorption, and the efficiency of conveying gas through Venturi is low.

Method used

A semiconductor exhaust gas treatment device is designed, including a gas supply module, a purity analysis module, a recovery module, a exhaust gas treatment module and a exhaust emission module. The purity analysis module is used to detect the gas purity purity in real time, and if it meets the standards, it will be recycled and transported to the process chamber; if it does not meet the standards, it will be processed to obtain the clean exhaust gas.

Benefits of technology

It realizes efficient recycling and utilization of special process gases, reduces waste, improves gas delivery efficiency, and ensures the cleanliness and safety of the equipment through purge and pressure relief modules.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a semiconductor tail gas treatment device and a semiconductor process system. The semiconductor tail gas treatment device comprises a gas supply module, a purity analysis module, a recovery module, a tail gas treatment module and a tail gas emission module. The device has the advantages that the purity analysis module is communicated with the gas supply module, and the recovery module is added, so that the purity of the special process gas conveyed by the gas supply module can be detected in real time, and if the purity of the special process gas meets the standard, the special process gas can be recovered and conveyed to the process chamber.
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Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to a semiconductor tail gas treatment device and a semiconductor process system. Background Art

[0002] A variety of special gases are used in the semiconductor manufacturing process. These gases are often highly toxic, flammable, and explosive, which can easily cause poisoning of workers and damage to the atmospheric environment. To avoid these hazards, these gases must be treated to be harmless and meet national atmospheric emission standards before they can be discharged into the atmosphere.

[0003] In the prior art, the tail gas treatment scheme for special gases is mostly to draw the special process gas through a venturi to an adsorption tank of the tail gas treatment device for reaction absorption, and the harmless gas after the reaction is discharged into the EXHAUST (exhaust pipe); however, in the prior art, the special process gas is directly introduced into the adsorption tank for reaction absorption, which is relatively wasteful, and the special process gas can be reused for a second time; in addition, the special process gas is transported to the adsorption tank by a venturi, and its gas transportation efficiency is low.

[0004] At present, no effective solution has been proposed for the problems in the related technology, such as the wasteful method of directly introducing special process gas into the adsorption tank for reaction absorption and the low phase rate of the method of transporting special process gas to the adsorption tank by Venturi. Utility Model Content

[0005] The purpose of the utility model is to provide a semiconductor exhaust gas treatment device and a semiconductor process system in order to address the deficiencies in the prior art, so as to solve the problems existing in the related technology that the method of directly introducing special process gas into an adsorption tank for reaction absorption is relatively wasteful and the method of transporting special process gas to the adsorption tank by a venturi method has a low phase rate.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] The utility model provides an exhaust gas treatment device, comprising:

[0008] A gas supply module, the gas supply module is connected to the process gas source and is used to provide power for the delivery of special process gas;

[0009] A purity analysis module, which is in communication with the gas supply module and is used to perform purity analysis on special process gases;

[0010] A recovery module, the recovery module is connected to the gas supply module and the process chamber respectively, and is used for recovering the special process gas and delivering it to the process chamber when the purity of the special process gas monitored by the purity analysis module meets the standard;

[0011] An exhaust gas treatment module, the exhaust gas treatment module is connected to the gas supply module, and is used to process the special process gas to obtain clean exhaust gas when the purity of the special process gas monitored by the purity analysis module does not meet the standard;

[0012] An exhaust gas emission module is connected to the exhaust gas treatment module and is used to discharge clean exhaust gas.

[0013] In some of the embodiments, the gas supply module comprises:

[0014] A main supply line, a first end of which is connected to a process gas source and is used to obtain and transport special process gas;

[0015] a first supply branch pipeline, wherein a first end of the first supply branch pipeline is connected to a second end of the supply main pipeline, and a second end of the first supply branch pipeline is connected to the recovery module, and is used to transport the special process gas to the recovery module;

[0016] a second supply branch pipeline, wherein a first end of the second supply branch pipeline is connected to a second end of the supply main pipeline, and a second end of the second supply branch pipeline is connected to the tail gas treatment module, and is used for conveying special process gas to the tail gas treatment module;

[0017] A gas delivery pump, which is arranged on the main supply line and is used to provide power for the delivery of special process gases;

[0018] A first valve assembly is provided on the main supply line, the first supply branch line and the second supply branch line, and is used to control the flow of the main supply line, the first supply branch line and the second supply branch line.

[0019] In some of the embodiments, the gas supply module further comprises:

[0020] A bypass pipeline, the bypass pipeline is connected to the main supply pipeline, and the first end and the second end of the bypass pipeline are respectively located upstream and downstream of the gas delivery pump;

[0021] A second valve assembly is provided in the bypass line and is used to control the flow of the bypass line.

[0022] In some of the embodiments, the purity analysis module includes:

[0023] an analysis pipeline, a first end of which is in communication with the gas supply module and is used to obtain and deliver special process gas;

[0024] A purity analyzer, which is arranged on the analysis pipeline and is used to analyze the special process gas flowing into the analysis pipeline;

[0025] A third valve component is disposed in the analysis pipeline and is used to control the flow of the analysis pipeline.

[0026] In some of the embodiments, the recovery module comprises:

[0027] a recovery pipeline, a first end of which is in communication with the gas supply module and is used for conveying special process gas;

[0028] A recovery tank, the recovery tank being in communication with the second end of the recovery pipeline, and being used for recovering the special process gas when the purity of the special process gas monitored by the purity analysis module meets the standard;

[0029] An output pipeline, a first end of which is connected to the recovery tank, and a second end of which is connected to the process chamber, for transporting the special process gas in the recovery tank to the process chamber for reuse;

[0030] A fourth valve assembly is provided in the recovery pipeline and the output pipeline, and is used to control the flow of the recovery pipeline and the output pipeline.

[0031] In some of the embodiments, the recovery module further comprises:

[0032] a first pressure monitoring pipeline, the first pressure monitoring pipeline being in communication with the recovery pipeline and being used for conveying special process gas;

[0033] A first pressure monitor is communicated with the first pressure monitoring pipeline and is used to monitor the pressure inside the recovery tank.

[0034] In some of the embodiments, the recovery module further comprises:

[0035] a second pressure monitoring pipeline, the second pressure monitoring pipeline being in communication with the recovery pipeline and being used for conveying special process gas;

[0036] a second pressure monitor, the second pressure monitor being in communication with the second pressure monitoring pipeline and being used for monitoring the pressure of the recovery pipeline;

[0037] A fifth valve assembly is provided in the second pressure monitoring pipeline and is used for controlling the flow of the second pressure monitoring pipeline.

[0038] In some embodiments, the exhaust gas treatment module includes:

[0039] a first processing pipeline, a first end of which is in communication with the gas supply module and is used to deliver a special process gas;

[0040] a first processing tank, the first processing tank being connected to the second end of the first processing pipeline and the tail gas emission module respectively, and the first processing tank being used for processing the special process gas to obtain clean tail gas when the purity of the special process gas monitored by the purity analysis module does not meet the standard;

[0041] A sixth valve assembly is disposed in the first processing pipeline and is used to control the flow of the first processing pipeline.

[0042] In some embodiments, the exhaust gas treatment module further includes:

[0043] a first pressure relief pipeline, wherein a first end of the first pressure relief pipeline is in communication with the first treatment tank, and a second end of the first pressure relief pipeline is in communication with the tail gas emission module;

[0044] The first pressure relief valve is arranged in the first pressure relief pipeline, and is used for relieving pressure when the pressure in the first processing tank exceeds a first preset pressure threshold.

[0045] In some embodiments, the exhaust gas treatment module further includes:

[0046] a second processing pipeline, a first end of which is in communication with the gas supply module and is used to deliver a special process gas;

[0047] a second processing tank, the second processing tank being connected to the second end of the second processing pipeline and the tail gas emission module respectively, and the second processing tank being used for processing the special process gas to obtain clean tail gas when the purity of the special process gas monitored by the purity analysis module does not meet the standard;

[0048] An eighth valve assembly is provided in the second processing pipeline to control the flow of the second processing pipeline.

[0049] In some embodiments, the exhaust gas treatment module further includes:

[0050] a second pressure relief pipeline, wherein a first end of the second pressure relief pipeline is in communication with the second treatment tank, and a second end of the second pressure relief pipeline is in communication with the tail gas emission module;

[0051] The second pressure relief valve is arranged in the first pressure relief pipeline, and is used for relieving pressure when the pressure in the second processing tank exceeds a second preset pressure threshold.

[0052] In some embodiments, the exhaust emission module includes:

[0053] An exhaust pipeline, a first end of which is connected to the exhaust gas treatment module, and a second end of which is connected to a subsequent process device, for discharging clean exhaust gas;

[0054] A blower, the blower is arranged in the exhaust pipeline and is used to provide power conditions for the discharge of clean exhaust gas;

[0055] A seventh valve assembly is disposed in the discharge pipeline and is used to control the flow of the discharge pipeline.

[0056] In some of the embodiments, it also includes:

[0057] A purge module, which is respectively connected to a purge gas source, the gas supply module, and the recovery module, and is used to purge the entire device and pipelines;

[0058] An exhaust module is connected to the power gas source and the purge module respectively, and is used for exhausting the entire equipment and pipelines.

[0059] In some embodiments, the purge module includes:

[0060] A purge pipeline, which is connected to the tail gas treatment module and the purge gas source respectively, and is used to purge the entire equipment and pipeline;

[0061] A ninth valve assembly, wherein the ninth valve assembly is disposed in the purge pipeline and is used to control the flow of the purge pipeline.

[0062] In some embodiments, the purge module further comprises:

[0063] a third pressure monitoring pipeline, the third pressure monitoring pipeline being in communication with the purge pipeline and being used for conveying purge gas;

[0064] A third pressure monitor is connected to the third pressure monitoring pipeline and is used to monitor the pressure of the purge pipeline.

[0065] In some embodiments, the exhaust module includes:

[0066] An exhaust pipeline, the exhaust pipeline is respectively connected to the purge module and the tail gas emission module, and is used for conveying gas;

[0067] A vacuum generator, which is arranged in the exhaust pipeline and is used to perform vacuum treatment on the entire equipment and pipeline;

[0068] A supply pipeline, the supply pipeline is connected to the vacuum generator and the power gas source respectively, and is used to transport the power gas;

[0069] A tenth valve assembly is provided in the exhaust pipeline and the supply pipeline, and is used to control the flow of the exhaust pipeline and the supply pipeline.

[0070] In some of the embodiments, it also includes:

[0071] A safety assurance module is connected to the recovery module and the tail gas emission module respectively, and is used to relieve pressure on the recovery module.

[0072] In some embodiments, the security module includes:

[0073] A third pressure relief pipeline, the third pressure relief pipeline is connected to the recovery module and the tail gas emission module respectively, and is used to transport special gas;

[0074] a third pressure relief valve, the third pressure relief valve being arranged in the third pressure relief pipeline and being used for relieving pressure when the pressure in the recovery module exceeds a third preset pressure threshold;

[0075] An eleventh valve assembly, the eleventh valve assembly is arranged in the third pressure relief pipeline, and is used to control the flow of the third pressure relief pipeline.

[0076] In a second aspect, the utility model provides a semiconductor process system, comprising:

[0077] The semiconductor tail gas treatment device as described in the first aspect;

[0078] A process chamber is connected to the recovery module of the semiconductor tail gas treatment device.

[0079] The utility model adopts the above technical solution, and compared with the prior art, has the following technical effects:

[0080] The utility model provides a semiconductor exhaust gas treatment device and a semiconductor process system. By connecting a purity analysis module with a gas supply module and adding a recovery module, the purity of the special process gas delivered by the gas supply module can be detected in real time. If the purity of the special process gas meets the standard, the special process gas can be recovered and delivered to the process chamber. In addition, by setting a purge module and an exhaust module, the overall equipment pipeline and valve body can be purged to ensure the cleanliness of the overall equipment pipeline and valve body. Furthermore, by setting a safety guarantee module, the recovery module can be protected to prevent production accidents caused by excessive internal pressure of the recovery module, thereby improving safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0081] Figure 1 1 is a schematic diagram of a semiconductor tail gas treatment device according to an embodiment of the utility model (I);

[0082] Figure 2 is a schematic diagram of a gas supply module and a purity analysis module according to an embodiment of the utility model;

[0083] Figure 3 is a schematic diagram of a recycling module according to an embodiment of the utility model;

[0084] Figure 4 is a schematic diagram of an exhaust gas treatment module and an exhaust gas emission module according to an embodiment of the utility model;

[0085] Figure 5 is a schematic diagram of a second treatment tank in a tail gas treatment module according to an embodiment of the utility model;

[0086] Figure 6 2 is a schematic diagram of a semiconductor tail gas treatment device according to an embodiment of the utility model;

[0087] Figure 7 is a schematic diagram of a purge module and an exhaust module according to an embodiment of the utility model;

[0088] Figure 8 Schematic diagram of a semiconductor tail gas treatment device according to an embodiment of the utility model (III);

[0089] Fig. 9 is a schematic diagram of a safety assurance module according to an embodiment of the utility model;

[0090] Fig.10 It is a specific embodiment of the semiconductor tail gas treatment device according to the embodiment of the utility model.

[0091] The reference numerals are: 100, gas supply module; 101, main supply pipeline; 102, first supply branch pipeline; 103, second supply branch pipeline; 104, gas delivery pump; 105, first valve assembly; 106, bypass pipeline; 107, second valve assembly;

[0092] 200. purity analysis module; 201. analysis pipeline; 202. purity analyzer; 203. third valve assembly;

[0093] 300, recovery module; 301, recovery pipeline; 302, recovery tank; 303, output pipeline; 304, fourth valve assembly; 305, first pressure monitoring pipeline; 306, first pressure monitor; 307, second pressure monitoring pipeline; 308, second pressure monitor; 309, fifth valve assembly;

[0094] 400, tail gas treatment module; 401, first treatment pipeline; 402, first treatment tank; 403, sixth valve assembly; 404, first pressure relief pipeline; 405, first pressure relief valve; 406, second treatment pipeline; 407, second treatment tank; 408, eighth valve assembly; 409, second pressure relief pipeline; 410, second pressure relief valve

[0095] 500, exhaust emission module; 501, emission pipeline; 502, blower; 503, seventh valve assembly;

[0096] 600, purge module; 601, purge pipeline; 602, ninth valve assembly; 603, third pressure monitoring pipeline; 604, third pressure monitor;

[0097] 700, exhaust module; 701, exhaust pipeline; 702, vacuum generator; 703, supply pipeline; 704, tenth valve assembly;

[0098] 800, safety assurance module; 801, third pressure relief pipeline; 802, third pressure relief valve; 803, eleventh valve assembly. DETAILED DESCRIPTION

[0099] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is described and illustrated below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0100] Obviously, the drawings described below are only some examples or embodiments of the present application. For ordinary technicians in this field, the present application can also be applied to other similar scenarios based on these drawings without creative work. In addition, it can also be understood that although the efforts made in this development process may be complicated and lengthy, for ordinary technicians in this field related to the content disclosed in this application, some changes in design, manufacturing or production based on the technical content disclosed in this application are just conventional technical means, and should not be understood as insufficient content disclosed in this application.

[0101] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0102] Unless otherwise defined, the technical terms or scientific terms involved in this application should be understood by people with ordinary skills in the technical field to which this application belongs. The words "one", "a", "a", "the" and the like involved in this application do not indicate a quantitative limitation, and may represent the singular or plural. The terms "include", "comprise", "have" and any of their variations involved in this application are intended to cover non-exclusive inclusions; for example, a process, method, system, product or device that includes a series of steps or modules (modules) is not limited to the listed steps or modules, but may also include steps or modules that are not listed, or may also include other steps or modules inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like involved in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The "multiple" involved in this application refers to two or more. "And / or" describes the association relationship of associated objects, indicating that there may be three relationships, for example, "A and / or B" can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects before and after are in an "or" relationship. The terms "first", "second", "third", etc. involved in this application are only used to distinguish similar objects and do not represent a specific ordering of the objects.

[0103] Example 1

[0104] An illustrative embodiment of the present utility model is as follows: Figure 1As shown, a tail gas treatment device includes a gas supply module 100, a purity analysis module 200, a recovery module 300, a tail gas treatment module 400 and a tail gas emission module 500. The gas supply module 100 is connected to the process gas source to provide power for the delivery of special process gas; the purity analysis module 200 is connected to the gas supply module 100 to perform purity analysis on the special process gas; the recovery module 300 is respectively connected to the gas supply module 100 and the process chamber to recover and deliver the special process gas to the process chamber when the purity of the special process gas monitored by the purity analysis module 200 meets the standard; the tail gas treatment module 400 is connected to the gas supply module 100 to process the special process gas to obtain clean tail gas when the purity of the special process gas monitored by the purity analysis module 200 does not meet the standard; the tail gas emission module 500 is connected to the tail gas treatment module 400 to discharge the clean tail gas.

[0105] It should be noted that in the special gas delivery system, purging and exhaust are only performed when the cylinder is replaced, and only the first exhaust is all special process gas, so the recovery module 300 is used to recover the process gas exhausted for the first time, and in the subsequent steps, the special process gas is directly discharged into the exhaust gas treatment module 400 for reaction absorption.

[0106] like Figure 2 As shown, the gas supply module 100 includes a main supply line 101 , a first branch supply line 102 , a second branch supply line 103 , a gas delivery pump 104 and a first valve assembly 105 . Among them, the first end of the main supply line 101 is connected to the process gas source for obtaining and transporting special process gas; the first end of the first supply branch line 102 is connected to the second end of the main supply line 101, and the second end of the first supply branch line 102 is connected to the recovery module 300, for transporting special process gas to the recovery module 300; the first end of the second supply branch line 103 is connected to the second end of the main supply line 101, and the second end of the second supply branch line 103 is connected to the exhaust gas treatment module 400, for transporting special process gas to the exhaust gas treatment module 400; the gas delivery pump 104 is arranged on the main supply line 101, for providing power for the delivery of special process gas; the first valve assembly 105 is arranged on the main supply line 101, the first supply branch line 102 and the second supply branch line 103, for controlling the circulation of the main supply line 101, the first supply branch line 102 and the second supply branch line 103.

[0107] It should be noted that the first end and the second end of the main supply pipeline 101 are respectively the two ends in the length direction; the first end and the second end of the first supply branch pipeline 102 are respectively the two ends in the length direction; the first end and the second end of the second supply branch pipeline 103 are respectively the two ends in the length direction.

[0108] In some of the embodiments, the main supply line 101 includes but is not limited to a stainless steel pipe.

[0109] In some of the embodiments, the first supply branch pipeline 102 includes, but is not limited to, a stainless steel pipe.

[0110] In some of the embodiments, the second supply branch pipeline 103 includes but is not limited to a stainless steel pipe.

[0111] Specifically, the gas delivery pump 104 is disposed in the main supply line 101 , and the gas delivery pump 104 can provide power conditions for the special process gas that subsequently flows into the recovery module 300 and the tail gas treatment module 400 .

[0112] In some of these embodiments, the gas delivery pump 104 includes, but is not limited to, a plunger pump.

[0113] Specifically, the first valve assembly 105 includes a first manual diaphragm valve, a first pneumatic diaphragm valve, a second manual diaphragm valve, a third manual diaphragm valve, a second pneumatic diaphragm valve and a third pneumatic diaphragm valve. Among them, the first manual diaphragm valve is arranged on the main supply line 101; the first pneumatic diaphragm valve is arranged on the main supply line 101 and is located downstream of the first manual diaphragm valve; the second manual diaphragm valve is arranged on the main supply line 101 and is located downstream of the first pneumatic diaphragm valve and upstream of the gas delivery pump 104; the third manual diaphragm valve is arranged on the main supply line 101 and is located downstream of the gas delivery pump 104; the second pneumatic diaphragm valve is arranged on the first supply branch line 102; the third pneumatic diaphragm valve is arranged on the second supply branch line 103.

[0114] In some of the embodiments, the first valve assembly 105 includes, but is not limited to, a diaphragm valve.

[0115] It should be noted that the first manual diaphragm valve is used to manually control the flow of the main supply line 101; the first pneumatic diaphragm valve is used to automatically control the flow of the main supply line 101 according to system instructions when the first manual diaphragm valve is open; the second manual diaphragm valve and the third manual diaphragm valve can isolate the gas delivery pump 104, thereby facilitating the replacement of the gas delivery pump 104; the second pneumatic diaphragm valve is used to automatically control the flow of the first supply branch line 102 according to system instructions; the third pneumatic diaphragm valve is used to automatically control the flow of the second supply branch line 103 according to system instructions.

[0116] Furthermore, the gas supply module 100 further includes a bypass pipeline 106 and a second valve assembly 107. The bypass pipeline 106 is in communication with the main supply pipeline 101, and the first end and the second end of the bypass pipeline 106 are respectively located upstream and downstream of the gas delivery pump 104; the second valve assembly 107 is disposed in the bypass pipeline 106 to control the flow of the bypass pipeline 106.

[0117] Specifically, the first end of the bypass line 106 is connected to the main supply line 101, and the connection point between the first end of the bypass line 106 and the main supply line 101 is located between the first pneumatic diaphragm valve and the second manual diaphragm valve, and the second end of the bypass line 106 is connected to the main supply line 101, and the connection point between the second end of the bypass line 106 and the main supply line 101 is located downstream of the third manual diaphragm valve.

[0118] In some of the embodiments, the bypass line 106 includes, but is not limited to, a stainless steel pipe.

[0119] Specifically, the second valve assembly 107 includes a fourth manual diaphragm valve, wherein the fourth manual diaphragm valve is disposed in the bypass pipeline 106 to control the flow of the bypass pipeline 106 .

[0120] In some of the embodiments, the second valve assembly 107 includes, but is not limited to, a diaphragm valve.

[0121] It should be noted that the bypass line 106 can maintain the normal operation of the equipment and the exhaust gas treatment function when the gas delivery pump 104 fails, and can avoid the interruption of the operation of the entire equipment during the replacement of the gas delivery pump 104.

[0122] like Figure 2 As shown, the purity analysis module 200 includes an analysis pipeline 201, a purity analyzer 202 and a third valve assembly 203. The first end of the analysis pipeline 201 is connected to the gas supply module 100 for obtaining and delivering special process gas; the purity analyzer 202 is disposed on the analysis pipeline 201 for analyzing the special process gas flowing into the analysis pipeline 201; and the third valve assembly 203 is disposed on the analysis pipeline 201 for controlling the flow of the analysis pipeline 201.

[0123] Specifically, a first end of the analysis pipeline 201 is in communication with the first supply branch pipeline 102 , and a second end of the branch pipeline is in communication with the exhaust gas treatment module 400 .

[0124] It should be noted that the first end and the second end of the analysis pipeline 201 are respectively two ends in the length direction thereof.

[0125] In some of the embodiments, the analysis line 201 includes but is not limited to a stainless steel tube.

[0126] In some of the embodiments, the purity analyzer 202 includes but is not limited to a gas chromatography purity analyzer 202 .

[0127] Specifically, the third valve assembly 203 includes a fourth pneumatic diaphragm valve, wherein the fourth pneumatic diaphragm valve is arranged in the analysis pipeline 201 and is located upstream of the purity analyzer 202 .

[0128] In some of the embodiments, the third valve component 203 includes but is not limited to a diaphragm valve.

[0129] It should be noted that the fourth pneumatic diaphragm valve is used to automatically control the flow of the analysis pipeline 201 according to system instructions.

[0130] like Figure 3 As shown, the recovery module 300 includes a recovery pipeline 301, a recovery tank 302, an output pipeline 303 and a fourth valve assembly 304. The first end of the recovery pipeline 301 is connected to the gas supply module 100 for conveying the special process gas; the recovery tank 302 is connected to the second end of the recovery pipeline 301 for reclaiming the special process gas when the purity of the special process gas monitored by the purity analysis module 200 meets the standard; the first end of the output pipeline 303 is connected to the recovery tank 302, and the second end of the output pipeline 303 is connected to the process chamber for conveying the special process gas in the recovery tank 302 to the process chamber for reuse; the fourth valve assembly 304 is provided on the recovery pipeline 301 and the output pipeline 303 for controlling the circulation of the recovery pipeline 301 and the output pipeline 303.

[0131] Specifically, a first end of the recovery pipeline 301 is in communication with the first supply branch pipeline 102 , and a second end of the recovery pipeline 301 is in communication with the recovery tank 302 .

[0132] It should be noted that the first end and the second end of the recovery pipeline 301 are respectively two ends in the length direction thereof.

[0133] In some of the embodiments, the recovery line 301 includes but is not limited to a stainless steel pipe.

[0134] Specifically, the recovery tank 302 is provided in a steel cylinder structure, and the recovery tank 302 can recover special process gases whose purity meets the standards.

[0135] In some of these embodiments, the recovery tank 302 includes, but is not limited to, a steel cylinder.

[0136] Specifically, a first end of the output pipeline 303 is connected to the recovery tank 302, and a second end of the output pipeline 303 is connected to the process chamber, so as to transport the special process gas in the recovery tank 302 to the process chamber for reuse.

[0137] It should be noted that the first end and the second end of the output pipeline 303 are respectively two ends in the length direction.

[0138] In some of the embodiments, the output pipeline 303 includes but is not limited to a stainless steel pipe.

[0139] Specifically, the fourth valve assembly 304 includes a first one-way valve, a fifth manual diaphragm valve and a sixth manual diaphragm valve. The first one-way valve is arranged in the recovery pipeline 301; the fifth manual diaphragm valve is arranged in the recovery pipeline 301 and is located downstream of the first one-way valve; and the sixth manual diaphragm valve is arranged in the output pipeline 303.

[0140] In some embodiments, the fourth valve component 304 includes but is not limited to a one-way valve and a diaphragm valve.

[0141] It should be noted that the first one-way valve is used to prevent the backflow of special process gas entering the recovery pipeline 301; the fifth manual diaphragm valve is used to manually control the flow between the recovery pipeline 301 and the recovery tank 302; the sixth manual diaphragm valve is used to manually control the flow between the recovery tank 302 and the process chamber.

[0142] Furthermore, the recovery module 300 further includes a first pressure monitoring pipeline 305 and a first pressure monitor 306. The first pressure monitoring pipeline 305 is connected to the recovery pipeline 301 for conveying special process gas; the first pressure monitor 306 is connected to the first pressure monitoring pipeline 305 for monitoring the pressure inside the recovery tank 302.

[0143] Specifically, the first end of the first pressure monitoring line 305 is connected to the recovery line 301 , and the connection point between the first pressure monitoring line 305 and the recovery line 301 is located at the connection point between the recovery line 301 and the first supply branch line 102 , and the second end of the first pressure monitoring line 305 is connected to the first pressure monitor 306 .

[0144] In some of the embodiments, the first pressure monitoring line 305 includes but is not limited to a stainless steel pipe.

[0145] Specifically, the first pressure monitor 306 can monitor the pressure at the air inlet of the recovery pipeline 301 in real time and transmit the pressure information to the central control room.

[0146] In some of these embodiments, the first pressure monitor 306 includes, but is not limited to, a pressure sensor.

[0147] Furthermore, the recovery module 300 further includes a second pressure monitoring pipeline 307, a second pressure monitor 308 and a fifth valve assembly 309. The second pressure monitoring pipeline 307 is connected to the recovery pipeline 301 for conveying special process gas; the second pressure monitor 308 is connected to the second pressure monitoring pipeline 307 for monitoring the pressure of the recovery pipeline 301; and the fifth valve assembly 309 is disposed in the second pressure monitoring pipeline 307 for controlling the circulation of the second pressure monitoring pipeline 307.

[0148] Specifically, a first end of the second pressure monitoring pipeline 307 is in communication with the recovery tank 302 , and a second end of the second pressure monitoring pipeline 307 is in communication with the second pressure monitor 308 .

[0149] In some of the embodiments, the second pressure monitoring line 307 includes but is not limited to a stainless steel tube.

[0150] Specifically, the second pressure monitor 308 can display the pressure inside the recovery tank 302 in real time, thereby facilitating observation by the staff.

[0151] In some of the embodiments, the second pressure monitor 308 includes but is not limited to an electronic pressure gauge and a mechanical pressure gauge.

[0152] Specifically, the fifth valve assembly 309 includes a seventh manual diaphragm valve, wherein the seventh manual diaphragm valve is disposed in the second pressure monitoring pipeline 307 , and is used to manually control the flow between the recovery tank 302 and the second pressure monitor 308 .

[0153] In some of the embodiments, the fifth valve assembly 309 includes, but is not limited to, a diaphragm valve.

[0154] like Figure 4 As shown, the tail gas treatment module 400 includes a first treatment pipeline 401, a first treatment tank 402 and a sixth valve assembly 403. The first end of the first treatment pipeline 401 is connected to the gas supply module 100 for conveying special process gas; the first treatment tank 402 is respectively connected to the second end of the first treatment pipeline 401 and the tail gas emission module 500, and the first treatment tank 402 is used to process the special process gas to obtain clean tail gas when the purity of the special process gas monitored by the purity analysis module 200 does not meet the standard; the sixth valve assembly 403 is arranged in the first treatment pipeline 401, and is used to control the flow of the first treatment pipeline 401.

[0155] Specifically, a first end of the first processing pipeline 401 is communicated with the second supply branch pipeline 103 , and a second end of the first processing pipeline 401 is communicated with the first processing tank 402 .

[0156] It should be noted that the first end and the second end of the first processing pipeline 401 are respectively two ends in the length direction thereof.

[0157] In some of the embodiments, the first processing line 401 includes but is not limited to a stainless steel pipe.

[0158] Specifically, the first processing tank 402 is provided in a hollow tank structure, and can filter special process gases.

[0159] In some of the embodiments, the first processing tank 402 includes, but is not limited to, a branch screen.

[0160] Specifically, the sixth valve assembly 403 includes a fifth pneumatic diaphragm valve and an eighth manual diaphragm valve, wherein the fifth pneumatic diaphragm valve is disposed in the first processing pipeline 401; the eighth manual diaphragm valve is disposed in the first processing pipeline 401 and is located downstream of the fifth pneumatic diaphragm valve.

[0161] In some of the embodiments, the sixth valve assembly 403 includes but is not limited to a diaphragm valve.

[0162] It should be noted that the fifth pneumatic diaphragm valve is used to automatically control the flow between the second supply branch pipeline 103 and the first processing pipeline 401 according to system instructions; the eighth manual diaphragm valve is used to manually control the flow between the first processing pipeline 401 and the first processing tank 402.

[0163] Furthermore, the exhaust gas treatment module 400 further includes a first pressure relief pipeline 404 and a first pressure relief valve 405. The first end of the first pressure relief pipeline 404 is in communication with the first treatment tank 402, and the second end of the first pressure relief pipeline 404 is in communication with the exhaust gas emission module 500; the first pressure relief valve 405 is disposed on the first pressure relief pipeline 404, and is used to relieve pressure when the pressure in the first treatment tank 402 exceeds a first preset pressure threshold.

[0164] Specifically, a first end of the first pressure relief pipeline 404 is in communication with the first processing tank 402 , and a second end of the first pressure relief pipeline 404 is in communication with the discharge pipeline 501 .

[0165] In some of the embodiments, the first pressure relief line 404 includes but is not limited to a stainless steel pipe.

[0166] Specifically, the first pressure relief valve 405 is disposed in the first pressure relief pipeline 404, and the first preset threshold of the first pressure relief valve 405 is 100 psi, that is, when the internal pressure of the first processing tank 402 is greater than 100 psi, the first pressure relief valve 405 automatically relieves the pressure of the first processing tank 402.

[0167] In some of the embodiments, the first pressure relief valve 405 includes but is not limited to a safety valve.

[0168] like Figure 4 As shown, the tail gas emission module 500 includes an emission pipeline 501, a blower 502 and a seventh valve assembly 503. The first end of the emission pipeline 501 is connected to the tail gas treatment module 400, and the second end of the emission pipeline 501 is connected to the subsequent process equipment for discharging clean tail gas; the blower 502 is arranged in the emission pipeline 501 to provide power conditions for the discharge of clean tail gas; the seventh valve assembly 503 is arranged in the exhaust pipeline 701 to control the flow of the emission pipeline 501.

[0169] Specifically, a first end of the discharge pipeline 501 is communicated with the first processing tank 402 , and a second end of the discharge pipeline 501 is communicated with subsequent process equipment.

[0170] It should be noted that the first end and the second end of the discharge pipeline 501 are respectively two ends in the length direction thereof.

[0171] In some of the embodiments, the exhaust line 501 includes but is not limited to a stainless steel pipe.

[0172] Specifically, the blower 502 is disposed in the exhaust pipeline 501 and communicated with the exhaust pipeline 501 , and is used to provide negative pressure to the end of the exhaust pipeline 501 .

[0173] In some of the embodiments, the blowing member includes but is not limited to a ventilation blower 502 .

[0174] Specifically, the seventh valve assembly 503 includes a ninth manual diaphragm valve and a second one-way valve, wherein the ninth manual diaphragm valve is disposed in the discharge pipeline 501 ; the second one-way valve is disposed in the discharge pipeline 501 and is located downstream of the seventh manual diaphragm valve.

[0175] In some of the embodiments, the seventh valve component 503 includes but is not limited to a diaphragm valve and a one-way valve.

[0176] It should be noted that the ninth manual diaphragm valve is used to manually control the connection between the first processing tank 402 and subsequent process equipment; the second one-way valve is used to prevent gas backflow.

[0177] The method of using this embodiment is as follows:

[0178] (I) Gas transportation

[0179] The first manual diaphragm valve, the second manual diaphragm valve, and the third manual diaphragm valve are manually opened, and the system opens the first pneumatic diaphragm valve, so that the special process gas can flow to the purity analysis module 200 through the output main line and the first supply branch line 102.

[0180] (II) Gas analysis

[0181] The system opens the fourth pneumatic diaphragm valve, so that the special process gas can flow to the purity analyzer 202 through the analysis pipeline 201 to perform purity analysis on the special process gas.

[0182] (III) Gas recovery

[0183] When the purity of the special process gas monitored by the purity analyzer 202 meets the standard, the fifth manual diaphragm valve is manually opened, and the system opens the second pneumatic diaphragm valve, so that the special process gas can enter the recovery tank 302 through the first supply branch pipeline 102 and the recovery pipeline 301.

[0184] (IV) Gas adsorption filtration

[0185] When the purity of the special process gas monitored by the purity analyzer 202 does not meet the standard, the eighth manual diaphragm valve is manually opened, and the system opens the third pneumatic diaphragm valve and the fifth pneumatic diaphragm valve, so that the special process gas can enter the first processing tank 402 through the second supply branch line 103 and the first processing line 401.

[0186] (V) Exhaust

[0187] The ninth manual diaphragm valve is manually opened so that the filtered gas generated after being processed in the first processing tank 402 can be discharged through the exhaust pipeline 701 .

[0188] The advantage of this embodiment is that by connecting the purity analysis module 200 with the gas supply module 100 and adding the recovery module 300, the purity of the special process gas delivered by the gas supply module 100 can be detected in real time. If the purity of the special process gas meets the standard, the special process gas can be recovered and delivered to the process chamber.

[0189] Example 2

[0190] This embodiment is a variation of the embodiment.

[0191] like Figure 5 As shown, the tail gas treatment module 400 also includes a second treatment pipeline 406, a second treatment tank 407 and an eighth valve assembly 408. The first end of the second treatment pipeline 406 is connected to the gas supply module 100 for conveying the special process gas; the second treatment tank 407 is respectively connected to the second end of the second treatment pipeline 406 and the tail gas emission module 500, and the second treatment tank 407 is used to process the special process gas to obtain clean tail gas when the purity of the special process gas monitored by the purity analysis module 200 does not meet the standard; the eighth valve assembly 408 is arranged on the second treatment pipeline 406 for controlling the circulation of the second treatment pipeline 406.

[0192] Specifically, a first end of the second processing pipeline 406 is communicated with the second supply branch pipeline 103 , and a second end of the second processing pipeline 406 is communicated with the second processing tank 407 .

[0193] It should be noted that the first end and the second end of the second processing pipeline 406 are respectively two ends in its length direction.

[0194] In some of these embodiments, the second processing line 406 includes, but is not limited to, a stainless steel tube.

[0195] Specifically, the second processing tank 407 is provided in a hollow tank structure, and can filter special process gases.

[0196] In some of the embodiments, the second processing tank 407 includes but is not limited to a branch screen.

[0197] It should be noted that when the adsorption filtration efficiency of the first treatment tank 402 is saturated, it can automatically switch to the second treatment tank 407. After the switch, the first treatment tank 402 can be replaced, so that the operation of the entire equipment will not be interrupted during the replacement of the first treatment tank 402; in addition, since the second treatment tank 407 is only temporarily used during the replacement of the first treatment tank 402, the volume of the second treatment tank 407 is smaller than that of the first treatment tank 402.

[0198] Specifically, the eighth valve assembly 408 includes a sixth pneumatic diaphragm valve and a tenth manual diaphragm valve, wherein the sixth pneumatic diaphragm valve is disposed in the second processing pipeline 406; the tenth manual diaphragm valve is disposed in the second adsorption pipeline and is located downstream of the sixth pneumatic diaphragm valve.

[0199] In some of these embodiments, the eighth valve assembly 408 includes, but is not limited to, a diaphragm valve.

[0200] It should be noted that the sixth pneumatic diaphragm valve is used to automatically control the flow between the second supply branch pipeline 103 and the second processing pipeline 406 according to system instructions; the tenth manual diaphragm valve is used to manually control the flow between the second processing pipeline 406 and the first processing tank 402.

[0201] Furthermore, the exhaust gas treatment module 400 further includes a second pressure relief pipeline 409 and a second pressure relief valve 410. The first end of the second pressure relief pipeline 409 is connected to the second treatment tank 407, and the second end of the second pressure relief pipeline 409 is connected to the exhaust gas emission module 500; the second pressure relief valve 410 is arranged on the second pressure relief pipeline 409, and is used to relieve pressure when the pressure in the second treatment tank 407 exceeds the second preset pressure threshold.

[0202] Specifically, a first end of the second pressure relief pipeline 409 is in communication with the second processing tank 407 , and a second end of the second pressure relief pipeline 409 is in communication with the discharge pipeline 501 .

[0203] In some of the embodiments, the second pressure relief line 409 includes but is not limited to a stainless steel pipe.

[0204] Specifically, the second pressure relief valve 410 is disposed in the second pressure relief pipeline 409 , and the second preset threshold of the second pressure relief valve 410 is 100 psi, that is, when the internal pressure of the second processing tank 407 is greater than 100 psi, the second pressure relief valve 410 automatically relieves the pressure of the second processing tank 407 .

[0205] In some of the embodiments, the second pressure relief valve 410 includes but is not limited to a safety valve.

[0206] The method of using this embodiment is as follows:

[0207] When the adsorption filtration efficiency of the first treatment tank 402 is saturated, the seventh manual diaphragm valve and the eighth manual diaphragm valve are manually closed, the fifth pneumatic diaphragm valve is closed by the system, and the ninth manual diaphragm valve is manually opened and the sixth pneumatic diaphragm valve is opened by the system to switch to the second treatment tank 407.

[0208] The advantage of this embodiment is that when the adsorption filtration efficiency of the first treatment tank 402 is saturated, it can automatically switch to the second treatment tank 407. After the switch, the first treatment tank 402 can be replaced, and the operation of the entire equipment can be achieved without interrupting the process of replacing the first treatment tank 402.

[0209] Example 3

[0210] This embodiment is a variation of the embodiment.

[0211] like Figure 6 As shown, the tail gas treatment equipment also includes a purge module 600 and an exhaust module 700. The purge module 600 is respectively connected to the purge gas source, the gas supply module 100, and the recovery module 300, and is used to purge the entire equipment and pipelines; the exhaust module 700 is respectively connected to the power gas source and the purge module 600, and is used to exhaust the entire equipment and pipelines.

[0212] like Figure 7 As shown, the purge module 600 includes a purge pipeline 601 and a ninth valve assembly 602. The purge pipeline 601 is connected to the tail gas treatment module 400 and the purge gas source respectively, and is used to purge the entire device and pipeline; the ninth valve assembly 602 is arranged on the purge pipeline 601, and is used to control the circulation of the purge pipeline 601.

[0213] Specifically, a first end of the purge pipeline 601 is connected to a purge gas source, and a second end of the purge pipeline 601 is connected to a connecting point between the first supply branch pipeline 102 and the recovery pipeline 301 .

[0214] It should be noted that the first end and the second end of the purge pipeline 601 are respectively two ends in the length direction thereof; in addition, the purge gas is PN2.

[0215] In some of the embodiments, the purge line 601 includes but is not limited to a stainless steel pipe.

[0216] Specifically, the ninth valve assembly 602 includes an eleventh manual diaphragm valve, a third one-way valve and a seventh pneumatic diaphragm valve. The tenth manual diaphragm valve is arranged in the purge line 601; the third one-way valve is arranged in the purge line 601 and is located downstream of the eleventh manual diaphragm valve; the seventh pneumatic diaphragm valve is arranged in the purge line 601 and is located downstream of the third one-way valve.

[0217] In some of the embodiments, the ninth valve assembly 602 includes but is not limited to a one-way valve and a diaphragm valve.

[0218] It should be noted that the eleventh manual diaphragm valve is used to manually control the flow of gas from the purge pipeline 601; the third one-way valve is used to prevent gas backflow; the seventh pneumatic diaphragm valve is used to automatically control the connection between the purge pipeline 601 and the first supply branch pipeline 102 according to system instructions.

[0219] Furthermore, the purge module 600 further includes a third pressure monitoring pipeline 603 and a third pressure monitor 604. The third pressure monitoring pipeline 603 is connected to the purge pipeline 601 for conveying purge gas; the third pressure monitor 604 is connected to the third pressure monitoring pipeline 603 for monitoring the pressure of the purge pipeline 601.

[0220] Specifically, the first end of the third pressure monitoring line 603 is connected to the purge line 601, and the connection between the first end of the third pressure monitoring line 603 and the purge line 601 is located between the eighth manual diaphragm valve and the third one-way valve, and the second end of the third pressure monitoring line 603 is connected to the second pressure gauge.

[0221] In some of the embodiments, the third pressure monitoring line 603 includes but is not limited to a stainless steel tube.

[0222] Specifically, the third pressure monitor 604 can display the pressure in the purge pipeline 601 in real time, thereby facilitating observation by the staff.

[0223] In some of the embodiments, the third pressure monitor 604 includes but is not limited to an electronic pressure gauge and a mechanical pressure gauge.

[0224] like Figure 8 As shown, the exhaust module 700 includes an exhaust pipeline 701, a vacuum generator 702, a supply pipeline 703 and a tenth valve assembly 704. The exhaust pipeline 701 is connected to the purge module 600 and the gas supply module 100 for conveying gas; the vacuum generator 702 is arranged on the exhaust pipeline 701 for vacuuming the whole equipment and pipeline; the supply pipeline 703 is respectively connected to the vacuum generator 702 and the power gas source for conveying power gas; the tenth valve assembly 704 is arranged on the exhaust pipeline 701 and the supply pipeline 703 for controlling the flow of the exhaust pipeline 701 and the supply pipeline 703.

[0225] Specifically, a first end of the exhaust pipeline 701 is connected to a connecting point between the first supply branch pipeline 102 and the recovery pipeline 301 , and a second end of the exhaust pipeline 701 is connected to the second supply branch pipeline 103 .

[0226] It should be noted that the first end and the second end of the exhaust pipe 701 are respectively two ends in the length direction thereof.

[0227] In some of the embodiments, the exhaust pipe 701 includes but is not limited to a stainless steel pipe.

[0228] Specifically, the vacuum generator 702 is a device that uses a Venturi to form a vacuum. The device requires a power gas. In this embodiment, the power gas is GN2.

[0229] In some of these embodiments, vacuum generator 702 includes, but is not limited to, a venturi generator.

[0230] Specifically, a first end of the supply pipeline 703 is in communication with a power gas source, and a second end of the supply pipeline 703 is in communication with the vacuum generator 702 , so as to provide power gas to the vacuum generator 702 .

[0231] It should be noted that the first end and the second end of the supply pipeline 703 are respectively two ends in the length direction thereof.

[0232] In some of these embodiments, the supply line 703 includes, but is not limited to, a stainless steel tube.

[0233] Specifically, the tenth valve assembly 704 includes an eighth pneumatic diaphragm valve, a fourth one-way valve and a twelfth manual diaphragm valve. The eighth pneumatic diaphragm valve is arranged in the exhaust pipeline 701; the fourth one-way valve is arranged in the exhaust pipeline 701 and is located downstream of the eighth pneumatic diaphragm valve; the twelfth manual diaphragm valve is arranged in the pipeline connecting the vacuum generator 702 and the power gas source.

[0234] In some of the embodiments, the tenth valve assembly 704 includes but is not limited to a diaphragm valve and a one-way valve.

[0235] It should be noted that the eighth pneumatic diaphragm valve is used to automatically control the flow of the exhaust pipeline 701 and the first supply branch pipeline 102 according to system instructions; the fourth one-way valve is used to prevent gas backflow; and the twelfth manual diaphragm valve is used to manually control the flow of power gas from the vacuum generator 702.

[0236] The method of using this embodiment is as follows:

[0237] (I) Pipeline cleaning before operation

[0238] Manually open the eighth manual diaphragm valve, the ninth manual diaphragm valve, and the tenth manual diaphragm valve, and the system opens the seventh pneumatic diaphragm valve, the second pneumatic diaphragm valve, the third pneumatic diaphragm valve, and the fifth pneumatic diaphragm valve, so that the purge gas can pass through the purge pipeline 601, the first supply branch pipeline 102, the second supply branch pipeline 103, the first processing pipeline 401, and the exhaust pipeline 701 in sequence, which can ensure the cleanliness of the pipelines and valve bodies of the overall equipment;

[0239] Subsequently, the eighth manual diaphragm valve, the ninth manual diaphragm valve, and the tenth manual diaphragm valve are manually closed, and the system opens the eighth pneumatic diaphragm valve and starts the vacuum generator 702 to extract the gas in the pipelines and valve bodies of the entire equipment.

[0240] (II) Pressure relief

[0241] When the internal pressure of the first processing tank 402 is greater than 100 psi, the first pressure relief valve 405 automatically relieves the pressure of the first processing tank 402, so that the excess gas inside the first processing tank 402 can be discharged through the first pressure relief pipeline 404 and the exhaust pipeline 501;

[0242] When the internal pressure of the second processing tank 407 is greater than 100 psi, the second pressure relief valve 410 automatically relieves the pressure of the first processing tank 402 , so that the excess gas in the second processing tank 407 can be discharged through the second pressure relief pipeline 409 and the exhaust pipeline 501 .

[0243] The advantage of this embodiment is that by providing the purge module 600 and the exhaust module 700, the entire equipment pipeline and valve body can be purged to ensure the cleanliness of the entire equipment pipeline and valve body.

[0244] Example 4

[0245] This embodiment is a variation of the embodiment.

[0246] like Figure 8 As shown, the semiconductor tail gas treatment device further includes a safety module 800. The safety module 800 is respectively connected to the recovery module 300 and the exhaust module 700, and is used to relieve the pressure of the recovery module 300.

[0247] like Fig. 9 As shown, the safety guarantee module 800 includes a third pressure relief pipeline 801, a third pressure relief valve 802 and an eleventh valve assembly 803. The third pressure relief pipeline 801 is respectively connected to the recovery module 300 and the exhaust module 700 for conveying special gas; the third pressure relief valve 802 is arranged on the third pressure relief pipeline 801 for relieving pressure when the pressure in the recovery module 300 exceeds the third preset pressure threshold; the eleventh valve assembly 803 is arranged on the third pressure relief pipeline 801 for controlling the flow of the third pressure relief pipeline 801.

[0248] Specifically, a first end of the third pressure relief pipeline 801 is in communication with the recovery tank 302 , and a second end of the third pressure relief pipeline 801 is in communication with the exhaust pipeline 701 .

[0249] In some of the embodiments, the third pressure relief line 801 includes but is not limited to a stainless steel pipe.

[0250] Specifically, the third pressure relief valve 802 is disposed on the third pressure relief pipeline 801, and the third preset threshold of the third pressure relief valve 802 is 250 psi, that is, when the pressure inside the recovery tank 302 is greater than 100 psi, the third pressure relief valve 802 automatically relieves the pressure of the recovery tank 302.

[0251] In some of the embodiments, the third pressure relief valve 802 includes but is not limited to a safety valve.

[0252] Specifically, the eleventh valve assembly 803 includes a fifth one-way valve, wherein the fifth one-way valve is arranged in the third pressure relief pipeline 801 and is located downstream of the third pressure relief valve 802 to prevent gas from flowing back.

[0253] In some of the embodiments, the eleventh valve assembly 803 includes but is not limited to a one-way valve.

[0254] The method of using this embodiment is as follows:

[0255] When the pressure inside the recovery tank 302 is greater than 250psi, the third pressure relief valve 802 automatically relieves the pressure of the recovery tank 302, so that the excess gas inside the recovery tank 302 can be adsorbed and filtered in the first processing tank 402 through the third pressure relief pipeline 801, the exhaust pipeline 701, the second supply branch pipeline 103, and the first processing pipeline 401.

[0256] The advantage of this embodiment is that by providing the safety assurance module 800, the recovery module 300 and the tail gas treatment module 400 can be protected, thereby preventing production accidents caused by excessive internal pressure in the recovery module 300 and improving safety.

[0257] Example 5

[0258] This embodiment relates to a semiconductor process system of the utility model.

[0259] A semiconductor process system comprises the semiconductor tail gas treatment device and a process chamber as described in any one of embodiments 1 to 4, wherein the process chamber is connected to a recovery module 300 of the semiconductor tail gas treatment device.

[0260] Specifically, there are a plurality of process chambers, and the plurality of process chambers are respectively connected to the recovery module 300 .

[0261] Example 6

[0262] This embodiment is a specific implementation of the present utility model, corresponding to Embodiment 1 to Embodiment 3.

[0263] like Fig.10 As shown, an exhaust gas treatment device includes a gas supply module, a purity analysis module, a recovery module, an exhaust gas treatment module, an exhaust gas emission module, a purge module, an exhaust module and a safety assurance module.

[0264] Among them, the gas supply module includes a process gas source, a plunger pump, a manual diaphragm valve MV01, a manual diaphragm valve MV02, a manual diaphragm valve MV03, a manual diaphragm valve MV04, a pneumatic diaphragm valve PV01, a pneumatic diaphragm valve PV04, and a pneumatic diaphragm valve PV05.

[0265] Among them, the purity analysis module includes a gas purity analyzer and a pneumatic diaphragm valve PV08.

[0266] Among them, the recovery module includes a recovery tank, a one-way valve CV3, a manual diaphragm valve MV11, a manual diaphragm valve MV12, a manual diaphragm valve MV15, and a pressure gauge PG2.

[0267] Among them, the exhaust gas treatment module includes adsorption tank A, adsorption tank B, manual diaphragm valve MV05, manual diaphragm valve MV07, pneumatic diaphragm valve PV02, and pneumatic diaphragm valve PV03.

[0268] Among them, the exhaust emission module includes a blower, a one-way valve CV1, a one-way valve CV2, a manual diaphragm valve MV06, and a manual diaphragm valve MV08.

[0269] Among them, the purge module includes a manual diaphragm valve MV09, a pressure gauge PG1, a one-way valve CV5, and a pneumatic diaphragm valve PV06.

[0270] Among them, the exhaust module includes pneumatic diaphragm valve PV07, one-way valve CV6, vacuum generator 720VG, and manual diaphragm valve MV10.

[0271] Among them, the safety assurance module includes a safety valve SV, a one-way valve CV4, a pressure relief valve RV1, and a pressure relief valve RV2.

[0272] The method of using this embodiment is as follows:

[0273] (1) Manually open MV05, MV06, MV07, MV08, and MV09, and the system opens PV02, PV03, PV04, PV05, and PV06, so that the purge gas can pass through the purge pipeline, the first supply branch pipeline, the second supply branch pipeline, the first treatment pipeline, and the exhaust pipeline in sequence, thereby ensuring the cleanliness of the pipelines and valve bodies of the entire equipment;

[0274] Subsequently, MV06, MV08, and MV09 are manually closed and MV10 is manually opened. The system opens PV07 and starts VG to extract the gas from the pipelines and valve bodies of the entire equipment.

[0275] (2) Manually open MV01, MV02, and MV03, and the system opens PV01, so that the special process gas can flow to the gas purity analyzer through the output main line and the first supply branch line.

[0276] (3) The system turns on PV08, allowing the special process gas to flow through the analysis pipeline to the gas purity analyzer for purity analysis of the special process gas.

[0277] (4) When the purity of the special process gas meets the standard, MV11 is opened manually and PV05 is opened by the system, so that the special process gas can flow into the recovery tank through the first supply branch pipeline and the recovery pipeline.

[0278] (5) When the purity of the special process gas meets the standard, MV05 is opened manually, and the system opens PV02 and PV04, so that the special process gas can enter the adsorption tank A through the second supply branch pipeline and the first treatment pipeline.

[0279] (6) Manually open MV06 so that the filtered gas produced by the adsorption tank A can be discharged through the exhaust pipe.

[0280] (7) When the pressure inside the recovery tank is greater than 250 psi, the SV automatically releases the pressure of the recovery tank, so that the excess gas inside the recovery tank can be adsorbed and filtered in the adsorption tank A through the first pressure relief pipeline, the exhaust pipeline, the second supply branch pipeline, and the first treatment pipeline;

[0281] When the internal pressure of the adsorption tank A is greater than 100 psi, RV1 automatically relieves the pressure of the adsorption tank A so that the excess gas inside the adsorption tank A can be discharged through the second pressure relief pipeline and the discharge pipeline.

[0282] (8) When the adsorption filtration efficiency of adsorption tank A is saturated, MV05 and MV06 are manually closed, PV02 is closed by the system, and MV07 is manually opened and PV03 is opened by the system to switch to adsorption tank B.

[0283] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0284] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A semiconductor tail gas treatment device, characterized in that: include: A gas supply module, the gas supply module is connected to the process gas source and is used to provide power for the delivery of special process gas; A purity analysis module, which is in communication with the gas supply module and is used to perform purity analysis on special process gases; A recovery module, the recovery module is connected to the gas supply module and the process chamber respectively, and is used for recovering the special process gas and delivering it to the process chamber when the purity of the special process gas monitored by the purity analysis module meets the standard; An exhaust gas treatment module, the exhaust gas treatment module is connected to the gas supply module, and is used to process the special process gas to obtain clean exhaust gas when the purity of the special process gas monitored by the purity analysis module does not meet the standard; The tail gas emission module is connected to the tail gas treatment module and is used to discharge clean tail gas.

2. The semiconductor tail gas treatment device according to claim 1, characterized in that: The gas supply module comprises: A main supply line, a first end of which is connected to a process gas source and is used to obtain and transport special process gas; a first supply branch pipeline, wherein a first end of the first supply branch pipeline is connected to a second end of the supply main pipeline, and a second end of the first supply branch pipeline is connected to the recovery module, and is used to transport the special process gas to the recovery module; a second supply branch pipeline, wherein a first end of the second supply branch pipeline is connected to a second end of the supply main pipeline, and a second end of the second supply branch pipeline is connected to the tail gas treatment module, and is used for conveying special process gas to the tail gas treatment module; A gas delivery pump, which is arranged on the main supply line and is used to provide power for the delivery of special process gases; a first valve assembly, the first valve assembly being disposed on the main supply line, the first supply branch line and the second supply branch line, and being used to control the flow of the main supply line, the first supply branch line and the second supply branch line; and / or The purity analysis module comprises: an analysis pipeline, a first end of which is in communication with the gas supply module and is used to obtain and deliver special process gas; A purity analyzer, which is arranged on the analysis pipeline and is used to analyze the special process gas flowing into the analysis pipeline; a third valve assembly, the third valve assembly being disposed in the analysis pipeline and used for controlling the flow of the analysis pipeline; and / or The recovery module comprises: A recovery pipeline, a first end of which is in communication with the gas supply module and is used for conveying special process gas; a recovery tank, the recovery tank being in communication with the second end of the recovery pipeline, and being used for recovering the special process gas when the purity of the special process gas monitored by the purity analysis module meets the standard; An output pipeline, a first end of which is in communication with the recovery tank, and a second end of which is in communication with the process chamber, for transporting the special process gas in the recovery tank to the process chamber for reuse; a fourth valve assembly, the fourth valve assembly being arranged in the recovery pipeline and the output pipeline, and being used for controlling the flow of the recovery pipeline and the output pipeline; and / or The exhaust gas treatment module comprises: a first processing pipeline, a first end of which is in communication with the gas supply module and is used to deliver a special process gas; a first processing tank, the first processing tank being connected to the second end of the first processing pipeline and the tail gas emission module respectively, and the first processing tank being used for processing the special process gas to obtain clean tail gas when the purity of the special process gas monitored by the purity analysis module does not meet the standard; a sixth valve assembly, the sixth valve assembly being disposed in the first processing pipeline and being used to control the flow of the first processing pipeline; and / or The exhaust emission module comprises: An exhaust pipeline, a first end of which is connected to the exhaust gas treatment module, and a second end of which is connected to a subsequent process device, for discharging clean exhaust gas; A blower, the blower is arranged in the exhaust pipeline and is used to provide power conditions for the discharge of clean exhaust gas; A seventh valve assembly is disposed in the discharge pipeline and is used to control the flow of the discharge pipeline.

3. The semiconductor tail gas treatment device according to claim 2, characterized in that: The gas supply module further comprises: A bypass pipeline, the bypass pipeline is connected to the main supply pipeline, and the first end and the second end of the bypass pipeline are respectively located upstream and downstream of the gas delivery pump; a second valve assembly, the second valve assembly being disposed in the bypass line and configured to control the flow of the bypass line; and / or The recycling module also includes: a first pressure monitoring pipeline, the first pressure monitoring pipeline being in communication with the recovery pipeline and being used for conveying special process gas; a first pressure monitor, the first pressure monitor being in communication with the first pressure monitoring pipeline and being used for monitoring the pressure inside the recovery tank; and / or The recycling module also includes: a second pressure monitoring pipeline, the second pressure monitoring pipeline being in communication with the recovery pipeline and being used for conveying special process gas; a second pressure monitor, the second pressure monitor being in communication with the second pressure monitoring pipeline and being used for monitoring the pressure of the recovery pipeline; a fifth valve assembly, the fifth valve assembly being disposed in the second pressure monitoring pipeline and being used to control the flow of the second pressure monitoring pipeline; and / or The exhaust gas treatment module also includes: a first pressure relief pipeline, wherein a first end of the first pressure relief pipeline is in communication with the first treatment tank, and a second end of the first pressure relief pipeline is in communication with the tail gas emission module; a first pressure relief valve, which is disposed in the first pressure relief pipeline and is used for relieving pressure when the pressure in the first processing tank exceeds a first preset pressure threshold; and / or The exhaust gas treatment module also includes: a second processing pipeline, a first end of which is in communication with the gas supply module and is used to deliver a special process gas; a second processing tank, the second processing tank being connected to the second end of the second processing pipeline and the tail gas emission module respectively, and the second processing tank being used for processing the special process gas to obtain clean tail gas when the purity of the special process gas monitored by the purity analysis module does not meet the standard; An eighth valve assembly is provided in the second processing pipeline to control the flow of the second processing pipeline.

4. The semiconductor tail gas treatment device according to claim 3, characterized in that: The exhaust gas treatment module also includes: a second pressure relief pipeline, wherein a first end of the second pressure relief pipeline is in communication with the second treatment tank, and a second end of the second pressure relief pipeline is in communication with the tail gas emission module; The second pressure relief valve is arranged in the first pressure relief pipeline, and is used for relieving pressure when the pressure in the second processing tank exceeds a second preset pressure threshold.

5. The semiconductor tail gas treatment device according to claim 2, characterized in that: Also includes: A purge module, which is respectively connected to a purge gas source, the gas supply module, and the recovery module, and is used to purge the entire device and pipelines; An exhaust module is connected to the power gas source and the purge module respectively, and is used for exhausting the entire equipment and pipelines.

6. The semiconductor tail gas treatment device according to claim 5, characterized in that: The purge module comprises: A purge pipeline, which is connected to the tail gas treatment module and the purge gas source respectively, and is used to purge the entire equipment and pipeline; a ninth valve assembly, the ninth valve assembly being disposed in the purge pipeline and being used to control the flow of the purge pipeline; and / or The exhaust module comprises: an exhaust pipeline, the exhaust pipeline being respectively connected to the purge module and the gas supply module and being used for conveying gas; A vacuum generator, which is arranged in the exhaust pipeline and is used to perform vacuum treatment on the entire equipment and pipeline; A supply pipeline, the supply pipeline is connected to the vacuum generator and the power gas source respectively, and is used to transport the power gas; A tenth valve assembly is provided in the exhaust pipeline and the supply pipeline, and is used to control the flow of the exhaust pipeline and the supply pipeline.

7. The semiconductor tail gas treatment device according to claim 6, characterized in that: The purge module also includes: a third pressure monitoring pipeline, the third pressure monitoring pipeline being in communication with the purge pipeline and being used for conveying purge gas; A third pressure monitor is connected to the third pressure monitoring pipeline and is used to monitor the pressure of the purge pipeline.

8. The semiconductor tail gas treatment device according to claim 5, characterized in that: Also includes: A safety assurance module is connected to the recovery module and the tail gas emission module respectively, and is used to relieve pressure on the recovery module.

9. The semiconductor tail gas treatment device according to claim 8, characterized in that: The security module comprises: A third pressure relief pipeline, the third pressure relief pipeline is connected to the recovery module and the exhaust module respectively, and is used to transport special gas; a third pressure relief valve, the third pressure relief valve being arranged in the third pressure relief pipeline and being used for relieving pressure when the pressure in the recovery tank exceeds a third preset pressure threshold; An eleventh valve assembly, the eleventh valve assembly is arranged in the third pressure relief pipeline, and is used to control the flow of the third pressure relief pipeline.

10. A semiconductor process system, characterized in that: include: The semiconductor tail gas treatment device according to any one of claims 1 to 9; A process chamber is connected to the recovery module of the semiconductor tail gas treatment device.

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