Temperature-controllable chip ejection device
By achieving precise temperature control on the surface of the ejection needle head of the chip ejection device, the problem of damage and poor results of traditional devices when dealing with thin chips and high-viscosity films is solved, and a more efficient and safe chip ejection process is achieved.
Patent Information
- Application Number
- CN202421280210.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-05
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2034-06-05
AI Technical Summary
Traditional thimble chip ejection devices are prone to damage when dealing with chips with small thickness or high wafer film viscosity, and multi-stage thimbles are not effective when the membrane viscosity is high.
A temperature-controllable chip ejection device is designed to achieve precise temperature control on the surface of the ejector head to reduce the viscosity of the wafer film. The device includes a base, a thimble base and a thimble head. It uses a voice coil motor to drive the thimble push block, and combines the heating device and a vacuum adsorption structure to achieve precise temperature control of the thimble head.
Through closed-loop temperature control, precise temperature control on the surface of the ejector head is achieved, and the viscosity of the wafer film is reduced, which effectively solves the ejection problem of thin chips and high-viscosity films, and improves the safety and success rate of the chip.
Smart Images
Figure CN222785263U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a temperature-controllable chip ejection device. Background Art
[0002] Currently, all die bonding equipment on the market are equipped with chip ejection devices to complete the pre-stripping action before chip removal. With the continuous development of semiconductor technology, chips in high-end packaging processes are becoming thinner and thinner, which places higher and higher requirements on chip ejection devices.
[0003] When faced with chips with very small thickness or high viscosity of wafer film, the traditional ejector pin type device can easily damage the chip during operation. The multi-stage ejector pin can better solve the pre-stripping problem of thin chips, but the effect is not good when the film viscosity is large. Utility Model Content
[0004] The utility model aims to provide a chip ejection device which can accurately control the temperature of the surface of a pin head to reduce the viscosity of a wafer film, so as to cope with a chip extraction scenario in which the chip is thin and the film viscosity is high.
[0005] To achieve the above purpose, the technical solution of the utility model is as follows:
[0006] A temperature-controllable chip ejection device comprises a base, an ejector seat and an ejector head, wherein the base is provided with an ejector seat and an ejector head in sequence, the base is provided with a voice coil motor, an ejector pusher head is arranged in the ejector seat, and a mover of the voice coil motor is connected to the ejector pusher head via an ejector pusher block.
[0007] The ejector head comprises a shaft, an ejector actuator seat, an ejector middle end and an ejector cap, the ejector actuator seat is provided with an ejector middle end and an ejector cap in sequence, the shaft is arranged in the cavity of the ejector actuator seat, the ejector middle end and the ejector cap, a spring adapter is arranged in the ejector middle end, the shaft sleeve is arranged in the spring adapter, an ejector shaft frame is arranged at the lower end of the shaft, the diameter of the ejector shaft frame is larger than the size of the hole at the lower end of the ejector actuator seat, a spring is sleeved on the shaft between the spring adapter and the ejector shaft frame, an ejector plate seat is arranged in the ejector cap, an ejector ejector plate is arranged on the ejector plate seat, an ejector is arranged on the ejector ejector plate, an ejector is arranged on the ejector plate, an ejector extension hole and a vacuum adsorption hole are arranged on the upper surface of the ejector cap, and a heating device and a vacuum adsorption structure are also provided on the device.
[0008] Preferably, the ejector seat is provided with an adsorption magnet and an adsorption air path for adsorbing the ejector head, and the ejector seat is provided with a second air path inlet for supplying air to the adsorption air path.
[0009] Preferably, the heating device comprises a heating rod and a thermocouple; the heating rod is arranged in the ejector seat, and the thermocouple is arranged on the ejector seat and connected to the heating rod to provide temperature feedback to the heating rod.
[0010] Preferably, the ejector seat, ejector actuator seat, ejector middle section and ejector cap are all made of heat conductive materials.
[0011] Preferably, the ejector seat is provided with a first gas path inlet, the ejector actuator seat is provided with a first channel; the middle end of the ejector is provided with a second channel, a first cavity and a third channel; the ejector plate seat of the ejector cap and the middle end of the ejector form a second cavity, the ejector ejector plate and the ejector cap form a third cavity, and the ejector plate seat and the ejector ejector plate are both provided with a fourth channel;
[0012] The first gas path inlet is connected to the first channel, the second channel, the first cavity, the third channel, the second cavity, the fourth channel, and the third cavity in sequence and acts on the vacuum adsorption hole provided on the ejector cap to form a vacuum adsorption structure.
[0013] Preferably, a heat insulating pad is provided between the base and the ejector seat.
[0014] Preferably, the mover of the voice coil motor is further provided with a mover connection lifting block, the mover connection lifting block is provided with a grating ruler, and the base is provided with a grating ruler reading head.
[0015] Preferably, the ejector seat is provided with a limiting hole, the mover of the voice coil motor is further connected to a limiting block, and the limiting block is located in the limiting hole.
[0016] The utility model realizes accurate temperature control on the surface of the ejector pin head through closed-loop temperature control to reduce the viscosity of the wafer film, so as to cope with the chip material extraction scenario where the chip is thin and the film viscosity is high.
[0017] The utility model uses the stator and mover of the voice coil motor as the power source for providing linear up and down motion. After power is turned on, the mover of the voice coil motor moves up and down in a linear manner, driving the ejector pusher connected thereto and the ejector pusher head, ejector shaft frame, shaft, ejector plate seat and ejector ejector plate connected thereto to move up and down in a linear manner synchronously. Finally, the power is transmitted to the ejector, and the ejector moves upward through the pinhole of the ejector cap, and finally lifts up the blue film so that it realizes the final function with the glass on the lower surface of the workpiece.
[0018] The utility model provides a movable member connected to a lifting block on which a grating ruler is installed, which is used in conjunction with a grating ruler reading head to achieve accurate lifting distance control.
[0019] The spring of the utility model is compressed during the lifting process, and the voice coil motor needs to overcome the elastic force of the spring. During the descending process, the spring plays a resetting role. A limit block is provided to cooperate with the ejector seat to play a limiting and buffering role during the up and down movement.
[0020] The gas path of the utility model is an air path through the first gas path inlet and the ejector seat, the ejector actuator seat, the ejector middle section, and the ejector cap. When the first gas path inlet generates a vacuum through the vacuum generator, the negative pressure will eventually pass through the vacuum adsorption hole on the head of the ejector cap to adsorb the wafer film.
[0021] The utility model heats by means of a heating rod, and the ejector seat, ejector actuator seat, ejector middle section, and ejector cap are all made of materials with good thermal conductivity. Eventually, the heat is conducted to the ejector cap to heat the adsorbed wafer film, making it easier for the chip to be lifted by the ejector pin. Temperature regulation uses a thermocouple to provide temperature feedback to the ejector seat of the heated workpiece, and then an external temperature controller controls the on and off of the voltage at both ends of the heating rod, thereby forming a closed-loop temperature control with the heating rod. The heated ejector seat portion is separated from the bottom motion module by a thermal insulation pad to ensure that when the temperature of the heating portion exceeds 100°C, the temperature of the motion module is still below 30°C, thereby preventing damage caused by overheating of the motor coil. In addition, this chip ejection device can realize a fully automatic ejector head switching function while ensuring that the temperature can be controlled, thereby maximizing the compatibility of the device with chips and wafer rings.
[0022] The ejector actuator seat and ejector shaft frame of the utility model are all parts of the ejector head, and as a whole, they can be quickly replaced. Through the airway in the ejector seat through the second air path inlet, a plurality of vacuum adsorption ports are formed on its surface, and the ejector actuator seat is fixed together with a plurality of magnets mounted on the surface. When it is necessary to replace other types of ejector heads, the vacuum input is stopped at the second air path inlet, and the ejector head can be removed through the ejector head removal and placement mechanism by simply overcoming the suction force of the magnet and the ejector head's own gravity. When inserting a new ejector head, the vacuum is re-supplied to the second air path inlet to re-fix it. After replacing the ejector head at room temperature, it only takes 5 minutes to heat it to the working temperature, which greatly increases its practicality. At the same time, the vacuum air path can feedback abnormal vacuum values when the ejector head is not placed stably, and can then be used as a safety sensor for ejector head replacement. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 It is a front cross-sectional view of this embodiment.
[0024] Figure 2 It is a side sectional view of this embodiment.
[0025] Figure 3 Schematic diagram of the ejector pin structure of this embodiment. DETAILED DESCRIPTION
[0026] The utility model is described in detail below with reference to the accompanying drawings. Example 1
[0027] like Figure 1-3 As shown, a temperature-controllable chip ejection device comprises a base, an ejector seat 24 and an ejector head, wherein the base is provided with an ejector seat 24 and an ejector head in sequence, the base is provided with a voice coil motor 2, an ejector seat 24 is provided with an ejector pusher head 8, and the mover of the voice coil motor 2 is connected to the ejector pusher head 8 via an ejector pusher block 7.
[0028] The ejector head comprises a shaft 12, an ejector actuator seat 19, an ejector middle end 18 and an ejector cap 16. The ejector actuator seat 19 is provided with the ejector middle end 18 and the ejector cap 16 in sequence. The shaft 12 is arranged in the cavity of the ejector actuator seat 19, the ejector middle end 18 and the ejector cap 16. The ejector middle end 18 is provided with a spring adapter 20. The shaft 12 is sleeved in the spring adapter 20. The lower end of the shaft 12 is provided with an ejector shaft frame 10. The diameter of the ejector shaft frame 10 is greater than The size of the hole at the lower end of the ejector actuator seat 19 is adjusted to achieve the limit of the shaft 10 in the ejector head. The shaft 12 is sleeved with a spring 11 between the spring adapter 20 and the ejector shaft frame 10. The ejector cap 16 is provided with an ejector plate seat 13, and an ejector ejector plate 14 is provided on the ejector plate 13. An ejector 15 is provided on the ejector ejector plate 14. The upper surface of the ejector cap 16 is provided with an ejector 15 extension hole and a vacuum adsorption hole. The device is also provided with a heating device and a vacuum adsorption structure.
[0029] Preferably, the ejector seat 24 is provided with an adsorption magnet 21 and an adsorption air path for adsorbing the ejector head, and the ejector seat 24 is provided with a second air path inlet I for supplying air to the adsorption air path.
[0030] Preferably, the heating device comprises a heating rod 22 and a thermocouple 23 ; the heating rod 22 is disposed in an ejector seat 24 , and the thermocouple 23 is disposed on the ejector seat 24 and connected to the heating rod 22 , so as to provide temperature feedback to the heating rod 22 .
[0031] Preferably, the ejector seat 24, the ejector actuator seat 19, the ejector middle section 18, and the ejector cap 16 are all made of heat conductive materials.
[0032] Preferably, the ejector seat 24 is provided with a first gas path inlet A, the ejector actuator seat 19 is provided with a first channel B; the ejector middle end 18 is provided with a second channel C, a first cavity D and a third channel E; the ejector plate seat 13 of the ejector cap 16 and the ejector middle end 18 form a second cavity F, the ejector ejector plate 14 forms a third cavity G between the ejector cap 16, and the ejector plate seat 13 and the ejector ejector plate 14 are both provided with a fourth channel H;
[0033] The first gas path inlet A is connected to the first channel B, the second channel C, the first cavity D, the third channel E, the second cavity F, the fourth channel H, and the third cavity G in sequence and acts on the vacuum adsorption hole opened on the ejector cap 16 to form a vacuum adsorption structure.
[0034] Preferably, a heat insulating pad 25 is provided between the base and the ejector seat 24 .
[0035] Preferably, a mover connecting lifting block 4 is further provided on the mover of the voice coil motor 2, a grating ruler is provided on the mover connecting lifting block 4, and a grating ruler reading head 1 is provided on the base.
[0036] Preferably, the ejector seat 24 is provided with a limiting hole, and the mover of the voice coil motor 2 is further connected to a limiting block 5, and the limiting block 5 is located in the limiting hole.
[0037] In this embodiment, a sealing ring is provided between the ejector cap 16 and the ejector middle section 18 .
[0038] Specific implementation method, the device uses the stator and mover of the voice coil motor 2 as the power source to provide linear up and down motion. After power is turned on, the mover of the voice coil motor 2 moves up and down in a straight line, driving the pusher 15 connected to it and the indirectly connected ejector pusher head 8, ejector shaft frame 10, shaft 12, ejector plate seat 13 and ejector ejector plate 14 to move up and down in a straight line synchronously. Finally, the power is transmitted to the ejector 15, and the ejector 15 moves upward through the pinhole of the ejector cap 16, and finally lifts up the blue film so that it can realize the final function with the glass on the lower surface of the workpiece.
[0039] Among them, a grating ruler is installed on the mover connection lifting block 4 provided in this embodiment, and is used in conjunction with the grating ruler reading head 1 to achieve precise control of the lifting distance.
[0040] The gas path of the utility model is an air path through the first gas path inlet A and the ejector seat 24, the ejector actuator seat 19, the ejector middle section 18, and the ejector cap 16. When the first gas path inlet A generates a vacuum through the vacuum generator, the negative pressure will eventually pass through the vacuum adsorption hole at the head of the ejector cap 16 to adsorb the wafer film.
[0041] In this embodiment, heating is performed by a heating rod 22, and the ejector seat 24, the ejector actuator seat 19, the ejector middle section 18, and the ejector cap 16 are all made of materials with good thermal conductivity. Eventually, the heat is conducted to the ejector cap 16 to heat the adsorbed wafer film, making it easier for the chip to be lifted by the ejector pin 15. The temperature regulation is performed by a thermocouple 23 to provide temperature feedback to the ejector seat 24 of the heated workpiece, and then the on and off of the voltage at both ends of the heating rod 22 is controlled by an external temperature controller, thereby forming a closed-loop temperature control with the heating rod 22. The heated ejector seat 24 is partially separated from the bottom motion module by a heat-insulating pad 25, ensuring that when the temperature of the heated part exceeds 100°C, the temperature of the motion module is still below 30°C, thereby preventing damage caused by overheating of the motor coil. In addition, this set of chip ejection device can realize a fully automatic ejector head switching function while ensuring that the temperature can be controlled, thereby maximizing the compatibility of the device with chips and wafer rings.
[0042] The ejector actuator seat 19 and the ejector shaft frame 10 of the utility model are all ejector head parts, and as a whole, they can be quickly replaced. Through the second air path inlet I, the airway in the ejector seat 24 forms three vacuum adsorption ports on its surface, and together with the nine magnets 21 mounted on the surface, the ejector actuator seat 19 is fixed. When it is necessary to replace other types of ejector heads, the second air path inlet I stops the vacuum input, and the ejector head can be removed through the ejector head pick-up and placement mechanism by simply overcoming the suction force of the nine magnets 21 and the ejector head's own gravity. When a new ejector head is placed, the vacuum is re-supplied to the second air path inlet I to re-fix it. After replacing the ejector head at room temperature, it only takes 5 minutes to heat it to the working temperature, which greatly increases its practicality. At the same time, the vacuum air path can feedback abnormal vacuum values when the ejector head is not placed stably, and can then be used as a safety sensor for ejector head replacement.
[0043] The above is a detailed description of the utility model in combination with specific embodiments, and it cannot be determined that the specific implementation methods of the present invention are limited to these descriptions. For ordinary technicians in the technical field to which the utility model belongs, making several equivalent substitutions or obvious modifications without departing from the concept of the present invention, and having the same performance or use, should be regarded as belonging to the patent protection scope of the utility model determined by the submitted claims.
Claims
1. A temperature-controllable chip ejection device, characterized in that: The device comprises a base, an ejector seat and an ejector head; The base is provided with an ejector seat and an ejector head in sequence; A voice coil motor is arranged on the base, and an ejector pusher head is arranged in the ejector seat; The mover of the voice coil motor is connected to the ejector head via an ejector push block; The ejector head comprises a shaft, an ejector actuator seat, an ejector middle end and an ejector cap; The ejector actuator seat is provided with an ejector middle end and an ejector cap in sequence; The shaft is arranged in the cavity of the ejector actuator seat, the ejector middle end and the ejector cap; A spring adapter is provided in the middle end of the ejector pin, and the shaft sleeve is provided in the spring adapter; An ejector shaft frame is provided at the lower end of the shaft, and the diameter of the ejector shaft frame is larger than the size of the hole at the lower end of the ejector actuator seat; The shaft is sleeved with a spring between the spring adapter and the ejector shaft bracket; An ejector plate seat is provided in the ejector cap, an ejector ejector plate is provided on the ejector plate seat, and an ejector is provided on the ejector ejector plate; The upper surface of the ejector cap is provided with an ejector extension hole and a vacuum adsorption hole; The device is also provided with a heating device and a vacuum adsorption structure.
2. A temperature-controllable chip ejection device according to claim 1, characterized in that: The ejector seat is provided with an adsorption magnet and an adsorption air path for adsorbing the ejector head.
3. The temperature-controllable chip ejection device according to claim 1, characterized in that: The heating device comprises a heating rod and a thermocouple; the heating rod is arranged in the ejector seat, and the thermocouple is arranged on the ejector seat and connected to the heating rod, so as to provide temperature feedback to the heating rod.
4. A temperature-controllable chip ejection device according to claim 3, characterized in that: The ejector seat, ejector actuator seat, ejector middle section and ejector cap are all made of heat conductive materials.
5. The temperature-controllable chip ejection device according to claim 1, characterized in that: The ejector seat is provided with a first gas path inlet, and the ejector actuator seat is provided with a first channel; the middle end of the ejector is provided with a second channel, a first cavity and a third channel; the ejector plate seat of the ejector cap and the middle end of the ejector form a second cavity, the ejector ejector plate and the ejector cap form a third cavity, and the ejector plate seat and the ejector ejector plate are both provided with a fourth channel; The first gas path inlet is connected to the first channel, the second channel, the first cavity, the third channel, the second cavity, the fourth channel, and the third cavity in sequence and acts on the vacuum adsorption hole provided on the ejector cap to form a vacuum adsorption structure.
6. A temperature-controllable chip ejection device according to claim 5, characterized in that: A heat insulating pad is provided between the base and the ejector seat.
7. The temperature-controllable chip ejection device according to claim 1, characterized in that: A mover connecting lifting block is also provided on the mover of the voice coil motor, a grating ruler is provided on the mover connecting lifting block, and a grating ruler reading head is provided on the base.
8. The temperature-controllable chip ejection device according to claim 1, characterized in that: The ejector seat is provided with a limiting hole, and the mover of the voice coil motor is also connected to a limiting block, and the limiting block is located in the limiting hole.