Broadband solid-state power amplifier based on ferrite Balun

Abstract

The utility model provides a broadband solid-state power amplifier based on a ferrite balun, which relates to the field of microwave solid-state power amplifiers, and comprises a broadband ferrite balun, a power amplifier tube core and an oxygen-free copper carrier plate, the broadband ferrite balun comprises ferrite, a coaxial line and a microstrip PCB (printed circuit board) circuit, the broadband ferrite balun is located before input matching and after output matching of the power amplifier, and the input and output echo performance of the power amplifier module is improved by means of the excellent echo characteristic of the broadband ferrite balun. The working frequency bandwidth of the amplifier can be expanded by adopting passive broadband input and output matching, the broadband ferrite Balun can optimize input and output echoes of the amplifier, and the power amplifier can be conveniently connected with other circuits such as a frequency source, an antenna and a higher-power output amplifier; and the phenomena of compression of the working bandwidth and burnout of the power amplifier cannot be caused, the introduced insertion loss is very small, and broadband matching and 30W saturation output are realized.

Description

Technical Field

[0001] The utility model belongs to the field of microwave solid-state power amplifiers, in particular to a broadband solid-state power amplifier based on a ferrite balun. Background Art

[0002] Microwave power amplifier is a very important component of long-range radar and communication systems. Its function is to amplify the RF signal of the RF front end and transmit it through the antenna. It can achieve a longer radar detection distance and a longer communication distance, and better communication effect. Its performance directly determines the quality of radar and communication systems.

[0003] In the development history of existing solid-state power amplifiers, amplifier cores have gradually experienced silicon-based technology, GaAs technology, and GaN technology; among them, GaN amplifier cores have higher saturated output power and higher energy conversion efficiency, and are currently the mainstream technology; but they also have certain defects, such as smaller area, faster heat dissipation, greater difficulty in broadband matching, and easy burning when connected to other circuits. Therefore, in order to realize microwave power solid-state circuits based on GaN technology, it is necessary to solve the heat dissipation problem and the problem of easy circuit connection under broadband matching.

[0004] In summary, the utility model provides a broadband solid-state power amplifier based on ferrite balun to solve the above problems. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0006] A broadband solid-state power amplifier based on a ferrite balun, comprising a broadband ferrite balun, a power amplifier die and an oxygen-free copper carrier board, wherein the broadband ferrite balun comprises ferrite, a coaxial line and a microstrip PCB circuit, and the broadband ferrite balun is located before input matching and after output matching of the power amplifier, and utilizes the excellent echo characteristics of the broadband ferrite balun to improve the input and output echo performance of the power amplifier module;

[0007] The power amplifier core uses a core whose saturated output is greater than the saturated output of the power amplifier. The power amplifier core is used to ensure the stability of the output power of the amplifier circuit. The input and output of the power amplifier core both use broadband passive matching, and mainly use microstrip lines and lumped components. The lumped components are high-precision RF inductors, RF capacitors and resistors.

[0008] Furthermore, in the present invention, the microstrip PCB circuit is mounted on the surface of an oxygen-free copper carrier, and the oxygen-free copper carrier is used for heat dissipation of the circuit and the die.

[0009] Furthermore, in the utility model, an integrated boss is also provided on the surface of the oxygen-free copper carrier, and the integrated boss is used to install the tube core.

[0010] Furthermore, in the present invention, the tube core adopts a welding process, wherein the welding uses a tin-gold alloy foil as a welding material and uses a eutectic process.

[0011] Beneficial effects: The utility model has the following beneficial effects:

[0012] The utility model can expand the working frequency bandwidth of the amplifier by adopting passive broadband input and output matching. The broadband ferrite balun can optimize the input and output echoes of the amplifier, which is convenient for the power amplifier to be connected with other circuits such as frequency source, antenna, and higher power output amplifier, and will not cause the compression of the working bandwidth and the burning of the power amplifier. The insertion loss introduced is very small, and broadband matching and 30W saturated output are achieved. In addition, the amplifier is not damaged under long-term test of outdoor connection antenna, thereby solving the heat dissipation problem under high power and the easy connection problem under broadband matching. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is the schematic diagram of the broadband solid-state power amplifier circuit based on ferrite balun;

[0014] Figure 2 This is a schematic diagram of the ferrite broadband balun structure;

[0015] Figure 3 This is the test result of ferrite broadband balun;

[0016] Figure 4 The PCB structure diagram of the broadband solid-state power amplifier circuit based on ferrite balun;

[0017] Figure 5 The schematic diagram of the structure of the broadband solid-state power amplifier circuit substrate based on ferrite balun;

[0018] Figure 6 The small signal gain test results of a broadband solid-state power amplifier based on ferrite balun are shown;

[0019] Figure 7 The 30W saturation output test results of a broadband solid-state power amplifier based on ferrite balun;

[0020] Figure 8 The figure shows the test results of 30W saturated output gain of a broadband solid-state power amplifier based on ferrite balun. DETAILED DESCRIPTION

[0021] In order to better understand the technical content of the utility model, specific embodiments are cited and described as follows in conjunction with the accompanying drawings. In this disclosure, various aspects of the utility model are described with reference to the accompanying drawings, and many illustrative embodiments are shown in the accompanying drawings. The embodiments of the present disclosure are not necessarily defined to include all aspects of the utility model. It should be understood that the various concepts and embodiments introduced above, as well as those described in more detail below, can be implemented in any of many ways, because the concepts and embodiments disclosed in the utility model are not limited to any implementation method. In addition, some aspects disclosed in the utility model can be used alone, or used in any appropriate combination with other aspects disclosed in the utility model.

[0022] Example 1

[0023] like Figure 1-8 As shown, it is the first embodiment of the utility model, which provides a broadband solid-state power amplifier based on a ferrite balun, including a broadband ferrite balun, a power amplifier die and an oxygen-free copper carrier board, the broadband ferrite balun includes ferrite, a coaxial line and a microstrip PCB circuit, the broadband ferrite balun is located before the input matching and after the output matching of the power amplifier, and the excellent echo characteristics of the broadband ferrite balun are used to improve the input and output echo performance of the power amplifier module;

[0024] The power amplifier core uses a core whose saturated output is greater than the power amplifier saturated output. The power amplifier core is used to ensure the stability of the output power of the amplifier circuit. The input and output of the power amplifier core both use broadband passive matching, and mainly use microstrip lines and lumped components. The lumped components are high-precision RF inductors, RF capacitors and resistors.

[0025] like Figure 1-8 As shown, the power amplifier die uses a die whose saturated output is greater than the saturated output of the power amplifier, which can ensure that the output power of the amplifier circuit can be stabilized above the design value. Broadband passive matching is performed before and after the die. The specific matching method is a mixed matching of microstrip and lumped components (R / L / C). The lumped components are used to reduce the size of the matching circuit. Broadband ferrite baluns are added before input matching and after output matching. The excellent echo characteristics of the broadband ferrite balun are used to improve the input and output echo performance of the power amplifier module. Passive broadband input and output matching can expand the operating frequency bandwidth of the amplifier. The broadband ferrite balun can optimize the input and output echo of the amplifier, which is convenient for the power amplifier to be connected with other circuits such as frequency sources, antennas, and higher power output amplifiers, and will not cause compression of the operating bandwidth and burning of the power amplifier.

[0026] Example 2

[0027] Reference Figure 2 and 4, which is the second embodiment of the utility model, and this embodiment is based on the previous embodiment.

[0028] In this embodiment, the microstrip PCB circuit is mounted on the surface of an oxygen-free copper substrate, and the oxygen-free copper substrate is used for heat dissipation of the circuit and the die.

[0029] An integrated boss is also provided on the surface of the oxygen-free copper carrier board, and the integrated boss is used for mounting the tube core.

[0030] The tube core adopts a welding process, and the welding uses tin-gold alloy foil as the welding material, using a eutectic process.

[0031] like Figure 2 and 4 As shown, the microstrip PCB circuit is assembled on a whole piece of oxygen-free copper carrier board, which can realize the function of rapid heat dissipation. The tube core is assembled on the boss, which can realize the rapid heat dissipation of the tube core. Since the GaN tube core area is small and the heat density is very high during operation, the area of ​​the boss must be larger than the chip area to make the heat dissipation speed fast enough. The chip area is 0.75mm*1.63mm. The chip adopts eutectic welding process, which has the characteristics of more solid welding and better heat dissipation performance.

[0032] When in use, broadband passive matching is performed before and after the tube core respectively. The specific matching method is a mixed matching of microstrip and lumped components (R / L / C). The lumped components are used to reduce the size of the matching circuit. Broadband ferrite baluns are added before input matching and after output matching. The excellent echo characteristics of broadband ferrite baluns are used to improve the input and output echo performance of the power amplifier module. Passive broadband input and output matching can expand the operating frequency bandwidth of the amplifier. The broadband ferrite balun can optimize the input and output echo of the amplifier, which facilitates the connection of the power amplifier with other circuits such as frequency sources, antennas, and higher power output amplifiers, and will not cause compression of the operating bandwidth and burning of the power amplifier.

[0033] The standard parts used in this application document can all be purchased from the market and can be customized according to the description in the specification and drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art. The control method is automatic control through a controller. The control circuit of the controller can be implemented through simple programming by technicians in this field, which is common knowledge in the field. This application is mainly used to protect mechanical devices, so this application no longer explains the control method and circuit connection in detail.

[0034] Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. A person with ordinary knowledge in the technical field to which the present invention belongs may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the claims.

Claims

1. A broadband solid-state power amplifier based on a ferrite balun, comprising a broadband ferrite balun, a power amplifier die and an oxygen-free copper substrate, characterized in that: The broadband ferrite balun includes ferrite, a coaxial line and a microstrip PCB circuit. The broadband ferrite balun is located before the input matching and after the output matching of the power amplifier, and the excellent echo characteristics of the broadband ferrite balun are used to improve the input and output echo performance of the power amplifier module; The power amplifier core uses a core whose saturated output is greater than the saturated output of the power amplifier. The power amplifier core is used to ensure the stability of the output power of the amplifier circuit. The input and output of the power amplifier core both use broadband passive matching, and mainly use microstrip lines and lumped components. The lumped components are high-precision RF inductors, RF capacitors and resistors.

2. The broadband solid-state power amplifier based on ferrite balun as claimed in claim 1, characterized in that: The microstrip PCB circuit is mounted on the surface of an oxygen-free copper carrier, and the oxygen-free copper carrier is used for heat dissipation of the circuit and the tube core.

3. The broadband solid-state power amplifier based on ferrite balun as claimed in claim 1, characterized in that: The surface of the oxygen-free copper carrier is also provided with an integrated boss, and the integrated boss is used for mounting the tube core.

4. The broadband solid-state power amplifier based on ferrite balun as claimed in claim 1, characterized in that: The tube core adopts a welding process, wherein the welding uses a tin-gold alloy foil as a welding material and uses a eutectic process.

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