Circuit board and electric equipment thereof

Abstract

The circuit board comprises a heating element and a heat dissipation structure, the heat dissipation structure comprises at least one metal heat conduction piece, the metal heat conduction piece comprises a heat conduction main body and at least two pins connected with the heat conduction main body, the pins are correspondingly inserted into through holes in the circuit board, and the heat conduction main body is connected with the heat conduction main body. The through hole is connected to the heating element through a heat conduction line of the circuit board. By arranging the metal heat conduction piece, heat generated by the heating element can be continuously transmitted to the pins and the heat conduction main body through the corresponding through holes, and then heat dissipation and cooling can be rapidly carried out on the circuit board; meanwhile, the heat conduction main body is fixed on the through hole of the circuit board through the pin, the installation process of the heat dissipation structure of the circuit board is simplified, the metal heat conduction piece can be rapidly and accurately installed on the circuit board through automatic equipment, the labor cost is saved, and the production efficiency of the circuit board and electric equipment of the circuit board is improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board and electrical equipment thereof. Background Art

[0002] The duct air conditioner, also known as the duct-type central air conditioner, is a type of central air conditioner and an upgrade of the traditional air conditioner. It consists of an outdoor unit and an indoor unit, which are connected by a copper pipe and the air is the transmission medium. When working, the outdoor unit draws air into the air supply duct, which is centrally cooled by the chiller, and then the fresh air is cooled or heated, mixed with the return air and transported to the room to adjust the indoor temperature and control the airflow through the valve. Since it is necessary to frequently send work instructions to the circuit board of the duct air conditioner during the temperature adjustment process, the heating elements of the circuit board emit a large amount of heat during use, and a heat dissipation structure is required to reduce the temperature to ensure the quality and life of the duct air conditioner circuit board. In the related art, the installation of the heat dissipation structure of the circuit board adopts a manual installation method to install the heat dissipation device on the heating device. Its fixing method is mainly through screwing or fixing with a retaining spring, which requires manual operation, affecting the production efficiency of the circuit board and its electrical equipment. Summary of the invention

[0003] This embodiment provides a circuit board and its electrical equipment. The heat dissipation structure of the circuit board is convenient for automated installation, and the metal heat conductor can be quickly and accurately installed on the circuit board, thereby improving the production efficiency of the circuit board and its electrical equipment.

[0004] In a first aspect, an embodiment of the present application provides a circuit board, including:

[0005] Heating element;

[0006] A heat dissipation structure comprises at least one metal heat conductor, wherein the metal heat conductor comprises a heat-conducting body and at least two pins connected to the heat-conducting body, at least one of the pins corresponds to a through hole on the circuit board, and the through hole is connected to the heating element through a heat-conducting line of the circuit board, wherein the heat dissipation structure and the circuit board do not form an electrical circuit.

[0007] In the above circuit board, the metal heat conductor is a plug-in terminal, which includes a wiring portion and two pins. The wiring portion of the plug-in terminal serves as the heat-conducting body, and the pins of the plug-in terminal serve as the plug pins.

[0008] In the above circuit board, the wiring part is in a sheet shape and is perpendicular to the circuit board.

[0009] In the above circuit board, the circuit board further comprises a ventilation slot, and the ventilation slot is arranged between at least two of the through holes into which the metal heat conductive member is inserted.

[0010] In the above circuit board, the heat-conducting body is a heat dissipation bar, and the two ends of the heat dissipation bar are respectively connected to a pin; the heat dissipation bar is welded in the through hole through the pin to be fixed on the circuit board, and the ventilation groove is arranged below the heat dissipation bar.

[0011] In the above circuit board, the circuit board includes a plurality of the metal heat conductive members, the heat dissipation bars of at least a portion of the metal heat conductive members are arranged parallel to each other, and the heat dissipation bars parallel to each other are arranged along the extension direction of the ventilation slots.

[0012] In the above circuit board, a gap is left between the heat dissipation strip and the surface of the circuit board.

[0013] In the above circuit board, the metal heat conductor is arranged in the peripheral area of ​​the heating element, and the shortest distance between the metal heat conductor and the heating element is less than 10 mm.

[0014] In the above circuit board, the heating element is arranged on a first surface of the circuit board, and the metal heat conductor is arranged on a second surface which is the opposite side of the first surface.

[0015] In the above circuit board, a pad corresponding to at least one pin of the heating element is connected to the through hole through the heat-conducting line.

[0016] In a second aspect, an embodiment of the present application provides an electrical device, including the circuit board described in the first aspect.

[0017] The circuit board and its electrical equipment of this embodiment have at least the following beneficial effects: by providing a metal heat conductor, the heat generated by the heating element can be continuously transferred to the pins and the heat-conducting body through the corresponding through-holes, thereby quickly dissipating the heat and cooling the circuit board; at the same time, the heat-conducting body is fixed to the through-holes of the circuit board by the pins, which simplifies the installation process of the heat dissipation structure of the circuit board, and the metal heat conductor can be quickly and accurately installed on the circuit board through automated equipment, saving labor costs; the heat dissipation structure and the circuit board circuit do not form an electrical loop, avoiding the heat dissipation structure from affecting the circuit during installation and use, and ensuring the structural stability of the circuit board. On the one hand, the embodiment of the present application can quickly and stably dissipate the heat of the circuit board through the metal heat conductor, and on the other hand, the circuit board heat dissipation structure can be quickly and accurately installed on the circuit board, improving the production efficiency of the circuit board and its electrical equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the front structure of a circuit board provided in an embodiment of the present application;

[0019] Figure 2 is a side view of a circuit board provided in an embodiment of the present application;

[0020] Figure 3 is a schematic diagram of the front structure of a circuit board provided by another embodiment of the present application;

[0021] Figure 4 is a side view of a circuit board provided in another embodiment of the present application;

[0022] Figure 5 This is a side view of a circuit board provided in another embodiment of the present application. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. In addition, the characteristics, operations or features described in the specification can be combined in any appropriate manner to form various implementation methods. At the same time, the steps or actions in the method description can also be replaced or adjusted in order in a manner that is obvious to those skilled in the art. Therefore, the various sequences in the specification and the accompanying drawings are only for the purpose of clearly describing a certain embodiment and are not meant to be a necessary sequence, unless otherwise specified that a certain sequence must be followed.

[0024] In the description of this application, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0025] The serial numbers of the components in this document, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings).

[0026] Circuit boards are important electronic components, supporting electronic components and providing circuit connections for electronic components. Almost all electronic products include circuit boards. As the integration of circuit boards becomes higher and higher, the components on the circuit boards are arranged more and more densely, and the heat dissipation area is insufficient, especially around high-heat generating components, where the temperature is more likely to exceed the standard. With the maturity of technology and improvement of functions of air-conditioning electrical equipment, its control logic and functional requirements have put forward higher requirements on the heat dissipation performance of circuit boards. Specifically, the heating elements of the circuit boards of electrical equipment emit a large amount of heat during use, and a heat dissipation structure is needed to reduce the temperature to ensure the quality and life of the circuit boards of the electrical equipment.

[0027] At present, when a few devices in the circuit board generate a large amount of heat, a heat sink or heat pipe can be added to the heat generating device. If the temperature still cannot be lowered, a heat sink with a fan can be used to enhance the heat dissipation effect. When there are a large number of heat generating devices, a large heat dissipation cover can be used. It is a special heat sink customized according to the position and height of the heat generating device on the circuit board, or different component height positions are cut out on a large flat heat sink. The heat dissipation cover is buckled on the component surface as a whole, and contacts each component to dissipate heat. However, due to the inconsistent height of the components during soldering, the heat dissipation effect is not good. Usually, a soft thermal phase change thermal pad is added to the component surface to improve the heat dissipation effect. The above heat dissipation structure needs to be manually installed on the circuit board to install the fixing device of the heat dissipation structure. The fixing method includes but is not limited to fixing by screwing, installing a retaining spring, etc., or a fixed base for installing the heat dissipation structure needs to be reserved in a specific area on the circuit board. This installation method not only requires planning and designing in advance according to the position of the heat generating component, but also requires manual operation during the installation process. It cannot be mass-produced and assembled by automated equipment, which affects the production efficiency of the circuit board and its electrical equipment, and greatly increases the production cost of the circuit board.

[0028] Based on this, the present embodiment provides a circuit board and its electrical equipment. By setting a metal heat conductor, the heat generated by the heating element can be continuously transferred to the pins and the heat-conducting body through the corresponding through holes, thereby quickly dissipating the heat and cooling the circuit board; at the same time, the heat-conducting body is fixed to the through holes of the circuit board by the pins, which simplifies the installation process of the heat dissipation structure of the circuit board, and the metal heat conductor can be quickly and accurately installed on the circuit board through automated equipment, saving labor costs; the heat dissipation structure and the circuit board circuit do not form an energized loop, avoiding the heat dissipation structure from affecting the circuit during installation and use, ensuring the structural stability of the circuit board, and ensuring that the metal heat conductor quickly and stably dissipates heat from the circuit board, while improving the production efficiency of the circuit board and its electrical equipment.

[0029] The following is a description of the circuit board and its electrical equipment in conjunction with the attached drawings:

[0030] See also Figure 1 , Figure 1 The front structural diagram of a circuit board provided by the first aspect of the present application is shown. Figure 1As shown, a circuit board 100 provided in this embodiment includes: a heating element 200; a heat dissipation structure, including at least one metal heat conductor 300, the metal heat conductor 300 includes a heat-conducting body 310 and at least two pins 320 connected to the heat-conducting body 310, at least one pin 320 is plugged into a through hole 110 on the circuit board 100, and the through hole 110 is connected to the heating element 200 through a heat-conducting line of the circuit board 100, wherein the heat dissipation structure and the circuit of the circuit board 100 do not form an electrical loop.

[0031] By providing the metal heat conductor 300, the heat generated by the heating element 200 can be continuously transferred to the pin 320 and the heat-conducting body 310 through the corresponding through hole 110, thereby quickly dissipating heat and cooling the circuit board 100; at the same time, the heat-conducting body 310 is fixed to the through hole 110 of the circuit board 100 through the pin 320, simplifying the installation process of the circuit board heat dissipation structure, and the metal heat conductor 300 can be quickly, accurately and flexibly installed on the circuit board 100 through automated equipment, saving labor costs; the heat dissipation structure and the circuit board 100 circuit do not form an electrical loop, avoiding the heat dissipation structure from affecting the circuit during installation and use, and ensuring the structural stability of the circuit board 100. On the one hand, the embodiment of the present application can quickly and stably dissipate heat for the circuit board 100 through the metal heat conductor 300, and on the other hand, the circuit board heat dissipation structure can be quickly and accurately installed on the circuit board 100, thereby improving the production efficiency of the circuit board 100.

[0032] It should be noted that the through hole (Through Via) is the copper-plated inner wall of the hole formed on the circuit board. The copper plating in the through hole 110 can electrically connect the connection pad on the front surface and the connection pad on the rear surface. The through hole 110 runs through the entire circuit board 100 and can be used for internal interconnection or as a component positioning hole. Its processing difficulty is lower than that of buried holes and blind holes. Therefore, the through hole 110 has the advantages of being easy to use and low cost. Specifically, the through hole 110 runs through the entire circuit board 100 and can be used to achieve inner layer connection and / or component positioning installation. Among them, the hole used for fixing the component terminal (including pins and wires) with the circuit board and / or achieving electrical connection is called a component hole; the plated hole used for inner layer connection but not inserting component leads or other reinforcing materials is called a through hole. The purpose of drilling the through hole 110 on the circuit board 100 mainly includes: first, to create an opening through the circuit board 100, allowing subsequent processes to form electrical connections between the top layer, bottom layer and inner layer circuits of the circuit board 100; second, to enable the installation of components on the circuit board 100 to maintain structural integrity and position accuracy.

[0033] It is understandable that since the through hole 110 has the advantages of being easy to use and low in cost, the through hole 110 can be quickly drilled on the circuit board 100 through automated equipment as needed, and the metal heat conductor 300 can be installed on the through hole 110 according to the heating condition of the heating element 200, which can not only achieve the effect of rapid heat dissipation, but also simplify the installation steps of the heat dissipation structure, improve the assembly efficiency of the circuit board 100, and reduce the production cost of the circuit board 100.

[0034] It is understandable that the main material of the existing circuit board 100 is FR4 copper clad board. The copper foil with a copper purity of not less than 99.8% realizes the electrical connection between the components on the plane, and the plated through hole (VIA) realizes the electrical connection in space between the copper foils of the same signal, which also makes it convenient for the heating element 200 to transfer the heat generated during operation to the through hole 110 through the heat conductive line of the circuit board 100.

[0035] It should be noted that, since different through holes 110 on the circuit board 100 can connect different conductive layers and heat-conducting circuits inside the circuit board 100, in order to avoid the situation where different conductive layers and heat-conducting circuits are connected through the metal heat-conducting member 300 to form a loop, causing the heating element 200 to short-circuit and affect the normal operation of the heating element 200, when the metal heat-conducting member 300 is connected to the through hole 110 through two or more pins 320, the corresponding two or more through holes 110 must have the same potential. In actual applications, the through holes 110 connected by the two pins 320 are connected to the same heat-conducting circuit or the same layer of copper foil, which effectively improves the heat dissipation efficiency of the circuit board 100 while ensuring the stability of the circuit board 100.

[0036] See also Figure 2 , Figure 2 The side view of a circuit board provided by the first aspect embodiment of the present application is shown. The metal heat conductor 300 includes a heat-conducting body 310 and at least two pins 320 connecting the heat-conducting body 310. Among them, the two pins 320 are components for connecting the metal heat conductor 300 to the circuit board 100. In electrical engineering, the pins 320 mostly refer to wiring terminals or wiring terminals, which are divided into single-hole, double-hole, sockets, hooks, etc., and are divided into copper-plated silver, copper-plated zinc, copper, aluminum, iron, etc. The function of the pins 320 is mainly to transmit electrical signals or conduct electricity. In this embodiment, the metal heat conductor 300 is fixed in the through hole 110 through the pins 320, so as to transfer the heat in the through hole 110 to the heat-conducting body 310 through the pins 320, so as to achieve the effect of rapid heat dissipation.

[0037] See also Figure 1 and Figure 2In another embodiment, the metal heat conductor 300 is a plug-in terminal, which includes a wiring portion and two pins. The wiring portion of the plug-in terminal serves as the heat-conducting body 310 , and the pins of the plug-in terminal serve as the plug pins 320 .

[0038] It is understandable that, in order to facilitate the connection of multiple wires to the circuit board 100, a plug-in terminal suitable for plugging into the circuit board can be used to quickly connect the wires to the circuit board 100. The plug-in terminal is mainly used to achieve electrical connection. As a type of connecting terminal, the plug-in terminal has a connecting end or a conductive terminal in a sheet shape, and its material is a conductive material, such as a copper plug-in terminal. Therefore, the plug-in terminal can be used as a metal heat conductor 300, wherein the plug-in terminal connects two pins of the circuit board 100 as pins 320, and the wiring part of the plug-in terminal is used as a heat-conducting body 310. Specifically, due to the large surface area of ​​the wiring part of the plug-in terminal, it can be directly used as the heat-conducting body 310 of the metal heat conductor 300, and the heat of the heating element 200 can be quickly transferred to the outside through the wiring part by connecting the through hole 110 with two pins.

[0039] It should be noted that the plug-in terminal is formed by stamping or cutting a single copper sheet, and has the advantages of easy installation, high stability, and low production cost. In addition, the two pins of the plug-in terminal match the size of the through hole 110, ensuring the stability of the connection between the pins of the plug-in terminal as the pins 320 and the circuit board 100.

[0040] See also Figure 2 In some embodiments, the wiring part is in the form of a sheet, and the wiring part is perpendicular to the circuit board 100. As a type of connection terminal, the plug-in terminal has a sheet-shaped connection end or a conductive terminal, which is convenient for connecting to external circuits and also increases the heat dissipation area of ​​the heat-conducting body 310 to ensure the heat dissipation performance of the circuit board 100. The wiring part is perpendicular to the circuit board 100, which can further increase the contact area between the wiring part as the heat-conducting body 310 and the air, and avoid heat accumulation between the wiring part and the circuit board 100, which affects the service life of the circuit board 100.

[0041] It is understandable that in practical applications, the heat dissipation structure includes a plurality of plug-in terminals. The plug-in terminals are adjusted in position according to the layout of the through holes 110 on the circuit board 100 and the heating element 200 to ensure that the heat generated by the heating element 200 can be quickly dissipated into the air. Figure 4 As shown, the two plug terminals are arranged perpendicularly to each other on the side of the heating element 200, which can further expand the contact area between the wiring part and the air, avoid heat exchange between the two heat-conducting bodies 310, and affect the heat dissipation performance of the metal heat-conducting member 300.

[0042] See also Figure 3 , Figure 3Another embodiment of the first aspect of the present application is shown to provide a side view of a circuit board. In some embodiments, the circuit board 100 also includes a ventilation slot 120, which is arranged between at least two through holes 110 plugged into the metal heat conductor 200. In order to improve the heat dissipation efficiency of the circuit board 100, heat dissipation holes and ventilation slots 120 can be added to the circuit board 100. The heat dissipation holes can enhance air flow and accelerate the dissipation of heat. The ventilation slots 120 can concentrate heat, reduce temperature, and improve the heat dissipation effect. Among them, the main setting rule of the heat dissipation holes and ventilation slots 120 is to use the heat dissipation holes and ventilation slots 120 as close as possible to the heat source directly below the heating element 200. Then, when the heat source is not ideal, no matter how the pads of the components are placed, the heat dissipation holes and ventilation slots 120 are also arranged on the periphery of the heating element 200. In this case, the rule also remains unchanged, that is, the heat dissipation holes and ventilation slots 120 are placed as close to the periphery of the group as possible. In order to effectively use the heat dissipation holes, it is very important to configure the heat dissipation holes near the heating element 200, such as directly below the heating element 200, etc. Therefore, the positions where the heat dissipation holes can be set on the circuit board 100 are limited, and simply setting the heat dissipation holes cannot effectively enhance the heat dissipation effect of the circuit board 100. The ventilation slots 120 are set between at least two through holes 110 plugged into the metal heat conductive member 200, and the setting position is more flexible and can quickly dissipate the heat transferred from the metal heat conductive member 200.

[0043] It should be noted that in other embodiments, the ventilation slots 120 can be flexibly set at other positions on the circuit board 100, such as between two rows of parallel metal heat conductors 200, and can also effectively dissipate the heat transferred from the metal heat conductors 200. This embodiment does not impose specific limitations.

[0044] In some embodiments, the heat-conducting body 310 is a heat dissipation bar, and a pin 320 is connected to each end of the heat dissipation bar; the heat dissipation bar is welded in the through hole 110 through the pin 320 to be fixed on the circuit board 100; a ventilation slot 120 is set under the heat dissipation bar.

[0045] It can be understood that the heat dissipation strip is in the shape of a cylindrical or cubic strip, which effectively increases the contact area between the heat-conducting body 310 and the air. Therefore, the heat-conducting body 310 is a heat dissipation strip, which can effectively increase the heat dissipation area of ​​the heat-conducting body 310. In practical applications, the heat dissipation strip is formed by fixing the existing metal connection wire in the through hole 110 by means of a jumper. Specifically, the two ends of each jumper are respectively welded on the two through holes 110 to be fixed on the front of the circuit board 100 and connected to the heating element 200, and each jumper is placed on both sides of the lateral or longitudinal sides of the ventilation slot 120 to form a heat dissipation strip, so that at least part of the heat generated by the corresponding heating element 200 during operation is transferred to the corresponding jumper through the corresponding through hole 110 and then transferred to the ventilation slot 120. Since the heat dissipation strip is cylindrical, the surface area of ​​each heat dissipation strip is a preset multiple of the area of ​​the attached surface of the corresponding heating element 200.

[0046] It should be noted that the jumper is actually a metal connecting wire between two demand points of the circuit board 100. Due to different product designs, the jumper uses different materials and thicknesses. Most jumpers are used for equal potential voltage transmission, and are also used to protect the reference voltage of the circuit. For those with precise voltage requirements, the voltage drop caused by a little bit of metal jumper will also have a great impact on product performance. In practical applications, according to the calorific value of the heat-conducting body 310, metal connecting wires of different materials and specifications are selected and welded into the through hole 110 to form the heat-conducting body 310. For example, copper wire can be used as the material of the jumper, specifically, the diameter of the copper wire ranges from 0.127mm to 8.251mm; aluminum wire can also be used as the material of the jumper, specifically, the diameter of the aluminum wire ranges from 0.127mm to 8.251mm. The reason why the thermal conductivity of these two metals is relatively high is mainly because they have a tight lattice structure, high electron mobility, and low thermal resistance. The excellent thermal conductivity of aluminum and copper makes them widely used in the field of heat conduction, meeting many application requirements that require efficient heat transfer. Among them, copper wire has better thermal conductivity due to its higher thermal conductivity.

[0047] In some embodiments, the circuit board 100 includes a plurality of metal heat conductive members 300, and the heat dissipation strips of at least a portion of the metal heat conductive members 300 are arranged in parallel with each other, and the parallel heat dissipation strips are arranged along the extension direction of the ventilation slots 120. In order to improve the working effect of the heat dissipation structure, a plurality of metal heat conductive members 300 are usually arranged at different positions on the circuit board 100 to further increase the heat dissipation area of ​​the heat conductive body 310, and to take away the heat generated by the heating element 200 with higher efficiency. Figure 1As shown, the heat dissipation bars of the metal heat conductor 300 are arranged in parallel with each other, so that the heat dissipation bars can dissipate heat outward more evenly and stably, and avoid the situation where the heat of the metal heat conductor 300 cannot be quickly dissipated outward due to uneven distances between the heat dissipation bars, resulting in the metal heat conductor 300 being overheated. Therefore, at least a portion of the heat dissipation bars of the metal heat conductor 300 are arranged in parallel with each other, which can effectively improve the heat dissipation performance and service life of the circuit board 100.

[0048] In some embodiments, the heat dissipation bars parallel to each other are arranged along the extension direction of the ventilation slots 120. In order to ensure that the heat dissipation bars can effectively and continuously dissipate heat to the outside, the heat dissipation bars parallel to each other are arranged along the extension direction of the ventilation slots 120 to further increase the contact area between the heat dissipation bars and the air, effectively avoid the heat of the heat dissipation bars from accumulating between the heat dissipation bars and the surface of the circuit board 100, and fully utilize the heat dissipation space of the ventilation slots 120 to improve the heat dissipation performance of the circuit board 100.

[0049] It can be understood that, in some embodiments, the ventilation slots 120 can be adjusted in shape according to the distribution of the heating elements 200. For example, the ventilation slots 120 can be rectangular, arc-shaped, etc., and the heat dissipation strips are arranged along the extension direction of the ventilation slots 120, which can better adapt to circuit boards 100 of different models and shapes, and effectively improve the ventilation and heat dissipation effects of the circuit boards 100.

[0050] See also Figure 4 , Figure 4 Another embodiment of the first aspect of the present application is shown, providing a side view of a circuit board. In some embodiments, a gap 130 is left between the heat dissipation bar and the surface of the circuit board 100. By setting the gap 130, it is ensured that there is air flow between the heat dissipation bar and the circuit board 100 to effectively take away the heat of the heat dissipation bar, and to avoid the heat dissipation bar being too close to the circuit board 100, and the heat of the heat dissipation bar being re-transmitted to the circuit board 100 and the heating element 200, affecting the heat dissipation effect and service life of the circuit board 100. Specifically, the size of the gap 130 can be adjusted according to the power of the heating element 200 and the size of the heat dissipation bar to ensure that the heat dissipation bar can continuously and orderly transfer heat to the gap 130. In other embodiments, the gap 130 between the heat dissipation bar and the surface of the circuit board 100 can effectively expand the heat dissipation range of the ventilation slot 120, avoid heat accumulation inside the ventilation slot 120, and affect the heat dissipation efficiency of the metal heat conductor 300.

[0051] In some embodiments, the metal heat conductor 300 is disposed in the peripheral area of ​​the heating element 200, and the shortest distance between the metal heat conductor 300 and the heating element 200 is less than 10 mm. The metal heat conductor 300 is disposed in the peripheral area of ​​the heating element 200 to facilitate the heat generated by the heating element 200 to be dissipated outward through the heat-conducting body 310, thereby avoiding the accumulation of heat in the heating element 200 and affecting the normal operation of the heating element 200.

[0052] It is understandable that the shorter the distance between the metal heat conductor 300 and the heating element 200, the higher the heat conduction efficiency between the heat-conducting body 310 and the heating element 200. In order to ensure that the heat of the heating element 200 can be quickly transferred to the heat-conducting body 310 through the heat-conducting line and the through hole 110, the shortest distance between the metal heat conductor 300 and the heating element 200 is less than 10 mm.

[0053] See also Figure 5 , Figure 5 Another embodiment of the first aspect of the present application is shown, providing a side view of a circuit board. In some embodiments, the heating element is arranged on the first surface of the circuit board, and the metal heat conductor is arranged on the second surface which is the opposite side of the first surface. It is understandable that the circuit board 100 can adopt a double-layer structure, that is, metal wires are distributed on both sides of the circuit board 100. In order to use the metal wires on both sides, it is necessary to make a circuit connection between the two sides. Specifically, this circuit connection between the two sides is realized through the guide holes of the circuit board 100. The guide holes are small holes filled with or coated with metal on the circuit board 100, which are used to connect the wires between the two sides of the circuit board 100. Because the area of ​​the double-layer circuit board is twice that of the single-layer circuit board, the double-sided heating element 200 is connected through the guide holes. The double-layer circuit board solves the difficulty of wiring interlacing in the single-layer circuit board and is suitable for more complex circuits. Similarly, the heat conduction circuits on both sides of the double-layer circuit board can be connected through the guide holes, so the metal heat conductor 300 can be set on the back of the heating element 200 to further shorten the distance between the heating element 200 and the metal heat conductor 300, thereby improving the heat dissipation effect of the circuit board 100.

[0054] In some embodiments, the pad 140 corresponding to at least one pin of the heating element 200 is connected to the through hole 110 through a heat-conducting line.

[0055] It is understood that copper foil is an electrolytic material, a thin, continuous metal foil deposited on the substrate layer of the circuit board 100, and is the conductor of the circuit board 100. Copper foil is easily bonded to the insulating layer, receives the printed protective layer, and forms a circuit pattern after corrosion, and is widely used in the production of various electronic components. Therefore, the heating element 200 can be connected to the through hole 110 through the pad 140 and the heat-conducting line on the copper foil, which facilitates the flexible design of the circuit board and improves the heat dissipation effect of the circuit board.

[0056] In a second aspect, an embodiment of the present application provides an electrical device, including the circuit board 100 of the embodiment of the first aspect.

[0057] The electrical equipment provided by the embodiment of the present application has at least the following beneficial effects: by providing the metal heat conductor 300, the heat generated by the heating element 200 can be continuously transferred to the pin 320 and the heat-conducting body 310 through the corresponding through hole 110, thereby quickly dissipating heat and cooling the circuit board 100; at the same time, the heat-conducting body 310 is fixed to the through hole 110 of the circuit board 100 through the pin 320, simplifying the installation process of the circuit board heat dissipation structure, and the metal heat conductor 300 can be quickly and accurately installed on the circuit board 100 through automated equipment, saving labor costs. On the one hand, the embodiment of the present application can quickly and stably dissipate heat for the circuit board 100 through the metal heat conductor 300, and on the other hand, the circuit board heat dissipation structure can be quickly and accurately installed on the circuit board 100, thereby improving the production efficiency of the circuit board 100 and its electrical equipment.

[0058] In actual applications, the duct machine is a kind of electrical equipment. During the temperature adjustment process of the duct machine, it is necessary to frequently send work instructions to the circuit board 100 in the duct machine, which will cause the heating element 200 of the circuit board 100 to emit a large amount of heat during use. The temperature is reduced by setting a heat dissipation structure in the circuit board 100 to ensure the quality and life of the duct machine circuit board 100, and to avoid the heat generated by the heating element 200 during high-intensity work. The heat cannot be dissipated in time, resulting in the circuit board 100 The temperature is too high, affecting the normal operation of the duct machine. At the same time, the heat-conducting body 310 is fixed to the through hole 110 of the circuit board 100 through the pin 320, which simplifies the installation process of the duct machine. The metal heat-conducting part 300 can be quickly and accurately installed on the circuit board 100 through automated equipment, saving the labor cost of duct machine production.

[0059] It will be appreciated by those skilled in the art that all or some of the steps and systems in the methods disclosed above may be implemented as software, firmware, hardware, and appropriate combinations thereof. Some or all physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium (or non-transitory medium) and a communication medium (or transient medium). As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically embodies computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0060] The above is a specific description of the preferred implementation of the present application, but the present application is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions without violating the spirit of the present application. These equivalent deformations or substitutions are all included in the scope defined by the claims of the present application.

Claims

1. A circuit board, characterized in that: include: Heating element; A heat dissipation structure comprises at least one metal heat conductor, wherein the metal heat conductor comprises a heat-conducting body and at least two pins connected to the heat-conducting body, at least one of the pins is plugged into a through hole on the circuit board, and the through hole is connected to the heating element through a heat-conducting line of the circuit board, wherein the heat dissipation structure and the circuit board circuit do not form an electrical loop.

2. The circuit board according to claim 1, characterized in that: The metal heat-conducting member is a plug-in terminal, which includes a wiring portion and two pins. The wiring portion of the plug-in terminal serves as the heat-conducting body, and the pins of the plug-in terminal serve as the plug pins.

3. The circuit board according to claim 2, characterized in that: The wiring part is in a sheet shape and is perpendicular to the circuit board.

4. The circuit board according to claim 1, characterized in that: The circuit board further comprises a ventilation slot, and the ventilation slot is arranged between at least two of the through holes into which the metal heat conductive member is inserted.

5. The circuit board according to claim 4, characterized in that: The heat-conducting body is a heat dissipation bar, and two ends of the heat dissipation bar are respectively connected to one of the pins; the heat dissipation bar is welded in the through hole through the pins to be fixed on the circuit board, and the ventilation slot is arranged below the heat dissipation bar.

6. The circuit board according to claim 5, characterized in that: The circuit board includes a plurality of the metal heat conducting members, the heat dissipating bars of at least a portion of the metal heat conducting members are arranged parallel to each other, and the heat dissipating bars parallel to each other are arranged along the extending direction of the ventilation slots.

7. The circuit board according to claim 5, characterized in that: A gap is left between the heat dissipation strip and the surface of the circuit board.

8. The circuit board according to claim 1, characterized in that: The metal heat conductor is arranged in the peripheral area of ​​the heating element, and the shortest distance between the metal heat conductor and the heating element is less than 10 mm.

9. The circuit board according to claim 1, characterized in that: The heating element is arranged on a first surface of the circuit board, and the metal heat conductor is arranged on a second surface which is the opposite side of the first surface.

10. The circuit board according to claim 1, characterized in that: The pad corresponding to at least one pin of the heating element is connected to the through hole through the heat-conducting line.

11. Electrical equipment, characterized in that: Comprising a circuit board as described in any one of claims 1-10.

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