PCB (Printed Circuit Board) module heat dissipation structure capable of reducing PCB

Abstract

The utility model discloses a PCB (printed circuit board) module radiating structure for reducing a PCB, which comprises the PCB, and components are uniformly distributed on the front surface and the back surface of the PCB and are used for reducing the PCB; locking structures I and locking structures II are punched on the backlight iron frame, the number of the locking structures I is at least two, and the number of the locking structures II is at least two; wherein the first locking structures are symmetrically distributed on the two sides of the PCB, the second locking structures are distributed on the other two sides of the PCB in an opposite side mode, and the first locking structures and the second locking structures jointly form a locking space used for buckling and locking of the PCB. According to the PCB module heat dissipation structure of the reduced PCB provided by the utility model, the traditional single-sided PCB is fused on the two sides of the reduced PCB, and the plurality of locking structures I and the plurality of locking structures II are punched on the backlight iron stand according to the appearance of the reduced PCB, so that the PCB can be supported and locked by the backlight iron stand.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a PCB module heat dissipation structure for reducing the size of a PCB board. Background Art

[0002] The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. Circuit boards miniaturize and visualize circuits, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layouts. Circuit boards can be called printed circuit boards or printed circuit boards.

[0003] Currently, PCB modules are assembled together and thus have limited heat dissipation space between them, resulting in poor heat dissipation effect and a great impact on the life of the product. Therefore, a PCB module heat dissipation structure with a smaller PCB board is proposed. Utility Model Content

[0004] Based on this, it is necessary to provide a PCB module heat dissipation structure with a smaller PCB board to address the above technical problems, concentrate most of the traditional single-sided PCB board on a small board and design it on both sides, and at the same time, punch out the locking structure one and the locking structure two according to the shape of the reduced PCB board, so that they can form a support for the PCB board while avoiding fitting contact to achieve better spatial heat dissipation.

[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0006] A PCB module heat dissipation structure with a reduced PCB board size, comprising:

[0007] A PCB board, with components distributed on the front and back of the PCB board, for reducing the size of the PCB board;

[0008] A backlight iron frame, on which a locking structure 1 and a locking structure 2 are punched, wherein the locking structure 1 has at least two and the locking structure 2 has at least two;

[0009] Wherein, a plurality of locking structures 1 are symmetrically distributed on two sides of the PCB board, and a plurality of locking structures 2 are distributed on the other two sides of the PCB board on opposite sides, and the locking structures 1 and 2 together form a locking space for buckling and locking the PCB board;

[0010] The first locking structure comprises a connecting portion and a supporting portion, wherein the supporting portion is provided with a supporting groove, and the supporting portion is divided into an outer arm and an inner arm by the supporting groove.

[0011] Furthermore, the number of the locking structure 1 and the number of the locking structure 2 are both four.

[0012] Furthermore, the width of the supporting groove is greater than the thickness of the PCB board.

[0013] Furthermore, an inner cylinder is sleeved on the surface of the outer arm, and the inner cylinder is wrapped with anti-static foam balls facing the supporting groove for supporting the edge of the PCB board.

[0014] Furthermore, an outer cylinder is sleeved on the surface of the inner cylinder, and a receiving cavity is provided in the outer cylinder, through which the outer cylinder can be slidably extended or accommodated along the length direction of the inner cylinder.

[0015] Furthermore, the surface of the outer cylinder is wrapped with an annular anti-static foam.

[0016] Furthermore, a quadrangular groove is provided inside the inner tube, and the quadrangular groove is matched with the size of the outer arm, and the inner tube can be sleeved on the surface of the outer arm through the quadrangular groove.

[0017] Furthermore, a gap between the inner side of the outer cylinder and the inner arm is greater than a thickness of the PCB board.

[0018] Furthermore, the gap between the inner side of the annular antistatic foam and the inner arm is smaller than the thickness of the PCB board.

[0019] Furthermore, rubber convex particles are fixed to the inner wall of the inner cylinder.

[0020] Compared with the prior art, the utility model has the following beneficial effects:

[0021] The PCB module heat dissipation structure of the reduced PCB board provided by the utility model integrates the traditional single-sided PCB board on the double sides of the reduced PCB board, and punches a plurality of locking structures 1 and 2 on the backlight iron frame according to the shape of the reduced PCB board, so that the support and locking of the PCB can be formed. At the same time, because the PCB is placed in the supporting groove for support, not only the contact surface during support is reduced, but also the gap between the PCB and the backlight iron frame is realized, so that the PCB board can dissipate heat more effectively.

[0022] At the same time, in the process of flipping the outer arms on the locking structure one and the locking structure two to the outside or flipping and resetting, the additional inner cylinder and outer cylinder can extend the length of the force arm applied during flipping, making it convenient for the operator to flip, and at the same time, the gap between the PCB board and the support groove can be filled through the cooperation of the annular anti-static foam and the anti-static foam ball, so that the state of the PCB board after buckling and locking is more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1A schematic diagram of the structure of the PCB module heat dissipation structure for reducing the size of the PCB board provided by the utility model;

[0024] Figure 2 A schematic diagram of the back structure of the PCB module heat dissipation structure for reducing the size of the PCB board provided by the utility model;

[0025] Figure 3 A schematic diagram of the PCB board structure of the PCB module heat dissipation structure with a reduced PCB board provided by the utility model;

[0026] Figure 4 A schematic diagram of a PCB assembly three-dimensional structure of a PCB module heat dissipation structure with a reduced PCB board provided by the utility model;

[0027] Figure 5 A schematic diagram of a locking structure of a PCB module heat dissipation structure for reducing the size of a PCB board provided by the utility model;

[0028] Figure 6 A schematic diagram of the inner cylinder and outer cylinder structure of the PCB module heat dissipation structure for reducing the size of the PCB board provided by the utility model;

[0029] Figure 7 The utility model provides a PCB module heat dissipation structure with a reduced PCB board Figure 6 A is a schematic diagram of the enlarged structure;

[0030] Figure 8 A schematic cross-sectional view of the outer cylinder and the inner cylinder of the PCB module heat dissipation structure for reducing the size of the PCB board provided by the utility model;

[0031] Fig. 9 A schematic diagram of a locking structure and a flipping state structure of a PCB module heat dissipation structure for reducing a PCB board provided by the utility model;

[0032] Fig.10 This is a structural schematic diagram of the inner and outer cylinders of the PCB module heat dissipation structure for reducing the size of the PCB board provided by the utility model in the expanded state.

[0033] The markings in the figure are as follows:

[0034] PCB board 1, components 11;

[0035] Backlight iron frame 2, locking structure 1 21, locking structure 2 22,

[0036] Connecting portion 210, supporting portion 211, supporting groove 212, outer arm 213, inner arm 214,

[0037] Inner cylinder 2130 , outer cylinder 2131 , accommodating chamber 2132 , annular antistatic foam 2133 , quadrangular groove 2134 , rubber convex particles 2135 , and antistatic foam balls 2136 . DETAILED DESCRIPTION

[0038] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0039] As described in the background art, currently PCB modules are assembled together by being attached to each other, so the heat dissipation space between them is limited, resulting in poor heat dissipation effect, which has a great impact on the life of the product.

[0040] In order to solve this technical problem, the utility model provides a PCB module heat dissipation structure with a reduced PCB board, which is applied to a PCB module.

[0041] Specifically, please refer to Figure 1-Figure 10 , the PCB module heat dissipation structure of the PCB board is reduced, including:

[0042] A PCB board 1, with components 11 distributed on the front and back of the PCB board 1, for reducing the size of the PCB board 1;

[0043] The backlight iron frame 2 has a first locking structure 21 and a second locking structure 22 punched thereon, the first locking structure 21 has at least two, and the second locking structure 22 has at least two;

[0044] Among them, a plurality of locking structures 21 are symmetrically distributed on two sides of the PCB board 1, and a plurality of locking structures 22 are distributed on the other two sides of the PCB board 1 on the opposite sides. The locking structures 21 and 22 together form a locking space for buckling and locking the PCB board 1.

[0045] The locking structure 21 includes a connecting portion 210 and a supporting portion 211 . A supporting groove 212 is formed on the supporting portion 211 , and the supporting groove 212 separates the supporting portion 211 into an outer arm 213 and an inner arm 214 .

[0046] The PCB module heat dissipation structure of the reduced PCB board provided by the utility model integrates the traditional single-sided PCB board on the double sides of the reduced PCB board 1, and punches a plurality of locking structures 1 21 and locking structures 2 22 on the backlight iron frame 2 according to the shape of the reduced PCB board 1, so that the PCB board 1 can be supported and locked. At the same time, because the PCB board 1 is placed in the supporting groove 212 for support, not only the contact surface during support is reduced, but also the assembly gap between it and the backlight iron frame 2 is retained, thereby achieving more effective heat dissipation after the PCB board 1 is assembled.

[0047] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiments of the utility model will be clearly and completely described below in conjunction with the accompanying drawings.

[0048] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0049] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0050] Please refer to Figure 1-Figure 5 As shown, a PCB module heat dissipation structure for reducing the size of the PCB board comprises a PCB board 1, on the front and back of the PCB board 1 are distributed components 11, used to reduce the size of the PCB board 1; a backlight iron frame 2, on which a locking structure 1 21 and a locking structure 2 22 are punched, the locking structure 1 21 has at least two, the locking structure 22 has at least two, wherein a plurality of locking structures 1 21 are symmetrically distributed on both sides of the PCB board 1, and a plurality of locking structures 22 are distributed on the opposite sides of the other two sides of the PCB board 1, and the locking structure 1 21 and the locking structure 2 22 jointly form a locking space for buckling and locking the PCB board 1;

[0051] The locking structure 21 includes a connecting portion 210 and a supporting portion 211 . A supporting groove 212 is formed on the supporting portion 211 , and the supporting groove 212 separates the supporting portion 211 into an outer arm 213 and an inner arm 214 .

[0052] The number of the locking structure 1 21 and the number of the locking structure 2 22 are both four, the width of the supporting groove 212 is greater than the thickness of the PCB board 1, and the structures of the locking structure 1 21 and the locking structure 2 22 are the same.

[0053] In the actual application process, the components of the PCB are arranged on both sides of the PCB board 1 through a double-sided design, thereby reducing the overall size of the PCB board 1. Then, according to the size and shape of the PCB board 1, punching is performed on the backlight iron frame 2 to form a locking structure 1 21 and a locking structure 2 22. The specific forms of the locking structure 1 21 and the locking structure 2 22 are as follows: Figure 5 As shown, the overall shape is "F";

[0054] Before assembling the PCB board 1 on the backlight iron frame 2, the outer arms 231 on the locking structure 1 21 and the locking structure 2 22 are turned outward to form a staggered state with the inner arms 214, so that the support grooves 211 can be partially exposed, and the PCB board 1 can be directly placed in the multiple support grooves 211 through the partially exposed support grooves 211, and then the outer arms 231 on the locking structure 1 21 and the locking structure 2 22 are returned to the correct position, and the outer arms 231 form a limit effect on the PCB board 1 and the back of the backlight frame, and then the backlight front and other components are assembled to complete the entire backlight, and then the TFT is assembled, and the assembly of the entire PCB module is completed;

[0055] Through the above assembly, a gap is provided between the PCB board 1 and the backlight iron frame 1 in the assembled state, so that the retention of the gap satisfies the effective heat dissipation of the PCB board 1 itself compared with the conventional single-sided PCB board directly fitted with the backlight iron frame. At the same time, through the gap between the PCB board 1 and the backlight iron frame 2, the requirements for arranging the double-sided components 11 of the PCB board 1 are also met, the size of the PCB board 1 is reduced, and the overall layout space is reduced;

[0056] At the same time, since the locking structure 1 21 and the locking structure 2 22 only lock the PCB board 1 through the contact between the outer arm 213 and the inner arm 214, the contact surface for locking the PCB board 1 is greatly reduced, thereby further satisfying the requirement that the PCB board 1 is more likely to be exposed to the outside world to maintain effective heat dissipation performance.

[0057] The heat dissipation structure of the PCB module with a reduced PCB board provided in Example 1 is further optimized. Specifically, Figure 6 , Figure 7 , Figure 8 , Fig. 9 and Fig.10 As shown, an inner cylinder 2130 is sleeved on the surface of the outer arm 213 , and the inner cylinder 2130 is wrapped with anti-static foam balls toward the supporting groove 212 for supporting the edge of the PCB board 1 .

[0058] The outer cylinder 2131 is sleeved on the surface of the inner cylinder 2130 , and a receiving cavity 2132 is opened in the outer cylinder 2131 , through which the outer cylinder 2131 can be slidably extended or stored along the length direction of the inner cylinder 2130 , and the surface of the outer cylinder 2131 is wrapped with an annular antistatic foam 2133 .

[0059] like Figure 5 As shown in the figure, the locking structure 1 21 is in a natural state at this time, in which the PCB board 1 can be locked. When the PCB board 1 needs to be placed in the locking structure 1 21 and the locking structure 22, the outer cylinder 2131 can be slid on the surface of the inner cylinder 2130 to expand the inner cylinder 2130 and the outer cylinder 2131, thereby increasing the contact surface between the inner cylinder 2130 and the operator's hand, and making it convenient for the operator to directly apply force to the outer cylinder 2131 to achieve the bending of the inner and outer arms 213, effectively saving manpower. The bent outer arm 231 is shown in FIG. Fig. 9 and Fig.10 In the state shown in FIG. 1 , the outer arms 231 on the locking structure 1 21 and the locking structure 2 22 are bent in sequence, and the PCB board 1 is placed in the supporting groove 212, and then the outer arm 213 is bent and reset by the outer cylinder 2131 to form the state shown in FIG. Figure 6 The status shown;

[0060] After the outer arm 213 is moved and reset, the outer cylinder 2131 is pushed to slide toward the inner cylinder 2130, so that the outer cylinder 2131 is accommodated, the contact area with the PCB board 1 is reduced, and the PCB board 1 is exposed as much as possible for heat dissipation;

[0061] After the outer arm 213 is bent and reset, the antistatic foam ball connected to the inner cylinder 2130 will eventually be placed inside the support groove 212. Since the antistatic foam ball has good softness, it can adaptively deform according to the actual gap, thereby forming filling protection for the edge of the PCB board 1.

[0062] The PCB module heat dissipation structure with a reduced PCB board provided in Embodiment 1 or 2 is further optimized. Figure 6 , Figure 7 , Figure 8 , Fig. 9 and Fig.10 As shown, a quadrangular groove 2134 is provided inside the inner cylinder 2130, and the quadrangular groove 2134 is adapted to the size of the outer arm 213, and the inner cylinder 2130 can be sleeved on the surface of the outer arm 213 through the quadrangular groove 2134. After the locking structure 1 21 and the locking structure 2 22 are punched, the inner cylinder 2130 can be sleeved thereon through the quadrangular groove 2134 to complete the assembly;

[0063] The gap between the inner side of the outer cylinder 2131 and the inner arm 214 is larger than the thickness of the PCB board 1;

[0064] The gap between the inner side of the annular antistatic foam 2133 and the inner arm 214 is smaller than the thickness of the PCB board 1;

[0065] The outer cylinder 2131 also avoids rigid contact with the PCB board 1 through the annular antistatic foam 2133 thereon, thereby forming protection for the PCB board 1 before and after flipping, and after flipping and resetting, the annular antistatic foam 2133 will resist against the surface of the PCB board 1, and the position of the outer cylinder 2131 on the inner cylinder 2130 is relatively limited by the resistance force, thereby avoiding its free sliding.

[0066] The inner wall of the inner cylinder 2130 is fixed with rubber protrusions 2135, such as Figure 8 As shown, due to the resistance of the rubber protrusions 2135, when the inner cylinder 2130 is slidably mounted on the outer arm 213, the stability of the inner cylinder 2130 is ensured after mounting, and the inner cylinder 2130 is prevented from sliding and falling off autonomously.

[0067] The use process of the PCB module heat dissipation structure for reducing the size of the PCB board provided by the utility model is as follows: components are arranged on both sides of the PCB board 1 through a double-sided design to reduce the overall size of the PCB board 1, and then the backlight iron frame 2 is punched according to the size and shape of the PCB board 1 to form a locking structure 1 21 and a locking structure 2 22, and then the inner cylinder 2130 is sleeved on the outer arm 213 through the four-corner groove 2134, and the outer arms 231 on the locking structure 1 21 and the locking structure 2 22 are turned outward by the extended outer cylinder 2131 to form a state of being staggered with the inner arm 214, and the PCB board 1 is placed in a plurality of supporting grooves 211, and then the outer cylinder 2131 is bent to return the outer arm 231 to the right position, and a limiting effect is formed on the PCB board 1 and the back of the backlight frame by the outer arm 231, and then the backlight front is assembled with other components to complete the entire backlight, and then the TFT is assembled, and the assembly of the entire PCB module is completed.

[0068] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0069] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.

Claims

1. A PCB module heat dissipation structure for reducing the size of the PCB board, characterized in that: It includes: A PCB board (1), with components (11) distributed on the front and back of the PCB board (1) for reducing the size of the PCB board (1); A backlight iron frame (2) having a first locking structure (21) and a second locking structure (22) punched thereon, wherein the first locking structure (21) has at least two, and the second locking structure (22) has at least two; wherein a plurality of locking structures one (21) are symmetrically distributed on two sides of the PCB board (1), and a plurality of locking structures two (22) are distributed on the other two sides of the PCB board (1) on the opposite sides, and the locking structures one (21) and the locking structures two (22) together form a locking space for buckling and locking the PCB board (1); The locking structure 1 (21) comprises a connecting portion (210) and a supporting portion (211); the supporting portion (211) is provided with a supporting groove (212); the supporting portion (211) is divided into an outer arm (213) and an inner arm (214) by the supporting groove (212); the locking structure 1 (21) and the locking structure 2 (22) have the same structure.

2. The PCB module heat dissipation structure for reducing the size of the PCB board according to claim 1, characterized in that: The number of the locking structure one (21) and the number of the locking structure two (22) are both four.

3. The PCB module heat dissipation structure for reducing the size of the PCB board according to claim 1, characterized in that: The width of the supporting groove (212) is greater than the thickness of the PCB board (1).

4. The PCB module heat dissipation structure for reducing the size of the PCB board according to claim 1, characterized in that: An inner cylinder (2130) is sleeved on the surface of the outer arm (213), and the inner cylinder (2130) is wrapped with an anti-static foam ball (2136) facing the support groove (212) and is used for supporting the edge of the PCB board (1).

5. The PCB module heat dissipation structure for reducing the size of the PCB board according to claim 4, characterized in that: An outer cylinder (2131) is sleeved on the surface of the inner cylinder (2130), and a receiving cavity (2132) is provided in the outer cylinder (2131), so that the outer cylinder (2131) can be slidably extended or accommodated along the length direction of the inner cylinder (2130) through the receiving cavity (2132).

6. The PCB module heat dissipation structure for reducing the size of the PCB board according to claim 5, characterized in that: The surface of the outer cylinder (2131) is wrapped with an annular antistatic foam (2133).

7. The PCB module heat dissipation structure for reducing the size of the PCB board according to claim 4, characterized in that: A quadrangular groove (2134) is provided inside the inner cylinder (2130), and the quadrangular groove (2134) is adapted to the size of the outer arm (213). The inner cylinder (2130) can be sleeved on the surface of the outer arm (213) through the quadrangular groove (2134).

8. The PCB module heat dissipation structure for reducing the size of the PCB board according to claim 6, characterized in that: The gap between the inner side of the outer cylinder (2131) and the inner arm (214) is greater than the thickness of the PCB board (1).

9. The PCB module heat dissipation structure for reducing the size of the PCB board according to claim 8, characterized in that: The gap between the inner side of the annular antistatic foam (2133) and the inner arm (214) is smaller than the thickness of the PCB board (1).

10. The PCB module heat dissipation structure for reducing the size of the PCB board according to claim 7, characterized in that: Rubber protrusions (2135) are fixed to the inner wall of the inner cylinder (2130).

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