Hot pressing plate structure for chip patch production

By designing a hot pressing plate structure including blocks, blocks, square rods, springs and limiting mechanisms, the problem of frequent replacement of pressing plates in chip patch production is solved, and the rapid pull-out and reset of pressing blocks is achieved, which improves the working efficiency and practicality of the device.

CN222786132UActive Publication Date: 2025-04-22CHENGDU TENGNUO TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202420860563.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-24
Publication Date
2025-04-22
Estimated Expiration
2034-04-24

AI Technical Summary

Technical Problem

In the chip production process, the prior art requires frequent replacement of the hot press plate, resulting in cumbersome processes and low efficiency.

Method used

A hot pressing plate structure for chip patch production is designed, using technical means such as squares, blocks, square rods, springs and limiting mechanisms to achieve rapid pull-out and reset of the blocks, adapting to the needs of different substrates and chip positions.

Benefits of technology

Through this structure, the same platen can adapt to different substrates and chip positions, avoiding the tedious process of replacing platens, and improving working efficiency and practicality of the device.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222786132U_ABST
    Figure CN222786132U_ABST
Patent Text Reader

Abstract

The utility model relates to the technical field of chip patch production, and discloses a hot pressing plate structure for chip patch production, which comprises a pressing plate, a plurality of square blocks are fixedly sleeved at the top of the pressing plate at equal intervals, a plurality of square holes matched with the square blocks are arranged at the top of the pressing plate at equal intervals, and a pressing mechanism is arranged at each square block. The pressing mechanism comprises a square rod slidably arranged in the middle of the top of the square block in a sleeving mode, a square hole matched with the square rod is formed in the middle of the square block, a pressing block is fixedly connected to the bottom of the square rod, a first conical column is fixedly connected to the top of the square rod, and a first spring sleeves the position, between the first conical column and the square block, of the square rod. The top of the first conical column is fixedly connected with a round rod. According to the utility model, the same pressing plate can enable the corresponding pressing blocks to extend out according to different substrates and required positions, thereby achieving the pressing of a chip patch, avoiding the tedious process of replacing the pressing plate, improving the working efficiency, and improving the practicality of the device.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of chip patch production, in particular to a hot pressing plate structure for chip patch production. Background Art

[0002] Chip bonding is an advanced electronic assembly technology that enables the manufacture and assembly of integrated circuits by attaching tiny semiconductor chips to circuit boards or other substrates, making it possible for the miniaturization and high performance of electronic devices.

[0003] In the prior art, during the chip mounting production process, the chip is placed on a substrate, a hot pressing plate is placed on the chip and the substrate, and then heat is provided to the plate through a heating element to melt the connecting material. Under the action of pressure, the molten connecting material flows into the gap between the chip and the substrate to form an electrical and mechanical connection. However, since there is generally more than one chip that needs to be fixed on the substrate, and the positions of the chips fixed on different substrates are also different, the plate needs to be replaced frequently. For this purpose, a hot pressing plate structure for chip mounting production is designed. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a hot pressing plate structure for chip patch production.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A hot pressing plate structure for chip patch production, comprising a pressing plate, a plurality of blocks are fixedly sleeved at equal distances on the top of the pressing plate, a plurality of square holes matching the blocks are opened at equal distances on the top of the pressing plate, a pressing mechanism is arranged at each of the blocks, the pressing mechanism comprises a square rod slidably sleeved on the middle position of the top of the block, a square hole matching the square rod is opened in the middle position of the block, a pressing block is fixedly connected to the bottom of the square rod, a first conical column is fixedly connected to the top of the square rod, a first spring is sleeved at a position of the square rod between the first conical column and the block, a round rod is fixedly connected to the top of the first conical column, a limiting block is fixedly connected to the top of the round rod, a second conical column is slidably sleeved on the circumferential surface of the round rod, a second spring is sleeved at a position of the round rod between the second conical column and the first conical column, a groove is opened at the bottom of the second conical column near the round rod, and the groove matches the second spring.

[0007] As a further solution of the utility model, hot air holes are opened on the four sides of each of the blocks, and the hot air holes are adapted to the pressing blocks.

[0008] As a further solution of the utility model, limiting mechanisms are provided on both sides of the top of each block, and the limiting mechanism includes a U-shaped plate fixedly connected to one side of the top of the block, and the top sliding sleeve of the U-shaped plate is provided with two limiting rods, and the top of the U-shaped plate is provided with two circular holes adapted to the limiting rods, and one end of the two limiting rods close to the square rods is fixedly connected to the same T-shaped block, and the other ends of the two limiting rods are fixedly connected to the same limiting strip, and the two limiting rods located between the T-shaped block and the U-shaped plate are both provided with a third spring.

[0009] As a further solution of the utility model, a rectangular cover is fixedly connected to the top of the pressing plate, and a plurality of strip holes are opened at equal distances on the top of the rectangular cover.

[0010] As a further solution of the utility model, a plurality of electric heating tubes are fixedly connected at equal distances on both sides of the inner wall of the rectangular cover near the bottom.

[0011] As a further solution of the utility model, two fixing plates are fixedly connected between the inner walls of the rectangular cover near the top, and fans are fixedly connected to the two fixing plates.

[0012] The beneficial effects of the utility model are:

[0013] The utility model adopts technical means such as a square block, a pressure block, a square rod, a first spring, a first conical column, a second conical column, a second spring and a limiting mechanism, and according to the position of the patch on the substrate that needs to be hot-pressed, the corresponding pressure block is pulled out, and when the pressure block is pulled out, the first spring is compressed, and when the first conical column slides to the bottom of the T-shaped block of the limiting mechanism, under the action of the third spring, the T-shaped block is reset, and the first conical column is limited at this time, so that the bottom of the pressure block at this location protrudes, so that according to the position of the patch that needs to be pulled out, the corresponding pressure block is effectively solved, and the problem raised in the background technology is effectively solved, and then the same pressure plate can be used according to different substrates and required positions, so that the corresponding pressure block is extended to achieve the pressing of the chip patch, avoiding the tedious process of replacing the pressure plate, improving work efficiency, and improving the technical effect of the practicality of the device.

[0014] The utility model: through the arrangement of hot air holes, electric heating pipes and fans, the hot air holes of the block on the top of the pressed block after being pulled out are not blocked by the pressed block, and ventilation will be achieved. At this time, the work can be carried out. The automatic electric heating pipes and fans, when the pressing plate descends, the corresponding pressed block will press the prepared patch, and the hot air holes and welding paste blown out from the top can be used to achieve rapid welding of the patch. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall structure of a hot pressing plate structure for chip mounting production proposed by the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of a pressing mechanism of a hot pressing plate structure for chip patch production proposed by the utility model;

[0017] Figure 3 The utility model is a schematic structural diagram of a limit mechanism of a hot pressing plate structure for chip patch production.

[0018] In the figure: 1, pressing plate; 2, square block; 201, hot air hole; 202, pressing block; 203, square rod; 204, first spring; 205, first conical column; 206, limiting block; 207, second conical column; 208, second spring; 3, electric heating pipe; 4, fixing plate; 401, fan; 5, rectangular cover; 501, strip hole; 6, limiting mechanism; 601, U-shaped plate; 602, limiting rod;

[0019] 603, the third spring; 604, the limit strip; 605, the T-shaped block. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0021] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present utility model will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0022] Reference Figure 1-Figure 3 A hot pressing plate structure for chip patch production includes a pressing plate 1, a plurality of square blocks 2 are fixedly sleeved at equal distances on the top of the pressing plate 1, a plurality of square holes matching the square blocks 2 are opened at equal distances on the top of the pressing plate 1, a pressing mechanism is arranged at each square block 2, the pressing mechanism includes a square rod 203 slidingly sleeved at the middle position of the top of the square block 2, a square hole matching the square rod 203 is opened at the middle position of the square block 2, a pressing block 202 is fixedly connected to the bottom of the square rod 203, and a first cone is fixedly connected to the top of the square rod 203 Column 205, square rod 203 is located between the first conical column 205 and the block 2 and is sleeved with a first spring 204, the top of the first conical column 205 is fixedly connected to a round rod, the top of the round rod is fixedly connected to a limiting block 206, a second conical column 207 is slidably sleeved on the circumferential surface of the round rod, the round rod is located between the second conical column 207 and the first conical column 205 and is sleeved with a second spring 208, a groove is provided at the bottom of the second conical column 207 near the round rod, and the groove is adapted to the second spring 208.

[0023] In this embodiment, hot air holes 201 are formed on four sides of each block 2 , and the hot air holes 201 are matched with the pressing blocks 202 .

[0024] In this embodiment, limiting mechanisms 6 are provided on both sides of the top of each block 2, and the limiting mechanism 6 includes a U-shaped plate 601 fixedly connected to one side of the top of the block 2, and two limiting rods 602 are slidably sleeved on the top of the U-shaped plate 601. Two round holes matching the limiting rods 602 are opened on the top of the U-shaped plate 601, and the two limiting rods 602 are fixedly connected to the same T-shaped block 605 at one end close to the square rod 203, and the other ends of the two limiting rods 602 are fixedly connected to the same limiting strip 604, and the two limiting rods 602 located between the T-shaped block 605 and the U-shaped plate 601 are both sleeved with a third spring 603. Through the cooperation of the limiting mechanism 6 and the pressing mechanism, quick adjustment can be achieved according to user needs.

[0025] In this embodiment, a rectangular cover 5 is fixedly connected to the top of the pressing plate 1 , and a plurality of strip-shaped holes 501 are opened at equal distances on the top of the rectangular cover 5 .

[0026] In this embodiment, a plurality of electric heating tubes 3 are fixedly connected at equal distances to both sides of the inner wall of the rectangular cover 5 near the bottom, and the electric heating tubes 3 realize heat supply.

[0027] In this embodiment, two fixing plates 4 are fixedly connected between the inner walls of the rectangular cover 5 near the top, and fans 401 are fixedly connected to the two fixing plates 4. Through the fans 401, heat reaches the bottom through the hot air holes 201.

[0028] Working principle: A hot pressing plate structure for chip patch production. When in use, according to the position of the patch on the substrate that needs hot pressing, the corresponding pressing block 202 is pulled out. When the pressing block 202 is pulled out, the first spring 204 is compressed. When the first conical column 205 slides to the bottom of the T-shaped block 605 of the limiting mechanism 6, under the action of the third spring 603, the T-shaped block 605 is reset. At this time, the first conical column 205 is limited, so that the bottom of the pressing block 202 at this location protrudes. In this way, according to the position of the patch that needs to be pulled out, the corresponding pressing block 202 is pulled out. After being pulled out, the hot air hole 201 of the block 2 on the top of the pressing block 202 is not blocked by the pressing block 202, and ventilation is achieved. At this time, the automatic electric heating pipe 3 and the fan 401, when the pressing When the board 1 descends, the corresponding pressing block 202 will press the prepared patch, and cooperate with the hot air hole 201 and welding paste blown out from the top to realize the rapid welding of the patch, so as to realize the welding of multiple patches at the same time. When it is necessary to reset the pulled-out pressing block 202, continue to pull the pressing block 202 so that the second conical column 207 slides to the bottom of the two T-shaped blocks 605. At this time, release the pressing block 202. Under the action of the first spring 204, the first conical column 205 rises. Under the action of the T-shaped block 605, the second conical column 207 will fit with the first conical column 205. The second spring 208 is located inside the groove. At this time, the two T-shaped blocks 605 will not be able to limit the first conical column 205, thereby realizing the reset of the pressing block 202.

[0029] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0030] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0031] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A hot pressing plate structure for chip bonding production, comprising a pressing plate (1), characterized in that: A plurality of blocks (2) are fixedly sleeved at equal distances on the top of the pressure plate (1), a plurality of square holes matching the blocks (2) are opened at equal distances on the top of the pressure plate (1), a pressing mechanism is provided at each of the blocks (2), the pressing mechanism comprises a square rod (203) slidably sleeved at the middle position of the top of the block (2), a square hole matching the square rod (203) is opened at the middle position of the block (2), a pressure block (202) is fixedly connected to the bottom of the square rod (203), a first conical column (205) is fixedly connected to the top of the square rod (203), and the square rod (203) is provided with a pressing block (202). 203) A first spring (204) is sleeved at a position between the first conical column (205) and the block (2); a round rod is fixedly connected to the top of the first conical column (205); a limit block (206) is fixedly connected to the top of the round rod; a second conical column (207) is slidably sleeved on the circumferential surface of the round rod; a second spring (208) is sleeved at a position of the round rod between the second conical column (207) and the first conical column (205); a groove is provided at the bottom of the second conical column (207) near the round rod, and the groove is adapted to the second spring (208).

2. The hot pressing plate structure for chip bonding production according to claim 1, characterized in that: Each of the blocks (2) is provided with hot air holes (201) on four sides, and the hot air holes (201) are matched with the pressing blocks (202).

3. The hot pressing plate structure for chip bonding production according to claim 1, characterized in that: A limiting mechanism (6) is provided on both sides of the top of each block (2), and the limiting mechanism (6) comprises a U-shaped plate (601) fixedly connected to one side of the top of the block (2), and two limiting rods (602) are slidably sleeved on the top of the U-shaped plate (601), and two round holes matching the limiting rods (602) are provided on the top of the U-shaped plate (601), and one end of the two limiting rods (602) close to the square rod (203) is fixedly connected to the same T-shaped block (605), and the other ends of the two limiting rods (602) are fixedly connected to the same limiting strip (604), and the two limiting rods (602) located between the T-shaped block (605) and the U-shaped plate (601) are sleeved with a third spring (603).

4. The hot pressing plate structure for chip bonding production according to claim 1, characterized in that: A rectangular cover (5) is fixedly connected to the top of the pressing plate (1), and a plurality of strip-shaped holes (501) are provided at equal distances on the top of the rectangular cover (5).

5. The hot pressing plate structure for chip bonding production according to claim 4, characterized in that: A plurality of electric heating tubes (3) are fixedly connected at equal distances to both sides of the inner wall of the rectangular cover (5) near the bottom.

6. The hot pressing plate structure for chip bonding production according to claim 5, characterized in that: Two fixing plates (4) are fixedly connected between the inner walls of the rectangular cover (5) near the top, and fans (401) are fixedly connected to the two fixing plates (4).