Secondary phase change radiator

Abstract

The utility model relates to a secondary phase change radiator, which is designed for solving the technical problem that the conventional similar products hardly adopt a solid-liquid secondary phase change mode of a solid working medium and are difficult to meet the heat dissipation requirements of the conventional power device products such as a high-power module (IGBT) and the like. The radiator comprises a substrate, fins, a solid working medium and a liquid working medium, one face of the substrate makes contact with a heat source, a substrate cavity is formed in the substrate, and the solid working medium is contained in the substrate cavity; fin cavities are formed in the fins, and liquid working media are contained in the fin cavities; according to the structural design key points, fins which are distributed at equal intervals or integrally formed fins are arranged on the other face of the base plate, a liquid working medium is contained in a fin cavity of each fin, a base plate cavity of the base plate and a fin cavity of each fin are arranged in a separated mode through a cavity chamber, and the fin structure is not limited to a form relieved tooth mode. The fin cavities of the fins can also be arranged on the substrate after being communicated and connected into a whole. Therefore, the temperature difference of the substrate is small, the temperature is uniform, and the heat dissipation effect is good.

Description

Technical Field

[0001] The utility model relates to a fin type heat sink, which is a secondary phase change heat sink. Background Art

[0002] A heat sink refers to a device used to quickly dissipate heat in mechanical equipment, metal cabinets, circuit boards and other equipment components to ensure the normal operation of the equipment components. Some existing heat sinks use air-cooled aluminum fin heat sinks. At present, the existing air-cooled aluminum fin heat sinks include shovel-tooth heat sinks, aluminum extruded heat sinks, slotted-tooth heat sinks, etc. They mainly rely on the thermal conductivity of single-phase materials to transfer heat from the device to the surface of the heat sink, and then exchange heat with the air to dissipate the heat into the environment. The efficiency of heat conduction in this type of method depends on the structural design of the heat sink, and is also limited by the inherent thermal conductivity of single-phase materials. As the power of power devices such as IGBTs increases and the product size decreases, traditional heat sinks can no longer meet the growing heat dissipation needs of power devices. For example, the application number disclosed in the Chinese patent document is 202220133437.2, the authorization announcement date is 2022.07.29, and the utility model name is "A gas-liquid circulation structure of a phase change heat dissipation element"; another example is the application number disclosed in the Chinese patent document is 202111420971.8, the authorization announcement date is 2022.03.11, and the utility model name is "A liquid absorption core for a phase change heat dissipation element"; however, the above-mentioned products and similar products rarely use the solid-liquid secondary phase change method of solid working fluid, and mainly use the gas-liquid secondary phase change method to meet the heat dissipation needs of existing high-power power modules (IGBT) and other power device products. Summary of the invention

[0003] In order to overcome the above shortcomings, the purpose of the utility model is to provide a secondary phase change heat sink in the art, so as to solve the technical problem that the existing similar products rarely use the solid-liquid secondary phase change method of solid working fluid, and it is difficult to meet the heat dissipation requirements of power device products such as existing high-power power modules (IGBT). The purpose is achieved through the following technical solutions.

[0004] A secondary phase change heat sink, the heat sink includes a substrate, fins, a solid working medium, and a liquid working medium. One side of the substrate contacts a heat source, a substrate cavity is formed inside the substrate, and the substrate cavity contains a solid working medium; a fin cavity is formed inside the fin, and the fin cavity contains a liquid working medium; the key points of its structural design are that the other side of the substrate is provided with equidistantly distributed fins or integrally formed fins, the fin cavities of the fins contain a liquid working medium, and the substrate cavity of the substrate and the fin cavity of the fins are separated by chamber isolation. Thus, the heat sink absorbs heat through a primary phase change of the working medium inside the substrate cavity, and then improves the heat conversion efficiency through a secondary phase change of the liquid working medium inside the fin cavity, thereby enhancing the heat dissipation capacity of the entire heat sink and solving the heat dissipation requirements of power devices such as high-power IGBTs. The layout of the above-mentioned fins is not limited to the shovel tooth method, and it can also adopt an existing fin structure.

[0005] The solid working medium in the substrate cavity of the substrate and the liquid working medium in the fin cavity of the fin are respectively integrally formed and packaged in the corresponding cavity, and the substrate and the fin are made in one piece. The above structure facilitates the fin to be installed on the substrate as a single module as needed.

[0006] The fin cavities of the fins are connected as one body, and a liquid injection hole is provided on one side of the fin cavity of the fin, so as to facilitate liquid injection into the fin and installation of the fin on the substrate; or the fin cavities of the fins are respectively provided with liquid injection holes for liquid injection.

[0007] The utility model has reasonable structural design, low conduction thermal resistance, good heat transfer capacity and heat exchange efficiency, small temperature difference of the substrate, uniform temperature, and meets the heat dissipation requirements of existing high-power power modules (IGBT); it is suitable for use as a secondary phase change radiator and a further improvement of similar products. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a schematic cross-sectional structural diagram of an embodiment of the utility model, in which part A is framed.

[0009] Figure 2 yes Figure 1 Schematic diagram of the three-dimensional structure, in which the dotted lines represent the internal structure of the substrate and the fins.

[0010] Figure 3 yes Figure 1 Enlarged view of part A.

[0011] Serial numbers and names of the accompanying drawings: 1. substrate, 101. substrate cavity, 2. fins, 201. fin cavity, 3. solid working fluid, 4. liquid working fluid. Implementation

[0012] Now, in conjunction with the accompanying drawings, the structure and use of the utility model are further described. Figure 1-Figure 3As shown, the radiator includes a substrate 1, fins 2, a solid working medium 3, and a liquid working medium 4. One side of the substrate is in contact with a heat source, and a substrate cavity 101 is formed inside the substrate, and the substrate cavity contains a solid working medium; a fin cavity 201 is formed inside the fin, and the fin cavity contains a liquid working medium. The other side of the substrate is provided with equidistantly distributed fins, and the fin cavities of the fins respectively contain liquid working medium, and the substrate cavity of the substrate and the fin cavity of the fin are separated by chamber isolation. The solid working medium in the substrate cavity of the substrate and the liquid working medium in the fin cavity of the fin are respectively integrally molded and packaged in the corresponding cavity, and the substrate and the fin are made in one piece. The fins of the substrate are integrally molded, and the fin cavities of the fins are interconnected as a whole, and a liquid injection hole is provided on one side of the fin cavity of the fin.

[0013] In summary, the heat sink solves the heat dissipation needs of power devices such as high-power IGBTs. The heat of the heat sink is transferred to the inside of the substrate cavity 101, so that the solid working medium 3 in the substrate cavity 101 absorbs heat and melts, causing a phase change, which reduces the temperature of the heat source. At this time, the temperature difference of the substrate 1 is very small, the temperature is uniform, and the temperature on the substrate is also rising. At the same time, the heat is also transferred to the inside of the fin cavity 201 through heat conduction. When the liquid working medium 4 inside is heated to the boiling point, it begins to vaporize and convert into gas, and a secondary phase change occurs. When cold wind blows through the fins, the gaseous working medium inside the fin cavity 201 is cooled and condensed into liquid, and the cycle repeats, working back and forth.

Claims

1. A secondary phase change heat sink, comprising a substrate (1), fins (2), a solid working medium (3), and a liquid working medium (4), wherein one side of the substrate contacts a heat source, a substrate cavity (101) is formed inside the substrate, and the solid working medium is contained in the substrate cavity; a fin cavity (201) is formed inside the fin, and the liquid working medium is contained in the fin cavity; wherein the ... The other side of the substrate (1) is provided with equidistantly distributed fins (2) or integrally formed fins, the fin cavities of the fins contain liquid working fluid, and the substrate cavity (101) of the substrate and the fin cavity of the fins are separated by chamber isolation.

2. The secondary phase change heat sink according to claim 1, characterized in that The solid working medium (3) in the substrate cavity (101) of the substrate (1) and the liquid working medium (4) in the fin cavity (201) of the fin (2) are respectively integrally formed and packaged in corresponding cavities, and the substrate and the fin are integrally manufactured.

3. The secondary phase change heat sink according to claim 1, characterized in that The fin cavities (201) of the fins (2) are interconnected as a whole, and a liquid injection hole is provided on one side of the fin cavity of the fin.

Images