LED chip packaging automatic production line

Abstract

The utility model discloses an LED chip packaging automatic production line, which comprises a working platform, an assembling mechanism and a packaging mechanism are arranged on the working platform, the assembling mechanism comprises a first feeding device and a driving device, the first feeding device is used for feeding chip terminals, and the driving device is used for driving the assembling mechanism to rotate. The driving device is used for grabbing the chip terminal and moving the chip terminal to the packaging mechanism; the packaging mechanism is arranged on one side of the assembling mechanism and comprises a braid conveying device and a braid, and the braid conveying device is used for driving the braid to move linearly; the driving device is used for moving a chip terminal to the braid; by arranging the feeding device and the driving device, after the chip modules are automatically fed, the driving device can drive the chip modules to move to the braid, the braid moves along the straight line, the chip modules can be placed in different grooves of the braid, then the chips are automatically placed on the braid, the structure is simple, and the automation degree is relatively high.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to an automatic production line for LED chip packaging. Background Art

[0002] The shell used to install semiconductor integrated circuit chips plays the role of placing, fixing, sealing, protecting the chips and enhancing the electrical and thermal performance. It is also a bridge between the internal world of the chip and the external circuit. The contacts on the chip are connected to the pins of the package shell with wires, and these pins are connected to other devices through wires on the printed circuit board. Therefore, packaging plays an important role for CPUs and other LSI integrated circuits. Generally, when packaging chips, it is necessary to place the chips in the tape first to facilitate the subsequent packaging of the chip module. At present, there are many ways to place or package the chips on the tape. Among them, the automated equipment has a more complex structure and a larger volume, and manual operation requires a lot of manpower. Utility Model Content

[0003] In view of this, the utility model discloses an automatic production line for LED chip packaging, which can automatically place the chip in a braid and has a simple structure.

[0004] The utility model discloses an automatic production line for LED chip packaging, comprising a working platform, wherein an assembly mechanism and a packaging mechanism are arranged on the working platform.

[0005] The assembly mechanism includes a first loading device and a driving device, wherein the first loading device is used to load the chip terminals, and the driving device is used to grab the chip terminals and move them to the packaging mechanism;

[0006] The packaging mechanism is arranged on one side of the assembly mechanism, and the packaging mechanism comprises a braid transmission device and a braid, wherein the braid transmission device is used to drive the braid to move linearly; the driving device is used to move the chip terminal to the braid;

[0007] The driving direction of the braid transmission device is perpendicular to the driving direction of the driving device.

[0008] Furthermore, the first loading device includes a flipping assembly and a jig assembly, the flipping assembly is fixed on the working platform, the jig assembly is arranged on one side of the flipping assembly, the flipping assembly is used to place the chip terminal on the jig assembly, and the driving device is used to grab the chip terminal from the jig and move it to the tape.

[0009] Further, the flip assembly includes a flip cylinder, a first flip bracket, a second flip bracket, a guide plate and a stopper, one end of the first flip bracket is rotatably connected to the working platform, the other end of the first flip bracket is fixedly connected to one end of the second flip bracket, the guide plate is fixedly connected to one end of the second flip bracket away from the first flip bracket, and the flip cylinder can drive the first flip bracket to rotate to drive the guide plate to rotate at the same time;

[0010] The guide plate is located above the jig assembly. When the guide plate is rotated to a certain position, the chip terminal can be moved to the jig assembly; the stopper is used to control the chip terminal to be separated from the guide plate.

[0011] Furthermore, a discharge port is provided on one side of the guide plate, and a feed port is provided on the other side of the guide plate. A loading guide rail is provided at the feed port, and chip terminals are provided in the loading guide rail. The chip terminals can move along the loading guide rail to the guide plate under the action of gravity; the stopper is provided at the discharge port of the guide plate.

[0012] Furthermore, the stop member includes a stop cylinder and a stop shaft, and the stop cylinder can drive the stop shaft to perform linear motion to open or close the discharge port.

[0013] Furthermore, one end of the flip cylinder is connected to the vertical shaft, the bottom end of the vertical shaft is slidingly matched with the working platform, the flip cylinder is rotationally matched with the vertical shaft, and the output shaft of the flip cylinder is rotationally matched with the first flip bracket or the second flip bracket.

[0014] Furthermore, the guide plate is provided with a plurality of guide rails, the feed port and the discharge port are respectively located on both sides of the guide rails, the jig assembly comprises a jig plate and a translation drive member, the jig plate is provided with a plurality of placement grooves corresponding to the guide rails one by one, the translation drive member can drive the guide plate to translate so as to move the chip modules in the placement grooves one by one to the grabbing station of the drive device.

[0015] Furthermore, the first loading device includes a first loading cylinder, a connecting plate, a lifting cylinder and an adsorption head. The adsorption head and the connecting plate slide in cooperation with each other in the vertical direction. The lifting cylinder can drive the adsorption head to slide in the vertical direction. The first loading cylinder is used to drive the connecting plate to move in a straight line. The adsorption head is used to grab the chip module from the placement slot.

[0016] Furthermore, the braid transmission device includes a braid guide rail, a driving motor and a driving wheel. The braid is slidably matched with the braid guide rail in the braid guide rail. The driving motor can drive the driving wheel to rotate. A plurality of driving teeth are arranged on the circumference of the driving wheel. Driving holes corresponding to the driving teeth are arranged on the side of the braid. When the driving wheel rotates, the driving teeth can cooperate with the driving holes to drive the braid to slide along the braid guide rail.

[0017] Compared with the prior art, the technical solution disclosed in the utility model has the following beneficial effects:

[0018] By setting up a loading device and a driving device, after the chip module is automatically loaded, the chip module can be driven by the driving device to move to the tape, and the tape can move along a straight line to place the chip module in different grooves of the tape, thereby realizing automatic placement of the chip on the tape, achieving a simple structure and a relatively high degree of automation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the packaging automatic production line;

[0020] Figure 2 This is a top view of the package on the production line;

[0021] Figure 3 It is a structural schematic diagram of the flip assembly;

[0022] Figure 4 It is a schematic diagram of the structure of the guide plate and the feeding guide rail;

[0023] Figure 5 It is a structural schematic diagram of the fixture assembly;

[0024] Figure 6 A schematic diagram of the structure of the driving device. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to another component, or there may be a central component at the same time. Unless otherwise defined, all technical and scientific terms used in this article have the same meaning as those generally understood by technicians in the technical field of the utility model. It should also be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection between the two components. For ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to specific circumstances. The terms used in the specification of the utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model.

[0026] It should also be noted that in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0027] like Figure 1 and Figure 2 As shown, the utility model discloses an automatic production line 100 for LED chip packaging, including a work platform 10, on which an assembly mechanism 20 and a packaging mechanism 30 are arranged, the assembly mechanism 20 is used to load the chip module and move the chip module to the packaging mechanism 30, the packaging mechanism 30 includes a braid, and the braid is used to carry the chip module.

[0028] Specifically, the assembly mechanism 20 includes a first loading device 21 and a driving device 22 . The first loading device 21 is used to load the chip terminals, and the driving device 22 is used to grab the chip terminals and move them to the braid of the packaging mechanism 30 .

[0029] Furthermore, the first loading device 21 includes a flip assembly 23 and a jig assembly 24, wherein the flip assembly 23 is fixed on the working platform 10, and the jig assembly 24 is arranged on one side of the flip assembly 23, and the flip assembly 23 is used to place the chip terminal on the jig assembly 24, and the driving device 22 is used to grab the chip terminal from the jig assembly 24 and move it to the braid. When working, the flip assembly 23 is used to move the chip module to a preset position, so that the chip module moves to the jig assembly 24 under the action of gravity, and the driving device 22 is used to move the chip module on the jig assembly 24 to the braid. In the present application, the flip assembly 23 can drive multiple chip modules to move at the same time, and the jig assembly 24 is used to carry multiple chip modules at the same time.

[0030] like Figure 3 As shown, further, the flip assembly 23 includes a flip cylinder 231, a first flip bracket 232, a second flip bracket 233, a guide plate 234 and a stopper 235, one end of the first flip bracket 232 is rotatably connected to the work platform 10, the other end of the first flip bracket 232 is fixedly connected to one end of the second flip bracket 233, the guide plate 234 is fixedly connected to one end of the second flip bracket 233 away from the first flip bracket 232, and the flip cylinder 231 can drive the first flip bracket 232 to rotate so as to drive the guide plate 234 to rotate at the same time. When working, the flip cylinder 231 can drive the first flip bracket 232, the first flip bracket 232 rotates relative to the work platform 10, and the guide plate 234 rotates synchronously until the guide plate 234 rotates to a preset position, and the chip module on the guide plate 234 falls to the fixture assembly 24 and is carried by the fixture assembly 24. In the present application, the flip cylinder 231 can also drive the second flip bracket 233.

[0031] Furthermore, one end of the flip cylinder 231 is connected to the vertical shaft 2311, the bottom end of the vertical shaft 2311 is slidably matched with the working platform 10, the flip cylinder 231 is rotationally matched with the vertical shaft 2311, and the output shaft of the flip cylinder 231 is rotationally matched with the first flip bracket 232 or the second flip bracket 233. The vertical shaft 2311 slides relative to the working platform 10 to prevent the flip cylinder 231 from having a driving dead point.

[0032] The guide plate 234 is located above the jig assembly 24. When the guide plate 234 rotates to a certain position, the chip terminal can be moved to the jig assembly 24. The stopper 235 is used to control the chip terminal to be separated from the guide plate 234. Specifically, when the guide plate 234 rotates, the stopper 235 stops the guide plate 234 to prevent the chip module from falling. When the guide plate 234 moves to a preset position, the stopper 235 works, and the chip can be separated from the guide plate 234.

[0033] A discharge port is provided on one side of the guide plate 234, and a feed port is provided on the other side of the guide plate 234. A loading guide rail 236 is provided at the feed port, and chip terminals are provided in the loading guide rail 236. The chip terminals can move to the guide plate 234 along the loading guide rail 236 under the action of gravity; the stopper 235 is provided at the discharge port of the guide plate 234. Figure 4 As shown, the stopper 235 includes a stopper cylinder 2351 and a stopper shaft 2352, and the stopper cylinder 2351 can drive the stopper shaft 2352 to perform linear motion to open or close the discharge port. In the present application, the loading guide rail 236 can carry multiple chip modules along a straight line, and the chips on the loading guide rail 236 can be moved to the guide plate 234 one by one.

[0034] The guide plate 234 is provided with a plurality of guide rails 2341, and the feed port and the discharge port are respectively located on both sides of the guide rails 2341. Figure 5 As shown, the jig assembly 234 includes a jig plate 241 and a translation drive 242. The jig plate 241 is provided with a plurality of placement slots 243 corresponding to the guide rails 2341. The translation drive 242 can drive the guide plate 234 to translate so as to move the chip modules in the placement slots 243 one by one to the grabbing station of the drive device 22. In the present application, the translation drive 242 can be a driving slide, a belt drive mechanism or a screw drive mechanism, as long as the jig plate 241 can reciprocate in a straight line, and its specific structure is not limited here.

[0035] like Figure 6 As shown, further, the first loading device 22 includes a first loading cylinder 221, a connecting plate 222, a lifting cylinder 223 and an adsorption head 224. The adsorption head 224 and the connecting plate 222 slide in the vertical direction. The lifting cylinder 223 can drive the adsorption head 224 to slide in the vertical direction. The first loading cylinder 221 is used to drive the connecting plate 222 to perform linear reciprocating motion; the adsorption head 224 is used to grab the chip module from the placement slot 243.

[0036] Please return to view Figure 1 The packaging mechanism 30 is arranged on one side of the assembly mechanism 20, and the packaging mechanism 30 also includes a braid transmission device, which is used to drive the braid to move linearly; the driving device is used to move the chip terminal to the braid;

[0037] The braid transmission device includes a braid guide rail 31, a drive motor 33 and a drive wheel 32. The braid is slidably matched with the braid guide rail 31 in the braid guide rail 31. The drive motor 33 can drive the drive wheel 32 to rotate. The drive wheel 32 is provided with a plurality of drive teeth on its circumference. The side of the braid is provided with drive holes corresponding to the drive teeth. When the drive wheel 32 rotates, the drive teeth can cooperate with the drive holes to drive the braid to slide along the braid guide rail 31.

[0038] The present invention can be implemented in various ways and modified without departing from the broad spirit and scope of the present invention. The above-mentioned embodiments are used to illustrate the present invention, but do not limit the scope of the present invention.

Claims

1. An automatic production line for LED chip packaging, characterized in that: It includes a working platform, on which an assembly mechanism and a packaging mechanism are arranged, wherein: The assembly mechanism includes a first loading device and a driving device, wherein the first loading device is used to load the chip terminals, and the driving device is used to grab the chip terminals and move them to the packaging mechanism; The packaging mechanism is arranged on one side of the assembly mechanism, and the packaging mechanism comprises a braid transmission device and a braid, wherein the braid transmission device is used to drive the braid to move linearly; the driving device is used to move the chip terminal to the braid; The driving direction of the braid transmission device is perpendicular to the driving direction of the driving device.

2. The LED chip packaging automatic production line according to claim 1, characterized in that: The first loading device includes a flipping assembly and a jig assembly, wherein the flipping assembly is fixed on the working platform, the jig assembly is arranged on one side of the flipping assembly, the flipping assembly is used to place the chip terminal on the jig assembly, and the driving device is used to grab the chip terminal from the jig and move it to the braid.

3. The LED chip packaging automatic production line according to claim 2, characterized in that: The flip assembly includes a flip cylinder, a first flip bracket, a second flip bracket, a guide plate and a stopper, one end of the first flip bracket is rotatably connected to the working platform, the other end of the first flip bracket is fixedly connected to one end of the second flip bracket, the guide plate is fixedly connected to one end of the second flip bracket away from the first flip bracket, and the flip cylinder can drive the first flip bracket to rotate so as to drive the guide plate to rotate simultaneously; The guide plate is located above the jig assembly. When the guide plate is rotated to a certain position, the chip terminal can be moved to the jig assembly; the stopper is used to control the chip terminal to be separated from the guide plate.

4. The LED chip packaging automatic production line according to claim 3, characterized in that: A discharge port is arranged on one side of the guide plate, and a feed port is arranged on the other side of the guide plate. A loading guide rail is arranged at the feed port, and chip terminals are arranged in the loading guide rail. The chip terminals can move to the guide plate along the loading guide rail under the action of gravity; the stopper is arranged at the discharge port of the guide plate.

5. The automatic production line for LED chip packaging according to claim 4, characterized in that: The stopper comprises a stop cylinder and a stop shaft, and the stop cylinder can drive the stop shaft to perform linear motion to open or close the discharge port.

6. The LED chip packaging automatic production line according to claim 3, characterized in that: One end of the flip cylinder is connected to the vertical shaft, the bottom end of the vertical shaft is slidably matched with the working platform, the flip cylinder is rotationally matched with the vertical shaft, and the output shaft of the flip cylinder is rotationally matched with the first flip bracket.

7. The automatic production line for LED chip packaging according to claim 4, characterized in that: The guide plate is provided with a plurality of guide rails, the feed port and the discharge port are respectively located on both sides of the guide rails, the jig assembly comprises a jig plate and a translation drive member, the jig plate is provided with a plurality of placement grooves corresponding to the guide rails one by one, the translation drive member can drive the guide plate to translate so as to move the chip modules in the placement grooves to the grabbing station of the drive device one by one.

8. The LED chip packaging automatic production line according to claim 7, characterized in that: The first loading device includes a first loading cylinder, a connecting plate, a lifting cylinder and an adsorption head. The adsorption head and the connecting plate slide in cooperation with each other in the vertical direction. The lifting cylinder can drive the adsorption head to slide in the vertical direction. The first loading cylinder is used to drive the connecting plate to perform linear motion. The adsorption head is used to grab the chip module from the placement slot.

9. The LED chip packaging automatic production line according to claim 1, characterized in that: The braid transmission device includes a braid guide rail, a driving motor and a driving wheel. The braid slides with the braid guide rail in the braid guide rail. The driving motor can drive the driving wheel to rotate. A plurality of driving teeth are arranged on the circumference of the driving wheel. Driving holes corresponding to the driving teeth are arranged on the side of the braid. When the driving wheel rotates, the driving teeth can cooperate with the driving holes to drive the braid to slide along the braid guide rail.

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