Cleaning equipment for IC chip recycling

Abstract

The utility model discloses cleaning equipment for IC (integrated circuit) chip recycling, which belongs to the technical field of chip recycling and cleaning and comprises a base, I-shaped baffles are fixedly mounted on two sides of the top of the base, a sliding rail is fixedly mounted between the two I-shaped baffles, and a mounting frame is slidably connected onto the sliding rail. And pulleys are rotationally mounted on the positions, located on the two sides of the sliding rails, in the mounting frames, a connecting plate is fixedly connected between the two mounting frames, and a first electric push rod is arranged in the connecting plate. According to the cleaning equipment for IC chip recycling, by arranging the soaking tanks, the sliding rails, the mounting frame, the sliding wheels and the connecting plate, different soaking solutions are injected into the four sets of soaking tanks, and the connecting plate drives a soaking sieve to move to the positions above the different soaking tanks, so that an IC chip can be soaked in the different soaking solutions to be rinsed; according to the immersion cleaning mode, the IC chip does not need to be manually carried to be immersed in different immersion pools to be rinsed, so that the manpower is saved, and the working efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip recycling and cleaning, in particular to cleaning equipment for recycling IC chips. Background Art

[0002] IC chips are the core components of integrated circuits, playing key functions and roles. They are widely used in various fields. While they are widely used in various fields, there is no shortage of a large number of discarded IC chips. There are many ways to deal with discarded IC chips. Generally, they are incinerated in the final stage, but this will produce a large amount of toxic smoke and gas, which is not recommended. Recycled waste IC chips can be cleaned and reused. IC chip cleaning requires soaking and rinsing with a variety of chemical solutions. Traditional cleaning equipment is relatively single and requires manual transportation of IC chips to soak in different soaking pools for rinsing, which not only wastes manpower but also reduces work efficiency. Utility Model Content

[0003] In order to overcome the above defects, the utility model provides a cleaning device for recycling IC chips, which solves the problem that traditional cleaning equipment requires manual transportation of IC chips to be immersed in different immersion tanks for rinsing, which wastes manpower and reduces work efficiency.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a cleaning device for recycling IC chips, comprising a base, with I-shaped baffles fixedly installed on both sides of the top of the base, a slide rail fixedly installed between two groups of I-shaped baffles, a mounting frame slidably connected to the slide rail, pulleys rotatably installed on both sides of the slide rail inside the mounting frame, a connecting plate fixedly connected between the two groups of mounting frames, an electric push rod is provided in the connecting plate, the bottoms of the two electric push rods are fixedly connected to a bracket, three groups of slide rods are equidistantly fixed inside the bracket, a slider is connected to the outer sleeve of the slide rod, the three groups of slide rods are located on both sides of the slider and are sleeved with springs, and a soaking screen is fixedly connected above the slider.

[0005] As a further solution of the utility model: three groups of fixing plates are fixed equidistantly inside the base, soaking tanks are slidably mounted on both sides of the fixing plates, and a wristband is provided on one side of the soaking tank.

[0006] As a further solution of the utility model: a second electric push rod is installed in the middle of the connecting plate, the second electric push rod passes through the connecting plate, and a cover plate is arranged at the bottom of the second electric push rod.

[0007] As a further solution of the utility model: connecting rods are fixedly connected to both ends of the soaking screen, and hand-held rods are fixedly connected between the two groups of connecting rods.

[0008] As a further solution of the utility model: fixing blocks are installed on both sides of the electric push rod 1 above the connecting plate, and the fixing blocks are fixed on both sides of the electric push rod 1 and the electric push rod 2.

[0009] As a further solution of the utility model: a groove is provided on the back side of the connecting plate on the side where the fixing block is installed, and the size of the groove is adapted to the size of the cover plate.

[0010] Compared with the prior art, the beneficial effects of the utility model are:

[0011] 1. The cleaning equipment for recycling IC chips is provided with soaking tanks, slide rails, mounting frames, pulleys and connecting plates. Different soaking liquids are injected into four groups of soaking tanks. The chips are placed in soaking screens. The mounting frame is pushed to make the rollers move on the surface of the slide rails, so that the mounting frame drives the connecting plate to move. The soaking screens are driven by the connecting plate to move to the tops of different soaking tanks. The soaking screens are immersed in soaking tanks injected with different soaking liquids, so that the IC chips can be immersed in different soaking liquids for rinsing. This soaking method does not require manual transportation of IC chips to be immersed in different soaking tanks for rinsing, which saves manpower and improves work efficiency.

[0012] 2. The cleaning equipment for recycling IC chips, by setting a bracket, a soaking screen, a sliding rod, a slider, a spring, a connecting rod and a hand-held rod, soaks the IC chip in the soaking tank through the soaking screen. Since three sets of sliding rods are set inside the bracket, the sliding rods penetrate the slider, so that the soaking screen can be moved above the bracket. The hand-held rod is pulled to make the connecting rod drive the soaking screen to move above the bracket. The springs on both sides of the slider can limit the moving range of the soaking screen, and the stains on the chip surface can be detached by shaking, so that the chip is convenient to clean. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0014] Figure 2 It is a structural schematic diagram of the pulley, mounting frame, electric push rod and soaking screen of the utility model;

[0015] Figure 3 For this utility model Figure 2 The enlarged structural diagram at A in the middle;

[0016] In the figure: 1. base; 2. slide rail; 3. I-shaped baffle; 4. mounting frame; 5. pulley; 6. connecting plate; 7. electric push rod 1; 8. bracket; 9. slide rod; 10. slider; 11. spring; 12. soaking screen; 13. connecting rod; 14. hand-held rod; 15. electric push rod 2; 16. cover plate; 17. fixing block; 18. fixing plate; 19. soaking tank; 20. wristband; 21. groove. DETAILED DESCRIPTION

[0017] The technical solution of this patent is further described in detail below in conjunction with specific implementation methods.

[0018] like Figure 1-3 As shown, the utility model provides a technical solution: a cleaning device for recycling IC chips, comprising a base 1, three groups of fixed plates 18 are fixed at equal intervals inside the base 1, soaking tanks 19 are slidably installed on both sides of the fixed plates 18, and a hand ring 20 is provided on one side of the soaking tank 19. By slidingly installing the soaking tank 19 and the hand ring 20, the soaking tank 19 can be pulled out from the base 1, which is convenient for injecting different soaking liquids and replacing the soaking liquids. I-shaped baffles 3 are fixedly installed on both sides of the top of the base 1, and the two groups of I-shaped baffles 3 are fixed between them. A slide rail 2 is fixedly installed, and a mounting frame 4 is slidably connected to the slide rail 2. Pulleys 5 are rotatably installed on both sides of the slide rail 2. A connecting plate 6 is fixedly connected between the two sets of mounting frames 4. The connecting plate 6 is located on the back of one side of the mounting fixed block 17 and has a groove 21. The size of the groove 21 is adapted to the size of the cover plate 16. By setting the groove 21, the cover plate 16 can be raised and snapped into the groove 21, so that there is enough distance between the cover plate 16 and the soaking screen 12, which is convenient for placing the chips into the soaking screen 12;

[0019] An electric push rod 2 15 is installed in the middle of the connecting plate 6. The electric push rod 2 15 passes through the connecting plate 6. A cover plate 16 is arranged at the bottom of the electric push rod 2 15. By arranging the cover plate 16, the IC chip can be covered above the soaking screen 12 when it is sunk into the immersion liquid, and will not be offset or float above the immersion liquid due to the buoyancy of the immersion liquid, thereby improving the stability during immersion. An electric push rod 1 7 is arranged in the connecting plate 6. Fixed blocks 17 are installed on both sides of the electric push rod 1 7 above the connecting plate 6. The fixed blocks 17 are fixed on both sides of the electric push rod 1 7 and the electric push rod 2 15. By arranging the fixed blocks 17, the electric push rod 1 7 can be electrically The movable push rod 15 is more stable above the connecting plate 6 to improve stability. The bottom of the two electric push rods 7 is fixedly connected with a bracket 8. Three groups of sliding rods 9 are equidistantly fixed inside the bracket 8. A slider 10 is connected to the outer sleeve of the sliding rod 9. The three groups of sliding rods 9 are located on both sides of the slider 10 and are sleeved with springs 11. A soaking screen 12 is fixedly connected above the slider 10. Both ends of the soaking screen 12 are fixedly connected with connecting rods 13. Hand-held rods 14 are fixedly connected between the two groups of connecting rods 13. By setting the hand-held rods 14, the chip can be easily shaken to remove stains on the chip surface during the immersion process, so that the chip can be cleaned conveniently.

[0020] The working principle of the utility model is:

[0021] When using the cleaning device, first inject different immersion liquids into four groups of immersion tanks 19, move the mounting frame 4, so that the pulley 5 drives the connecting plate 6 to slide on the slide rail 2 to the top of the immersion tank 19, put the IC chip to be cleaned into the immersion screen 12, start the electric push rod 1 7, the electric push rod 1 7 drives the bracket 8 to move toward the immersion tank 19, wait for the immersion screen 12 to sink into the immersion liquid, start the electric push rod 2 15, so that the cover plate 16 covers the top of the chip, wait for the chip to be immersed in the immersion liquid, pull the hand-held rod 14, the hand-held rod 14 drives the immersion screen 12 to move above the bracket 8, because the two sides of the slider 10 are provided with springs 11, the immersion screen 12 is reset by the rebound of the spring 11 during the movement, and the stains on the surface of the chip are detached by shaking, so that the chip is cleaned.

[0022] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0023] The above describes in detail the preferred implementation of this patent, but this patent is not limited to the above implementation. Various changes can be made within the knowledge scope of ordinary technicians in this field without departing from the purpose of this patent.

Claims

1. A cleaning device for recycling IC chips, comprising a base (1), characterized in that: I-shaped baffles (3) are fixedly installed on both sides of the top of the base (1), a slide rail (2) is fixedly installed between the two groups of I-shaped baffles (3), a mounting frame (4) is slidably connected to the slide rail (2), pulleys (5) are rotatably installed inside the mounting frame (4) on both sides of the slide rail (2), a connecting plate (6) is fixedly connected between the two groups of mounting frames (4), an electric push rod (7) is arranged inside the connecting plate (6), the bottoms of the two electric push rods (7) are fixedly connected to a bracket (8), three groups of slide rods (9) are equidistantly fixed inside the bracket (8), a slider (10) is connected to the outer surface of the slide rod (9), the three groups of slide rods (9) are located on both sides of the slider (10) and are sleeved with springs (11), and a soaking screen (12) is fixedly connected above the slider (10).

2. The IC chip recycling cleaning device according to claim 1, characterized in that: Three groups of fixing plates (18) are fixed at equal intervals inside the base (1), soaking tanks (19) are slidably mounted on both sides of the fixing plates (18), and a wristband (20) is arranged on one side of the soaking tank (19).

3. The IC chip recycling cleaning device according to claim 1, characterized in that: A second electric push rod (15) is installed in the middle of the connecting plate (6), the second electric push rod (15) passes through the connecting plate (6), and a cover plate (16) is arranged at the bottom of the second electric push rod (15).

4. The cleaning equipment for recycling IC chips according to claim 1, characterized in that: Connecting rods (13) are fixedly connected to both ends of the soaking screen (12), and a hand-held rod (14) is fixedly connected between the two groups of connecting rods (13).

5. The IC chip recycling cleaning device according to claim 3, characterized in that: Fixed blocks (17) are installed on both sides of the electric push rod 1 (7) above the connecting plate (6), and the fixed blocks (17) are fixed on both sides of the electric push rod 1 (7) and the electric push rod 2 (15).

6. The cleaning equipment for recycling IC chips according to claim 5, characterized in that: A groove (21) is provided on the back side of the connecting plate (6) located on the side where the fixing block (17) is installed, and the size of the groove (21) is adapted to the size of the cover plate (16).

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