Adjusting device for flow guide plate of silicon wafer cutting machine and silicon wafer cutting machine

Abstract

The utility model provides a silicon wafer cutting machine guide plate adjusting device and a silicon wafer cutting machine, the silicon wafer cutting machine guide plate adjusting device comprises a mounting seat, the mounting seat is provided with a height adjusting assembly and a horizontal adjusting assembly, and the horizontal adjusting assembly is used for adjusting the horizontal position of the mounting seat; the connecting seat is arranged on the mounting seat, the connecting seat is used for being connected with a flow guide plate of the silicon wafer cutting machine, and the height adjusting assembly is used for adjusting the height position of the connecting seat. According to the adjusting device for the flow guide plate of the silicon wafer cutting machine, the height position and the horizontal position of the flow guide plate can be conveniently and rapidly adjusted, and therefore the problems of line marks, total thickness errors, abnormal products of thin and thick wafers, defective products and the like are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon slice cutting, in particular to an adjusting device for a guide plate of a silicon slice cutting machine and a silicon slice cutting machine. Background Art

[0002] At present, the silicon wafer cutting field mainly uses single crystal silicon slicers to cut silicon rods and further process the crystal rods into silicon wafers. Before cutting, the crystal rod is pushed into the cutting chamber of the wire saw, and the silicon rod on the crystal support is fixed by the wire saw workbench. The wire mesh connected wire wheel and wire wheel are used to synchronously rotate through the main roller to achieve the cutting of the silicon rod.

[0003] During the cutting process, water flushing is required to cool down and flush away the silicon mud during the cutting process. During the flushing process, the guide plate plays an important role. However, the existing guide plate fixing device cannot firmly fix the guide plate due to certain design defects. During the cutting process, the guide plate is prone to shaking, resulting in the inability to guide stably, and it is easy to cause line marks, total thickness variation (Total Thickness Variation, TTV), abnormal products of thin and thick slices, defective products and other problems. In addition, after the existing guide plate is fixed, the height position and horizontal position of the guide plate cannot be adjusted. The guide plate cannot be adjusted to a suitable position according to actual conditions, which affects the diversion, and it cannot meet the water flow guidance under different cutting conditions, which is also easy to cause total thickness error, abnormal products of thin and thick slices, defective products and other problems. Utility Model Content

[0004] In view of this, the utility model provides an adjustment device for a guide plate of a silicon wafer cutting machine and a silicon wafer cutting machine, which can conveniently and quickly adjust the height and horizontal position of the guide plate, thereby avoiding problems such as line marks, total thickness errors, abnormal and defective products of thin and thick slices.

[0005] In order to solve at least one of the above technical problems, the present invention adopts the following technical solutions:

[0006] According to the first aspect of the present invention, the regulating device of the guide plate of the silicon wafer cutting machine comprises:

[0007] A mounting seat, wherein the mounting seat is provided with a height adjustment component and a level adjustment component, and the level adjustment component is used to adjust the horizontal position of the mounting seat;

[0008] A connecting seat, wherein the connecting seat is arranged on the mounting seat, the connecting seat is used to be connected to a guide plate of a silicon wafer cutting machine, and the height adjustment component is used to adjust the height position of the connecting seat.

[0009] Furthermore, the level adjustment component comprises:

[0010] A first screw, a first long hole matching with the first screw is arranged on the mounting seat, the first long hole is arranged in a horizontal direction, and the first screw passes through the first long hole to lock the mounting seat.

[0011] Furthermore, a protruding portion is provided on one side of the mounting seat, and the first long hole is provided on the protruding portion.

[0012] Furthermore, there are more than two first long holes, and the more than two first long holes are arranged in sequence up and down. There are multiple first screws, and each of the first long holes corresponds to more than two first screws.

[0013] Furthermore, the height adjustment component comprises:

[0014] A screw rod is threadedly connected to the connecting seat. The screw rod is arranged in the vertical direction and is axially fixed. A limiting piece that cooperates with the connecting seat is arranged on the mounting seat. Under the action of the limiting piece, rotating the screw rod can make the connecting seat move up and down along the screw rod.

[0015] Furthermore, the limiting member is a slideway arranged in the vertical direction, a fixing plate is arranged on the mounting seat, a through hole for the screw to pass through is arranged on the fixing plate, the screw is an adjusting bolt, a nut is arranged on the screw, and the head of the screw cooperates with the nut to axially fix the screw relative to the fixing plate.

[0016] Furthermore, the connecting seat is provided with a second long hole, the second long hole is arranged along the vertical direction, the mounting seat is provided with a second screw, and the second screw passes through the second long hole to lock the connecting seat on the mounting seat.

[0017] Furthermore, the connection base comprises:

[0018] A first connecting portion, the first connecting portion cooperates with the slideway;

[0019] The second connecting part and the first connecting part are in an L-shaped structure, the second connecting part extends in a direction away from the mounting seat, and the second connecting part is connected to the guide plate through a butterfly screw.

[0020] A silicon wafer cutting machine according to an embodiment of the second aspect of the present invention comprises:

[0021] A cutting chamber, wherein a guide plate and an adjusting device are arranged in the cutting chamber, wherein the adjusting device is the adjusting device of the guide plate of the silicon wafer cutting machine in the first aspect of the embodiment mentioned above, wherein the adjusting device is connected to the guide plate, and the adjusting device is used to adjust the height position and the horizontal position of the guide plate.

[0022] Furthermore, the regulating devices are in two groups, and the two groups of regulating devices are distributed on both sides of the guide plate.

[0023] The above technical solution of the utility model has at least one of the following beneficial effects:

[0024] According to the adjustment device of the guide plate of the silicon wafer cutting machine according to the embodiment of the utility model, a mounting seat and a connecting seat are provided, and a height adjustment component and a horizontal adjustment component are provided on the mounting seat, wherein the mounting seat is used to be fixedly installed in the cutting chamber of the silicon wafer cutting machine, the connecting seat is used to be connected to the guide plate of the silicon wafer cutting machine, the horizontal adjustment component is used to adjust the horizontal position of the mounting seat, and the height adjustment component is used to adjust the height position of the connecting seat provided on the mounting seat. Thus, the adjustment device of the utility model can conveniently and quickly adjust the height position and horizontal position of the guide plate, so that the guide plate is located in a suitable position, can ensure that the guide plate can better guide the flow, can also reduce the adverse effects caused by the shaking of the guide plate, can also effectively avoid the situation of insufficient or excessive local cooling in the cutting area, meet the water flow guidance under different cutting conditions, adapt to the cutting requirements of silicon wafers of different thicknesses or sizes, and thus avoid the problems of line marks, total thickness errors, abnormal products of thin and thick slices, defective products, etc.

[0025] In addition, the regulating device provided by the utility model has a simple and smart design and strong applicability.

[0026] Furthermore, more than two first long holes are arranged on the mounting seat, and the two or more first long holes are arranged in sequence up and down, and a plurality of first screws are also arranged, and each first long hole corresponds to more than two first screws. Thus, the mounting seat effectively provides a plurality of fixing points, thereby improving the stability of the guide plate, preventing the guide plate from shaking during the cutting process, and thus avoiding problems such as line marks, total thickness errors, abnormal products of thin and thick sheets, and defective products. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a structural front view of an adjusting device for a guide plate of a silicon wafer cutting machine according to an embodiment of the utility model;

[0028] Figure 2 A top view of the structure of the adjusting device of an embodiment of the utility model;

[0029] Figure 3 This is a schematic diagram of connecting a guide plate to an adjusting device in a cutting chamber of a silicon wafer cutting machine according to an embodiment of the utility model.

[0030] Reference numerals:

[0031] 100. Mounting seat;

[0032] 110. Height adjustment assembly; 111. Screw rod;

[0033] 120. Horizontal adjustment component; 121. First screw; 122. First long hole;

[0034] 130. Extension;

[0035] 140. Limiting parts;

[0036] 150. Fixed plate; 151. Through hole;

[0037] 200. Connecting seat; 210. First connecting part; 211. Second long hole; 212. Second screw; 220. Second connecting part; 221. Butterfly screw;

[0038] 10. Adjustment device; 20. Guide plate. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution of the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings of the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the described embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the utility model.

[0040] Unless otherwise defined, the technical terms or scientific terms used in the present invention shall have the usual meanings understood by persons with ordinary skills in the field to which the present invention belongs. The words "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not indicate quantity restrictions, but indicate the existence of at least one. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship also changes accordingly.

[0041] The following first describes in detail the adjusting device of the guide plate of the silicon wafer cutting machine according to the first embodiment of the utility model in conjunction with the drawings.

[0042] Figure 1 A structural front view of an adjusting device for a guide plate of a silicon wafer cutting machine according to an embodiment of the utility model is shown; Figure 2 A top view of the structure of the adjusting device according to an embodiment of the utility model is shown.

[0043] Specifically, Figure 1 to Figure 2As shown, the adjusting device 10 of the guide plate 20 of the silicon wafer cutting machine according to the embodiment of the utility model (hereinafter sometimes simply referred to as “adjusting device 10 ”) may include: a mounting seat 100 and a connecting seat 200 .

[0044] The mounting base 100 is provided with a height adjustment component 110 and a horizontal adjustment component 120, and the horizontal adjustment component 120 is used to adjust the horizontal position of the mounting base 100. The connecting base 200 is provided on the mounting base 100, and the connecting base 200 is used to connect with the guide plate 20 of the silicon wafer cutting machine, and the height adjustment component 110 is used to adjust the height position of the connecting base 200.

[0045] Specifically, if Figure 1 to Figure 2 As shown, a mounting base 100 and a connecting base 200 are provided, and a height adjustment component 110 and a horizontal adjustment component 120 are provided on the mounting base 100, wherein the mounting base 100 is used to be fixedly installed in a cutting chamber of a silicon wafer cutting machine, the connecting base 200 is used to be connected to a guide plate 20 of the silicon wafer cutting machine, the horizontal adjustment component 120 is used to adjust the horizontal position of the mounting base 100, and the height adjustment component 110 is used to adjust the height position of the connecting base 200 provided on the mounting base 100.

[0046] The height adjustment component 110 can timely and accurately adjust the height position of the guide plate 20, so that the guide plate 20 can move up and down in the cutting chamber to meet the needs of cutting silicon wafers of different thicknesses or sizes. For example, by adjusting the height of the guide plate 20, the coverage area of ​​the water flow can be increased, which is suitable for cutting processes that require more extensive cooling or larger silicon wafers; by adjusting the height of the guide plate 20, the water flow can also be concentrated to improve the local cooling efficiency, which is suitable for areas that require high-intensity cooling or fine cutting of small-sized silicon wafers. At the same time, the horizontal adjustment component 120 can timely and accurately adjust the horizontal position of the guide plate 20, so that the guide plate 20 can be aligned with the center of the cutting area to avoid the water flow from deviating to one side, thereby ensuring better diversion.

[0047] Therefore, the adjusting device 10 of the utility model can conveniently and quickly adjust the height position and horizontal position of the guide plate 20 through the height adjustment component 110 and the horizontal adjustment component 120, so that the guide plate 20 is located at a suitable position, which can ensure that the guide plate 20 can better guide the flow, and can also reduce the adverse effects caused by the shaking of the guide plate 20, and can also effectively avoid the situation of insufficient or excessive local cooling in the cutting area, effectively reduce the deformation of the silicon wafer caused by the difference in thermal expansion or contraction, meet the water flow guidance under different cutting conditions, adapt to the cutting requirements of silicon wafers of different thicknesses or sizes, and thus avoid the generation of line marks, total thickness errors, abnormal products of thin and thick slices, defective products and other problems. In addition, the adjusting device 10 provided by the utility model is simple in design, smart, and has strong applicability.

[0048] In some embodiments of the present invention, Figure 1 to Figure 2 As shown, the horizontal adjustment component 120 may include: a first screw 121, a first long hole 122 matching the first screw 121 is provided on the mounting base 100, the first long hole 122 is arranged along the horizontal direction, and the first screw 121 passes through the first long hole 122 to lock the mounting base 100.

[0049] That is, the mounting base 100 is connected to the guide plate 20, and when the guide plate 20 needs to be adjusted in the horizontal direction, the first screw 121 in the first long hole 122 is loosened, and then the mounting base 100 is moved back and forth in the horizontal direction until it is adjusted to the required fixed position of the guide plate 20, and finally the first screw 121 is tightened. In this way, the adjustment and fixation of the guide plate 20 in the horizontal direction can be achieved, and the operation is simple and the effect is good.

[0050] In some embodiments of the present invention, Figure 1 to Figure 2 As shown, a protruding portion 130 is provided on one side of the mounting seat 100, and the first long hole 122 is provided on the protruding portion 130. By providing the protruding portion 130 on one side of the mounting seat 100, an additional support area and contact point can be provided, thereby increasing the support capacity of the mounting seat 100, and thus enhancing the stability of the adjustment device 10 fixing the guide plate 20. In addition, by providing the first long hole 122 on the protruding portion 130, more space can be reserved on the mounting seat 100 for arranging other components coordinated therewith, such as the connecting seat 200, etc., and the layout is more compact.

[0051] In some embodiments of the present invention, Figure 1 to Figure 2 As shown, there are more than two first long holes 122, which are arranged up and down in sequence, and there are more than one first screw 121, and each first long hole 122 corresponds to more than two first screws 121. In other words, the mounting base 100 provides multiple fixing points, thereby improving the stability of the guide plate 20, preventing the guide plate 20 from shaking during the cutting process, and thus avoiding problems such as line marks, total thickness errors, abnormal products of thin and thick sheets, and defective products.

[0052] In some embodiments of the present invention, Figure 1 to Figure 2 As shown, the height adjustment assembly 110 may include: a screw 111, the screw 111 is threadedly connected to the connecting seat 200, the screw 111 is arranged in the vertical direction and is axially fixed, and a limiting member 140 that cooperates with the connecting seat 200 is arranged on the mounting seat 100. Under the action of the limiting member 140, rotating the screw 111 can make the connecting seat 200 move up and down along the screw 111.

[0053] That is to say, the screw rod 111 is connected to the connecting seat 200, and the connecting seat 200 is connected to the guide plate 20. When the guide plate 20 needs to adjust its height in the vertical direction, the adjustment can be achieved by rotating the screw rod 111. The connecting seat 200 moves up and down in the vertical direction under the guidance of the screw rod 111 until it is adjusted to the required height position of the guide plate 20. During this period, the limiter 140 limits the up and down movement range of the connecting seat 200 driven by the screw rod 111 relative to the mounting seat 100, preventing the connecting seat 200 from being over-adjusted and disengaged from the mounting seat 100 or horizontally offset when moving up and down, further improving the stability and reliability of the adjustment device 10.

[0054] In some embodiments of the present invention, Figure 1 to Figure 2 As shown, the limit member 140 is a slideway arranged in the vertical direction, and a fixing plate 150 is arranged on the mounting seat 100. The fixing plate 150 is provided with a through hole 151 for the screw 111 to pass through. The screw 111 is an adjusting bolt, and a nut is arranged on the screw 111. The head of the screw 111 cooperates with the nut to axially fix the screw 111 relative to the fixing plate 150.

[0055] Specifically, combined Figure 1 and Figure 2 When the height position of the guide plate 20 needs to be adjusted, the screw rod 111, i.e., the adjusting bolt, is rotated, and the head of the adjusting bolt cooperates with the nut to fix the adjusting bolt axially relative to the fixing plate 150, so that the connecting seat 200 moves up and down in a straight line along the vertical direction when the adjusting bolt is rotated. In addition, the movement of the connecting seat 200 is limited by the slideway on the mounting seat 100. During the movement, problems such as over-adjustment and disengagement from the mounting seat 100 or horizontal offset when moving up and down are avoided.

[0056] In some embodiments of the present invention, Figure 1 to Figure 2 As shown, the connecting base 200 is provided with a second long hole 211, which is arranged in the vertical direction, and the mounting base 100 is provided with a second screw 212, which passes through the second long hole 211 to lock the connecting base 200 on the mounting base 100. There may be one or more second long holes 211, and each second long hole 211 may correspond to one or more second screws 212.

[0057] That is, the height adjustment assembly 110 of the adjustment device 10 is realized by the coordinated action of the screw rod 111, the second long hole 211, and the second screw 212. When the guide plate 20 needs to adjust its height position in the vertical direction, first loosen the second screw 212 in the second long hole 211, and then rotate the screw rod 111 to make the connecting seat 200 slide up and down relative to the slideway of the mounting seat 100. After it is adjusted to the desired position, finally tighten the second screw 212 to lock the connecting seat 200 at the desired height position. In this way, the height adjustment of the guide plate 20 is achieved without affecting its stability during the cutting process.

[0058] In some embodiments of the present invention, Figure 1 to Figure 2 As shown, the connection seat 200 includes: a first connection portion 210 and a second connection portion 220. The first connection portion 210 cooperates with the slideway. The second connection portion 220 and the first connection portion 210 are in an L-shaped structure, and the second connection portion 220 extends in a direction away from the mounting seat 100. The second connection portion 220 is connected to the guide plate 20 through a butterfly screw 221.

[0059] That is to say, by providing the first connection part 210 and the second connection part 220 in an L-shaped structure, on the one hand, the first connection part 210 can be easily moved up and down along the slide in the vertical direction, and the adjustment process is smooth and without resistance. In combination with the adjustment bolt, it can be fine-tuned according to the height requirements of the guide plate 20 to obtain the best adjustment effect. On the other hand, the second connection part 220 extends in a direction away from the mounting seat 100 and is connected to the guide plate 20 through the butterfly screw 221, ensuring the stable fixation between the connection seat 200 and the guide plate 20. In addition, the butterfly screw 221 is convenient for manual and flexible disassembly and assembly, and other screws can also be used to achieve this fixing effect. The utility model does not limit the type of screws.

[0060] Figure 3 A schematic diagram showing the connection of the guide plate to the regulating device in the cutting chamber of the silicon wafer cutting machine according to the embodiment of the utility model.

[0061] According to the second aspect of the present invention, the silicon wafer cutting machine is as follows: Figure 3 As shown, the silicon wafer cutting machine may include: a cutting chamber (not shown), in which a guide plate 20 and an adjusting device 10 for the guide plate 20 of the silicon wafer cutting machine of the first embodiment are arranged, the adjusting device 10 is connected to the guide plate 20, and the adjusting device 10 is used to adjust the height position and horizontal position of the guide plate 20.

[0062] Specifically, the silicon wafer cutting machine of the present application can realize timely and accurate adjustment of the height position of the guide plate 20 through the adjustment device 10, so that the guide plate 20 is located in a suitable position, which can ensure that the guide plate 20 can better guide the flow, and can also reduce the adverse effects caused by the shaking of the guide plate 20. It can also effectively avoid insufficient or excessive local cooling in the cutting area, effectively reduce the deformation of the silicon wafer due to thermal expansion or contraction differences, meet the water flow guidance under different cutting conditions, and adapt to the cutting needs of silicon wafers of different thicknesses or sizes, thereby avoiding the generation of line marks, total thickness errors, abnormal thin and thick wafers, defective products and other problems.

[0063] In some embodiments of the present invention, there are two groups of adjusting devices 10, and the two groups of adjusting devices 10 are distributed on both sides of the guide plate 20. Each group of adjusting devices 10 may include one or more adjusting devices 10. That is, each group of adjusting devices 10 corresponds to one side of the guide plate 20, so as to adjust the horizontal position and height position of both sides of the guide plate 20 one by one, thereby ensuring the stability and consistency of the silicon wafer cutting machine during the cutting process.

[0064] The above is a preferred embodiment of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. An adjusting device for a guide plate of a silicon wafer cutting machine, characterized in that: include: A mounting seat, wherein the mounting seat is provided with a height adjustment component and a level adjustment component, and the level adjustment component is used to adjust the horizontal position of the mounting seat; A connecting seat, the connecting seat is arranged on the mounting seat, the connecting seat is used to be connected to the guide plate of the silicon wafer cutting machine, and the height adjustment component is used to adjust the height position of the connecting seat; Wherein, the horizontal adjustment component comprises: a first screw, a first long hole matching with the first screw is arranged on the mounting seat, the first long hole is arranged in the horizontal direction, and the first screw passes through the first long hole to lock the mounting seat; The height adjustment assembly includes: a screw rod, which is threadedly connected to the connecting seat, the screw rod is arranged in the vertical direction and is axially fixed, and a limiting piece that cooperates with the connecting seat is arranged on the mounting seat. Under the action of the limiting piece, rotating the screw rod can make the connecting seat move up and down along the screw rod.

2. The adjusting device for guide plate of silicon wafer cutting machine according to claim 1, characterized in that: A protruding portion is provided on one side of the mounting seat, and the first long hole is provided on the protruding portion.

3. The adjusting device for guide plate of silicon wafer cutting machine according to claim 2, characterized in that: There are more than two first long holes, which are arranged in sequence up and down. There are more than one first screws, and each of the first long holes corresponds to more than two first screws.

4. The adjusting device for guide plate of silicon wafer cutting machine according to claim 1, characterized in that: The limiting member is a slideway arranged in the vertical direction, the mounting seat is provided with a fixing plate, the fixing plate is provided with a through hole for the screw to pass through, the screw is an adjusting bolt, a nut is provided on the screw, and the head of the screw cooperates with the nut to axially fix the screw relative to the fixing plate.

5. The adjusting device for guide plate of silicon wafer cutting machine according to claim 4, characterized in that: The connecting seat is provided with a second long hole, which is arranged in a vertical direction. The mounting seat is provided with a second screw, which passes through the second long hole to lock the connecting seat on the mounting seat.

6. The adjusting device for guide plate of silicon wafer cutting machine according to claim 5, characterized in that: The connecting seat comprises: A first connecting portion, the first connecting portion cooperates with the slideway; The second connecting part and the first connecting part are in an L-shaped structure, the second connecting part extends in a direction away from the mounting seat, and the second connecting part is connected to the guide plate through a butterfly screw.

7. A silicon wafer cutting machine, characterized in that: include: A cutting chamber, wherein a guide plate and an adjusting device are arranged in the cutting chamber, wherein the adjusting device is the adjusting device of the guide plate of the silicon wafer cutting machine described in any one of claims 1 to 6, wherein the adjusting device is connected to the guide plate, and the adjusting device is used to adjust the height position and horizontal position of the guide plate.

8. The silicon wafer cutting machine according to claim 7, characterized in that: There are two groups of regulating devices, and the two groups of regulating devices are distributed on both sides of the guide plate.

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