Drying device

By designing a drying device including a shell, a hot air supply assembly and a circulation pipeline assembly, the problems of insufficient heat energy supply and high energy consumption in the prior art are solved, and the recycling of drying hot air and rapid drying of silicon wafers are realized, reducing costs and extending the equipment life.

CN222799522UActive Publication Date: 2025-04-25LUOYANG CSI PHOTOVOLTAIC TECH CO LTD +1
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Patent Information

Application Number
CN202421652004.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-12
Publication Date
2025-04-25
Estimated Expiration
2034-07-12

AI Technical Summary

Technical Problem

When the existing drying devices dry silicon wafers, insufficient heat energy supply causes water droplets to still adhere to the surface of the silicon wafers, and the heating components have a short life, high operating costs, and high energy consumption costs.

Method used

A drying device is designed, including a shell, a hot air supply assembly and a circulation pipeline assembly. The drying hot air is recovered and utilized through the circulation pipeline, reducing the power use of the hot air supply assembly, extending its service life, and quickly removing moisture from the silicon wafer through the air shower assembly.

Benefits of technology

The recycling of drying hot air is realized, energy consumption and operating costs are reduced, the service life of the hot air supply module is extended, and the drying efficiency of silicon wafers is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of silicon wafer production equipment, and discloses a drying device. The drying device comprises a shell, a hot air supply assembly and a circulation pipeline assembly. An air shower assembly is arranged in the shell; the hot air supply assembly is arranged on the shell and can heat air flowing through the hot air supply assembly and convey hot air into the shell. The circulating pipeline assembly comprises a circulating pipe, the circulating pipe is provided with an inlet end, a first outlet end and a second outlet end which are communicated with one another, an air draft part is arranged at the inlet end of the circulating pipe, the inlet end of the circulating pipe is communicated with the interior of the shell, the first outlet end of the circulating pipe is communicated with the hot air supply assembly, and the second outlet end of the circulating pipe is communicated with the hot air supply assembly. And the second outlet end of the circulating pipe is communicated with the air shower assembly. According to the utility model, the hot air for drying the silicon wafer can be recycled, and the energy consumption cost is reduced.
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Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer production equipment, in particular to a drying device. Background Art

[0002] At present, a drying device is generally used to dry the silicon wafers that have completed texturing and cleaning.

[0003] In the prior art, a drying device generally includes a shell with an air inlet and an air outlet. A fan and a heating component are provided at the air inlet. The heating component heats the air sucked in by the fan to form hot air, and then sends the hot air to a receiving tank of the drying device. The hot air is used to blow the silicon wafers and the carrier in the receiving tank to dry the silicon wafers. The airflow that has blown through the silicon wafers is discharged through the air outlet.

[0004] In the above drying device, if the silicon wafer wants to achieve the ideal drying effect, the heating component needs to work continuously at high power to continuously supply heat energy. If the heat energy supply is insufficient, water droplets will still adhere to the surface of the silicon wafer after discharge.

[0005] However, if the heating element continues to work at high power, the life of the heating element will be shortened and the operating cost of the drying device will increase. In addition, the hot air generated by the heating element after drying the silicon wafer is not recycled, resulting in high energy consumption costs. Utility Model Content

[0006] The utility model aims to provide a drying device, which can recycle the hot air used for drying silicon wafers, ensure the service life of the hot air supply component, and reduce energy consumption cost and operation cost.

[0007] To achieve this purpose, the utility model adopts the following technical solutions:

[0008] Drying device, comprising:

[0009] A shell, wherein an air shower assembly is arranged in the shell;

[0010] A hot air delivery component is disposed in the shell and is capable of heating the gas flowing through the hot air delivery component and delivering hot air into the shell;

[0011] The circulation pipeline assembly includes a circulation pipe, the circulation pipe having an inlet end, a first outlet end and a second outlet end which are interconnected, an exhaust piece is provided at the inlet end of the circulation pipe, the inlet end of the circulation pipe is connected to the interior of the shell, the first outlet end of the circulation pipe is connected to the hot air supply assembly, and the second outlet end of the circulation pipe is connected to the air shower assembly.

[0012] Optionally, the air shower assembly is located at the top of the shell, the hot air supply assembly is located at the bottom of the shell, and the inlet end of the circulation pipe is connected to the side of the shell.

[0013] Optionally, the air shower assembly includes:

[0014] A pre-air shower component is arranged on the top of the shell;

[0015] The air shower component is arranged on the top of the shell, and the hot air supply component is located at the bottom of the shell and is arranged opposite to the air shower component.

[0016] Optionally, the drying device further comprises a conveying member, wherein the conveying member is disposed in the shell and is located between the air shower assembly and the hot air supply assembly.

[0017] Optionally, the drying device further comprises a drainage assembly, an inlet end of the drainage assembly is connected to the bottom of the shell.

[0018] Optionally, a slope is provided at the bottom of the shell, and the inlet end of the drainage component is arranged at the lowest point of the slope.

[0019] Optionally, the circulation pipe comprises:

[0020] A main pipe, the inlet end of which is in communication with the interior of the shell;

[0021] a first shunt pipe, one end of which is connected to the outlet end of the main pipe, and the other end of the first shunt pipe is the first outlet end;

[0022] One end of the second shunt pipe is connected to the outlet end of the main pipe, and the other end of the second shunt pipe is the second outlet end.

[0023] Optionally, the exhaust member is provided on the main pipe.

[0024] Optionally, a dehumidification component is provided on the main pipe.

[0025] Optionally, a plurality of third diversion pipes are connected to the second outlet end, and the outlet end of each of the third diversion pipes is connected to a corresponding hot air supply component.

[0026] Beneficial effects of the utility model:

[0027] When the drying device proposed by the utility model is working, the exhaust part works, so that the gas in the shell circulates. The gas in the shell passes through the circulation pipe, and a part of the gas flows from the first outlet end of the circulation pipe to the hot air supply component. The hot air supply component heats the gas in this part, and the heated gas forms hot air and enters the shell to dry the silicon wafers in the shell; the other part of the gas flows from the second outlet end of the circulation pipe to the air shower component, and the air shower component can blow the silicon wafers to be dried in the shell to blow most of the water attached to the silicon wafers away from the silicon wafers. In this way, while the drying hot air is recycled, the silicon wafers can be dried quickly, reducing energy consumption costs. In the initial stage of drying, the hot air supply component works at a relatively high power. When the temperature in the shell is relatively high, the hot air supply component can reduce the power or even stop working, thereby ensuring the life of the hot air supply component. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0029] Figure 1 It is a structural schematic diagram of the drying device provided in an embodiment of the utility model, when the material to be dried is located below the pre-air shower element;

[0030] Figure 2 It is a structural schematic diagram of the drying device provided by the embodiment of the utility model, when the material to be dried is located under the air shower;

[0031] Figure 3 It is a side view of the housing provided by the embodiment of the utility model.

[0032] In the figure:

[0033] 1. Shell;

[0034] 2. Air shower assembly; 21. Pre-air shower component; 22. Air shower component;

[0035] 3. Hot air supply component;

[0036] 41. circulation pipe; 411. main pipe; 412. first shunt pipe; 413. second shunt pipe; 414. third shunt pipe; 42. exhaust element; 43. dehumidification element;

[0037] 5. Conveyor parts;

[0038] 6. Drainage components;

[0039] 7. Connecting parts; 71. Handle. DETAILED DESCRIPTION

[0040] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0041] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0043] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0044] See also Figure 1-Figure 3 This embodiment provides a drying device that can recycle hot air used to dry materials and reduce energy consumption costs.

[0045] Optionally, the material may be silicon wafers, and the silicon wafers may be placed on a flower basket, and the flower basket may be placed in a drying device to dry the silicon wafers.

[0046] Specifically, the drying device includes a shell 1, a hot air supply component 3 and a circulation pipeline component.

[0047] An air shower assembly 2 is arranged in the housing 1 .

[0048] The hot air supply component 3 is disposed in the housing 1 , and can heat the gas flowing through the hot air supply component 3 and supply hot air into the housing 1 .

[0049] The circulation pipeline assembly includes a circulation pipe 41, which has an inlet end, a first outlet end and a second outlet end that are interconnected. An exhaust component 42 is provided at the inlet end of the circulation pipe 41. The inlet end of the circulation pipe 41 is connected to the interior of the shell 1, the first outlet end of the circulation pipe 41 is connected to the hot air supply assembly 3, and the second outlet end of the circulation pipe 41 is connected to the air shower assembly 2.

[0050] The drying device provided in this embodiment can dry the silicon wafers in the shell 1. When working, the exhaust member 42 works to make the gas in the shell 1 circulate. The gas in the shell 1 passes through the circulation pipe 41, and a part of the gas flows from the first outlet end of the circulation pipe 41 to the hot air supply component 3. The hot air supply component 3 heats the gas in this part, and the heated gas forms hot air and enters the shell 1 to dry the silicon wafers in the shell 1; the other part of the gas flows from the second outlet end of the circulation pipe 41 to the air shower component 2, and the air shower component 2 can blow the silicon wafers to be dried in the shell 1, and blow most of the water attached to the silicon wafers away from the silicon wafers.

[0051] With this arrangement, the hot drying air can be recycled and the silicon wafers can be dried quickly, thus reducing energy consumption costs.

[0052] Specifically, the circulation pipe 41 includes a main pipe 411 , a first branch pipe 412 and a second branch pipe 413 .

[0053] The inlet end of the main pipe 411 is communicated with the interior of the shell 1 .

[0054] One end of the first shunt pipe 412 is connected to the outlet end of the main pipe 411 , and the other end of the first shunt pipe 412 is a first outlet end.

[0055] One end of the second diverter pipe 413 is connected to the outlet end of the main pipe 411 , and the other end of the second diverter pipe 413 is a second outlet end.

[0056] Furthermore, an air suction member 42 is provided on the main pipe 411 , and when the air suction member 42 is in operation, the gas in the shell 1 can be circulated through the circulation pipe 41 .

[0057] Furthermore, since the drying hot air carries a large amount of water molecules after drying the silicon wafers, a dehumidification component 43 is provided on the main pipe 411. The dehumidification component 43 dehumidifies the drying hot air carrying a large amount of water molecules entering the main pipe 411, so that the humidity of the gas entering the shell 1 again after passing through the first branch pipe 412 and the second branch pipe 413 is reduced, thereby ensuring the drying effect on the silicon wafers.

[0058] Preferably, the dehumidification element 43 is located at the upstream portion of the air suction element 42 to prevent the air flow with excessive humidity from damaging the components of the air suction element 42 when passing through the air suction element 42 .

[0059] Specifically, the drying device further includes a drainage component 6 , the inlet end of which is communicated with the bottom of the shell 1 , for draining the liquid accumulated at the bottom of the shell 1 .

[0060] The liquid blown off by the air shower assembly 2 generally drips onto the bottom of the housing 1 .

[0061] If more liquid is stored at the bottom of the housing 1, the presence of the liquid will affect the drying effect, and the liquid will corrode the bottom plate of the housing 1, causing irreversible damage to the bottom plate of the housing 1. By providing the drainage component 6, the liquid dripping on the bottom plate of the housing 1 can be quickly drained away.

[0062] Preferably, in order to achieve rapid drainage of the liquid accumulated at the bottom of the housing 1 , a slope is provided at the bottom of the housing 1 , and the inlet end of the drainage component 6 is arranged at the lowest point of the slope.

[0063] Further, see Figure 3 Two slopes are provided at the bottom of the shell 1, and the two slopes form a V-shaped groove, and the inlet end of the drainage component 6 is connected to the lowest point of the V-shaped groove.

[0064] Furthermore, the inlet end of the drainage component 6 is communicated with the lowest point of the V-shaped groove.

[0065] Furthermore, the water outlet of the dehumidifying component 43 is connected to the drainage component 6 .

[0066] Optionally, the dehumidifying element 43 is a dehumidifier, and the water tank of the dehumidifier is connected to the drainage component 6. When the dehumidifier is working, the separated water is discharged to the drainage component 6 through the water tank.

[0067] Specifically, the drainage component 6 is a drainage pipe.

[0068] Furthermore, a plurality of third diversion pipes 414 are connected to the second outlet end, and the outlet end of each third diversion pipe 414 is correspondingly connected to a hot air supply component 3 .

[0069] The provision of several hot air supply components 3 can improve the heating efficiency and thus improve the drying efficiency.

[0070] Specifically, the hot air supply component 3 includes a heating element and a fan. The fan enables the rapid passage of airflow, and the heating element heats the airflow.

[0071] Optionally, the hot air supply component 3 is arranged inside the shell 1.

[0072] Specifically, in this embodiment, the air shower assembly 2 is located at the top of the shell 1 , the hot air supply assembly 3 is located at the bottom of the shell 1 , and the inlet end of the circulation pipe 41 is connected to the side of the shell 1 .

[0073] In this arrangement, the silicon wafer to be dried is located in the shell 1, and the air shower component 2 blows air from top to bottom. Under the action of the blowing and the gravity of the liquid, most of the liquid on the silicon wafer drips to the bottom of the shell 1 and is discharged from the drainage component 6. The drying hot air blown out by the hot air component 3 dries the silicon wafer from bottom to top.

[0074] Furthermore, in order to prevent the liquid blown off by the air shower assembly 2 from affecting the operation of the hot air supply assembly 3 , in this embodiment, the air shower assembly 2 includes a pre-air shower component 21 and an air shower component 22 .

[0075] The pre-air shower part 21 is arranged on the top of the housing 1. The pre-air shower part 21 comprises a pre-air shower pipe, and a pre-air shower blowing port is arranged on the pre-air shower pipe.

[0076] The air shower 22 is arranged at the top of the housing 1, and the hot air supply assembly 3 is located at the bottom of the housing 1 and arranged opposite to the air shower 22. The air shower 22 includes an air shower pipe, and an air shower blowing port is arranged on the air shower pipe.

[0077] The hot air supply component 3 and the pre-air shower component 21 are staggered.

[0078] When the silicon wafer first enters the shell 1, it is placed under the pre-air shower 21, and the pre-air shower 21 blows air from top to bottom. Under the action of the blowing and liquid gravity, most of the liquid on the silicon wafer drips to the bottom of the shell 1 and is drained from the drainage component 6.

[0079] The silicon wafer is then moved to the bottom of the air shower 22. At this time, most of the liquid on the silicon wafer has left the silicon wafer. Under the action of the air shower 22, a part of the liquid remaining on the silicon wafer is blown away from the silicon wafer, and the other part of the liquid remaining on the silicon wafer is also left from the silicon wafer under the action of the drying hot air blown out by the hot air supply component 3.

[0080] Furthermore, in order to achieve position switching of the silicon wafer in the housing 1 , the drying device further includes a conveying member 5 , which is disposed in the housing 1 and located between the air shower assembly 2 and the hot air supply assembly 3 .

[0081] Optionally, the conveying member 5 may be a conveyor belt.

[0082] Exemplarily, the working process of the drying device provided in this embodiment is as follows:

[0083] Place the silicon wafers to be dried on a basket, and place the basket on the conveyor 5 so that the basket is located below the pre-air shower 21;

[0084] The air exhaust part 42 is started, so that the pre-air shower part 21 blows air to the silicon wafers on the flower basket, so that most of the liquid on the silicon wafers can drip to the bottom of the housing 1;

[0085] Then, the conveyor 5 transfers the flower basket to the bottom of the air shower 22 , and the air shower 22 blows air to the silicon wafers on the flower basket. The hot air blown by the hot air delivery assembly 3 dries the silicon wafers on the flower basket.

[0086] During operation of the drying device, the gas in the shell 1 flows to the first branch pipe 412 and the second branch pipe 413 through the main pipe 411 and then enters the shell 1 again, thereby realizing the recycling of the drying hot air in the shell 1.

[0087] It is understandable that a switchable door structure is provided on the housing 1. When the door structure is opened, the silicon wafers to be dried can be placed on the conveyor 5, and the silicon wafers that have been dried can also be taken out. During the drying process, the door structure is always in a closed state.

[0088] Optionally, when the door structure is in a closed state, the door structure and the shell 1 are sealed to ensure that the gas in the shell 1 can fully participate in the circulation.

[0089] Specifically, the door structure is located at the side of the housing 1 .

[0090] Furthermore, in order to better control the drying process, a temperature sensor is provided in the housing 1 .

[0091] When the temperature sensor detects that the temperature in the housing 1 reaches the set temperature, the heating element of the hot air supply component 3 stops working to reduce energy consumption. When the temperature sensor detects that the temperature in the housing 1 is lower than the set temperature, the heating element of the hot air supply component 3 starts heating.

[0092] During the drying process, the silicon wafer may generate fragments and fall into the housing 1. Since there are many dead corners inside the housing 1, it is difficult to clean the fallen fragments.

[0093] In order to solve the above problem, a receiving member 7 is provided below the conveying member 5. The receiving member 7 can be slidably disposed in the housing 1 to receive the fragments dropped from the flower basket during the drying process.

[0094] The receiving member 7 is provided with a handle 71, and the operator can pull the receiving member 7 out of the housing 1 by pulling the handle, so as to clean up the fallen debris in time.

[0095] Optionally, the receiving member 7 may be a filter.

[0096] By providing the receiving member 7, it is convenient to clean up the fallen debris in time, and avoid the debris from hitting the normal silicon wafer with the operation of the fan, causing the silicon wafer to have broken edges and gaps, or even more debris. It can also prevent the debris from getting stuck in the motor of the running fan, which will affect the operation of the drying device and reduce the service life of the drying device.

[0097] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. Drying device, characterized in that: include: A shell (1), wherein an air shower assembly (2) is arranged in the shell (1); A hot air supply component (3) is arranged on the shell (1) and is capable of heating the gas flowing through the hot air supply component (3) and supplying hot air into the shell (1); A circulation pipeline assembly comprises a circulation pipe (41), wherein the circulation pipe (41) has an inlet end, a first outlet end and a second outlet end which are interconnected, an air exhaust component (42) is provided at the inlet end of the circulation pipe (41), the inlet end of the circulation pipe (41) is connected to the interior of the shell (1), the first outlet end of the circulation pipe (41) is connected to the hot air supply assembly (3), and the second outlet end of the circulation pipe (41) is connected to the air shower assembly (2).

2. The drying device according to claim 1, characterized in that: The air shower assembly (2) is located at the top of the shell (1), the hot air supply assembly (3) is located at the bottom of the shell (1), and the inlet end of the circulation pipe (41) is connected to the side of the shell (1).

3. The drying device according to claim 1, characterized in that: The air shower assembly (2) comprises: A pre-air shower element (21) is arranged on the top of the housing (1); The air shower component (22) is arranged at the top of the shell (1), and the hot air supply component (3) is located at the bottom of the shell (1) and is arranged opposite to the air shower component (22).

4. The drying device according to claim 3, characterized in that: The drying device further comprises a conveying member (5), wherein the conveying member (5) is arranged in the shell (1), and the conveying member (5) is located between the air shower assembly (2) and the hot air supply assembly (3).

5. The drying device according to claim 1, characterized in that: The drying device further comprises a drainage component (6), the inlet end of the drainage component (6) being in communication with the bottom of the shell (1).

6. The drying device according to claim 5, characterized in that: The bottom of the shell (1) is provided with a slope, and the inlet end of the drainage component (6) is arranged at the lowest point of the slope.

7. The drying device according to any one of claims 1 to 6, characterized in that: The circulation pipe (41) comprises: A main pipe (411), the inlet end of the main pipe (411) being in communication with the interior of the shell (1); A first shunt pipe (412), one end of which is connected to the outlet end of the main pipe (411), and the other end of the first shunt pipe (412) is the first outlet end; One end of the second shunt pipe (413) is connected to the outlet end of the main pipe (411), and the other end of the second shunt pipe (413) is the second outlet end.

8. The drying device according to claim 7, characterized in that: The main pipe (411) is provided with the air suction member (42).

9. The drying device according to claim 7, characterized in that: The main pipe (411) is provided with a dehumidifying component (43).

10. The drying device according to claim 7, characterized in that: A plurality of third diversion pipes (414) are connected to the second outlet end, and the outlet end of each of the third diversion pipes (414) is connected to a corresponding hot air supply component (3).