Multi-channel temperature monitor

Abstract

The utility model discloses a multichannel temperature monitor which comprises an MCU, an LORA module, a screen module, a storage module, a temperature sensor module and a clock module. The LORA module is in signal connection with the MCU through the USART communication module, and the multi-channel temperature monitor is networked with the ESD system through the LORA module so as to realize remote monitoring; the screen module is in signal connection with the MCU through the USART communication module; the storage module can record the temperature state when the LORA module is offline through IIC bus programming and read offline data through the ESD system when the LORA module is suddenly disconnected from the network and after the LORA module is connected to the network again, and the storage module establishes signal connection with the MCU through the IIC communication module; and the temperature sensor module is in signal connection with the MCU through the RS485 communication module. According to the utility model, the temperature of 10 paths can be monitored in real time, so that the production efficiency and quality are improved.

Description

Technical Field

[0001] The utility model relates to temperature monitoring equipment, in particular to a multi-channel temperature monitor. Background Art

[0002] Industrial Environment Monitoring In industrial environments such as factories, warehouses, and production lines, temperature monitors can be used to monitor the temperature of equipment, machines, and processes. It can provide real-time temperature data and alarm reminders to prevent production problems caused by overheating or overcooling.

[0003] Ordinary temperature monitors can only monitor one place. Multiple places require multiple monitors, which increases the equipment cost and space occupied. Networking multiple devices to form a monitoring system also brings a lot of trouble.

[0004] In view of this, it is necessary to improve the existing temperature monitor. Utility Model Content

[0005] In view of the shortcomings of the prior art, the technical problem to be solved by the utility model is to provide a multi-channel temperature monitor. The purpose of designing the multi-channel temperature monitor is to enable one temperature monitor to monitor multiple different places at the same time, thereby saving costs.

[0006] In order to solve the above technical problems, the utility model is implemented by the following scheme: A multi-channel temperature monitor of the utility model includes an MCU and also includes:

[0007] The LORA module establishes a signal connection with the MCU through the USART communication module, and the multi-channel temperature monitor is connected to the ESD system through the LORA module to achieve remote monitoring;

[0008] The screen module establishes a signal connection with the MCU through the USART communication module;

[0009] A storage module that can record the temperature state of the LORA module when it is offline through IIC bus programming and read offline data through the ESD system when the LORA module suddenly loses the network and when the LORA module is reconnected to the network, and the storage module establishes a signal connection with the MCU through the IIC communication module;

[0010] The temperature sensor module establishes a signal connection with the MCU via the RS485 communication module;

[0011] The clock module establishes a signal connection with the MCU through the SPI communication module.

[0012] Furthermore, the MCU is an STMicroelectronics single chip microcomputer, which has a PA3_RO port, a PA2_DI port, multiple PA pins, multiple PB pins, multiple PC pins, multiple PD pins and multiple PE pins.

[0013] Furthermore, the temperature sensor module and the MCU establish a signal connection through a ten-channel RS485 circuit.

[0014] Furthermore, any RS485 circuit includes an RS485 chip, 7 resistors, and 2 capacitors;

[0015] Pin 1 RO, pin 2 RE#, pin 3 DE, and pin 4 DI of the RS485 chip are respectively connected to the first end of the first resistor, the first end of the second resistor, the first end of the third resistor, and the first end of the fourth resistor;

[0016] The second end of the first resistor, the second end of the second resistor, the second end of the third resistor, and the second end of the fourth resistor are connected to each other and to the 8-pin VCC of the RS485 chip, and the 8-pin VCC of the RS485 chip is connected to the first voltage;

[0017] The 5-pin GND of the RS485 chip is grounded

[0018] The 6-pin A of the RS485 chip is respectively connected to the 1st end of the fifth resistor and the 1st end of the sixth resistor, the 2nd end of the fifth resistor is connected to the 7-pin B of the RS485 chip and the 1st end of the seventh resistor, the 2nd end of the seventh resistor is respectively connected to the 2nd end of the first capacitor and the 2nd end of the second capacitor, the 1st end of the first capacitor and the 1st end of the second capacitor are connected to the 8-pin VCC of the RS485 chip after being mutually connected;

[0019] A circuit node between the second end of the first capacitor and the second end of the second capacitor is grounded;

[0020] The second end of the sixth resistor is connected to the 8-pin VCC of the RS485 chip.

[0021] Furthermore, the first voltage is +5V.

[0022] Furthermore, in the ten-way RS485 circuit, the RO pin of each RS485 chip is connected to the PA3_RO port of the MCU, and the DI pin of each RS485 chip is connected to the PA2_DI port of the MCU;

[0023] The 2nd pin RE# of each RS485 chip is connected one-to-one to the multiple PB pins of the MCU;

[0024] The 3-pin DE of each RS485 chip is connected one-to-one to the multiple PB pins of the MCU;

[0025] The 2nd pin RE# of each RS485 chip and the 3rd pin DE of each RS485 chip correspond to different PB pins.

[0026] Compared with the prior art, the beneficial effects of the utility model are as follows: The purpose of the utility model is to provide a multi-channel temperature monitoring system that can achieve high efficiency and high stability, and can monitor 10 channels of temperature in real time with the ESD system, and simultaneously monitor and record the temperature of multiple key devices or areas to ensure that they operate within a suitable temperature range, thereby improving production efficiency and quality. The use of a ten-channel temperature monitor can detect temperature anomalies in a timely manner, such as excessively high or low temperatures, thereby triggering an alarm to ensure the safety of the working environment and personnel. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a principle block diagram of the multi-channel temperature monitor of the utility model.

[0028] Figure 2 This is the MCU circuit diagram of the utility model.

[0029] Figure 3 for Figure 2 Enlarged diagram of the upper circuit.

[0030] Figure 4 for Figure 2 An enlarged view of the lower circuit.

[0031] Figure 5 This is the circuit diagram of 5 groups of CN interfaces of the utility model.

[0032] Figure 6 This is the first channel RS485 circuit diagram of the utility model.

[0033] Figure 7 This is the second channel RS485 circuit diagram of the utility model.

[0034] Figure 8 This is the third channel RS485 circuit diagram of the utility model.

[0035] Fig. 9 This is the fourth channel RS485 circuit diagram of the utility model.

[0036] Fig.10 This is the fifth channel RS485 circuit diagram of the utility model.

[0037] Fig.11 This is the sixth channel RS485 circuit diagram of the utility model.

[0038] Fig.12 This is the seventh channel RS485 circuit diagram of the utility model.

[0039] Fig.13 This is the eighth channel RS485 circuit diagram of the utility model.

[0040] Fig.14 This is the ninth channel RS485 circuit diagram of the utility model.

[0041] Fig.15 This is the tenth channel RS485 circuit diagram of the utility model.

[0042] Fig.16 This is the circuit diagram of the wireless module of the utility model.

[0043] Fig.17 This is the circuit diagram of the clock module of the utility model.

[0044] Fig.18 This is a storage circuit diagram of the utility model.

[0045] Marked in the accompanying drawings: MCU circuit 1. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model, so that the advantages and features of the utility model can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the utility model. In addition, the technical features involved in the different embodiments of the utility model described below can be combined with each other as long as they do not conflict with each other.

[0047] Embodiment 1: The specific structure of the utility model is as follows:

[0048] Please refer to the attached Figure 1-17 The utility model is a multi-channel temperature monitor, including an MCU, wherein the MCU is an STMicroelectronics single-chip microcomputer, which has a PA3_RO port, a PA2_DI port, multiple PA pins, multiple PB pins, multiple PC pins, multiple PD pins and multiple PE pins. Specifically, the utility model MCU is preferably a single-chip microcomputer of the STM32F103VET6 model. Figure 1 As shown, Figure 1 This is the diagram of MCU circuit 1. The 6-pin VBAT of the MCU circuit 1 is connected to two voltage-stabilizing diodes, where the positive pole of the voltage-stabilizing diode D1 is connected to the 3.3V voltage, and the positive pole of the other voltage-stabilizing diode is connected to the battery BAT terminal.

[0049] The multi-channel temperature monitor also includes a LORA module, a screen module, a storage module, a temperature sensor module and a clock module.

[0050] The LORA module establishes a signal connection with the MCU through the USART communication module, and the multi-channel temperature monitor is connected to the ESD system through the LORA module to achieve remote monitoring; the LORA module is a long-distance wireless communication module based on LPWAN, supports the LORAWAN standard protocol, and serial port data transparent two-way communication.

[0051] The screen module establishes a signal connection with the MCU through the USART communication module; the screen module uses a serial port screen, and the communication format between the serial port screen and the MCU is simple, which can greatly improve the product development efficiency. The serial port screen can realize data visualization and intuitively see the temperature changes.

[0052] The storage module records the temperature state of the LORA module when it is offline through IIC bus programming, and reads offline data through the ESD system when the LORA module suddenly loses the network and when the LORA module is reconnected to the network. The storage module establishes a signal connection with the MCU through the IIC communication module. The storage chip model used by the storage module is AT24C512. The storage module can record the temperature state of the LORA module when it is offline through IIC bus programming, and can store 1500 data and device parameter information. When the LORA module suddenly loses the network and when the LORA module is reconnected to the network, the MCU controls the ESD system to read offline data to check whether there is any problem with the monitored device during the network loss period, so as to take corresponding measures. The storage module has a storage circuit, such as Fig.18 As shown, Fig.18 The utility model is a storage circuit diagram.

[0053] The temperature sensor module establishes a signal connection with the MCU through the RS485 communication module. The temperature sensor module uses a Pt100 temperature sensor with a wide measurement range of 200°C~-50°C. Through RS485 communication, it can well resist the interference of signals from other equipment stacks. According to the Pt100 temperature characteristic curve, the slope of the resistance characteristic curve within the normal operating temperature range changes little and is basically linear. The software calibration of the sensor is easier to achieve. The high-temperature resistant silicone wire is selected as the compensation wire material, which can effectively insulate and isolate the thermal resistor from the monitored equipment and provide accurate temperature monitoring results.

[0054] The clock module establishes a signal connection with the MCU through the SPI communication module. The clock module uses the DS1302Z chip. The clock module can accurately calculate the year, month, day, hour, minute, and second, and can calculate leap years. It can effectively compensate until 2100. The operating voltage is in the range of 2.0~5.0V. At 2.0V, the power consumption is less than 300nA. In terms of temperature tolerance, it can withstand -40~85 degrees Celsius, greatly enhancing the working adaptability of the equipment.

[0055] like Figure 2-15As shown, the following is a signal connection established between the temperature sensor module and the MCU through a ten-channel RS485 circuit and a specific circuit structure of the ten-channel RS485 circuit.

[0056] Any RS485 circuit, including RS485 chip, 7 resistors, and 2 capacitors;

[0057] Pin 1 RO, pin 2 RE#, pin 3 DE, and pin 4 DI of the RS485 chip are respectively connected to the first end of the first resistor, the first end of the second resistor, the first end of the third resistor, and the first end of the fourth resistor;

[0058] The second end of the first resistor, the second end of the second resistor, the second end of the third resistor, and the second end of the fourth resistor are connected to each other and to the 8-pin VCC of the RS485 chip. The 8-pin VCC of the RS485 chip is connected to a first voltage, which is +5V.

[0059] The 5-pin GND of the RS485 chip is grounded

[0060] The 6-pin A of the RS485 chip is respectively connected to the 1st end of the fifth resistor and the 1st end of the sixth resistor, the 2nd end of the fifth resistor is connected to the 7-pin B of the RS485 chip and the 1st end of the seventh resistor, the 2nd end of the seventh resistor is respectively connected to the 2nd end of the first capacitor and the 2nd end of the second capacitor, the 1st end of the first capacitor and the 1st end of the second capacitor are connected to the 8-pin VCC of the RS485 chip after being mutually connected;

[0061] A circuit node between the second end of the first capacitor and the second end of the second capacitor is grounded;

[0062] The second end of the sixth resistor is connected to the 8-pin VCC of the RS485 chip.

[0063] In the ten-way RS485 circuit, the RO pin of each RS485 chip is connected to the PA3_RO port of the MCU, and the DI pin of each RS485 chip is connected to the PA2_DI port of the MCU;

[0064] The 2nd pin RE# of each RS485 chip is connected one-to-one to the multiple PB pins of the MCU;

[0065] The 3-pin DE of each RS485 chip is connected one-to-one to the multiple PB pins of the MCU;

[0066] The 2nd pin RE# of each RS485 chip and the 3rd pin DE of each RS485 chip correspond to different PB pins.

[0067] like Figure 5 As shown, Figure 5This is the circuit diagram of 5 groups of CN interfaces of the utility model. 5 groups of CN interfaces are connected in parallel. Figure 6-15 , is a ten-channel RS485 circuit diagram, and the structure of each RS485 circuit is the same.

[0068] One-to-one connection between U27_A port in CN1 interface and U27_B port in CN1 interface Fig.15 U27_A port of RS485 chip U27 and U27_B port of RS485 chip U27; U3_A port of CN1 interface and U3_B port of CN1 interface are connected to Figure 6 The U3_A port of the RS485 chip U3 and the U3_B port of the RS485 chip U3, the PB13_RE port of the RS485 chip U27 are connected to the PB13_RE port of the MCU, and the PB12_DE port of the RS485 chip U27 is connected to the PB12_DE port of the MCU.

[0069] According to the circuit connection method of CN1 interface above, connect CN2 interface to Figure 7 RS485 chip U19 connection, Figure 8 The RS485 chip U20 is connected.

[0070] According to the circuit connection method of CN1 interface above, connect CN3 interface to Fig.13 RS485 chip U25 connection, Fig.14 The RS485 chip U26 is connected.

[0071] According to the circuit connection method of CN1 interface above, connect CN4 interface to Fig.11 RS485 chip U23 connection, Fig.12 The RS485 chip U24 is connected.

[0072] According to the circuit connection method of CN1 interface above, connect CN5 interface to Fig. 9 RS485 chip U21 connection, Fig.10 The RS485 chip U22 is connected.

[0073] The utility model uses an MCU polling ten-channel RS485 circuit, and cooperates with the idle interrupt function to realize low-delay waiting for communication with the temperature sensor and receiving and sending data.

[0074] In each CN interface of the utility model, the RE pin and the DE# pin are connected to different RS485 chips, thereby realizing the communication between one serial port and multiple temperature sensors. On the left side of the RS485 chip, there is a pull-up resistor of more than 10K, that is, Figure 6-15In the figure, the four resistors on the left are used to stabilize the working state of the RS485 chip and limit the current to prevent the RS485 chip from burning. In the control program, the MCU sets the RE# pin to 1 and the DE pin to 0 to disconnect the communication between the RS485 chip and the MCU to ensure the sending and receiving of data.

[0075] The multi-channel temperature monitor of the utility model is also provided with a buzzer, and the buzzer is connected to the MCU via the PD15_BUZZER port.

[0076] In summary, the purpose of the utility model is to provide a multi-channel temperature monitoring device that can achieve high efficiency and high stability. It can monitor 10 channels of temperature in real time in conjunction with the ESD system, and simultaneously monitor and record the temperature of multiple key devices or areas to ensure that they operate within a suitable temperature range, thereby improving production efficiency and quality. The use of a ten-channel temperature monitor can detect temperature anomalies in a timely manner, such as excessively high or low temperatures, thereby triggering an alarm to ensure the safety of the working environment and personnel.

[0077] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A multi-channel temperature monitor, including an MCU, characterized in that: Also includes: The LORA module establishes a signal connection with the MCU through the USART communication module, and the multi-channel temperature monitor is connected to the ESD system through the LORA module to achieve remote monitoring; The screen module establishes a signal connection with the MCU through the USART communication module; A storage module that can record the temperature state of the LORA module when it is offline through IIC bus programming and read offline data through the ESD system when the LORA module suddenly loses the network and when the LORA module is reconnected to the network, and the storage module establishes a signal connection with the MCU through the IIC communication module; The temperature sensor module establishes a signal connection with the MCU via the RS485 communication module; The clock module establishes a signal connection with the MCU through the SPI communication module.

2. The multi-channel temperature monitor according to claim 1, characterized in that: The MCU used is an STMicroelectronics single-chip microcomputer, which has a PA3_RO port, a PA2_DI port, multiple PA pins, multiple PB pins, multiple PC pins, multiple PD pins and multiple PE pins.

3. The multi-channel temperature monitor according to claim 2, characterized in that: The temperature sensor module and the MCU establish a signal connection via a ten-channel RS485 circuit.

4. The multi-channel temperature monitor according to claim 3, characterized in that: Any RS485 circuit, including RS485 chip, 7 resistors, and 2 capacitors; Pin 1 RO, pin 2 RE#, pin 3 DE, and pin 4 DI of the RS485 chip are respectively connected to the first end of the first resistor, the first end of the second resistor, the first end of the third resistor, and the first end of the fourth resistor; The second end of the first resistor, the second end of the second resistor, the second end of the third resistor, and the second end of the fourth resistor are connected to each other and to the 8-pin VCC of the RS485 chip, and the 8-pin VCC of the RS485 chip is connected to the first voltage; The 5-pin GND of the RS485 chip is grounded The 6-pin A of the RS485 chip is respectively connected to the 1st end of the fifth resistor and the 1st end of the sixth resistor, the 2nd end of the fifth resistor is connected to the 7-pin B of the RS485 chip and the 1st end of the seventh resistor, the 2nd end of the seventh resistor is respectively connected to the 2nd end of the first capacitor and the 2nd end of the second capacitor, the 1st end of the first capacitor and the 1st end of the second capacitor are connected to the 8-pin VCC of the RS485 chip after being mutually connected; A circuit node between the second end of the first capacitor and the second end of the second capacitor is grounded; The second end of the sixth resistor is connected to the 8-pin VCC of the RS485 chip.

5. The multi-channel temperature monitor according to claim 4, characterized in that: The first voltage is +5V.

6. The multi-channel temperature monitor according to claim 5, characterized in that: In the ten-way RS485 circuit, the RO pin of each RS485 chip is connected to the PA3_RO port of the MCU, and the DI pin of each RS485 chip is connected to the PA2_DI port of the MCU; The 2nd pin RE# of each RS485 chip is connected one-to-one to the multiple PB pins of the MCU; The 3-pin DE of each RS485 chip is connected one-to-one to the multiple PB pins of the MCU; The 2nd pin RE# of each RS485 chip and the 3rd pin DE of each RS485 chip correspond to different PB pins.

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