Equipment for detecting strength of gold bonding wire
By designing a bonded wire strength detection device including an electric push rod, a winding roller and a friction plate, the problem of complex detection operations and easy-to-break bonded wire in the prior art is solved, and a more efficient and accurate detection process is achieved.
Patent Information
- Application Number
- CN202421524396.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-01
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-07-01
AI Technical Summary
The existing bonded wire strength detection equipment requires a lot of manual intervention and debugging during the inspection process, and the operation is complicated, and the bonded wire is easily broken due to point contact during the inspection, resulting in inaccurate test results.
A bonded wire strength detection device including a device frame, a first electric push rod, a mounting plate, a tension sensor, a test hook head, a shaft body, a winding roller, a second electric push rod, a push plate, a guide sleeve, a guide rod, an extrusion plate, a fixing plate, a friction plate and a guide roller are designed. Multi-section inspection is carried out through two winding rollers, and the second electric push rod drives the friction plate to fix the bonded alloy wire to avoid point contact, and uses guide rollers to assist in bending and tightening.
The detection operation of bonded wire is simplified, manual intervention is reduced, detection accuracy and efficiency are improved, and the problem of bonded wire being pulled out due to point contact during detection is avoided.
Smart Images

Figure CN222800500U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of gold bonding wire detection, in particular to a gold bonding wire strength detection device. Background Art
[0002] Gold bonding wire is an important material in the microelectronics industry, used as a connecting wire between chips and lead frames. Gold bonding wire is an inner lead material with excellent electrical, thermal, mechanical properties and good stability. Whether it is the connection between the chip and the substrate, or the electrical interconnection between the substrate and the housing, the gold bonding wire is responsible for connecting and conducting signals. In this process, the stability and reliability of the gold bonding wire are particularly critical, so after the gold bonding wire is processed and produced, its strength needs to be tested.
[0003] After searching, the patent document with publication number: CN219694772U discloses a bonding wire strength detection device, including a main body mechanism, a connecting mechanism, an adjusting mechanism and an auxiliary mechanism, wherein the connecting mechanism is located at the upper end of the main body mechanism, the adjusting mechanism is located at the outer end of the connecting mechanism, and the auxiliary mechanism is located at the outer end of the main body mechanism. The adjusting mechanism includes a rotating handle, a screw rod, a movable block, an assembly frame, a limit block and a limit groove, wherein the screw rod is fixedly mounted on the outer end of the rotating handle, the movable block is movably mounted on the outer end of the screw rod, and the assembly frame is fixedly mounted on the outer end of the movable block. The bonding wire strength detection device, by installing the movable block, rotates the rotating handle to adjust the position of the movable block to drive the connecting mechanism, so that after the bonding wire is positioned, it does not need to be repeatedly adjusted to perform convenient detection, which increases the convenience of the strength detection device and the detection effect of the bonding wire.
[0004] Although the above-mentioned device has solved some of the existing shortcomings, when fixing the bonding gold wire, the above-mentioned device needs to operate the adjustment mechanism and the connecting mechanism at both ends in turn. In this process, the bonding gold wire needs to pass through the pull head, and one end is wound on the vertical winding rod, and the other end is squeezed and limited by the downward pressure of the positioning block. The overall operation requires continuous manual intervention and debugging. When there are many test samples, the overall operation process is complicated; and the bonding gold wire is driven up or down by the pull head on the detection component. When the bonding gold wire itself is bent and tightened by tension, point contact is easily formed between the bonding gold wire and the edge of the positioning block, and this part is easily broken first, resulting in inaccurate test results. In addition, when the bonding gold wire on the vertical winding rod is pulled up, the bonding gold wire is easy to slip out of the winding rod due to the upward tension. Therefore, we propose a bonding gold wire strength detection device to solve the above problems. Utility Model Content
[0005] The utility model aims to solve the shortcomings in the prior art and proposes a bonding gold wire strength detection device.
[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0007] A bonding gold wire strength detection device comprises a device frame, a first electric push rod is fixedly connected to the top of the device frame, a mounting plate is fixedly connected to the bottom of the output end of the first electric push rod, a tension sensor is fixedly connected to the outer wall of the mounting plate, a test hook is fixedly connected to the detection end of the tension sensor, two shafts are fixedly connected to the inner wall of the device frame, winding rollers are rotatably sleeved on the outer walls of the two shafts, two fixing plates are fixedly connected to the inside of the device frame, two guide rollers are rotatably connected to the inside of the device frame, and a limiting mechanism is provided on the inner wall of the device frame.
[0008] Preferably, the limiting mechanism includes a pushing plate, a second electric push rod is fixedly connected to the inside of the equipment frame, the top of the output end of the second electric push rod is fixedly connected to the bottom of the pushing plate, four guide sleeves are fixedly connected to the top of the pushing plate, the inner walls of the four guide sleeves are slidably connected to guide rods, the bottom of the guide rod is fixedly connected to the inner wall of the equipment frame, the four guide sleeves are fixedly connected to an extrusion plate in groups of two, and the bonding gold wire is fixed between the four friction plates by arranging the extrusion plate and the fixing plate.
[0009] Preferably, a sliding hole is provided at the top of the device frame, the inner wall of the sliding hole is slidably connected to the outer wall of the output end of the first electric push rod, and the test hook head is driven to move up and down by setting the first electric push rod.
[0010] Preferably, the outer wall of the push plate is provided with four guide holes, the inner walls of the four guide holes are slidably connected to the outer walls of four guide rods respectively, and the guide rod auxiliary sleeve is provided to move up and down with the push plate.
[0011] Preferably, the outer walls of the fixing plate and the extrusion plate are both fixedly connected with friction plates.
[0012] Preferably, the outer wall of the push plate is slidably connected to the inner wall of the equipment frame.
[0013] Compared with the prior art, the advantages of the utility model are:
[0014] This solution includes disposing a first electric push rod, a mounting plate, a tension sensor, a test hook, a shaft, a winding roller, a second electric push rod, a push plate, a guide sleeve, a guide rod, an extrusion plate, a fixed plate, a friction plate and a guide roller. The two winding rollers facilitate sequential detection of multiple sections of the bonding gold wire. The second electric push rod drives multiple friction plates to fix the bonding gold wire at the same time, and there is no need to fix the two ends of the bonding gold wire in sequence. The two guide rollers assist in bending and tightening the bonding gold wire to avoid point contact between the bonding gold wire and the fixed plate. The bonding gold wire to be detected in the next round is directly drawn out from one of the winding rollers. The overall operation is simple. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the technical solution of the present invention, the drawings required for use in the description of the specific implementation methods will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0016] Figure 1 This is a three-dimensional structural schematic diagram of a bonding wire strength detection device proposed by the utility model;
[0017] Figure 2 This is a schematic cross-sectional structure diagram of a bonding wire strength detection device proposed by the utility model;
[0018] Figure 3 A bonding wire strength detection device proposed by the utility model Figure 2 A schematic diagram of the enlarged structure of part A in the figure.
[0019] In the figure: 1. Equipment frame; 2. First electric push rod; 3. Mounting plate; 4. Tension sensor; 5. Test hook; 6. Shaft; 7. Winding roller; 8. Second electric push rod; 9. Push plate; 10. Guide sleeve; 11. Guide rod; 12. Extrusion plate; 13. Fixed plate; 14. Friction plate; 15. Guide roller. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] Depend on Figure 1-Figure 3As shown, it relates to a bonding wire strength detection device, including a device frame 1, a first electric push rod 2 is fixedly connected to the top of the device frame 1, a sliding hole is opened on the top of the device frame 1, the inner wall of the sliding hole is slidably connected to the outer wall of the output end of the first electric push rod 2, the bottom of the output end of the first electric push rod 2 is fixedly connected to a mounting plate 3, the outer wall of the mounting plate 3 is fixedly connected to a tension sensor 4, the tension sensor 4 is usually composed of a force sensitive device and a resistance strain gauge, when the force sensitive device produces elastic deformation under the action of external force, the resistance strain gauge pasted on its surface will also be deformed, after the resistance strain gauge is deformed, its resistance value will change (increase or decrease), and then the resistance change is converted into an electrical signal (voltage or current) through a corresponding measuring circuit, thereby completing the process of converting the external force into an electrical signal, the detection end of the tension sensor 4 is fixedly connected to a test hook 5.
[0022] The inner wall of the equipment frame 1 is fixedly connected to two shafts 6, and the outer walls of the two shafts 6 are rotatably sleeved with winding rollers 7, which are installed and rotated through the shafts 6. The interior of the equipment frame 1 is fixedly connected to two fixed plates 13, and the interior of the equipment frame 1 is rotatably connected to two guide rollers 15 through existing bearings. The two guide rollers 15 are provided to prevent the bonding gold wire from making point contact with the fixed plate 13 after bending.
[0023] The inner wall of the equipment frame 1 is provided with a limiting mechanism, which includes a push plate 9. The outer wall of the push plate 9 is slidably connected to the inner wall of the equipment frame 1. A second electric push rod 8 is fixedly connected to the inside of the equipment frame 1. The top of the output end of the second electric push rod 8 is fixedly connected to the bottom of the push plate 9. The operation of the second electric push rod 8 drives the push plate 9 to move up and down.
[0024] Four guide sleeves 10 are fixedly connected to the top of the push plate 9, and the inner walls of the four guide sleeves 10 are slidably connected to guide rods 11. The bottom of the guide rod 11 is fixedly connected to the inner wall of the equipment frame 1. Four guide holes are opened on the outer wall of the push plate 9. The inner walls of the four guide holes are respectively slidably connected to the outer walls of the four guide rods 11. The guide rods 11 assist the push plate 9 and the guide sleeves 10 to move up and down. The four guide sleeves 10 are fixedly connected to the extrusion plate 12 in groups of two. The outer walls of the fixed plate 13 and the extrusion plate 12 are fixedly connected with friction plates 14. The friction plates 14 increase the friction force of the bonding wire to ensure that it is fixed between the fixed plate 13 and the extrusion plate 12.
[0025] Working principle: When in use, the bonding gold wire is wound onto one of the winding rollers 7 and wound a sufficiently long number of turns, and the other end of the bonding gold wire is wound onto the other winding roller 7. After the subsequent test, the other winding roller 7 collects the bonding gold wire. The two winding rollers 7 are sleeved on the two shafts 6, and the bonding gold wire is placed between the extrusion plate 12 and the fixed plate 13. The second electric push rod 8 drives the push plate 9 to move upward, and the push plate 9 moves upward to drive the four guide sleeves 10 and the two extrusion plates 12 to move upward, and the outer wall of the bonding gold wire is squeezed onto the four friction plates 14, and the bonding gold wire is fixed by the friction plates 14. The first electric push rod 2 drives the mounting plate 3, the tension sensor 4 and the test hook 5 to move downward, and the test hook 5 is hooked On the bonding gold wire, the first electric push rod 2 moves upward to drive the test hook head 5 and the bonding gold wire to move upward. During the movement, the bonding gold wire is bent and tightened, and two guide rollers 15 are used to assist in the tightening process to avoid point contact between the bonding gold wire and the fixed plate 13. As the tension of the test hook head 5 increases as the first electric push rod 2 operates, the force generated by the test hook head 5 is transmitted to the force-sensitive device of the tension sensor 4, causing its elastic deformation, thereby triggering a change in the electrical signal, and measuring the magnitude of the tension; after the bonding gold wire breaks, one of the winding rollers 7 unwinds the bonding gold wire, and the other winding roller 7 winds up the excess bonding gold wire and the bonding gold wire to be tested in the next round, and repeats the above steps to compress and limit the bonding gold wire.
[0026] The standard parts used in the utility model can all be purchased from the market, special-shaped parts can be customized according to the description in the specification and the drawings, the specific connection methods of each part all adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art, the machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here, and the components known to technical personnel in this field, their structures and principles can be known to these technical personnel through technical manuals or through conventional experimental methods.
[0027] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A bonding wire strength detection device, comprising a device frame (1), characterized in that: The top of the device frame (1) is fixedly connected to a first electric push rod (2); the bottom of the output end of the first electric push rod (2) is fixedly connected to a mounting plate (3); the outer wall of the mounting plate (3) is fixedly connected to a tension sensor (4); the detection end of the tension sensor (4) is fixedly connected to a test hook (5); the inner wall of the device frame (1) is fixedly connected to two shafts (6); the outer walls of the two shafts (6) are both rotatably sleeved with winding rollers (7); the interior of the device frame (1) is fixedly connected to two fixing plates (13); the interior of the device frame (1) is rotatably connected to two guide rollers (15); and the inner wall of the device frame (1) is provided with a limiting mechanism.
2. A bonding wire strength detection device according to claim 1, characterized in that: The limiting mechanism comprises a pushing plate (9), a second electric push rod (8) is fixedly connected inside the equipment frame (1), the top of the output end of the second electric push rod (8) is fixedly connected to the bottom of the pushing plate (9), the top of the pushing plate (9) is fixedly connected to four guide sleeves (10), the inner walls of the four guide sleeves (10) are slidably connected to guide rods (11), the bottom of the guide rod (11) is fixedly connected to the inner wall of the equipment frame (1), and the four guide sleeves (10) are fixedly connected to an extrusion plate (12) in pairs.
3. The bonding wire strength detection device according to claim 1, characterized in that: A sliding hole is provided on the top of the device frame (1), and the inner wall of the sliding hole is slidably connected to the outer wall of the output end of the first electric push rod (2).
4. A bonding wire strength detection device according to claim 2, characterized in that: The outer wall of the push plate (9) is provided with four guide holes, and the inner walls of the four guide holes are respectively slidably connected to the outer walls of the four guide rods (11).
5. The bonding wire strength detection device according to claim 2, characterized in that: The outer walls of the fixing plate (13) and the extrusion plate (12) are both fixedly connected with friction plates (14).
6. A bonding wire strength detection device according to claim 2, characterized in that: The outer wall of the push plate (9) is slidably connected to the inner wall of the device frame (1).
Citation Information
Patent Citations
Equipment for detecting strength of gold bonding wire
CN219694772U
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