Testing mother board and tested daughter board interconnection power supply device
By opening daughter board grooves and mother board grooves on the top of the base of the circuit test device, and using the design of clamps and front and reverse threaded rods, the problem of difficulty in fixing test daughter boards of different shapes and sizes in the prior art is solved, and convenient fixing and connection of test daughter boards is achieved, and the flexibility and efficiency of circuit testing is improved.
Patent Information
- Application Number
- CN202421526110.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-01
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-07-01
AI Technical Summary
Existing circuit testing devices are difficult to conveniently fix test daughterboards of different shapes and sizes.
A power supply device for interconnecting the test motherboard and the daughterboard to be tested is designed. By opening a daughterboard groove and a motherboard groove on the top of the base, a clamp and a forward and reverse threaded rod are arranged inside. By rotating the threaded rod, the clamp is driven to approach, clamp the test daughterboard and fix it in the center of the daughterboard groove.
It realizes convenient fixing and connection of test daughterboards of different shapes and sizes, improving the flexibility and efficiency of circuit testing.
Smart Images

Figure CN222800852U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit testing devices, in particular to a power supply device for interconnecting a testing motherboard and a tested daughterboard. Background Art
[0002] Circuit board test system refers to a general term for a type of system that can automatically complete stimulation, measurement, data processing, display or output test results under the control of a computer. Circuit board testing is used to complete the performance test of the PCB under test. It can also be expanded into a diagnostic system based on the analysis of the test results, the diagnosis and location of the fault. The circuit board test system has many characteristics such as high speed, high precision, multi-function, multi-parameter and wide measurement range. Computer technology, microelectronics technology and electronic measurement technology are the three cornerstones of establishing circuit board testing.
[0003] During circuit testing, the test motherboard needs to be fixed before connecting the test daughter board to the test motherboard. However, the test daughter boards have different shapes and sizes, and the existing circuit testing device is not convenient for fixing the test daughter boards of different shapes and sizes. Utility Model Content
[0004] The purpose of this section is to summarize some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract of the specification and the name of the utility model of this application to avoid blurring the purpose of this section, the abstract of the specification and the name of the utility model, and such simplifications or omissions cannot be used to limit the scope of the utility model.
[0005] In view of the above problems and / or the problems existing in the existing power supply device for interconnecting a testing motherboard and a tested daughterboard, the present utility model is proposed.
[0006] Therefore, the purpose of the utility model is to provide a power supply device for interconnecting a test motherboard and a tested daughter board, by opening a daughter board slot on the top of the base, and a mother board slot at the bottom of the daughter board slot, the test motherboard is connected inside the mother board slot, and two clamps are symmetrically arranged inside the daughter board slot, and the two clamps are connected by a positive and negative threaded rod, and the test daughter board is placed inside the daughter board slot and between the two clamps, and the positive and negative threaded rod is rotated to drive the two clamps to approach each other, and the two clamps push the test daughter board to move toward the center of the daughter board slot until the test daughter board is clamped and fixed in the center of the daughter board slot, so as to facilitate the fixation of test daughter boards of different shapes and sizes and connect the test daughter board to the test motherboard.
[0007] In order to solve the above technical problems, according to one aspect of the present invention, the present invention provides the following technical solutions:
[0008] A power supply device for interconnecting a test motherboard and a tested daughterboard, comprising:
[0009] A base, wherein a sub-board slot is provided on the top of the base, a motherboard slot is provided on the bottom of the sub-board slot, a guide slot is provided on the side wall of the sub-board slot, a knob is rotatably connected to the side wall of the base, and a positive and negative threaded rod is installed on the side wall of the knob;
[0010] Clamping plates, the clamping plates are two and symmetrically located inside the sub-plate slot, the side wall of the clamping plate is installed with a guide plate, the other end of the guide plate extends through the guide slot and is installed with a slider, the side wall of the slider is provided with a threaded hole, the positive and negative threaded rod is rotated to pass through the threaded hole;
[0011] A test motherboard is located inside the motherboard slot.
[0012] As a preferred solution of the power supply device for interconnecting a test motherboard and a tested daughterboard described in the utility model, two sloped plates are symmetrically installed on the side wall of the clamping plate, and the slopes of the two sloped plates are opposite to each other.
[0013] As a preferred solution of a power supply device for interconnecting a test motherboard and a tested daughter board described in the utility model, a push plate is slidably connected inside the motherboard slot, a spring is installed on the side wall of the push plate, and the other end of the spring is connected to the inner wall of the motherboard slot.
[0014] As a preferred solution of the power supply device for interconnecting a test motherboard and a tested daughterboard described in the utility model, the length of the motherboard slot is greater than the length of the daughterboard slot, and the width of the motherboard slot is greater than the width of the test motherboard.
[0015] As a preferred solution of the power supply device for interconnecting a test motherboard and a tested sub-board described in the utility model, it also includes a limit assembly, which includes a shell installed on the side wall of the base, a pull plate sliding inside the shell, a second spring installed at the bottom of the pull plate, and a limit plate installed at the top of the pull plate.
[0016] As a preferred solution of the power supply device for interconnecting a test motherboard and a tested daughterboard described in the utility model, the top of the limiting plate extends through the top of the shell and extends to the side wall of the test motherboard.
[0017] Compared with the prior art: a daughter board slot is opened on the top of the base, a mother board slot is opened at the bottom of the daughter board slot, the test mother board is connected inside the mother board slot, two clamps are symmetrically arranged inside the daughter board slot, and the two clamps are connected by a positive and negative threaded rod. By placing the test daughter board inside the daughter board slot and between the two clamps, the positive and negative threaded rod is rotated to drive the two clamps closer to each other, and the two clamps push the test daughter board toward the center of the daughter board slot until the test daughter board is clamped and fixed in the center of the daughter board slot, which is convenient for fixing test daughter boards of different shapes and sizes and connecting the test daughter board to the test mother board. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solution of the implementation of the utility model, the utility model will be described in detail below in combination with the drawings and detailed implementation. Obviously, the drawings described below are only some implementations of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:
[0019] Figure 1 This is an overall structural diagram of a power supply device for interconnecting a test motherboard and a tested daughterboard according to the utility model;
[0020] Figure 2 This is a structural diagram of a base of a power supply device for interconnecting a test motherboard and a tested daughterboard according to the utility model;
[0021] Figure 3 This is a diagram showing the internal structure of a test sub-board of a power supply device for interconnecting a test motherboard with a tested sub-board according to the utility model;
[0022] Figure 4 The utility model is a structural diagram of a limiting component of a power supply device for interconnecting a test motherboard and a tested daughterboard. DETAILED DESCRIPTION
[0023] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.
[0024] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the implementation of the present invention, for the sake of convenience, the cross-sectional diagram showing the device structure will not be partially enlarged according to the general proportion, and the schematic diagram is only an example, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.
[0025] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.
[0026] The utility model provides a power supply device for interconnecting a test motherboard and a tested daughter board, wherein a daughter board slot is provided at the top of a base, a mother board slot is provided at the bottom of the daughter board slot, the test motherboard is connected inside the mother board slot, two clamping plates are symmetrically arranged inside the daughter board slot, the two clamping plates are connected by a positive and negative threaded rod, the test daughter board is placed inside the daughter board slot and between the two clamping plates, the positive and negative threaded rod is rotated to drive the two clamping plates to approach each other, the two clamping plates push the test daughter board to move toward the center of the daughter board slot until the test daughter board is clamped and fixed in the center of the daughter board slot, the test daughter boards of different shapes and sizes can be fixed conveniently, and the test daughter board can be connected to the test motherboard.
[0027] Figure 1-4 The utility model shows a schematic diagram of a structure of a test motherboard and a tested daughterboard interconnection power supply device implementation, see Figure 1-Figure 4 In this embodiment, a power supply device for interconnecting a test motherboard and a tested daughterboard comprises a base 100 , a clamping plate 200 , a test motherboard 300 and a limiting assembly 400 .
[0028] A sub-board slot 110 is provided at the top of the base 100, a motherboard slot 120 is provided at the bottom of the sub-board slot 110, a guide slot 130 is provided on the side wall of the sub-board slot 110, a knob 140 is rotatably connected to the side wall of the base 100, and a positive and negative threaded rod 150 is installed on the side wall of the knob 140.
[0029] There are two clamping plates 200 and they are symmetrically located inside the sub-board slot 110. A guide plate 210 is installed on the side wall of the clamping plate 200. The other end of the guide plate 210 extends through the guide slot 130 and is installed with a slider 220. A threaded hole 230 is opened on the side wall of the slider 220. The positive and negative threaded rod 150 rotates through the threaded hole 230. Two slope plates 240 are symmetrically installed on the side wall of the clamping plate 200. The slopes of the two slope plates 240 are opposite. By placing the test sub-board inside the sub-board slot 110 and on the top of the test mother board 300, the test sub-board is located between the two clamping plates 200, and the knob 140 is rotated to pass through the threaded hole 230. The positive and negative threaded rod 150 is driven to rotate. When the positive and negative threaded rod 150 rotates, the screw structure is used to push the two sliders 220 to drive the two clamps 200 to approach each other. When the two clamps 200 move, they push the test sub-board to move toward the center of the left and right directions inside the sub-board slot 110. At the same time, when the clamps 200 move, the test sub-board is squeezed and moved along the slope surface of the slope plate 240 toward between the two slope plates 240, that is, it moves toward the center of the front and back directions inside the sub-board slot 110, until the two clamps 200 clamp the test sub-board and fix the test sub-board at the center position inside the sub-board slot 110.
[0030] The test motherboard 300 is located inside the motherboard slot 120, and a push plate 160 is slidably connected inside the motherboard slot 120. A spring 170 is installed on the side wall of the push plate 160, and the other end of the spring 170 is connected to the inner wall of the motherboard slot 120. The length of the motherboard slot 120 is greater than the length of the daughter board slot 110, and the width of the motherboard slot 120 is greater than the width of the test motherboard 300. The limiting assembly 400 includes a shell 410 installed on the side wall of the base 100, a pull plate 420 slidably located inside the shell 410, and a second spring 430 installed at the bottom of the pull plate 420 The limit plate 440 is installed on the top of the pull plate 420. The top of the limit plate 440 extends through the top of the shell 410 and extends to the side wall of the test motherboard 300. By pulling the pull plate 420 downward and squeezing the second spring 430, the limit plate 440 slides with the pull plate 420 into the shell 410, and at this time, the test motherboard 300 is pushed to move into the motherboard slot 120. The test motherboard 300 pushes the push plate 160 to move into the sub-board slot 110 and squeezes the spring 170 until the test motherboard 300 is completely received into the motherboard slot 120. The pull plate 420 is released at this time, and the second spring 430 rebounds to push the pull plate 420 and the limit plate 440 to move upward until the limit plate 440 extends to the side wall of the motherboard slot 120, and the test motherboard 300 is limited and fixed inside the motherboard slot 120. When the test motherboard 300 needs to be removed, the pull plate 420 is pulled to drive the limit plate 440 into the shell 410, and the spring 170 rebounds to push the push plate 160 to push the test motherboard 300 out of the opening of the motherboard slot 120. 300 is connected to the CPCI on the bus backplane The measured daughter board is connected to 300 through the FMC inter-board connector. The bus backplane provides 12V power output for 300. The input interface of 300 adopts CPCI connector. The power supply required by 300 is 5V, 1.2V and 3.3V respectively output through three DCDC conversion chips. At the same time, the 3.3V output of the DCDC conversion chip is converted into 1.8V and 2.5V output through two LDO chips. 5.0V is output to the FMC inter-board connector to power the measured daughter board.
[0031] Although the present invention has been described above with reference to the embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention may be used in combination with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is only for the sake of omitting space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
Claims
1. A power supply device for interconnecting a test motherboard and a tested daughterboard, characterized in that: include: A base (100), wherein a sub-board slot (110) is provided at the top of the base (100), a motherboard slot (120) is provided at the bottom of the sub-board slot (110), a guide slot (130) is provided on the side wall of the sub-board slot (110), a knob (140) is rotatably connected to the side wall of the base (100), and a positive and negative threaded rod (150) is installed on the side wall of the knob (140); A clamping plate (200), wherein the clamping plates (200) are two and symmetrically located inside the sub-plate groove (110), a guide plate (210) is installed on the side wall of the clamping plate (200), the other end of the guide plate (210) penetrates through the guide groove (130) and is installed with a slider (220), a threaded hole (230) is opened on the side wall of the slider (220), and the positive and negative threaded rod (150) rotates through the threaded hole (230); The testing motherboard (300) is located inside the motherboard slot (120).
2. A power supply device for interconnecting a test motherboard and a tested daughterboard according to claim 1, characterized in that: Two sloped plates (240) are symmetrically mounted on the side wall of the clamping plate (200), and the slope surfaces of the two sloped plates (240) are opposite to each other.
3. The power supply device for interconnecting a test motherboard and a tested daughterboard according to claim 2, characterized in that: A push plate (160) is slidably connected inside the motherboard slot (120), a spring (170) is installed on the side wall of the push plate (160), and the other end of the spring (170) is connected to the inner wall of the motherboard slot (120).
4. The power supply device for interconnecting a test motherboard and a tested daughterboard according to claim 3, characterized in that: The length of the motherboard slot (120) is greater than the length of the daughterboard slot (110), and the width of the motherboard slot (120) is greater than the width of the test motherboard (300).
5. The power supply device for interconnecting a test motherboard and a tested daughterboard according to claim 4, characterized in that: It also includes a limiting assembly (400), which includes a shell (410) installed on the side wall of the base (100), a pull plate (420) slidably located inside the shell (410), a second spring (430) installed at the bottom of the pull plate (420), and a limiting plate (440) installed on the top of the pull plate (420).
6. The power supply device for interconnecting a testing motherboard and a tested daughterboard according to claim 5, characterized in that: The top of the limiting plate (440) extends through the top of the housing (410) and extends to the side wall of the test motherboard (300).