Memory bank test temperature control mechanism

Abstract

The utility model relates to the technical field of memory bank testing, and provides a memory bank testing temperature control mechanism which comprises a housing, the housing is divided into a plurality of temperature control areas which are in one-to-one correspondence with and matched with testing mainboard slot areas, and a matched heating assembly is arranged in each temperature control area. A plurality of fans capable of switching stations and a plurality of temperature sensors are arranged on the two sides of each temperature control area correspondingly, the heating assembly comprises a heat conduction substrate and a plurality of electric heating pieces arranged on the heat conduction substrate at equal intervals, and cooling fins and heating fins are evenly distributed on the two sides of the heat conduction substrate correspondingly; a space between every two adjacent heating fins is a temperature control grid; separation type temperature control testing is achieved, heat transfer interference is avoided, all the memory banks are located under the same temperature condition, the testing accuracy is guaranteed, the fan can be further used for memory bank normal temperature testing, operation is easy and convenient, and the memory bank testing efficiency is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of memory bar testing, in particular to a memory bar testing temperature control mechanism. Background Art

[0002] In the development and production process of electronic products, memory stick testing is a key link to ensure product quality and stability. Among them, temperature is one of the important factors affecting the operating performance of memory sticks. Therefore, detecting the operating status of memory sticks at different temperatures is an important part of memory testing.

[0003] Currently, most memory stick temperature control tests use an overall heating method, that is, the entire motherboard area where the memory stick is installed is heated through a heating unit to reach a preset test temperature. This heating method ignores the differences in thermal conduction efficiency, heat dissipation conditions, and memory stick layouts at different locations on the motherboard, resulting in significant differences in the temperature environments of different memory sticks during actual testing. This temperature differentiation directly affects the accuracy of the test, making it difficult for the test results to truly reflect the performance of the memory stick under different temperature conditions. In addition, the memory stick also needs to be tested at room temperature, and when doing so, it needs to be cooled with the help of a fan device, which is more troublesome to operate and affects the test efficiency of the memory stick.

[0004] Therefore, the utility model proposes a memory stick test temperature control mechanism to solve the above problem. Utility Model Content

[0005] The embodiment of the utility model aims to provide a memory stick test temperature control mechanism to solve the above-mentioned problem.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A memory stick test temperature control mechanism comprises a cover shell for covering the entire test motherboard, the cover shell is divided into a plurality of temperature control zones corresponding to and adapted to the test motherboard slot areas one by one, each of the temperature control zones is provided with an adapted heating component, and a plurality of fans with switchable working positions and a plurality of temperature sensors are respectively provided on both sides of each temperature control zone, the heating component comprises a heat-conducting substrate and a plurality of electric heating elements equidistantly arranged on the heat-conducting substrate, heat dissipation fins and heating fins are respectively evenly arranged on both sides of the heat-conducting substrate, wherein the number of heating fins is the number of slots in the corresponding slot area plus one, the space between each two adjacent heating fins is a temperature control grid for accommodating memory sticks during testing, and a plurality of ventilation holes are arranged at positions corresponding to each temperature control grid on both sides of each temperature control zone.

[0008] In an optional solution: a bracket with a movable switching position is provided on the cover, and the plurality of fans are arranged on the bracket.

[0009] In an optional solution: the cover is provided with a driving assembly for realizing the movement of the bracket to drive the multiple fans to switch positions.

[0010] Compared with the prior art, the beneficial effects of the embodiments of the present invention are as follows:

[0011] 1. During the temperature control test, the cover will cover the test motherboard with the memory stick to be tested as a whole. At the same time, each temperature control area will separate the corresponding slot area on the test motherboard to avoid heat cross-flow interference. The memory sticks inserted in each slot area are all in the corresponding temperature control grid. One memory stick corresponds to one temperature control grid. The electric heating element generates heat and transfers it to the heating fins to increase the temperature of the temperature control grid. The fan generates airflow through the temperature control area and the temperature control grid to take away the heat and reduce the temperature of the temperature control grid. The temperature sensor senses the temperature value in real time. The separated temperature control test avoids heat transfer interference, so that each memory stick is under the same temperature condition to ensure the accuracy of the test;

[0012] 2. When the memory stick is tested at room temperature (so that the test temperature is lower than the ambient temperature), two test methods are provided. One is that the cover covers the entire test motherboard with the memory stick to be tested, the electric heating element remains closed, and the fan generates airflow to flow through the temperature control area to achieve cooling. The other is that the cover does not cover the entire test motherboard, and the fan corresponding to each temperature control area moves down to the normal temperature station (staggered with the temperature control area), and the entire test motherboard is blown to achieve cooling. The operation is simple and easy to use, and the memory stick test efficiency is effectively improved;

[0013] 3. When the fan moves down to the normal temperature position, it can also be used to blow air to cool the memory stick, accelerating its cooling and reducing cooling time.

[0014] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings herein are incorporated into and constitute a part of the specification to illustrate embodiments consistent with the present application and are used together with the specification to explain the principles of the present application. At the same time, these drawings and text descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application for those skilled in the art by referring to specific embodiments.

[0016] Figure 1 It is a structural schematic diagram of an embodiment of the utility model.

[0017] Figure 2 It is a schematic structural diagram of another angle of an embodiment of the utility model.

[0018] Figure 3This is a schematic diagram of the structure of the embodiment of the utility model after the cover plate is removed.

[0019] Figure 4 It is a schematic diagram of the structure of the cover shell in the embodiment of the utility model.

[0020] Figure 5 It is a schematic diagram of the structure of the heating component in the embodiment of the utility model.

[0021] Figure 6 This is a schematic structural diagram of the heating component from another angle in an embodiment of the utility model.

[0022] Notes on figure numbers: 1-housing, 2-driving assembly, 3-bracket, 4-fan, 5-cover plate, 6-exhaust hole, 7-exhaust port, 8-temperature sensor, 9-temperature control zone, 10-heating assembly, 1001-thermal conductive substrate, 1002-heating fins, 1003-electric heating element, 1004-heating fins, 1005-temperature control grid, 11-ventilation hole. DETAILED DESCRIPTION

[0023] The present application is further described in detail below in conjunction with the accompanying drawings. It is necessary to point out here that the following specific implementation methods are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Technical personnel in this field can make some non-essential improvements and adjustments to the present application based on the above application content.

[0024] See also Figure 1 to Figure 6 , a memory stick test temperature control mechanism, comprising a cover 1 for covering the entire test motherboard, the cover 1 being divided into a plurality of temperature control zones 9 corresponding to and adapted to the test motherboard slot areas, each of the temperature control zones 9 being provided with an adapted heating component 10, and a plurality of fans 4 with switchable positions and a plurality of temperature sensors 8 being provided on both sides of each temperature control zone 9, the heating component 10 comprising a heat-conducting substrate 1001 and a plurality of electric heating elements 1003 equidistantly arranged on the heat-conducting substrate 1001, heat dissipation fins 1002 and heating fins 1004 being evenly arranged on both sides of the heat-conducting substrate 1001, wherein the number of heating fins 1004 is the number of slots in the corresponding slot area plus one, the space between each adjacent two heating fins 1004 being a temperature control grid 1005 for accommodating memory sticks during testing, and a plurality of ventilation holes 11 being arranged at positions corresponding to each temperature control grid 1005 on both sides of each temperature control zone 9.

[0025] During the temperature control test, the fan 4 is in the temperature control position (i.e., the position of the fan 4 is kept relative to the temperature control zone 9), and the cover 1 covers the test motherboard with the memory stick to be tested as a whole. At the same time, each temperature control zone 9 separates the corresponding slot areas on the test motherboard to avoid heat cross-flow interference. The memory sticks inserted in each slot area are all in the corresponding temperature control grid 1005, and one memory stick corresponds to one temperature control grid 1005. The heat is generated by the electric heating element 1003 and transferred to the heating fins 1004, thereby increasing the temperature of the temperature control grid 1005. The airflow generated by the fan 4 flows through the temperature control zone 9 and the temperature control grid 1005 to take away the heat, thereby reducing the temperature of the temperature control grid 1005. The temperature sensor 8 is used in real time to monitor the temperature of the memory stick. Sensing temperature value, separated temperature control test, avoid heat transfer interference, so that each memory stick is in the same temperature condition, to ensure the accuracy of the test, when the memory stick is tested at normal temperature (so that the test temperature is lower than the ambient temperature), the present application provides two testing methods, one is that the cover 1 covers the test motherboard with the memory stick to be tested as a whole, the electric heating element 1003 remains closed, and the fan 4 generates airflow through the temperature control zone 9 to achieve cooling, the other is that the cover 1 does not cover the test motherboard as a whole, and the fan 4 corresponding to each temperature control zone 9 is moved down to the normal temperature station (offset with the temperature control zone 9), and the test motherboard is cooled by blowing air as a whole, which is simple to operate and easy to use, and effectively improves the memory stick test efficiency.

[0026] Furthermore, since the temperature of the memory stick is high after the temperature control test is completed, it needs to cool naturally to a certain temperature before it can be unplugged (or for the next test). When the fan 4 moves down to the normal temperature position, it can also be used to blow air to cool the memory stick to accelerate its cooling and reduce cooling time.

[0027] It should be noted that a certain number of the two rows of ventilation holes 11 corresponding to each temperature control grid 1005 can be selectively blocked according to actual test requirements to control the wind flow in the temperature control grid 1005 and achieve the effect of precise temperature control. In addition, the ventilation holes 11 arranged in rows can also be waist-shaped holes, and the wind flow in the temperature control grid 1005 can also be controlled by blocking a part of the waist-shaped holes.

[0028] See also Figure 1 and Figure 2 In one embodiment of the utility model, the cover shell 1 is provided with a cover plate 5 for covering the protective temperature sensor 8, the cover plate 5 is provided with an exhaust port 7, and the cover plate 5 and each temperature control zone 9 are provided with exhaust holes 6 at a position opposite to each other, and the air flow flowing through the temperature control zone 9 and the temperature control grid 1005 is discharged through the exhaust holes 6 and the exhaust port 7.

[0029] See also Figure 1 and Figure 2In one embodiment of the utility model, the cover shell 1 is provided with a bracket 3 for movable switching positions, and the multiple fans 4 are arranged on the bracket 3. The cover shell 1 is provided with a driving component 2 for realizing the movement of the bracket 3 to drive the multiple fans 4 to switch positions.

[0030] In this embodiment, the drive assembly 2 is used to drive the bracket 3 to move, and then drive the multiple fans 4 to move to achieve work station switching. The drive assembly 2 is composed of components such as a threaded rod, a bearing, and a motor for driving the threaded rod to rotate. The threaded rod and the bracket 3 are threadedly matched, and the movement of the bracket 3 is achieved by rotating the threaded rod. This is a prior art and will not be described in detail here.

[0031] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A memory stick test temperature control mechanism, characterized in that: The invention comprises a cover (1) for covering the entire test mainboard, the cover (1) being divided into a plurality of temperature control zones (9) corresponding to and adapted to the test mainboard slot areas one by one, each of the temperature control zones (9) being provided with an adapted heating component (10), and a plurality of fans (4) with switchable positions and a plurality of temperature sensors (8) being respectively provided on both sides of each temperature control zone (9), the heating component (10) comprising a heat-conducting substrate (1001) and a plurality of electric heaters (1001) equidistantly arranged on the heat-conducting substrate (1001). A heat element (1003), heat dissipation fins (1002) and heating fins (1004) are evenly arranged on both sides of the heat-conducting substrate (1001), wherein the number of heating fins (1004) is the number of slots in the corresponding slot area plus one, and the space between each two adjacent heating fins (1004) is a temperature control grid (1005) for accommodating memory sticks during testing, and a plurality of ventilation holes (11) are arranged at positions corresponding to each temperature control grid (1005) on both sides of each temperature control zone (9).

2. The memory stick test temperature control mechanism according to claim 1, characterized in that: The housing (1) is provided with a bracket (3) that can be moved to switch working positions, and the plurality of fans (4) are all arranged on the bracket (3).

3. The memory stick test temperature control mechanism according to claim 2, characterized in that: The housing (1) is provided with a driving assembly (2) for moving the bracket (3) to drive the plurality of fans (4) to switch working positions.

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