Internal memory radiator
By designing a fully enclosed waterway structure and optimizing the internal layout of the radiator, the problem of poor heat dissipation effect of existing memory radiators under extreme high temperature or high load conditions is solved, achieving more efficient heat dissipation effect and lower energy loss.
Patent Information
- Application Number
- CN202420760158.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-13
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-04-13
AI Technical Summary
The existing memory radiators have limited heat dissipation effects under extreme high temperatures or high loads, and water-cooled pipes are prone to leak water, the radiator structure is bulky, and the long waterway length and complex routes lead to energy loss.
A memory radiator is designed, adopting a fully enclosed water circuit structure, connecting the water supply chamber and the water supply chamber through metal pipes, and a heat dissipation fin and a fan are provided in the heat dissipation shell on the side of the cold head. The heat conduction oil or water is used as the heat dissipation medium to drive the heat dissipation medium in the cold head through the water pump to shorten the length of the water circuit and reduce energy loss.
It effectively reduces the risk of liquid leakage, maintains the balance between the internal and external air pressure of the radiator, shortens the length of the waterway, reduces the energy loss caused by factors such as waterway impact and friction, and improves the heat dissipation efficiency.
Smart Images
Figure CN222801103U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the field of electronic accessories, in particular to a memory radiator. Background Art
[0002] There are many factors that determine computer performance. People usually choose motherboards, CPUs, graphics cards, memory sticks, and solid-state drives with excellent performance to improve computer performance. However, the impact of temperature on computer performance, especially the temperature of the memory stick, is often overlooked. If the heat cannot be effectively dissipated under high temperature conditions, the temperature of the memory stick will continue to rise. This high temperature state will cause the heat generated by electronic components to increase further, thereby reducing the working efficiency of the memory. When the operating temperature of the memory exceeds the normal range, its processing speed will slow down and the response time will increase, which will seriously affect the overall computer performance. The current common memory heat dissipation method is to add heat dissipation armor to the surface of the memory stick - attaching heat dissipation fins to the surface, but this passive heat dissipation technology may still have limited heat dissipation effect under extremely high temperatures or high loads.
[0003] There are the following problems:
[0004] 1. Common water cooling pipes are prone to water leakage at the connection parts after long-term use;
[0005] 2. The radiator adopts a strong structure to cope with the pressure difference between the inside and outside of the radiator, which makes the radiator structure bulky;
[0006] 3. Common radiator water paths are long and complex, resulting in energy loss. Utility Model Content
[0007] (1) Technical issues to be solved
[0008] In view of the deficiencies of the prior art, the purpose of the present invention is to provide a memory heat sink, aiming to solve the technical problems existing in the background technology under the prior art.
[0009] (2) Technical solution
[0010] A memory heat sink comprises a heat dissipation armor clamped on a memory stick, and a frame comprising a cold head and a heat dissipation shell fitted with the heat dissipation armor, heat dissipation fins arranged in the heat dissipation shell, a fan fitted with the heat dissipation shell to blow air to the heat dissipation fins, and a water pump for the flow of heat dissipation medium in the cold head. The heat dissipation shell is arranged on the side of the cold head, and the heat dissipation shell and the cold head are integrally parallel to the XOY plane. The heat dissipation shell comprises a shell wall, wherein at least one pair of the shell walls arranged opposite to each other are respectively provided with an opening one and an opening two, the opening one is connected to the opening two through a metal pipe, and the other sides of the opening one and the opening two connected to the metal pipe are respectively provided with an upper water chamber and a lower water chamber, and a channel is provided at the bottom of the cold head, and the heat dissipation medium can flow among the upper water chamber, the metal pipe, the lower water chamber, and the channel.
[0011] Furthermore, the channel is a groove, and the bottom of the channel is formed by a plate. The side of the plate away from the channel is arranged in close contact with the heat dissipation armor, and the side of the plate facing the channel is provided with heat dissipation fins, and the setting direction of the heat dissipation fins is consistent with the flow direction of the heat dissipation medium.
[0012] Furthermore, the heat dissipation fin height is a, the channel height is b, and a≤b.
[0013] Furthermore, the heat dissipation armor wraps the memory stick through a thermally conductive gasket, each heat dissipation armor is provided with hole one, the plate is provided with hole two, and several heat dissipation armors are arranged in parallel to form a surface mounting position, and the cold head can be fixed on the surface mounting position through hole one and hole two.
[0014] Furthermore, the frame is provided with a plug, the plug is connected to the heat dissipation medium, a through cavity is provided in the middle of the plug, a semi-permeable membrane is provided in the cavity, and the semi-permeable membrane can seal the cross-section formed by the cavity.
[0015] Furthermore, the heat dissipation medium is heat conducting oil.
[0016] Furthermore, the heat dissipation medium is water.
[0017] Furthermore, the frame in the blowing direction of the fan is provided with a through opening, and the wind blown out by the fan can leave from the through opening.
[0018] Furthermore, the upper water chamber, the lower water chamber, the frame and the metal pipe are connected by welding.
[0019] Furthermore, the distance of the heat dissipation medium circulating in the upper water chamber, the metal pipe, the lower water chamber and the channel does not exceed 720 mm.
[0020] (3) Beneficial effects
[0021] Compared with the prior art, the beneficial effects of the utility model are:
[0022] 1. Fully enclosed water channel structure to reduce the risk of leakage;
[0023] 2. Use a semi-permeable membrane structure to maintain the internal and external air pressure of the radiator;
[0024] 3. Shorten the length of the waterway and reduce energy loss caused by factors such as waterway impact and friction. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 : Explosion diagram of the utility model.
[0026] Figure 2 : A partial cross-sectional view of the utility model.
[0027] Figure 3 :The utility model Figure 2 Sectional view of section AA.
[0028] Figure 4 : Schematic diagram of the heat dissipation medium flow direction and heat dissipation fin position of the utility model.
[0029] Figure 5 : Schematic diagram of channel height and heat dissipation fin height of the utility model.
[0030] Figure 6 : The installation diagram of the plate and heat dissipation armor of the utility model.
[0031] Figure 7 : Schematic diagram of the ventilation structure of the plug of the utility model.
[0032] Figure 8 : Frame and fan position structure diagram of the utility model.
[0033] Fig. 9 : Schematic diagram of the weld position of the present invention.
[0034] Fig.10 : Schematic diagram of the medium flow direction of the utility model.
[0035] The markings of the components in the accompanying drawings are as follows:
[0036] 1-memory bar, 2-heat dissipation armor, 21-hole one, 22-thermal gasket, 23-surface mounting position, 3-frame, 31-heat dissipation shell, 311-shell wall, 3111-opening one, 3112-opening two, 32-cold head, 321-channel, 3211-plate, 3212-heat dissipation fin, 3213-hole two, 33-metal pipe, 341-upper water chamber, 342-lower water chamber, 35-through opening, 36-heat dissipation fin two, 4-fan, 5-heat dissipation medium, 6-water pump, 7-heat dissipation fin, 8-plug, 81-cavity, 82-semi-permeable membrane, 9-weld. DETAILED DESCRIPTION
[0037] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.
[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0039] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0041] In order to describe the present invention in more detail and clearly, the following definitions are made: Figure 1 As shown, the X-axis direction is defined as the left-right direction, and the direction indicated by the arrow is right; the Y-axis direction is defined as the front-back direction, and the direction indicated by the arrow is front; the Z-axis direction is defined as the up-down direction, and the direction indicated by the arrow is up, and the XOY plane is formed by the two axes of the X-axis and the Y-axis.
[0042] Please refer to Figure 1-10 ,
[0043] like Figure 1 , Figure 2 , Figure 3 , Figure 4As shown, the utility model provides a memory heat sink, including a heat sink armor 2 and a frame 3 clamped on a memory stick 1, including a cold head 32 fitted with the heat sink armor 2, a heat sink shell 31, heat sink fins 7 arranged in the heat sink shell 31, a fan 4 fitted with the heat sink shell 31 to blow air to the heat sink fins 7, and a water pump 6 for the flow of heat dissipation medium 5 in the cold head 32. The heat sink shell 31 is arranged on the side of the cold head 32, and the heat sink shell 31 and the cold head 32 are integrally parallel to the XOY plane. The heat sink 31 includes a shell wall 31 1, wherein at least one pair of the shell walls 311 disposed opposite to each other are respectively provided with an opening 1 3111 and an opening 2 3112, the opening 1 3111 being connected to the opening 2 3112 through a metal tube 33, the other side of the opening 1 3111 and the opening 2 3112 being connected to the metal tube 33 are respectively provided with an upper water chamber 341 and a lower water chamber 342, the bottom of the cold head 32 is provided with a channel 321, and the heat dissipation medium 5 can flow among the upper water chamber 341, the metal tube 33, the lower water chamber 342, and the channel 321. The memory radiator adopts an integrated structure, with the frame 3 as the main building platform, and the required components are centrally attached to the frame 3, which greatly reduces the volume of the memory radiator, and at the same time limits the heat dissipation medium 5 to flow among the upper water chamber 341, the metal tube 33, the lower water chamber 342, and the channel 321, forming a fully enclosed water channel structure to reduce the risk of leakage. At the same time, the cold head 32 also includes heat dissipation fins 36, which is conducive to accelerating the heat dissipation efficiency. The heat dissipation shell 31 is arranged on the side of the cold head 32. The heat dissipation shell 31 and the cold head 32 are integrated and parallel to the XOY plane to reduce the height of the memory radiator and facilitate installation in the computer case.
[0044] like Figure 3 , Figure 4 As shown, Figure 4 The direction of the middle arrow is the flow direction of the heat dissipation medium 5. The channel 321 is a groove. The bottom of the channel 321 is formed by a plate 3211. The side of the plate 3211 away from the channel 321 is fitted with the heat dissipation armor 2. The side of the plate 3211 facing the channel 321 is provided with a heat dissipation fin 3212. The setting direction of the heat dissipation fin 3212 is consistent with the flow direction of the heat dissipation medium 5. The plate 3211 is fitted on the heat dissipation armor 2 to help absorb the heat on the heat dissipation armor 2. At the same time, the side of the plate 3211 facing the channel 321 is provided with a heat dissipation fin 3212. The heat dissipation fin 3212 increases the heat dissipation area of the plate 3211. When the setting direction of the heat dissipation fin 3212 is consistent with the flow direction of the heat dissipation medium 5, the heat dissipation medium 5 can be ensured to flow quickly, reduce the temperature rise of the heat dissipation medium 5, and quickly flow back to the metal tube 33 to cool down, so as to maintain the memory stick 1 at a lower temperature.
[0045] like Figure 5As shown, the height of the heat dissipating fin 3212 is a, and the height of the channel 321 is b, and a≤b. Only when the height a of the heat dissipating fin 3212 is less than or equal to the height b of the channel 321, the heat dissipating fin 3212 can be arranged in the channel 321, and the plate 3211 can form a sealed waterway with the channel 321, and the heat dissipating medium 5 flowing through the sealed waterway takes away the heat of the heat dissipating fin 3212, thereby accelerating the heat dissipation.
[0046] like Figure 6 As shown, the heat dissipation armor 2 wraps the memory stick 1 through the thermal pad 22, each of the heat dissipation armor 2 is provided with a hole 1 21, the plate 3211 is provided with a hole 2 3213, and a plurality of the heat dissipation armors 2 are arranged in parallel to form a surface mounting position 23, and the cold head 32 can be fixed on the surface mounting position 23 through the hole 1 21 and the hole 2 3213. The thermal pad 22 can better fit the memory stick 1, and can better transfer the heat of the memory stick 1 to the heat dissipation armor 2. Compared with the adhesive connection method, the connection method through the hole 1 21 and the hole 2 3213 lock hole reduces the adhesive interval, which is more conducive to heat transfer. The surface mounting position 23 formed by the parallel arrangement of a plurality of heat dissipation armors 2 facilitates the uniform fitting of the cold head 32.
[0047] like Figure 7 As shown, the frame 3 is provided with a plug 8, the plug 8 is connected with the heat dissipation medium 5, and a cavity 81 is provided through the middle of the plug 8, and a semipermeable membrane 82 is provided in the cavity 81, and the semipermeable membrane 82 can seal the cross section formed by the cavity 81. The cavity 81 of the plug 8 is divided into inner and outer sides by the semipermeable membrane 82, wherein the inner side is in contact with the heat dissipation medium 5, so that the heat dissipation medium 5 can be effectively prevented from flowing out. At the same time, the semipermeable membrane 82 has filtering and selective permeability. When the memory radiator is working, the gas that gradually heats up and expands inside can be discharged to avoid the positive pressure explosion of the memory radiator; after the memory radiator is idle after working, it can absorb external gas to balance the pressure difference between the inside and the outside to avoid the negative pressure explosion of the memory radiator. The heat dissipation medium 5 is heat transfer oil. As a preferred solution, the heat dissipation medium 5 preferably uses heat transfer oil. Compared with the traditional heat dissipation medium 5, the heat transfer oil can work stably at high temperature to avoid the generation of high vapor pressure, and also has better thermal stability and longer service life. The heat dissipation medium 5 is water. As an alternative solution, when economic benefits are important, the heat dissipation medium 5 may also use water, which will not produce carbon deposits and sludge and can be used for a longer time under safe and stable conditions.
[0048] like Figure 8 The arrow direction is the wind direction of the fan, and the frame 3 in the direction of the fan 4 is provided with a through opening 35, and the wind blown by the fan 4 can leave from the through opening 35. Through the design of the through opening 35, the wind blown by the fan 4 can leave along the through opening 35, avoiding the turbulence caused by the frame 3 blocking and slowing down the heat dissipation speed.
[0049] like Fig. 9 As shown, Fig. 9 The cross section of the metal tube 33 and the frame 3 after welding is taken as an example. The upper water chamber 341, the lower water chamber 342, the frame 3, and the metal tube 33 are connected by welding. Compared with the common clamp connection of general radiators, welding has obvious advantages in terms of connection stability, sealing, thermal conductivity, appearance quality, and processing efficiency. At the same time, welding produces a weld 9, which increases the surface area and also increases the speed of heat dissipation. The welding in this embodiment is brazing.
[0050] like Fig.10 The arrow direction is the flow direction of the heat dissipation medium 5, and the heat dissipation medium 5 circulates in the upper water chamber 341, the metal pipe 33, the lower water chamber 342, and the channel 321 for a single circulation distance of no more than 720 mm. Through the waterway formed by the upper water chamber 341, the metal pipe 33, the lower water chamber 342, and the channel 321, the heat dissipation medium 5 circulates in the waterway for a single circulation distance of no more than 720 mm, which greatly shortens the length of the waterway, reduces the energy loss caused by factors such as waterway impact and friction, and keeps the heat dissipation medium 5 at a faster flow rate.
[0051] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.
[0052] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementations that can be understood by those skilled in the art.
Claims
1. A memory heat sink, characterized in that: The invention comprises a heat dissipation armor (2) clamped on a memory stick (1), a frame (3), a cold head (32) fitted with the heat dissipation armor (2), a heat dissipation shell (31), heat dissipation fins (7) arranged in the heat dissipation shell (31), a fan (4) fitted with the heat dissipation shell (31) to blow air to the heat dissipation fins (7), and a water pump (6) for supplying the heat dissipation medium (5) in the cold head (32) to flow, the heat dissipation shell (31) being arranged on the side of the cold head (32), the heat dissipation shell (31) and the cold head (32) being integrally parallel to the XOY plane, the heat dissipation shell (31) comprising a shell wall (311), wherein at least one The shell walls (311) arranged opposite to each other are respectively provided with an opening one (3111) and an opening two (3112); the opening one (3111) is connected to the opening two (3112) via a metal tube (33); an upper water chamber (341) and a lower water chamber (342) are respectively provided on the other side where the opening one (3111) and the opening two (3112) are connected to the metal tube (33); a channel (321) is provided at the bottom of the cold head (32); and the heat dissipation medium (5) can flow among the upper water chamber (341), the metal tube (33), the lower water chamber (342), and the channel (321).
2. A memory heat sink according to claim 1, characterized in that: The channel (321) is a groove, and the bottom of the channel (321) is formed by a plate (3211). The side of the plate (3211) away from the channel (321) is arranged in close contact with the heat dissipation armor (2). The side of the plate (3211) facing the channel (321) is provided with heat dissipation fins (3212), and the arrangement direction of the heat dissipation fins (3212) is consistent with the flow direction of the heat dissipation medium (5).
3. A memory heat sink according to claim 2, characterized in that: The height of the heat dissipation fin (3212) is a, the height of the channel (321) is b, and a≤b.
4. A memory heat sink according to claim 2, characterized in that: The heat dissipation armor (2) wraps the memory stick (1) via a thermally conductive gasket (22); each heat dissipation armor (2) is provided with a first hole (21); the plate (3211) is provided with a second hole (3213); a plurality of heat dissipation armors (2) are arranged in parallel to form a surface mounting position (23); and the cold head (32) can be fixed on the surface mounting position (23) via the first hole (21) and the second hole (3213).
5. The memory heat sink according to claim 1, characterized in that: The frame (3) is provided with a plug (8), the plug (8) is connected to the heat dissipation medium (5), a through cavity (81) is provided in the middle of the plug (8), a semi-permeable membrane (82) is provided in the cavity (81), and the semi-permeable membrane (82) can seal the cross section formed by the cavity (81).
6. A memory heat sink according to claim 5, characterized in that: The heat dissipation medium (5) is heat-conducting oil.
7. The memory heat sink according to claim 5, characterized in that: The heat dissipation medium (5) is water.
8. The memory heat sink according to claim 1, characterized in that: The frame (3) in the blowing direction of the fan (4) is provided with a through opening (35), and the wind blown out by the fan (4) can leave from the through opening (35).
9. The memory heat sink according to claim 1, characterized in that: The upper water chamber (341), the lower water chamber (342), the frame (3), and the metal pipe (33) are connected by welding.
10. The memory heat sink according to claim 1, characterized in that: The distance of one circulation of the heat dissipation medium (5) in the upper water chamber (341), the metal pipe (33), the lower water chamber (342) and the channel (321) does not exceed 720 mm.