Sandwich type water-cooling heat dissipation piece of server

Abstract

The utility model relates to the technical field of water-cooling heat dissipation, in particular to a sandwich type water-cooling heat dissipation piece for a server, which comprises a water-cooling plate, a joint plate mounted at the top of the water-cooling plate and a heat conducting plate mounted at the bottom of the water-cooling plate, a concave flow channel groove is formed in the water-cooling plate, and a top brazing surface is formed at the bottom of the flow channel groove. A bottom brazing face matched with the top brazing face is formed on the top of the heat conduction plate, a protruding brazing rod is formed on the top brazing face, and a brazing groove matched with the brazing rod is formed in the bottom brazing face. When the heat conduction plate and the flow channel groove are brazed, the bottom brazing face and the top brazing face are attached, welding flux located on the brazing rod can be matched with the heat conduction plate and the flow channel groove to be integrally formed in the welding process, and due to the fact that the brazing groove coaxially aligned with the brazing rod is formed, the welding flux can be collected into the brazing groove and cannot overflow out of the brazing groove; and the situation of material leakage is avoided, the stability of the whole structure is guaranteed, the sealing performance can be guaranteed, and meanwhile material leakage can be prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of water cooling and heat dissipation, in particular to a sandwich-type water cooling and heat dissipation component for a server. Background Art

[0002] The water-cooled radiator has a water inlet and an outlet, and there are multiple water channels inside the radiator, which can give full play to the advantages of water cooling and take away more heat. This is the basic principle of the water-cooled radiator, and the water-cooled radiator is composed of a water-cooling block, circulating fluid, a water pump, pipes and a water tank or heat exchanger.

[0003] Among them, the water cooling block is a metal block with water channels inside, made of copper or aluminum. It comes into contact with the CPU to absorb the heat of the CPU and cool the CPU.

[0004] Among them, the patent document with application number 202322824869.5 discloses a water-cooled radiator, including a circuit board, a water-cooled heat dissipation mechanism for dissipating heat therefrom, the water-cooled heat dissipation mechanism including a water-cooled plate body and a water-cooled plate cover, the back of the water-cooled plate body being attached to the circuit board, the water-cooled plate body being connected to the water-cooled plate cover, a water channel being arranged inside the water-cooled plate body, both ends of the water channel being provided with threaded fixing holes, the threaded fixing holes at both ends being respectively connected with a water outlet joint and a water inlet joint. The water-cooled plate body and the water-cooled plate cover of the water-cooled radiator are processed separately, so it is easy to check whether the water channel has defects, and the two are combined into a water-cooled heat dissipation mechanism by stir friction welding, which avoids the sealing instability caused by manual operation, and secondly, compared with ordinary welding, can minimize deformation, and ribs are arranged in the water-cooled plate body to form a flowing water channel, which has a better heat dissipation effect.

[0005] After the existing water channel is formed, water overflow easily occurs at its edge, resulting in a continuous reduction of the water-cooling liquid, which affects the sealing of the water-cooling heat dissipation structure. Summary of the invention

[0006] The utility model aims to provide a server sandwich water cooling heat sink to address the deficiencies of the prior art.

[0007] To achieve the above purpose, the technical solution of the utility model is as follows:

[0008] A server sandwich water-cooled heat sink comprises a water-cooled plate, a joint plate installed on the top of the water-cooled plate, and a heat-conducting plate installed on the bottom of the water-cooled plate. The water-cooled plate is formed with a concave flow channel groove, a top brazing surface is formed at the bottom of the flow channel groove, a bottom brazing surface matched with the top brazing surface is formed at the top of the heat-conducting plate, a raised brazing rod is formed on the top brazing surface, and a brazing groove matched with the brazing rod is formed on the bottom brazing surface.

[0009] Furthermore: an opening is formed at the bottom of the flow channel groove, and a shovel tooth structure embedded in the opening is formed on the top of the heat conducting plate.

[0010] Furthermore: a copper plate baffle with an area smaller than the flow channel is installed in the flow channel, and the side wall of the copper plate baffle and the side wall of the flow channel have a first channel for water cooling liquid to pass through.

[0011] Furthermore: the copper plate baffle is rectangular and is coaxially arranged in the flow channel groove.

[0012] Furthermore, the copper plate baffle is also penetrated by a second channel for cooling liquid to pass through.

[0013] Further: the joint plate is formed with a guide seat that cooperates with the flow channel groove, a flow cavity is formed in the guide seat, the flow cavity is connected to the second channel, and the joint plate is also equipped with a liquid inlet joint and a liquid outlet joint, and the liquid inlet joint is connected to the flow cavity of the guide seat.

[0014] Furthermore: a third channel coaxially aligned with the second channel is formed at the bottom of the flow cavity, and the bottom surface of the guide seat is in contact with the top surface of the copper plate baffle.

[0015] Furthermore: a first buffer groove is formed on the top of the flow groove, the first buffer groove is coaxially formed on the periphery of the flow groove, the flow groove is connected to the first buffer groove and is integrally formed, and a second buffer groove coaxially aligned with the first buffer groove is formed on the bottom surface of the joint plate, and the second buffer groove is connected to the liquid outlet joint.

[0016] Furthermore: the water cooling plate is also formed with a bottom connecting hole, and the joint plate is formed with a top connecting hole coaxially aligned with the bottom connecting hole.

[0017] The beneficial effects of the utility model: when the heat conducting plate and the flow channel are brazed, the bottom brazing surface and the top brazing surface are fitted together, and the solder located in the brazing rod will be integrated with the heat conducting plate and the flow channel during welding. Since a brazing groove coaxially aligned with the brazing rod is provided, the solder will be collected in the brazing groove and will not overflow outside the brazing groove, and material leakage will not occur, thereby ensuring the overall structural stability, ensuring sealing, and preventing material leakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the water-cooled heat sink.

[0019] Figure 2 Schematic diagram of the exploded structure of the water-cooled heat sink.

[0020] Figure 3 This is a schematic diagram of the water-cooled heat sink structure from another perspective of the water-cooled heat sink.

[0021] Figure 4 It is a structural schematic diagram of the connection between the water cooling plate and the heat conducting plate.

[0022] Reference numerals include:

[0023] 1-Water cooling plate,

[0024] 11-flow channel, 12-opening, 13-heat conducting plate, 14-shovel tooth structure, 15-top brazing surface,

[0025] 16- bottom brazing surface, 17- brazing rod, 18- brazing groove,

[0026] 2-Copper plate screen,

[0027] 21-first channel, 22-second channel, 23-connector plate, 24-guide seat, 25-third channel,

[0028] 26-first buffer tank, 27-second buffer tank, 28-liquid inlet connector, 29-liquid outlet connector

[0029] 30-bottom connection hole, 31-top connection hole DETAILED DESCRIPTION

[0030] The utility model is described in detail below with reference to the accompanying drawings.

[0031] like Figure 1-4 As shown, a server sandwich water-cooled heat sink includes a water-cooled plate 1, a joint plate 23 installed on the top of the water-cooled plate 1, and a heat-conducting plate 13 installed on the bottom of the water-cooled plate 1. The water-cooled plate 1 is formed with a concave flow channel 11, and a top brazing surface 15 is formed at the bottom of the flow channel 11. A bottom brazing surface 16 matching the top brazing surface 15 is formed at the top of the heat-conducting plate 13. A protruding brazing rod 17 is formed on the top brazing surface 15, and a brazing groove 18 matching the brazing rod 17 is formed on the bottom brazing surface 16.

[0032] Preferably, the brazing rod 17 is formed in a U-shape on the top brazing surface 15 .

[0033] Preferably, the brazing groove 18 is formed in a U-shaped shape on the bottom brazing surface 16 .

[0034] When the heat conducting plate 13 and the flow channel 11 are brazed, the bottom brazing surface 16 and the top brazing surface 15 are fitted together, and the plane-to-plane welding after the brazing process can increase the plane flatness and sealing connectivity; the solder located at the brazing rod 17 will be integrated with the heat conducting plate 13 and the flow channel 11 during welding, and since a brazing groove 18 coaxially aligned with the brazing rod 17 is provided, the solder will be collected in the brazing groove 18, and the solder will not overflow outside the brazing groove 18, and there will be no material leakage, thereby ensuring the overall structural stability, which can ensure sealing while preventing material leakage.

[0035] An opening 12 is formed at the bottom of the flow channel 11, and a shovel structure 14 embedded in the opening 12 is formed on the top of the heat conducting plate 13. The shovel structure 14 can allow water cooling liquid to flow. When the heat conducting plate 13 conducts heat, the water cooling liquid flows along the shovel structure 14, increasing the contact area with the heat conducting plate 13, which can accelerate the heat dissipation effect.

[0036] A copper plate baffle 2 with an area smaller than that of the flow groove 11 is installed in the flow groove 11, and the side walls of the copper plate baffle 2 and the side walls of the flow groove 11 have a first channel 21 for water-cooling liquid to pass through; the water-cooling liquid entering the flow groove 11 is discharged outwardly through the first channel 21 of the side wall. With the cooperation of the copper plate baffle 2, the water-cooling liquid entering the flow groove 11 will pass through most of the area of ​​the shovel tooth structure 14 and then be discharged outwardly from the first channel 21 of the side wall, so that the area through which the water-cooling liquid flows is increased, the area in contact with the shovel tooth structure 14 is increased, and the heat dissipation effect is further increased.

[0037] Furthermore, the copper plate baffle 2 is rectangular and is coaxially arranged in the flow channel 11; in this embodiment, with the cooperation of the copper plate baffle 2, the water-cooling liquid entering the flow channel 11 will pass through most of the area of ​​the shovel tooth structure 14 and then be discharged outward from the first channel 21 of the side wall. The water-cooling liquid can be discharged outward from the first channels 21 of the four side walls more evenly, and there will be no liquid accumulation in one area, and the heat dissipation effect is more uniform.

[0038] The copper plate baffle 2 is also penetrated by a second channel 22 for cooling water to pass through. After the cooling water enters the flow channel 11, it enters the scraper tooth structure 14 through the second channel 22 and can fully contact the scraper tooth structure 14 to transfer the heat of the heat conducting plate 13 to the outside.

[0039] The joint plate 23 is formed with a guide seat 24 that cooperates with the flow channel groove 11, and a flow cavity is formed in the guide seat 24. After the joint plate 23 is fitted and installed with the water-cooled plate 1, the guide seat 24 will be inserted into the flow channel groove 11, so that the bottom surface of the guide seat 24 is fitted with the top surface of the copper plate baffle 2, and the flow cavity is connected with the second channel 22. The joint plate 23 is also equipped with a liquid inlet joint 28 and a liquid outlet joint 29, and the liquid inlet joint 28 is connected with the flow cavity of the guide seat 24; when water-cooling liquid needs to be introduced, it is discharged into the flow cavity of the guide seat 24 through the liquid inlet joint 28, enters the flow channel groove 11 after passing through the flow cavity, and enters the shovel tooth structure 14 through the second channel 22 of the flow channel groove 11 to realize heat transfer.

[0040] A third channel 25 coaxially aligned with the second channel 22 is formed at the bottom of the flow cavity, and the bottom surface of the guide seat 24 is in contact with the top surface of the copper plate baffle 2; when the water-cooling liquid enters the shovel tooth structure 14 in the flow cavity of the guide seat 24, since the bottom surface of the guide seat 24 is in contact with the top surface of the copper plate baffle 2, the second channel 22 and the third channel 25 are in coaxial contact, and the water-cooling liquid can quickly enter the shovel tooth structure 14 and be discharged to the first channel 21 of the outer wall through the shovel tooth structure 14.

[0041] Preferably, a first buffer groove 26 is formed at the top of the flow groove 11, and the first buffer groove 26 is coaxially formed on the periphery of the flow groove 11. The flow groove 11 and the first buffer groove 26 are connected and formed as one piece. A second buffer groove 27 coaxially aligned with the first buffer groove 26 is formed on the bottom surface of the joint plate 23, and the second buffer groove 27 is connected to the liquid outlet joint 29; in this embodiment, the water-cooling liquid that needs to be discharged outward enters the first buffer groove 26 at the top of the flow groove 11 after passing through the first channel 21. At this time, the second buffer groove 27 is coaxially aligned with the first buffer groove 26. Under the action of the water pump, it will continue to be discharged outward along the second buffer groove 27 through the liquid outlet joint 29 of the joint plate 23 to achieve heat transfer.

[0042] The water-cooling plate 1 is also formed with a bottom connecting hole 30, and the joint plate 23 is formed with a top connecting hole 31 coaxially aligned with the bottom connecting hole 30. The water-cooling plate 1 and the joint plate 23 are installed by bolts through the bottom connecting hole 30 and the top connecting hole 31 to prevent displacement and ensure the flow of water-cooling liquid.

[0043] In summary, it can be seen that the utility model has the above-mentioned excellent characteristics, which can enhance the performance unprecedented in the prior art and become a product with great practical value.

[0044] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The contents of this specification should not be understood as limiting the present invention.

Claims

1. A server sandwich water-cooling heat sink, comprising a water-cooling plate, a connector plate installed on the top of the water-cooling plate, and a heat-conducting plate installed on the bottom of the water-cooling plate, characterized in that: The water cooling plate is formed with a concave flow channel groove, the bottom of the flow channel groove is formed with a top brazing surface, the top of the heat conducting plate is formed with a bottom brazing surface matching the top brazing surface, the top brazing surface is formed with a raised brazing rod, and the bottom brazing surface is formed with a brazing groove matching the brazing rod.

2. A server sandwich water cooling heat sink according to claim 1, characterized in that: An opening is formed at the bottom of the flow channel groove, and a shovel tooth structure embedded in the opening is formed at the top of the heat conducting plate.

3. The server sandwich water cooling heat sink according to claim 1, characterized in that: A copper plate baffle with an area smaller than that of the flow channel is installed in the flow channel, and the side wall of the copper plate baffle and the side wall of the flow channel are provided with a first channel for the water cooling liquid to pass through.

4. A server sandwich water cooling heat sink according to claim 3, characterized in that: The copper plate baffle is rectangular and is coaxially arranged in the flow channel groove.

5. The server sandwich water cooling heat sink according to claim 3, characterized in that: The copper plate baffle is also formed with a second channel through which water cooling liquid passes.

6. A server sandwich water cooling heat sink according to claim 4, characterized in that: The joint plate is formed with a guide seat that cooperates with the flow channel groove, and a flow cavity is formed in the guide seat, and the flow cavity is connected to the second channel. The joint plate is also equipped with a liquid inlet joint and a liquid outlet joint, and the liquid inlet joint is connected to the flow cavity of the guide seat.

7. A server sandwich water cooling heat sink according to claim 6, characterized in that: A third channel coaxially aligned with the second channel is formed at the bottom of the flow cavity, and the bottom surface of the guide seat is in contact with the top surface of the copper plate baffle.

8. The server sandwich water cooling heat sink according to claim 7, characterized in that: A first buffer groove is formed on the top of the flow channel groove, the first buffer groove is coaxially formed on the periphery of the flow channel groove, the flow channel groove is connected with the first buffer groove and is integrally formed, a second buffer groove coaxially aligned with the first buffer groove is formed on the bottom surface of the joint plate, and the second buffer groove is connected with the liquid outlet joint.

9. A server sandwich water cooling heat sink according to claim 8, characterized in that: The water cooling plate is also formed with a bottom connecting hole, and the joint plate is formed with a top connecting hole coaxially aligned with the bottom connecting hole.

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