High-capacity high-voltage ultrathin flat plate with heat dissipation performance

Abstract

The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a high-capacity high-pressure ultrathin flat plate with heat dissipation performance, which comprises a heat dissipation mechanism and a flat plate body wrapping the heat dissipation mechanism, the heat dissipation mechanism comprises a heat dissipation plate, a flow area and a support area, and the flow area and the support area are arranged on the heat dissipation plate. The heat dissipation plate is provided with a flowing area, the heat dissipation plate is provided with supporting areas except the flowing area, the heat dissipation plate is parallel to the tablet machine body, the supporting areas abut against the interior of the tablet machine body so as to fix a heat dissipation mechanism, and the supporting areas and the flowing area are arranged on the same side of the heat dissipation plate. The heat dissipation capability of the high-capacity and high-voltage ultrathin flat plate is improved, and the performance of the high-capacity and high-voltage ultrathin flat plate is optimized.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic equipment, and in particular to a high-capacity and high-voltage ultra-thin flat plate with heat dissipation properties. Background Art

[0002] With the rapid development of science and technology, various electronic products are updated and iterated faster and faster, so people's performance requirements for high-capacity, high-voltage and ultra-thin flat panels are getting higher and higher. High-capacity, high-voltage and ultra-thin flat panels are a new type of electronic product with the dual advantages of excellent performance and thin and light volume. High-capacity, high-voltage and ultra-thin flat panels achieve higher energy density by adopting advanced battery technology, such as solid-state batteries and lithium-sulfur batteries, that is, storing more energy in a smaller volume. High-voltage batteries or circuit designs are also used to improve the power output of high-capacity, high-voltage and ultra-thin flat panels, which are suitable for high-performance computing, high-speed communications and other scenarios. At the same time, ultra-thin materials and compact structural designs are used to make high-capacity, high-voltage and ultra-thin flat panels light and portable while maintaining high performance, meeting the portability requirements of modern electronic high-capacity, high-voltage and ultra-thin flat panels.

[0003] This type of high-capacity, high-voltage, ultra-thin flat panel will generate a lot of heat during operation. If the heat dissipation is not good, it will seriously affect the performance and life of the high-capacity, high-voltage, ultra-thin flat panel. The existing heat dissipation technology is still insufficient for the heat dissipation needs of this type of high-performance, high-capacity, high-voltage, ultra-thin flat panel, and it is difficult to ensure the stability and safety of the high-capacity, high-voltage, ultra-thin flat panel during high-load operation. Therefore, the development of an efficient heat dissipation system is of great significance to improving the performance and life of the high-capacity, high-voltage, ultra-thin flat panel. Utility Model Content

[0004] In order to solve the above technical problems, the present application provides a high-capacity and high-voltage ultra-thin flat plate with heat dissipation.

[0005] The present application provides a high-capacity and high-voltage ultra-thin flat plate with heat dissipation, which adopts the following technical solution:

[0006] A high-capacity and high-pressure ultra-thin flat plate with heat dissipation, comprising a heat dissipation mechanism and a flat body covering the heat dissipation mechanism, the heat dissipation mechanism comprising a heat dissipation plate, a flow area and a support area arranged on the heat dissipation plate, the heat dissipation plate except the flow area is the support area, the heat dissipation plate is arranged parallel to the flat body, the support area abuts against the inside of the flat body to fix the heat dissipation mechanism, and the support area and the flow area are arranged on the same side of the heat dissipation plate.

[0007] By adopting the above technical scheme, the present application sets a heat dissipation mechanism in the tablet body, and the heat dissipation mechanism includes a heat dissipation plate installed inside the tablet body. The tablet body includes a rear shell and a main control board. The heat dissipation plate is provided with a flow area and a support area on the side facing the main control board. By adding a heat dissipation fluid into the flow area, the heat generated by the main control board can be quickly introduced into the flow area. Through the flow circulation of the heat dissipation fluid in the flow area, the heat can be quickly exported to the other side and edge of the heat dissipation plate. Therefore, the high-capacity and high-pressure ultra-thin flat plate of the present application has good heat dissipation capability, greatly optimizes the performance of the high-capacity and high-pressure ultra-thin flat plate, and extends the life of the high-capacity and high-pressure ultra-thin flat plate.

[0008] Preferably, a capillary tube for driving the heat dissipation fluid to flow is embedded in the flow area.

[0009] By adopting the above technical solution, the present application embeds a capillary in the flow area to drive the flow of the heat dissipation fluid, provides power for the circulation of the heat dissipation fluid in the flow area, accelerates the speed of heat extraction, and realizes effective heat dissipation and temperature control of the high-capacity and high-pressure ultra-thin flat plate, further optimizes the performance of the high-capacity and high-pressure ultra-thin flat plate, and extends the life of the high-capacity and high-pressure ultra-thin flat plate.

[0010] Preferably, a phase change heat absorption block is embedded on the surface of the support area.

[0011] By adopting the above technical solution, the present application embeds a phase change heat absorption block on the surface of the supporting area. The phase change heat absorption block undergoes a phase change at a specific temperature, changing from solid to liquid or from liquid to solid. During this process, a large amount of heat is absorbed or released, thereby achieving the regulation of the internal temperature of the high-capacity and high-pressure ultra-thin flat plate. The phase change heat absorption block is isolated from the outside world to avoid leakage of the phase change material inside the phase change heat absorption block, thereby improving its own stability and applicability.

[0012] Preferably, a side of the heat sink where the support area and the flow area are not provided is provided with heat sink fins, the heat sink fins are vertically fixedly connected to the heat sink, and a side of the heat sink fins away from the heat sink abuts against the flat body.

[0013] By adopting the above technical solution, the present application vertically arranges a plurality of cooling fins on the side opposite to the rear shell of the tablet body of the heat sink, thereby forming a large amount of cooling space between the heat sink and the rear shell, effectively increasing the cooling area, and the heat sink isolates this part of the cooling space from the main control board, which can further improve the cooling capacity of the high-capacity and high-voltage ultra-thin flat panel, optimize the performance of the high-capacity and high-voltage ultra-thin flat panel, and extend the life of the high-capacity and high-voltage ultra-thin flat panel.

[0014] Preferably, the tablet body includes a display area, a processing area and a control area connected to each other, a first flow area is arranged at a position of the flow area corresponding to the control area, a second flow area is arranged at a position of the flow area corresponding to the processing area, and the first flow area and the second flow area are connected.

[0015] Preferably, the first flow zone is in a honeycomb shape, and the second flow zone is in a divergent tree shape.

[0016] By adopting the above technical scheme, the present application sets a first flow zone at the position corresponding to the control zone, and the first flow zone is honeycomb-shaped, which can increase the heat dissipation area of ​​the control zone with more heat generation and improve the heat dissipation effect. A second flow zone is set at the position corresponding to the processing zone, and the second flow zone is divergent tree-shaped, which can increase the heat dissipation area and optimize the heat dissipation effect. The connection between the first flow zone and the second flow zone enables the heat dissipation fluid to form a good circulation inside the flat body, thereby improving the heat dissipation effect. The heat will be dissipated to the edge of the heat sink along the divergent tree-shaped branches of the second flow zone, thereby improving the heat dissipation efficiency inside the high-capacity and high-pressure ultra-thin flat plate.

[0017] Preferably, a temperature sensor and an emergency temperature control system capable of receiving information from the temperature sensor are provided in the tablet body.

[0018] By adopting the above technical solution, the present application sets up a temperature sensor for monitoring the temperature and an emergency temperature control system that can receive temperature information and make adjustments in the tablet body, so as to realize accurate temperature monitoring and regional control. When the high-capacity and high-pressure ultra-thin flat panel is overheated, the power consumption and performance can be adjusted in real time according to the working status and load, so as to reduce the heat dissipated by the high-capacity and high-pressure ultra-thin flat panel, optimize the performance of the high-capacity and high-pressure ultra-thin flat panel, and extend the life of the high-capacity and high-pressure ultra-thin flat panel.

[0019] Preferably, the heat sink has a thickness of 500-800 um.

[0020] By adopting the above technical solution, the present application controls the thickness of the heat sink within 500-800um, and ensures the effective flow heat dissipation volume and heat dissipation effect of the internal flow area of ​​the heat sink without affecting the ultra-thin thickness of the high-capacity and high-pressure ultra-thin flat plate, thereby optimizing the heat dissipation capacity of the high-capacity and high-pressure ultra-thin flat plate.

[0021] Preferably, the length of the heat dissipation fin is 100-150 um.

[0022] By adopting the above technical solution, the present application controls the length of the heat sink fins within 100-150um, and ensures the effective flow heat dissipation volume and heat dissipation effect of the heat dissipation space between the heat sink and the back shell without affecting the ultra-thin thickness of the high-capacity and high-voltage ultra-thin flat plate, thereby optimizing the heat dissipation capacity of the high-capacity and high-voltage ultra-thin flat plate.

[0023] Preferably, the heat sink is made of ceramic, graphene or carbon fiber composite material.

[0024] By adopting the above technical solution, the present application uses ceramics, graphene or carbon fiber composite materials with a low thermal expansion coefficient as the material of the heat sink, which can maintain the stability of the heat sink when the temperature changes, thereby ensuring that it is not easy to deform under different ambient temperatures, thereby improving the structural stability and durability of the high-capacity and high-pressure ultra-thin flat plate.

[0025] In summary, the present application includes at least one of the following beneficial technical effects:

[0026] 1. The present application provides a flow area and a support area on the heat dissipation plate. The flow area can dissipate heat through the flow of the heat dissipation fluid, while the support area not only plays a supporting role, but also increases the heat dissipation area and improves the heat dissipation efficiency.

[0027] 2. The phase change heat absorption block embedded in the surface of the support area of ​​the present application can absorb heat when the temperature of the high-capacity and high-pressure ultra-thin flat plate rises, further enhancing the heat dissipation effect;

[0028] 3. This application sets a temperature sensor and an emergency temperature control system to timely adjust the temperature of the high-capacity and high-pressure ultra-thin flat plate when the temperature is too high, thereby ensuring the safe operation of the high-capacity and high-pressure ultra-thin flat plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the structure of an embodiment of the present application;

[0030] Figure 2 It is a cross-sectional view of an embodiment of the present application.

[0031] Explanation of the reference numerals in the accompanying drawings: 1. heat dissipation mechanism; 11. heat dissipation plate; 111. flow area; 1111. first flow area; 1112. second flow area; 112. support area; 113. capillary; 114. phase change heat absorption block; 115. heat dissipation fins; 2. tablet body; 21. display area; 22. processing area; 23. control area; 24. temperature sensor; 25. emergency temperature control system. DETAILED DESCRIPTION

[0032] The following is combined with Figure 1-2 Further elaboration of this application:

[0033] The present application discloses a high-capacity and high-pressure ultra-thin flat plate with heat dissipation, comprising a heat dissipation mechanism 1 and a flat body 2 covering the heat dissipation mechanism 1. The heat dissipation mechanism 1 is composed of a heat dissipation plate 11, a flow area 111 and a support area 112 arranged on the heat dissipation plate 11. The heat dissipation plate 11 is made of ceramic, graphene or carbon fiber composite materials. The above materials have a low thermal expansion coefficient and can maintain the stability of the heat dissipation plate 11 when the temperature changes, thereby ensuring that it is not easy to deform at different ambient temperatures, thereby improving the structural stability and durability of the high-capacity and high-pressure ultra-thin flat plate.

[0034] The heat sink 11 is arranged in parallel with the tablet body 2, and the support area 112 abuts against the inside of the tablet body 2 to fix the heat dissipation mechanism 1. The tablet body 2 includes a display area 21, a processing area 22 and a control area 23. The first flow area 1111 is arranged at the position of the flow area 111 corresponding to the control area 23, and the second flow area 1112 is arranged at the position of the flow area 111 corresponding to the processing area 22. The first flow area 1111 and the second flow area 1112 are connected to facilitate the flow of the heat dissipation fluid and heat transfer. The first flow area 1111 is honeycomb-shaped, which increases the complexity of the flow of the heat dissipation fluid, expands the heat dissipation area, and improves the heat dissipation effect; the second flow area 1112 is divergent tree-shaped, which helps to quickly transfer heat to the edge of the heat sink 11, further improving the heat dissipation efficiency. The flow area 111 is embedded with a capillary 113 for driving the flow of the heat dissipation fluid, which provides the power for the circulation of the heat dissipation fluid in the flow area 111, accelerates the speed of heat extraction, and realizes effective heat dissipation and temperature control for high-capacity and high-pressure ultra-thin flat panels. A phase change heat absorption block 114 is embedded on the surface of the support area 112, which undergoes a phase change at a specific temperature, changing from solid to liquid or from liquid to solid. During this process, a large amount of heat is absorbed or released, thereby achieving the regulation of the internal temperature of the high-capacity and high-pressure ultra-thin flat plate. The phase change heat absorption block 114 is isolated from the outside world to avoid leakage of the phase change material inside the phase change heat absorption block 114, thereby improving its own stability and applicability.

[0035] A plurality of heat dissipation fins 115 are provided on the side of the heat dissipation plate 11 where the support area 112 and the flow area 111 are not provided. The heat dissipation fins 115 are vertically fixedly connected to the heat dissipation plate 11, and the side of the heat dissipation fins 115 away from the heat dissipation plate 11 abuts against the flat body 2. The heat dissipation fins 115 increase the heat dissipation area and improve the heat dissipation efficiency. The thickness of the heat dissipation plate 11 of the flat body 2 is 500-800um, and the length of the heat dissipation fins 115 is 100-150um, which not only ensures the heat dissipation effect, but also takes into account the light and thin design of the high-capacity and high-pressure ultra-thin flat plate, increases the heat dissipation area, and does not increase the overall thickness of the high-capacity and high-pressure ultra-thin flat plate.

[0036] The tablet body 2 is provided with a temperature sensor 24 and an emergency temperature control system 25 capable of receiving information from the temperature sensor 24. The temperature sensor 24 monitors the temperature of the high-capacity and high-pressure ultra-thin tablet in real time. When the temperature exceeds the set value, the emergency temperature control system 25 is activated and corresponding measures are taken to reduce the temperature of the high-capacity and high-pressure ultra-thin tablet to ensure the safe operation of the high-capacity and high-pressure ultra-thin tablet.

[0037] The implementation principle of the high-capacity and high-pressure ultra-thin flat plate with heat dissipation of the present application is: through the support area 112, the flow area 111 and the heat dissipation fins 115 on the heat dissipation plate 11, as well as the embedded capillary 113 and the phase change heat absorption block 114, the heat dissipation process of the high-capacity and high-pressure ultra-thin flat plate is jointly acted on, and through the heat dissipation plate 11 of a certain thickness and the heat dissipation fins 115 of a certain length, without affecting the ultra-thin thickness of the high-capacity and high-pressure ultra-thin flat plate, the effective flow heat dissipation volume and heat dissipation effect of the heat dissipation space between the heat dissipation plate 11 and the rear shell are ensured, and the effective flow heat dissipation volume and heat dissipation effect of the flow area 111 inside the heat dissipation plate 11 are ensured, thereby ensuring the stability and durability of the high-capacity and high-pressure ultra-thin flat plate during high-performance operation.

[0038] The above are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application. For example, the shape, size, and material of the heat dissipation fins can be adjusted according to actual needs; the layout, shape, and size of the flow area and the support area can also be optimized according to the specific design of the flat body; the emergency temperature control system can take a variety of measures to reduce the temperature of the high-capacity and high-pressure ultra-thin flat panel, such as increasing the speed of the cooling fan, reducing the performance of the high-capacity and high-pressure ultra-thin flat panel to reduce heat generation, etc. These equivalent changes should be deemed to be included in the protection scope of the present application.

Claims

1. A high-capacity and high-voltage ultra-thin flat plate with heat dissipation, characterized in that: The invention comprises a heat dissipation mechanism (1) and a flat body (2) covering the outside of the heat dissipation mechanism (1); the heat dissipation mechanism (1) comprises a heat dissipation plate (11), a flow area (111) and a support area (112) arranged on the heat dissipation plate (11); the heat dissipation plate (11) is provided with the support area (112) except the flow area (111); the heat dissipation plate (11) is provided in parallel with the flat body (2); the support area (112) abuts against the inside of the flat body (2) to fix the heat dissipation mechanism (1); and the support area (112) and the flow area (111) are provided on the same side of the heat dissipation plate (11).

2. The high-capacity and high-voltage ultra-thin flat plate with heat dissipation according to claim 1, characterized in that: The flow area (111) is embedded with a capillary tube (113) for driving the heat dissipation fluid to flow.

3. The high-capacity and high-voltage ultra-thin flat plate with heat dissipation according to claim 1, characterized in that: A phase-change heat absorption block (114) is embedded on the surface of the support area (112).

4. The high-capacity and high-voltage ultra-thin flat plate with heat dissipation according to claim 1, characterized in that: A heat sink fin (115) is provided on a side of the heat sink (11) where the support area (112) and the flow area (111) are not provided, the heat sink fin (115) is vertically fixedly connected to the heat sink (11), and a side of the heat sink fin (115) away from the heat sink (11) is in contact with the flat body (2).

5. The high-capacity and high-voltage ultra-thin flat plate with heat dissipation according to claim 1, characterized in that: The tablet body (2) comprises a display area (21), a processing area (22) and a control area (23) which are connected to each other; a first flow area (1111) is arranged at a position of the flow area (111) corresponding to the control area (23); a second flow area (1112) is arranged at a position of the flow area (111) corresponding to the processing area (22); and the first flow area (1111) and the second flow area (1112) are in a connected state.

6. The high-capacity and high-voltage ultra-thin flat plate with heat dissipation according to claim 5, characterized in that: The first flow area (1111) is in a honeycomb shape, and the second flow area (1112) is in a divergent tree shape.

7. The high-capacity and high-voltage ultra-thin flat plate with heat dissipation according to claim 1, characterized in that: A temperature sensor (24) and an emergency temperature control system (25) capable of receiving information from the temperature sensor (24) are arranged in the flat body (2).

8. The high-capacity and high-voltage ultra-thin flat plate with heat dissipation according to claim 1, characterized in that: The heat dissipation plate (11) has a thickness of 500-800 um.

9. The high-capacity and high-voltage ultra-thin flat plate with heat dissipation according to claim 4, characterized in that: The heat dissipation fin (115) has a length of 100-150 um.

10. The high-capacity and high-voltage ultra-thin flat plate with heat dissipation according to claim 1, characterized in that: The heat dissipation plate (11) is made of ceramic, graphene or carbon fiber composite material.

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