Display module and terminal equipment

Abstract

The embodiment of the utility model discloses a display module and a terminal device, the display module comprises a display panel, a first back plate, a heat dissipation plate and a flexible circuit board, the display panel comprises a display section, a binding section and a bending section, the flexible circuit board is bonded with the heat dissipation plate through a first glue structure, the display module further comprises a second glue structure, and the second glue structure is bonded with the heat dissipation plate through a second glue structure. The first end of the second glue structure is connected with the heat dissipation plate, the second end of the second glue structure is connected with at least one side face of the flexible circuit board, and the thickness of the second glue structure is larger than that of the first glue structure; the second glue structure is arranged on at least one side face of the flexible circuit board, the second glue structure is further connected with the heat dissipation plate, the adhesion area between the flexible circuit board and the heat dissipation plate can be increased through the second glue structure, and the adhesion force between the flexible circuit board and the heat dissipation plate is improved; and virtual bonding caused by insufficient bonding force between the flexible circuit board and the heat dissipation plate is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of display, and in particular to a display module and a terminal device. Background Art

[0002] In order to increase the space of the existing display module to accommodate batteries with larger capacity and size, it is necessary to reduce the thickness of the adhesive layer used to bond the flexible circuit board to the heat sink. However, the thinning of the adhesive layer will lead to a decrease in viscosity, making the flexible circuit board easy to rebound and stick loosely. The rebound will cause two problems: one is that the contact impedance between the flexible circuit board body and the heat sink increases, and the other is that abnormal noise will occur when pressing the loosely attached position of the flexible circuit board body.

[0003] Therefore, the existing display module has a technical problem that the adhesive force between the flexible circuit board body and the heat sink is insufficient, resulting in false adhesion. Utility Model Content

[0004] The embodiments of the utility model provide a display module and a terminal device, which can alleviate the technical problem of insufficient adhesion between a flexible circuit board body and a heat dissipation plate in the existing display module, resulting in false adhesion.

[0005] An embodiment of the utility model provides a display module, comprising:

[0006] a display panel, the display panel comprising a display segment, a binding segment, and a bending segment connecting the display segment and the binding segment, the binding segment being bent to the back side of the display module via the bending segment, and the display segment and the binding segment being arranged opposite to each other;

[0007] A first back plate, a heat sink, and a flexible circuit board on the light-emitting side away from the display segment, wherein the first back plate is arranged on the back side of the display segment, the heat sink is arranged on the side of the first back plate away from the display segment, the flexible circuit board is arranged on the side of the heat sink away from the display segment, and a first adhesive structure is arranged between the flexible circuit board and the heat sink;

[0008] Among them, the display module also includes a second glue structure, the second glue structure includes a first end facing the heat sink and a second end facing the flexible circuit board, the first end is connected to the heat sink, and the second end is connected to at least one side of the flexible circuit board. In the film thickness direction, the thickness of the second glue structure is greater than the thickness of the first glue structure.

[0009] Optionally, in some embodiments of the present invention, the flexible circuit board includes a flexible circuit board body and a connecting portion, one end of the connecting portion is connected to the flexible circuit board body, the other end of the connecting portion is connected to the binding section, and the end of the connecting portion connected to the flexible circuit board body is bent toward one side of the heat sink relative to the other end of the connecting portion.

[0010] Optionally, in some embodiments of the utility model, the display module also includes a third glue structure, and the third glue structure is arranged on a side surface of the flexible circuit board body away from the display segment. The second glue structure also includes a top surface facing away from the heat dissipation plate, and the top surface height of the second glue structure does not exceed the top surface of the third glue structure.

[0011] Optionally, in some embodiments of the present invention, in the film thickness direction, the height of the top surface of the third adhesive structure is less than or equal to the height of the top surface of the binding section.

[0012] Optionally, in some embodiments of the present invention, an edge of the third adhesive structure is set inward relative to an edge of the flexible circuit board body, and a distance between the edge of the third adhesive structure and the edge of the flexible circuit board body is greater than 1 mm.

[0013] Optionally, in some embodiments of the present invention, the edge of the first adhesive structure is retracted relative to the edge of the flexible circuit board body to form a recess between the flexible circuit board body and the heat dissipation plate, and the distance between the edge of the first adhesive structure and the edge of the flexible circuit board body is greater than 1 mm.

[0014] Optionally, in some embodiments of the present invention, the second adhesive structure is at least partially filled in the recess, and the second adhesive structure is in contact with the bottom surface of the flexible circuit board body and the side surface of the first adhesive structure.

[0015] Optionally, in some embodiments of the utility model, the display module also includes a fourth glue structure and a second back panel, the fourth glue structure is arranged on a side surface of the heat sink away from the first back panel, the second back panel is arranged on a side of the fourth glue structure away from the first back panel, and the two ends of the fourth glue structure are respectively bonded to the heat sink and the second back panel, wherein the thickness of the first glue structure is less than the thickness of the fourth glue structure.

[0016] Optionally, in some embodiments of the present invention, the second adhesive structure is made of UV adhesive, and the first adhesive structure is double-sided adhesive.

[0017] An embodiment of the present utility model provides a terminal device, and the terminal device includes a display module as described in any of the above embodiments.

[0018] Beneficial effect: By additionally providing a second adhesive structure on at least one side of the flexible circuit board, the second adhesive structure contacts with at least one side of the flexible circuit board toward the first end of the flexible circuit board, and contacts with the heat sink toward the second end of the heat sink, thereby increasing the adhesion area between the flexible circuit board and the heat sink, improving the adhesion between the flexible circuit board and the heat sink, avoiding false adhesion of the flexible circuit board, and alleviating the technical problem of false adhesion caused by insufficient adhesion between the flexible circuit board and the heat sink in the existing display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 This is a first cross-sectional schematic diagram of the display module provided by the utility model;

[0021] Figure 2 This is a first top view schematic diagram of the display module provided by the utility model;

[0022] Figure 3 This is a second cross-sectional schematic diagram of the display module provided by the utility model.

[0023] Description of reference numerals:

[0024] DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described below in conjunction with the drawings in the embodiments of the present invention. The technical solutions described below are only used to explain and illustrate the concept of the present invention and should not be regarded as limiting the protection scope of the present invention.

[0026] In addition, the terms "first", "second" and similar words do not indicate any order, quantity or importance, but are only used to distinguish different technical features. The term "plurality" and similar words mean two or more, unless otherwise clearly defined.

[0027] See also Figure 1 , Figure 2The display module 1 provided by the utility model includes a display panel 2, a first back plate 3, a heat sink 4, and a flexible circuit board. The display panel 2 includes a display segment 21, a binding segment 23, and a bending segment 22. The binding segment 23 is bent to the back side of the display module 1 through the bending segment 22. The first back plate 3 is arranged on the side of the display segment 21 away from the light emitting direction, the heat sink 4 is arranged on the side of the first back plate 3 away from the display segment 21, and the flexible circuit board is arranged on the side of the heat sink 4 away from the display segment 21. The flexible circuit board is bonded to the heat sink 4 through a first adhesive structure 6; wherein, the display module 1 also includes a second adhesive structure 8, the second adhesive structure 8 includes a first end facing the heat sink 4 and a second end facing the flexible circuit board, the first end is connected to the heat sink 4, and the second end is connected to at least one side of the flexible circuit board. In the film thickness direction, the thickness of the second adhesive structure 8 is greater than the thickness of the first adhesive structure 6.

[0028] The two ends of the bending section 22 connect the display section 21 and the binding section 23 . The bending section 22 is bent, and the display section 21 and the binding section are arranged opposite to each other.

[0029] The display module 1 further includes a polarizer 12 disposed on a side of the display segment 21 away from the heat sink 4 , an optical adhesive 13 disposed on a side of the polarizer 12 away from the display segment 21 , and a cover plate 14 disposed on a side of the optical adhesive 13 away from the display segment 21 .

[0030] In this embodiment, a second adhesive structure 8 is provided on at least one side of the flexible circuit board, and the second adhesive structure 8 is also connected to the heat sink 4. The second adhesive structure 8 can increase the adhesion area between the flexible circuit board and the heat sink 4, and enhance the adhesion force between the flexible circuit board and the heat sink 4, thereby alleviating the technical problem of insufficient adhesion between the flexible circuit board and the heat sink 4 in the existing display module 1, resulting in false adhesion.

[0031] The technical solution of the utility model is now described in conjunction with specific embodiments.

[0032] It should be noted that the back side mentioned in the present invention is: the side away from the light emitting direction.

[0033] In one embodiment, the flexible circuit board includes a flexible circuit board body 5 and a connecting portion 7, one end of the connecting portion 7 is connected to the flexible circuit board body 5, the other end of the connecting portion 7 is connected to the binding section 22, and the end of the connecting portion 7 connected to the flexible circuit board body 5 is bent toward one side of the heat dissipation plate 4 relative to the other end of the connecting portion 7.

[0034] Wherein, the flexible circuit board body can be a multi-layer board structure.

[0035] Among them, the connecting part can be a single-layer board structure, which includes at least one copper material layer. A binding terminal is arranged on the connecting part, and the binding terminal of the connecting part is interconnected with the binding terminal at the corresponding position on the binding segment to realize the electrical connection between the flexible circuit board and the display panel.

[0036] In one embodiment, the flexible circuit board body 5 includes a binding side facing the binding section 23, and the second adhesive structure 8 can be arranged on at least one of the three side surfaces of the flexible circuit board body 5 except the binding side surface, and the second adhesive structure 8 is also in contact with the heat sink 4, and the second adhesive structure 8 has the effect of bonding the flexible circuit board body 5 and the heat sink 4.

[0037] The second adhesive structure 8 may be disposed on two opposite sides of the flexible circuit board body 5 .

[0038] The second adhesive structure 8 may be disposed on two adjacent side surfaces of the flexible circuit board body 5 .

[0039] Among them, see Figure 2 The second adhesive structure 8 can be arranged on three sides of the flexible circuit board body 5 , and the second adhesive structure 8 can be arranged around the sides of the flexible circuit board body 5 .

[0040] It is understandable that the above example only takes the case where the flexible circuit board body 5 includes four side surfaces. When the flexible circuit board body 5 includes more than four side surfaces, any side surface except the binding side surface facing the binding section 23 can be provided with the second adhesive structure 8.

[0041] In one embodiment, see Figure 1 , Figure 3 The display module 1 also includes a third glue structure 9, which is arranged on a side surface of the flexible circuit board body 5 away from the display segment 21, and the top surface of the second glue structure 8 does not exceed the top surface of the third glue structure 9.

[0042] The third adhesive structure 9 is disposed to at least cover a portion of the top surface of the flexible circuit board body.

[0043] The third adhesive structure 9 may include one or more adhesive layers.

[0044] The top surface of the second glue structure 8 is the surface of the second glue structure 8 away from the display segment 21 , and the top surface of the third glue structure 9 is the surface of the third glue structure 9 away from the display segment 21 .

[0045] The top surface of the second adhesive structure 8 does not exceed the top surface of the third adhesive structure 9, which means: Figure 3 , the top surface of the second adhesive structure 8 is located on the side of the top surface of the third adhesive structure 9 facing the display segment 21, or, refer to Figure 1 , the top surface of the second adhesive structure 8 is flush with the top surface of the third adhesive structure 9.

[0046] It is understandable that by making the top surface of the second adhesive structure 8 not exceed the top surface of the third adhesive structure 9, the second adhesive structure 8 will not occupy additional space above the third adhesive structure 9, thereby saving space in the whole machine and freeing up space for the battery to increase the battery capacity.

[0047] In this embodiment, by setting the top surface of the second adhesive structure 8 not to exceed the third adhesive structure 9, the second adhesive structure 8 can reduce the space occupied by the entire device in the film thickness direction, freeing up space for the battery to increase the battery capacity.

[0048] In one embodiment, the display module also includes a fourth glue structure 11 and a second back panel 10, the fourth glue structure 11 is arranged on a side surface of the heat sink 4 away from the first back panel 3, the second back panel 10 is arranged on a side of the fourth glue structure 11 away from the first back panel 3, and the two ends of the fourth glue structure 11 are respectively bonded to the heat sink 4 and the second back panel 10, wherein the thickness of the first glue structure 6 is less than the thickness of the fourth glue structure 11.

[0049] Wherein, the thickness of the first adhesive structure 6 is less than or equal to 50 micrometers.

[0050] The thickness of the first adhesive structure 6 may be any one of 10 micrometers, 20 micrometers, 30 micrometers, 40 micrometers, and 50 micrometers.

[0051] It is understandable that the greater the thickness of the first adhesive structure 6 , the greater the bonding force of the first adhesive structure 6 on the flexible circuit board body 5 and the heat dissipation plate 4 , and the smaller the thickness of the first adhesive structure 6 , the smaller the thickness of the whole device.

[0052] It can be understood that, compared with the thickness of conventional double-sided tape of 60 to 100 microns, the film thickness of the first adhesive structure in this embodiment can be less than 50 microns. While ensuring that the first adhesive structure 6 has a certain adhesion to the flexible circuit board body 5 and the heat sink 4, the first adhesive structure 8 further reduces the space occupied by the entire machine in the film thickness direction, thereby freeing up space for the battery to increase the battery capacity.

[0053] In one embodiment, a vertical distance D between the top surface of the third adhesive structure 9 and the top surface of the heat sink is in a range of 220 micrometers to 510 micrometers.

[0054] The vertical distance D between the top surface of the third adhesive structure 9 and the top surface of the heat sink may be any one of 220 micrometers, 300 micrometers, 380 micrometers, and 510 micrometers.

[0055] It is understandable that the smaller the vertical distance D between the top surface of the third adhesive structure 9 and the top surface of the heat sink, the less space is occupied by the whole machine, which can save the whole machine space and free up space for the battery to increase the battery capacity.

[0056] In this embodiment, due to the thinning of the first adhesive structure 6, the vertical distance D meets the thickness range of 220 microns to 510 microns. This thickness range can effectively reduce the space occupied by the first adhesive structure, the flexible circuit board body, and the fourth adhesive structure.

[0057] In one embodiment, the height of the top surface of the third adhesive structure is less than or equal to the height of the top surface of the binding section.

[0058] It can be understood that after the first glue structure 6 is thinned, the overall thickness of the first glue structure 6, the flexible circuit board body 5 and the third glue structure 9 above it is reduced, so that the height of the top surface of the top third glue structure 9 is less than or equal to the height of the top surface of the binding segment 22 of the display panel; the top surface here refers to the side surface of the third glue structure 9 and the binding segment facing away from the display segment 21.

[0059] In one embodiment, one end of the connecting portion 7 connected to the flexible circuit board body 5 is bent toward one side of the heat dissipation plate relative to the other end of the connecting portion 7 .

[0060] It can be understood that the thickness of the first adhesive structure 6 is reduced, so that the connecting portion 7 is arranged closer to the heat sink 4 at one end toward the flexible circuit board body 5 than at the other end, so that the connecting portion 7 is changed from the original directly extended design to a downward bending design, and the connecting portion 7 is bent downward to be connected to the flexible circuit board body 5, and the flexible circuit board body 5 is arranged closer to the display segment 21 relative to the binding portion, thereby reducing the space occupied by the first adhesive structure 6 on the entire machine, saving the space of the entire machine, and freeing up space for the battery to increase the battery capacity.

[0061] In one embodiment, the edge of the third adhesive structure 9 is set inward relative to the edge of the flexible circuit board body 5, and the distance between the edge of the third adhesive structure 9 and the edge of the flexible circuit board body 5 is greater than 1 mm.

[0062] The distance between the edge of the third adhesive structure 9 and the edge of the flexible circuit board body 5 may be at least one of 1.5 mm, 2 mm, 2.5 mm, and 3 mm.

[0063] It can be understood that by retracting the third glue structure 9 relative to the flexible circuit board body 5, when preparing the second glue structure 8, even if there is a precision error in the applied glue material, it can avoid the top surface of the third glue structure 9, thereby preventing the glue material from being applied to the top surface of the third glue structure 9 and causing an increase in the space of the entire machine, thereby saving the space of the entire machine.

[0064] It should be noted that in the prior art, the distance range of the edge of the third glue structure 9 relative to the edge of the flexible circuit board body 5 is 0.2 mm to 0.5 mm, and there is a certain error in the coating range in the glue coating process. The distance of 0.2 mm to 0.5 mm is not enough to make the third glue structure 9 avoid the glue coating position. Therefore, the above distance range of the prior art will cause the top surface of the third glue structure 9 to have residual glue material, resulting in an increase in the space occupied by the entire machine.

[0065] In this embodiment, the edge of the third glue structure 9 is further retracted by at least 1 mm relative to the edge of the flexible circuit board body 5 so that the third glue structure 9 and the glue-coated area avoid each other, thereby reducing the space occupied by the entire machine and freeing up space for the battery to increase the battery capacity.

[0066] In one embodiment, see Figure 1 , Figure 3 The edge of the first glue structure 6 is set inward relative to the edge of the flexible circuit board body 5, a recess 15 is formed between the flexible circuit board body 5 and the heat dissipation plate 4, and the distance S between the edge of the first glue structure 6 and the edge of the flexible circuit board body 5 is greater than 1 mm.

[0067] It can be understood that the recess 15 can be formed by the above-mentioned inward-retracting design, and the depth of the recess 15 is the same as the range of the distance S.

[0068] It can be understood that by shrinking the edge of the first adhesive structure 6 relative to the flexible circuit board body 5, the bottom surface of the flexible circuit board body 5, the side surface of the first adhesive structure 6, and the top surface of the heat sink 4 are surrounded by the recess 15, and the second adhesive structure 8 can also contact the inner surface of the recess 15. The inner surface of the recess 15 includes the bottom surface of the flexible circuit board body 5, the side surface of the first adhesive structure 6, and the top surface of the heat sink 4, thereby increasing the contact area between the second adhesive structure 8 and the heat sink 4 and the flexible circuit board body 5, and further enhancing the bonding force between the heat sink 4, the flexible circuit board body 5 and the second adhesive structure 8.

[0069] In one embodiment, see Figure 3The second adhesive structure 8 is at least partially filled in the recess 15 , and the second adhesive structure 8 is in contact with the bottom surface of the flexible circuit board body 5 and the side surface of the first adhesive structure 6 .

[0070] It can be understood that by partially filling the second glue structure 8 in the recess 15, the contact area between the second glue structure 8 and the heat sink 4 and the flexible circuit board body 5 can be increased. The first glue structure 6 and the second glue structure 8 jointly ensure that the flexible circuit board body 5 is better attached to the heat sink 4, avoiding false attachment of the flexible circuit board body 5 due to insufficient viscosity of the first glue structure 6.

[0071] In one embodiment, the viscosity of the material of which the second adhesive structure 8 is made is greater than the viscosity of the material of which the first adhesive structure 6 is made.

[0072] In one embodiment, the second adhesive structure 8 may be made of UV adhesive, and the first adhesive structure 6 may be a double-sided adhesive.

[0073] In one embodiment, the connecting portion 7 can be integrally formed with the flexible circuit board body 5 ; one end of the connecting portion 7 facing the flexible circuit board body 5 can be connected to any one of the top surface, side surface, and bottom surface of the flexible circuit board body 5 .

[0074] In one embodiment, the optical adhesive 13 is flush with the edge of the cover plate 14 to improve the bonding strength between the optical adhesive 13 and the cover plate 14 .

[0075] The cover plate 14 may be made of a transparent material to improve the light transmittance of the cover plate 14 .

[0076] The display module 1 further includes a fourth adhesive structure 11 disposed on the side of the heat sink 4 away from the display segment 21 , a second back plate 10 disposed on the side of the fourth adhesive structure 11 away from the display segment 21 , and a binding segment 23 disposed on the side of the second back plate 10 away from the display panel 2 .

[0077] The utility model provides a second adhesive structure 8 on at least one side of the flexible circuit board body 5 that does not need to be bound, and one end of the second adhesive structure 8 contacts the heat sink 4, and the other end of the second adhesive structure 8 contacts the flexible circuit board body 5, thereby improving the adhesion between the heat sink 4 and the flexible circuit board body 5, and avoiding the problem of virtual adhesion of the flexible circuit board body 5 caused by reduced viscosity due to thinning of the first adhesive structure 6.

[0078] The utility model also proposes a terminal device, which includes the above-mentioned display module, wherein the terminal device includes but is not limited to a mobile phone, a laptop computer, and a tablet computer.

[0079] The display module provided by the embodiment of the utility model includes a display panel, a first back plate, a heat sink, a flexible circuit board, and a second glue structure, wherein the first end of the second glue structure is connected to the heat sink, and the second end of the second glue structure is connected to at least one side surface of the flexible circuit board; by arranging the second glue structure on at least one side surface of the flexible circuit board, the second glue structure is also connected to the heat sink, and the second glue structure can increase the adhesion area between the flexible circuit board and the heat sink, and enhance the adhesion force between the flexible circuit board and the heat sink, thereby alleviating the technical problem of insufficient adhesion between the flexible circuit board and the heat sink resulting in false adhesion in the existing display module.

[0080] The display module provided by the embodiment of the utility model is described in detail above. Without departing from the spirit and essential points of the utility model, technicians familiar with the field can make various corresponding changes and deformations according to the utility model, but these corresponding changes and deformations should all fall within the scope of protection of the claims attached to the utility model.

Claims

1. A display module, characterized in that: include: a display panel, the display panel comprising a display segment, a binding segment, and a bending segment connecting the display segment and the binding segment, the binding segment being bent to the back side of the display module via the bending segment, and the display segment and the binding segment being arranged opposite to each other; A first back plate, a heat sink, and a flexible circuit board on the light-emitting side away from the display segment, wherein the first back plate is arranged on the back side of the display segment, the heat sink is arranged on the side of the first back plate away from the display segment, the flexible circuit board is arranged on the side of the heat sink away from the display segment, and a first adhesive structure is arranged between the flexible circuit board and the heat sink; Among them, the display module also includes a second glue structure, the second glue structure includes a first end facing the heat sink and a second end facing the flexible circuit board, the first end is connected to the heat sink, and the second end is connected to at least one side of the flexible circuit board. In the film thickness direction, the thickness of the second glue structure is greater than the thickness of the first glue structure.

2. The display module according to claim 1, wherein: The flexible circuit board includes a flexible circuit board body and a connecting portion, one end of the connecting portion is connected to the flexible circuit board body, the other end of the connecting portion is connected to the binding section, and the end of the connecting portion connected to the flexible circuit board body is bent toward one side of the heat dissipation plate relative to the other end of the connecting portion.

3. The display module according to claim 2, wherein: The display module also includes a third glue structure, which is arranged on a side surface of the flexible circuit board body away from the display segment. The second glue structure also includes a top surface away from the heat dissipation plate, and the top surface height of the second glue structure does not exceed the top surface of the third glue structure.

4. The display module according to claim 3, wherein: In the film thickness direction, the height of the top surface of the third adhesive structure is less than or equal to the height of the top surface of the binding section.

5. The display module according to claim 3, wherein: The edge of the third adhesive structure is set inward relative to the edge of the flexible circuit board body, and the distance between the edge of the third adhesive structure and the edge of the flexible circuit board body is greater than 1 mm.

6. The display module according to claim 3, characterized in that: The edge of the first adhesive structure is set inward relative to the edge of the flexible circuit board body to form a recess between the flexible circuit board body and the heat dissipation plate, and the distance between the edge of the first adhesive structure and the edge of the flexible circuit board body is greater than 1 mm.

7. The display module according to claim 6, wherein: The second adhesive structure is at least partially filled in the recess, and the second adhesive structure is in contact with the bottom surface of the flexible circuit board body and the side surface of the first adhesive structure.

8. The display module according to claim 1, wherein: The display module also includes a fourth glue structure and a second back plate. The fourth glue structure is arranged on a surface of a side of the heat sink away from the first back plate. The second back plate is arranged on a side of the fourth glue structure away from the first back plate. Both ends of the fourth glue structure are respectively bonded to the heat sink and the second back plate, wherein the thickness of the first glue structure is less than the thickness of the fourth glue structure.

9. The display module according to claim 1, wherein: The second adhesive structure is made of UV adhesive, and the first adhesive structure is double-sided adhesive.

10. A terminal device, characterized in that: The terminal device comprises the display module according to any one of claims 1 to 9.

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