Heating carrier structure suitable for semiconductor wet cleaning equipment
By designing the heating carrier structure of the inner tank body, baffle, heating film unit and cooling pipe in semiconductor wet cleaning equipment, the problems of large heat transfer loss and long maintenance time of existing equipment are solved, higher safety and production capacity are achieved, and cost and energy consumption are reduced.
Patent Information
- Application Number
- CN202420620550.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-28
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-03-28
AI Technical Summary
The open heating design of existing semiconductor wet cleaning equipment leads to large heat transfer losses and long maintenance time, which affects production capacity and safety.
A heating carrier structure including an inner groove body, a baffle, a heating film unit and a cooling tube is designed. A heating film unit is provided on the bottom and side of the inner cavity of the inner groove body, and a cooling tube is provided on the inner side wall to form a plurality of independent grooves to reduce the drop and carbonization of the medicine liquid.
It effectively reduces heat transfer losses, reduces maintenance time, improves equipment safety and production capacity, reduces enterprise costs, and achieves energy saving and consumption reduction.
Smart Images
Figure CN222801746U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a heating carrier structure suitable for semiconductor wet cleaning equipment, belonging to the technical field of semiconductor wet cleaning. Background Art
[0002] In the semiconductor industry, the tank body of the wet cleaning stripping tank equipment has a lot of heating requirements, and the process temperature is usually above 105°C. In the industry, the manual cleaning equipment of the stripping tank adopts a split design with an upper stainless steel tank body and a lower hot plate, and an open heating solution. In the actual production site, the open heating design causes a lot of energy waste due to heat transfer losses. At the same time, when the wafers flow through the tanks, the dripping waste liquid will accumulate on the surface of the hot plate. After long-term use, it will be carbonized into black slag and adsorbed on the hot plate and stainless steel tank body. The hot plate and stainless steel tank body need to be regularly managed, cleaned and maintained, which affects production capacity and also creates hidden dangers in safety. Utility Model Content
[0003] The technical problem to be solved by the utility model is to provide a heating carrier structure suitable for semiconductor wet cleaning equipment in view of the above-mentioned prior art, so as to reduce heat transfer loss, shorten maintenance time, and improve production capacity and safety.
[0004] The technical solution adopted by the utility model to solve the above-mentioned problem is: a heating carrier structure suitable for semiconductor wet cleaning equipment, including an inner tank body, a baffle is arranged in the inner cavity of the inner tank body, the baffle divides the inner cavity of the inner tank body equally to form a plurality of independent tanks; heating film units are respectively arranged on the bottom surface of the inner cavity of the inner tank body and the two oppositely arranged inner side surfaces of the inner tank body, the heating film units heat the liquid dripping when the chip is circulated; the inner side walls of the inner tank body are respectively provided with cooling pipes, the cooling pipes cool the inner tank body.
[0005] A protective shell is also provided, and the inner tank body is provided with a protective shell, and a gap is left between the inner wall of the protective shell and the outer wall of the inner tank body.
[0006] The heating film units respectively include heating films, and the bottom surface of the inner cavity of the inner tank body and the two opposite inner side surfaces of the inner tank body are respectively provided with heating films; the outer side surface and the bottom of the inner tank body are respectively provided with thermocouples and temperature limiters; the thermocouples are electrically connected to the temperature control meter, and the temperature control meter, the temperature limiter and the power line of the heating film are electrically connected in series.
[0007] The bottom of the inner tank body is provided with a plurality of chemical reagent ports, and the chemical reagent ports are connected with the corresponding independent tanks.
[0008] Compared with the prior art, the utility model has the advantages of: a heating carrier structure suitable for semiconductor wet cleaning equipment, which can effectively reduce heat transfer losses, reduce maintenance time, and improve equipment safety, reduce enterprise costs, and save energy and reduce consumption. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1 This is a schematic diagram of a heating carrier structure suitable for semiconductor wet cleaning equipment according to an embodiment of the utility model;
[0010] Figure 2 for Figure 1 Side view of
[0011] Figure 3 for Figure 1 A top view of
[0012] In the figure, 1 is a protective shell, 2 is an inner tank, 3 is a cooling tube, 4 is a thermocouple, 5 is a heating film, 6 is a cross baffle, and 7 is a chemical reagent port. DETAILED DESCRIPTION
[0013] The present invention will be described in further detail below in conjunction with the accompanying drawings.
[0014] like Figure 1 , 2 As shown in Figure 3, a heating carrier structure suitable for semiconductor wet cleaning equipment in this embodiment includes an inner tank body 2, and a cross baffle 6 is arranged in the inner cavity of the inner tank body 2. The cross baffle 6 divides the inner tank body 2 into four independent tanks. The four independent tanks are isolated from each other and numbered in sequence as 1# independent tank, 2# independent tank, 3# independent tank, and 4# independent tank, so that there is no gap between the independent tanks, which is convenient for process personnel to distribute chemical reagents in the four independent tanks. The bottom surface of the inner cavity of the inner tank body 2 and the two opposite inner side surfaces of the inner tank body are respectively provided with heating film units. The heating film units heat the liquid medicine dripping down when the chip is circulated to prevent the liquid medicine remaining in the gap from carbonizing. Each independent tank is installed with three-sided heating film units, and the maximum heating area is much larger than the original open bottom heating area. The heating film units directly heat the surface of the inner tank body to achieve rapid temperature rise and fall of the inner tank body and maintain a constant temperature. The inner side walls of the inner tank body are respectively provided with cooling pipes 3, and the cooling pipes 3 cool the inner tank body 2.
[0015] The bottom of the inner tank body 2 is provided with four chemical reagent ports 7, which are connected to the corresponding independent tanks. The chemical reagent ports 7 are opened to facilitate the discharge of the chemical reagents in the independent tanks.
[0016] The above-mentioned heating film unit includes a heating film 5, which is installed on the bottom surface of the inner cavity of the inner tank body 2 and the inner side surface of the inner tank body. The outer side surface and the bottom of the inner tank body 2 are respectively attached with a thermocouple 4 and a temperature limiter through temperature-resistant silicone. The thermocouple 4 is electrically connected to the temperature control meter, and the temperature control meter is electrically connected to the power cord of the heating film. The thermocouple detects the temperature of the inner tank body and feeds back to the temperature control meter. The temperature control meter controls whether the heating film heats the inner tank body. The temperature limiter is electrically connected in series with the temperature control meter and the power cord of the heating film. When the thermocouple is damaged and the temperature in the inner tank body exceeds the set temperature, the temperature limiter controls the power cord of the heating film 5 to automatically cut off the power, thereby enhancing the safety of the heating operation.
[0017] The inner tank body 2 is covered with a protective shell 1, and a gap is left between the inner wall of the protective shell 1 and the outer wall of the inner tank body 2. The protective shell 1 protects the thermocouple 4, the temperature limiter and the load circuit from environmental corrosion. At the same time, if used in an organic environment, the protective shell improves safety.
[0018] The present application heats the inner tank body by means of a heating film, which can effectively reduce heat transfer losses and reduce maintenance time. A protective outer shell is provided outside the inner tank body, which improves equipment safety, reduces enterprise costs, and saves energy and reduces consumption.
[0019] In addition to the above embodiments, the present invention also includes other implementation modes. Any technical solutions formed by equivalent transformation or equivalent replacement should fall within the protection scope of the claims of the present invention.
Claims
1. A heating carrier structure suitable for semiconductor wet cleaning equipment, characterized in that: It includes an inner tank body, wherein a baffle is arranged in the inner cavity of the inner tank body, and the baffle divides the inner cavity of the inner tank body into equal parts to form a plurality of independent tanks; heating film units are respectively arranged on the bottom surface of the inner cavity of the inner tank body and the two oppositely arranged inner side surfaces of the inner tank body, and the heating film units heat the drug solution dripping down when the chip is circulated; and cooling pipes are respectively arranged on the inner side walls of the inner tank body, and the cooling pipes cool the inner tank body.
2. A heating carrier structure suitable for semiconductor wet cleaning equipment according to claim 1, characterized in that: A protective shell is also provided, and the inner tank body is provided with a protective shell, and a gap is left between the inner wall of the protective shell and the outer wall of the inner tank body.
3. The heating carrier structure suitable for semiconductor wet cleaning equipment according to claim 1, characterized in that: The heating film units respectively include heating films, and the bottom surface of the inner cavity of the inner tank body and the two opposite inner side surfaces of the inner tank body are respectively provided with heating films; the outer side surface and the bottom of the inner tank body are respectively provided with thermocouples and temperature limiters; the thermocouples are electrically connected to the temperature control meter, and the temperature control meter, the temperature limiter and the power line of the heating film are electrically connected in series.
4. The heating carrier structure suitable for semiconductor wet cleaning equipment according to claim 1, characterized in that: The bottom of the inner tank body is provided with a plurality of chemical reagent ports, and the chemical reagent ports are connected with the corresponding independent tanks.