Rapid cooling system of silicon carbide corrosion furnace
By designing a fast cooling system for silicon carbide corrosion furnace and using cooling pipelines to exchange heat with the crucible, the problem of too slow cooling speed in the prior art is solved, and rapid cooling and efficient operation are achieved.
Patent Information
- Application Number
- CN202420644859.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2025-04-25
- Estimated Expiration
- 2034-03-29
AI Technical Summary
The cooling speed of existing silicon carbide corrosion furnaces is too slow, which affects subsequent operation and use.
A silicon carbide corrosion furnace rapid cooling system is designed, including crucibles and cooling devices. The cooling device consists of a cooling source and a cooling pipeline. The cooling pipeline is arranged on the outer wall of the crucible. The cooling water flows through the cooling pipeline and heat exchanges with the crucible to achieve rapid cooling.
Through this system, the cooling speed of the silicon carbide corrosion furnace is significantly accelerated, shortening the cooling time and improving the efficiency of subsequent operation and use.
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Figure CN222801747U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of wafer processing, in particular to a rapid cooling system for a silicon carbide etching furnace. Background Art
[0002] Silicon carbide (SiC), as an emerging third-generation semiconductor core material, has excellent properties such as wide bandgap, high critical breakdown electric field strength, high electron mobility, good radiation resistance and chemical stability. This makes it an important substrate wafer material with wide applications, showing good application prospects in the fields of aviation devices, new energy vehicles, rail transportation and household appliances.
[0003] Etching is one of the common processes in the processing of silicon carbide wafers. After the silicon carbide wafers are etched in the etching furnace, the etching furnace needs to be cooled down. However, existing etching furnaces usually use natural cooling, and the cooling speed is too slow. Utility Model Content
[0004] The utility model aims to provide a rapid cooling system for a silicon carbide etching furnace, which can realize rapid cooling of the silicon carbide etching furnace.
[0005] The embodiment of the utility model is achieved as follows:
[0006] In a first aspect, the utility model provides a rapid cooling system for a silicon carbide etching furnace, comprising:
[0007] A crucible, wherein the crucible is used to contain a corrosive liquid and to place a silicon carbide wafer therein for etching;
[0008] A cooling device, the cooling device comprises a cooling source and a cooling pipeline, the water outlet of the cooling source is connected to the water inlet of the cooling pipeline, the water outlet of the cooling pipeline is connected to the water inlet of the cooling source, and the cooling pipeline is arranged on the outer wall of the crucible.
[0009] In an optional embodiment, the water inlet and the water outlet of the cooling pipeline are respectively provided with a first valve and a second valve.
[0010] In an optional embodiment, both the first valve and the second valve are solenoid valves.
[0011] In an optional embodiment, the first valve is higher than the second valve.
[0012] In an optional embodiment, the cooling pipeline is provided with an arc-shaped portion, and the arc-shaped portion is in contact with the outer wall of the crucible.
[0013] In an optional embodiment, the cooling pipeline is spirally wound around the outer wall of the crucible.
[0014] In an optional embodiment, the cooling pipeline is made of metal.
[0015] In an optional embodiment, the cooling source is PCW.
[0016] In an optional embodiment, a water-using device is further included, and the water-using device is connected in parallel with the cooling pipeline.
[0017] In an optional embodiment, a water pump is provided between the water-using equipment and the cooling pipeline.
[0018] The beneficial effects of the embodiments of the utility model include:
[0019] The utility model provides a rapid cooling system for a silicon carbide etching furnace, which includes a crucible and a cooling device. The crucible is used to contain an etching liquid and to place a silicon carbide wafer for etching. The cooling device includes a cooling source and a cooling pipeline. The water outlet of the cooling source is connected to the water inlet of the cooling pipeline. The water outlet of the cooling pipeline is connected to the water inlet of the cooling source. The cooling pipeline is arranged on the outer wall of the crucible. The cooling water of the cooling source can enter the cooling pipeline from the water inlet of the cooling pipeline and flow along the cooling pipeline to the water outlet of the cooling pipeline. The cooling water can exchange heat with the crucible during the flow in the cooling pipeline, thereby taking away the heat emitted by the crucible, realizing rapid cooling of the crucible, and thus realizing rapid cooling of the etching furnace. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0021] Figure 1 A schematic diagram of the structure of a rapid cooling system for a silicon carbide etching furnace provided by an embodiment of the utility model;
[0022] Figure 2 A schematic diagram of the structure of a cooling pipeline provided in an embodiment of the utility model.
[0023] Icons: 100-crucible; 200-cooling device; 210-cooling source; 220-cooling pipeline; 222-first valve; 224-second valve; 226-arc-shaped part; 230-water-using equipment; 240-water pump. DETAILED DESCRIPTION
[0024] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0025] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0026] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0027] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0028] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0029] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0030] After use, the existing silicon carbide etching furnace needs to be cooled down for subsequent operation. However, the existing silicon carbide etching furnace usually uses natural cooling to cool down, and the cooling speed is too slow, which may affect subsequent use.
[0031] In view of the above situation, an embodiment of the utility model provides a silicon carbide etching furnace rapid cooling system, which, by providing an additional cooling device, allows the user to selectively and rapidly cool the silicon carbide etching furnace according to demand, thereby facilitating subsequent operation and use.
[0032] Please refer to Figure 1 and Figure 2 The silicon carbide etching furnace rapid cooling system provided by the utility model comprises a crucible 100 and a cooling device 200. The crucible 100 is used to contain etching liquid and put silicon carbide wafers for etching. The cooling device 200 comprises a cooling source 210 and a cooling pipeline 220. The water outlet of the cooling source 210 is connected to the water inlet of the cooling pipeline 220. The water outlet of the cooling pipeline 220 is connected to the water inlet of the cooling source 210. The cooling pipeline 220 is arranged on the outer wall of the crucible 100.
[0033] When the above-mentioned silicon carbide etching furnace rapid cooling system is working, the cooling water of the cooling source 210 can enter the cooling pipeline 220 from the water inlet of the cooling pipeline 220, and flow along the cooling pipeline 220 to the water outlet of the cooling pipeline 220. During the flow of the cooling water in the cooling pipeline 220, the cooling water can exchange heat with the crucible 100, thereby taking away the heat dissipated by the crucible 100, realizing rapid cooling of the crucible 100, and thus realizing rapid cooling of the etching furnace.
[0034] The cooling source 210 can adopt different structures as needed. In this embodiment, the cooling source 210 is PCW (Process Cooling Water System). PCW is a commonly used cooling source for process equipment and is commonly used in various production workshops for cooling various process equipment. By using PCW as the cooling source 210 of the rapid cooling system of the silicon carbide etching furnace, there is no need to set up independent cooling equipment, thereby reducing the cost of the cooling source 210.
[0035] Of course, it should be noted that in other embodiments, the cooling source 210 may also be cooling equipment of other structural forms, such as air conditioning.
[0036] The cooling pipe 220 can be made of different materials as needed. In this embodiment, in order to improve the heat exchange effect of the cooling pipe 220, the cooling pipe 220 is made of metal. Metal has good heat transfer efficiency and can effectively improve the cooling effect of the cooling pipe 220 on the crucible 100.
[0037] The cooling pipe 220 can be configured in different shapes as required. In this embodiment, the cooling pipe 220 is spirally wound around the outer wall of the crucible 100. The spiral configuration can increase the contact area between the cooling pipe 220 and the crucible 100, thereby improving the heat exchange effect between the cooling pipe 220 and the crucible 100, thereby improving the cooling effect on the crucible 100.
[0038] In order to further increase the contact area between the cooling pipe 220 and the crucible 100 , in this embodiment, the cooling pipe 220 is provided with an arc portion 226 , which fits against the outer wall of the crucible 100 , thereby further improving the cooling effect of the cooling pipe 220 on the crucible 100 .
[0039] In order to allow the user to use the cooling device 200 as needed, in this embodiment, the water inlet and the water outlet of the cooling pipeline 220 are respectively provided with a first valve 222 and a second valve 224. The two valves can be of different types as needed. In this embodiment, the first valve 222 and the second valve 224 are both solenoid valves. By setting two solenoid valves to control the on and off of the water inlet and the water outlet of the cooling pipeline 220, the user can selectively enable or disable the cooling device 200 as needed. When it is needed, open the first valve 222 and the second valve 224. When it is not needed, close the first valve 222 and the second valve 224. The selection of the solenoid valve form can facilitate the automatic opening and closing of the two valves. The two valves can be electrically connected to the control system of the corrosion furnace and selectively opened and closed under the control of the control system, thereby improving the automation of the entire system.
[0040] Furthermore, in this embodiment, the first valve 222 is higher than the second valve 224, that is, the water inlet of the cooling pipeline 220 is higher than the water outlet. In this way, the cooling water entering the cooling pipeline 220 from the water inlet can flow to the water outlet under the action of its own gravity, thereby ensuring the fluidity of the cooling water in the cooling pipeline 220.
[0041] Please refer to Figure 1 The silicon carbide etching furnace rapid cooling system further includes a water-using device 230 , which is connected in parallel with the cooling pipeline 220 , and a water pump 240 is provided between the water-using device 230 and the cooling pipeline 220 .
[0042] The purpose of setting up the water-using equipment 230 is to improve the utilization rate of the above-mentioned heat. The cooling water flowing out of the cooling pipeline 220 will increase in temperature due to absorbing the heat of the crucible 100. This part of the cooling water with relatively high temperature can flow back to the PCW for cooling. However, directly flowing back to the PCW will cause the heat absorbed by the cooling water to be wasted. Therefore, the water-using equipment 230 can be set up, so that the relatively high-temperature water flowing out of the cooling pipeline 220 can be supplied to other water-using equipment 230 in need, and the setting of the water pump 240 can provide sufficient power for the above-mentioned supply.
[0043] The working principle and process of the rapid cooling system of the silicon carbide corrosion furnace are as follows:
[0044] When the silicon carbide etching furnace is finished working, if rapid cooling is not required, the first valve 222 and the second valve 224 are closed, and the cooling water of the PCW will not pass through the cooling pipeline 220, and the silicon carbide etching furnace is cooled naturally. If rapid cooling is required, the first valve 222 and the second valve 224 are opened, and the cooling water of the PCW will pass through the cooling pipeline 220. During the flow of the cooling pipeline 220, the cooling water exchanges heat with the crucible 100, thereby absorbing the heat of the crucible 100 and realizing rapid cooling of the crucible 100.
[0045] The temperature of the cooling water flowing out of the cooling pipe 220 is relatively high. At this time, if other water-using equipment 230 has water demand, the water can be guided through other water-using equipment 230 to meet the needs of other water-using equipment 230, while also reducing the refrigeration load of PCW and the power consumption of the entire system.
[0046] In summary, the silicon carbide etching furnace rapid cooling system provided in this embodiment includes a crucible 100 and a cooling device 200. The crucible 100 is used to contain the etching liquid and put the silicon carbide wafer into it for etching. The cooling device 200 includes a cooling source 210 and a cooling pipeline 220. The water outlet of the cooling source 210 is connected with the water inlet of the cooling pipeline 220. The water outlet of the cooling pipeline 220 is connected with the water inlet of the cooling source 210. The cooling pipeline 220 is arranged on the outer wall of the crucible 100. The cooling water of the cooling source 210 can enter the cooling pipeline 220 from the water inlet of the cooling pipeline 220, and flow along the cooling pipeline 220 to the water outlet of the cooling pipeline 220. During the flow of the cooling water in the cooling pipeline 220, the cooling water can exchange heat with the crucible 100, thereby taking away the heat emitted by the crucible 100, realizing the rapid cooling of the crucible 100, and thus realizing the rapid cooling of the etching furnace.
[0047] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A rapid cooling system for a silicon carbide etching furnace, characterized in that: include: A crucible (100), wherein the crucible (100) is used to contain a corrosive liquid and to place a silicon carbide wafer therein for etching; A cooling device (200), the cooling device (200) comprising a cooling source (210) and a cooling pipeline (220), the water outlet of the cooling source (210) being in communication with the water inlet of the cooling pipeline (220), the water outlet of the cooling pipeline (220) being in communication with the water inlet of the cooling source (210), and the cooling pipeline (220) being arranged on the outer wall of the crucible (100).
2. The silicon carbide etching furnace rapid cooling system according to claim 1, characterized in that: The water inlet and the water outlet of the cooling pipeline (220) are respectively provided with a first valve (222) and a second valve (224).
3. The silicon carbide etching furnace rapid cooling system according to claim 2, characterized in that: The first valve (222) and the second valve (224) are both solenoid valves.
4. The silicon carbide etching furnace rapid cooling system according to claim 2, characterized in that: The first valve (222) is higher than the second valve (224).
5. The silicon carbide etching furnace rapid cooling system according to claim 1, characterized in that: The cooling pipeline (220) is provided with an arc-shaped portion (226), and the arc-shaped portion (226) is in contact with the outer wall of the crucible (100).
6. The silicon carbide etching furnace rapid cooling system according to claim 1, characterized in that: The cooling pipeline (220) is spirally wound around the outer wall of the crucible (100).
7. The silicon carbide etching furnace rapid cooling system according to claim 1, characterized in that: The cooling pipeline (220) is made of metal.
8. The silicon carbide etching furnace rapid cooling system according to claim 1, characterized in that: The cooling source (210) is PCW.
9. The silicon carbide etching furnace rapid cooling system according to claim 8, characterized in that: It also includes a water-using device (230), wherein the water-using device (230) is connected in parallel with the cooling pipeline (220).
10. The silicon carbide etching furnace rapid cooling system according to claim 9, characterized in that: A water pump (240) is provided between the water-using equipment (230) and the cooling pipeline (220).