Wafer bonding device

Abstract

The utility model provides a wafer bonding device which is used for bonding a first wafer and a second wafer, the bonding device is provided with a bonding chamber, and the bonding chamber is provided with a first driving console, a second driving console, a first loading platform, a second loading platform, a wafer loading area and a wafer alignment area. The first driving console and the second driving console respectively control the first loading platform and the second loading platform to enter the wafer loading area and the wafer alignment area in a vertically parallel and staggered manner; the edge, perpendicular to the second guide rail, of the second loading table is provided with a plurality of linearly-arranged air knife holes. Before the first wafer is loaded in the first wafer loading area, the blowing gas blows away particles on the first wafer loading area through the air knife hole, and then the first wafer is loaded on the first wafer loading area, so that during bonding, because the first wafer is completely attached to the first wafer loading area, bonding waves can be completely discharged from the space between the two wafers, and the bonding efficiency is improved. And bubbles are prevented from being generated between the two wafers.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer bonding device. Background Art

[0002] Please refer to Figure 1 Wafer bonding is a key process in chip manufacturing, which refers to the process of tightly connecting two or more wafers 1 together. During the wafer bonding process, once bubbles are generated, the product yield will be affected.

[0003] The reason for the bubbles is the presence of particles on the platform. The main sources of particles are particles caused by the incomplete cleaning of the equipment and the wear of cables. Figure 2 When there are particles 3 on the lower carrier 2, the wafer 1 placed on the lower carrier 2 is partially raised. During bonding, the bonding wave diffuses from the inside to the outside and is not discharged in time in this area. Therefore, bubbles 4 are generated between the two wafers 1.

[0004] At present, the main means of preventing bubbles in the industry is to ensure the cleanliness of the inside of the equipment and replace the cables in time. However, the inside of the equipment is not a closed space, so it is difficult to ensure that it is completely clean. In addition, frequent replacement of cables will increase costs.

[0005] Therefore, there is no effective technology to prevent bubbles from being generated between wafers during bonding. Furthermore, how to prevent bubbles from being generated between wafers during bonding has become a technical problem that needs to be solved urgently in this field. Utility Model Content

[0006] In order to solve the above technical problems, the utility model provides a wafer bonding device for bonding a first wafer and a second wafer, wherein the bonding device is provided with a bonding chamber, and the bonding chamber is provided with: a first driving control console, a second driving control console, a first loading platform, a second loading platform, a wafer loading area and a wafer alignment area;

[0007] The first driving console is sleeved in the second driving console; the first driving console is provided with an air-floating drive for driving the first loading platform to move along the first guide rail to the first guide rail of the wafer loading area / the wafer alignment area, and the second driving console is provided with an air-floating drive for driving the second loading platform to move along the second guide rail to the second guide rail of the wafer loading area / the wafer alignment area;

[0008] The first driving control console and the second driving control console respectively control the first loading platform and the second loading platform to enter the wafer loading area and the wafer alignment area in parallel and staggered manner up and down;

[0009] The second loading platform is provided with a plurality of air flotation holes at positions corresponding to the second guide rail, and the plurality of air flotation holes are arranged in two parallel lines. A second wafer loading area is provided in the middle of the second loading platform; a first wafer loading area is provided in the middle of the first loading platform; and the second loading platform is provided with a plurality of air knife holes arranged in a linear manner at the edge perpendicular to the second guide rail.

[0010] When the first driving control console drives the first loading platform to enter the wafer loading area to load the first wafer, and at the same time the second driving control console drives the second loading platform from the wafer loading area to enter the wafer alignment area, the second loading platform moves up and down parallel and staggered relative to the first loading platform, and the wind knife hole purges the first wafer loading area on the first loading platform which moves parallel to the lower position.

[0011] Preferably, when the first loading platform is located in the wafer alignment area and the second loading platform is located in the wafer loading area, the air knife hole is located at a side edge of the lower surface of the second loading platform close to the first loading platform.

[0012] Preferably, the wind knife holes are arranged vertically.

[0013] Preferably, the wind knife hole is arranged obliquely toward the first loading platform.

[0014] Preferably, the wind knife hole is inclined at 45° to 75° relative to the vertical direction.

[0015] Preferably, the wind knife hole is connected to an air source through a first air path, and the air flotation hole is connected to the air source through a second air path.

[0016] Preferably, the first air circuit includes a first main air pipe, a plurality of first bronchial pipes and a first valve, the first main air pipe is connected to a plurality of the air knife holes through a plurality of the first bronchial pipes respectively, the first main air pipe is also connected to the air source through a main air pipe; the first valve is arranged on the first main air pipe;

[0017] The second air circuit includes a second main air pipe, a plurality of second bronchi and a second valve. The second main air pipe is connected to a plurality of air flotation holes through a plurality of the second bronchi respectively. The second main air pipe is also connected to the air source through the main air pipe. The second valve is arranged on the second main air pipe.

[0018] Preferably, the main air pipe is also provided with a main valve.

[0019] Compared with the prior art, the technical solution of the embodiment of the utility model has the following beneficial effects:

[0020] Before the first wafer is loaded in the first wafer loading area, the utility model uses a purge gas to form a wind knife on the surface of the first wafer loading area through the wind knife hole, and the wind knife will blow away the particles on the first wafer loading area, and then load the first wafer on the first wafer loading area after the particles on the first wafer loading area are blown away. Then, during bonding, since the first wafer is completely attached to the first wafer loading area, the bonding wave will be completely discharged from between the two wafers, thereby preventing bubbles from being generated between the two wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 It is a schematic diagram of the structure of wafer bonding;

[0023] Figure 2 It is a schematic diagram of the structure of bubbles generated between two wafers during wafer bonding;

[0024] Figure 3 This is a schematic diagram of the structure of a bonding device provided by an embodiment of the utility model. Figure 1 ;

[0025] Figure 4 This is a schematic diagram of the structure of a bonding device provided by an embodiment of the utility model. Figure 2 ;

[0026] Figure 5 This is a schematic diagram of the structure of a bonding device provided by an embodiment of the utility model. Figure 3 (excluding the first loading station and the second loading station);

[0027] Figure 6 It is a structural schematic diagram of a first loading platform provided by an embodiment of the utility model;

[0028] Figure 7 It is a structural schematic diagram of an air flotation hole provided by an embodiment of the utility model being connected to an air source through a second air path;

[0029] Figure 8 It is a structural schematic diagram of an air knife hole provided by an embodiment of the utility model being connected to an air source through a first air path;

[0030] Description of reference numerals:

[0031] 1--wafer;

[0032] 2--Lower bearing platform;

[0033] 3--granules;

[0034] 4--bubbles;

[0035] 5--Wafer loading area;

[0036] 6--First loading platform;

[0037] 7--First wafer loading area;

[0038] 8--Wafer alignment area

[0039] 9--Second loading platform;

[0040] 901--wind knife hole;

[0041] 10--Second wafer loading area;

[0042] 11--Second drive console;

[0043] 12--Second guide rail;

[0044] 13--First drive console;

[0045] 14--First guide rail;

[0046] 15--Main valve;

[0047] 16--main trachea;

[0048] 17--Second gas path;

[0049] 1701--Second bronchus;

[0050] 1702--Second main airway;

[0051] 1703--Second valve;

[0052] 18--First gas path;

[0053] 1801--First bronchus;

[0054] 1802--First main airway;

[0055] 1803--The first valve. DETAILED DESCRIPTION

[0056] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0057] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices. The terms "on" and "above" and any of their variations are intended to describe positional relationships and do not represent a relationship of direct contact between the described objects.

[0058] As described in the background technology, due to the presence of particles on the lower carrier, the local position of the wafer placed on the lower carrier is raised. During bonding, the bonding wave will diffuse from the inside to the outside and is not discharged in time in this area. Therefore, bubbles are generated between the two wafers. The main sources of particles are particles generated by incomplete cleaning inside the equipment and mutual wear of cables. If the particles are eliminated only from the perspective of the source of the particles, this treatment method will not only fail to achieve the desired effect, but will also increase production costs. Through creative research, technicians in this field have found that if the particles on the lower carrier are cleaned before loading the lower wafer, bubbles can be prevented from being generated between the wafers during bonding.

[0059] Therefore, please refer to Figures 3 to 6 The embodiment of the utility model provides a wafer bonding device for bonding a first wafer and a second wafer. The bonding device is provided with a bonding chamber, and the bonding chamber is provided with: a first driving control console 13, a second driving control console 11, a first loading platform 6, a second loading platform 9, a wafer loading area 5 and a wafer alignment area 8;

[0060] The first driving console 13 is sleeved in the second driving console 11; the first driving console 13 is provided with an air-floating drive for the first loading platform 6 to move along the first guide rail 14 to the first guide rail 14 of the wafer loading area 5 / the wafer alignment area 8, and the second driving console 11 is provided with an air-floating drive for the second loading platform 9 to move along the second guide rail 12 to the second guide rail 12 of the wafer loading area 5 / the wafer alignment area 8;

[0061] The first driving control console 13 and the second driving control console 11 respectively control the first loading platform 6 and the second loading platform 9 to enter the wafer loading area 5 and the wafer alignment area 8 in parallel and staggered manner.

[0062] The second loading platform 9 is provided with a plurality of air flotation holes at positions corresponding to the second guide rail 12, and the plurality of air flotation holes are arranged in two parallel lines. A second wafer loading area 10 is provided in the middle of the second loading platform 9; a first wafer loading area 7 is provided in the middle of the first loading platform 6; the second loading platform 9 is provided with a plurality of air knife holes 901 arranged in a linear manner at the edge perpendicular to the second guide rail 12;

[0063] When the first driving control console 13 drives the first loading platform 6 to enter the wafer loading area 5 to load the first wafer, and at the same time the second driving control console 11 drives the second loading platform 9 from the wafer loading area 5 to enter the wafer alignment area 8, the second loading platform 9 moves up and down parallel and staggered relative to the first loading platform 6, and the wind knife hole 901 purges the first wafer loading area 7 on the first loading platform 6 that moves parallel to the relatively lower position.

[0064] Before the first wafer is loaded on the first wafer loading area 7, the utility model uses a purge gas to form a wind knife on the surface of the first wafer loading area 7 through the wind knife hole 901, and the wind knife will blow away the particles on the first wafer loading area 7. After the particles on the first wafer loading area 7 are blown away, the first wafer is loaded on the first wafer loading area 7. Then, during bonding, since the first wafer is completely attached to the first wafer loading area 7, the bonding wave will be completely discharged from between the first wafer and the second wafer, thereby preventing bubbles from being generated between the two wafers.

[0065] In this embodiment, the first loading platform 6 is located below the second loading platform 9, that is, the first loading platform 6 is a lower loading platform, the second loading platform 9 is an upper loading platform, and the first loading platform 6 is arranged in parallel with the second loading platform 9. The first wafer loading area 7 of the first loading platform 6 is arranged upward, and the second wafer loading area 10 of the second loading platform 9 is arranged downward.

[0066] The first wafer loading area 7 and the second wafer loading area 10 are used to load wafers separately, and the first wafer is first loaded on the first wafer loading area 7, that is, the first driving control console 13 drives the first loading platform 6 to enter the wafer loading area 5, and the first wafer is loaded on the first wafer loading area 7 in the wafer loading area 5. At this time, the second loading platform 9 is located in the wafer alignment area 8. After the first wafer is loaded on the first wafer loading area 7, the first driving control console 13 drives the first loading platform 6 to enter the wafer alignment area 8, and at the same time, the second driving control console 11 drives the second loading platform 9 from the wafer alignment area 8 to enter the wafer loading area 5, and the second wafer is loaded on the second wafer loading area 10 in the wafer loading area 5. Then, the second driving control console 11 drives the second loading platform 9 from the wafer loading area 5 to enter the wafer alignment area 8 for bonding.

[0067] Please refer to Figure 3 Before the wafer is loaded, the initial position of the first loading platform 6 is in the wafer alignment area 8, and the initial position of the second loading platform 9 is in the wafer loading area 5. Therefore, in the process of the first driving control console 13 driving the first loading platform 6 from the wafer alignment area 8 to the wafer loading area 5, the second driving control console 11 drives the second loading platform 9 from the wafer loading area 5 to the wafer alignment area 8, that is, the first loading platform 6 and the second loading platform 9 are parallel and staggered moving up and down. Before the relative movement between the first loading platform 6 and the second loading platform 9 ends, that is, before the first wafer is loaded in the first wafer loading area 7, it is necessary to blow away the particles on the first wafer loading area 7. As for whether the blowing of the first wafer loading area 7 through the wind knife hole 901 is carried out in the process of the opposite movement before the intersection of the first loading platform 6 and the second loading platform 9, or in the process of the intersection, or in the process of the opposite movement after the intersection, or even in the whole relative movement process, the utility model does not limit this, and it can be set according to actual use requirements. Therefore, the utility model does not make any specific restrictions on the direction of the wind knife hole 901, and it can be set according to actual usage. If the wind knife hole 901 purges the first wafer loading area 7 during the intersection of the first loading platform 6 and the second loading platform 9, then the wind knife hole 901 can be set vertically; if the wind knife hole 901 purges the first wafer loading area 7 during the intersection of the first loading platform 6 and the second loading platform 9, then the wind knife hole 901 can be set at an angle.

[0068] In this embodiment, it is preferred that the blowing to the first wafer loading area 7 through the air knife hole 901 is performed during the process of the first loading platform 6 and the second loading platform 9 moving toward each other before the first loading platform 6 and the second loading platform 9 intersect. Then, when the first loading platform 6 is located in the wafer alignment area 8 and the second loading platform 9 is located in the wafer loading area 5, the air knife hole 901 is located at the side edge of the lower surface of the second loading platform 9 close to the first loading platform 6. This arrangement can ensure that the blowing of the air knife hole 901 to the first wafer loading area 7 is performed during the process of the first loading platform 6 and the second loading platform 9 intersect. The air knife hole 901 is arranged to be inclined toward the first loading platform 6. In order to blow away all the particles on the first wafer loading area 7 of the first loading platform 6 as much as possible, the air knife hole 901 is preferably inclined at 45° to 75° relative to the vertical direction.

[0069] In this embodiment, both the air knife hole 901 and the air flotation hole need to avoid the second wafer loading area 10 , in order to prevent them from affecting the second wafer loaded on the second wafer loading area 10 .

[0070] Please refer to Figure 7 and Figure 8 Since the air knife hole 901 needs to be supplied with gas to purge the first wafer loading area 7, the air knife hole 901 is connected to the gas source through the first gas path 18. Since the air flotation hole needs to be supplied with gas to achieve flotation, to avoid friction between the second loading platform 9 and the first loading platform 6 during movement, the air flotation hole is connected to the gas source through the second gas path 17, and the gas source supplies gas to the air flotation hole through the second gas path 17, and the air flotation hole blows downward to float the second loading platform 9.

[0071] The air knife hole 901 and the air flotation hole can share the same air source or use air sources independently, and the utility model does not limit this. Considering the convenience of the structure and cost saving, the air knife hole 901 and the air flotation hole can share the same air source in this embodiment.

[0072] Specifically, the first air circuit 18 includes a first main air pipe 1802, several first branch air pipes 1801 and a first valve 1803. The first main air pipe 1802 is connected to several wind knife holes 901 respectively through several first branch air pipes 1801. The first main air pipe 1802 is also connected to the air source through the main air pipe 16. The first valve 1803 is arranged on the first main air pipe 1802. Whether the air source supplies air to the wind knife hole 901 can be individually controlled through the first valve 1803.

[0073] The second gas circuit 17 includes a second main gas pipe 1702, a plurality of second branch pipes 1701 and a second valve 1703. The second main gas pipe 1702 is connected to a plurality of the air flotation holes through a plurality of the second branch pipes 1701 respectively. The second main gas pipe 1702 is also connected to the gas source through the main gas pipe 16. The second valve 1703 is arranged on the second main gas pipe 1702. Whether the gas source supplies gas to the air flotation holes can be controlled separately by the second valve 1703. A main valve 15 is also arranged on the main gas pipe 16.

[0074] As for the specific types of the first valve 1803 and the second valve 1703, the present invention does not impose any specific restrictions on this, and can be set according to actual use requirements. It can be a pneumatic valve or an electric valve, such as a solenoid valve, and the air pressure can also be adjusted through the solenoid valve.

[0075] As for the specific gas of the purge gas, the utility model does not limit it. In this embodiment, nitrogen is preferred. The gas used for flotation in the device itself is nitrogen. In order to simplify the structure of the device, the existing gas pipeline and gas of the device are preferably used.

[0076] In summary, before the first wafer is loaded in the first wafer loading area 7, the purge gas forms a wind knife on the surface of the first wafer loading area 7 through the wind knife hole 901, and the wind knife will blow away the particles on the first wafer loading area 7, and the first wafer will be loaded on the first wafer loading area 7 after the particles on the first wafer loading area 7 are blown away. Then, during bonding, since the first wafer is completely attached to the first wafer loading area 7, the bonding wave will be completely discharged from between the two wafers, thereby preventing bubbles from being generated between the two wafers.

[0077] Although the utility model is disclosed as above, the utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model. Therefore, the protection scope of the utility model shall be subject to the scope defined by the claims.

Claims

1. A wafer bonding device, used for bonding a first wafer and a second wafer, characterized in that: The bonding device is provided with a bonding chamber, and the bonding chamber is provided with: a first driving control console, a second driving control console, a first loading platform, a second loading platform, a wafer loading area and a wafer alignment area; The first driving console is sleeved in the second driving console; the first driving console is provided with an air-floating drive for driving the first loading platform to move along the first guide rail to the first guide rail of the wafer loading area / the wafer alignment area, and the second driving console is provided with an air-floating drive for driving the second loading platform to move along the second guide rail to the second guide rail of the wafer loading area / the wafer alignment area; The first driving control console and the second driving control console respectively control the first loading platform and the second loading platform to enter the wafer loading area and the wafer alignment area in parallel and staggered manner up and down; The second loading platform is provided with a plurality of air flotation holes at positions corresponding to the second guide rail, and the plurality of air flotation holes are arranged in two parallel lines. A second wafer loading area is provided in the middle of the second loading platform; a first wafer loading area is provided in the middle of the first loading platform; and the second loading platform is provided with a plurality of air knife holes arranged in a linear manner at the edge perpendicular to the second guide rail. When the first driving control console drives the first loading platform to enter the wafer loading area to load the first wafer, and at the same time the second driving control console drives the second loading platform from the wafer loading area to enter the wafer alignment area, the second loading platform moves up and down parallel and staggered relative to the first loading platform, and the wind knife hole purges the first wafer loading area on the first loading platform which moves parallel to the lower position.

2. The wafer bonding device according to claim 1, characterized in that: When the first loading platform is located in the wafer alignment area and the second loading platform is located in the wafer loading area, the air knife hole is located at a side edge of the lower surface of the second loading platform close to the first loading platform.

3. The wafer bonding device according to claim 2, characterized in that: The wind knife hole is arranged vertically.

4. The wafer bonding device according to claim 2, characterized in that: The wind knife hole is arranged obliquely toward the first loading platform.

5. The wafer bonding device according to claim 4, characterized in that: The wind knife hole is inclined at 45° to 75° relative to the vertical direction.

6. The wafer bonding device according to claim 1, characterized in that: The air knife hole is connected to the air source through a first air path, and the air flotation hole is connected to the air source through a second air path.

7. The wafer bonding device according to claim 6, characterized in that: The first air circuit includes a first main air pipe, a plurality of first bronchial pipes and a first valve. The first main air pipe is connected to a plurality of the air knife holes through a plurality of the first bronchial pipes respectively. The first main air pipe is also connected to the air source through a main air pipe. The first valve is arranged on the first main air pipe. The second air circuit includes a second main air pipe, a plurality of second bronchi and a second valve. The second main air pipe is connected to a plurality of air flotation holes through a plurality of the second bronchi respectively. The second main air pipe is also connected to the air source through the main air pipe. The second valve is arranged on the second main air pipe.

8. The wafer bonding device according to claim 7, characterized in that: The main air pipe is also provided with a main valve.

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